JP2004172546A - Static eliminating transport device, and processor equipped with same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a device (this is called "a static eliminating transport device"), which transports a workpiece while eliminating static electricity, and effectively prevents charging of the workpiece, such as a semiconductor wafer and a quartz substrate, and has a low cost and few restrictions in arrangement. <P>SOLUTION: The device includes a main body 112 to be transferred by a driving means 111, and arms 115, 116 provided so as to extend from the body 112 to lower places. The arms 115, 116 retain the workpieces 100, 101 in the places lower to the body 112. Ionizers 51, 52 attached to the lower surface of the body 112 are provided. The ionizers 51, 52 emit ions toward the workpieces 100, 101. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a static eliminator / transporter, and more particularly, to a static eliminator / transporter that conveys an object to be processed such as a semiconductor wafer or a quartz substrate while removing static electricity. In addition, the present invention relates to a processing apparatus that conveys an object to be processed while removing static electricity by such a static elimination conveyance apparatus, and performs a process using a chemical solution or pure water on the object to be processed.
[0002]
[Prior art]
With the enlargement of electronic devices such as semiconductor integrated circuits or liquid crystal panels and the miniaturization of processing techniques, the adsorption of dust in the air due to static electricity on semiconductor wafers and quartz substrates during the manufacturing process, or the destruction of wiring patterns due to electrostatic discharge. It becomes a problem. For example, while the design rule of the distance between metal wirings formed on a semiconductor wafer in the process of manufacturing a semiconductor integrated circuit is about 0.2 μm to 0.1 μm, the particle size adsorbed by electrostatic force is about the same. Is greater than or equal to. For this reason, if particles adhere to the semiconductor substrate during the manufacturing process, it may cause a short circuit in the circuit and the like, resulting in a decrease in yield (yield).
[0003]
Generally, when a semiconductor wafer is immersed in a chemical bath or a pure water bath for processing, the semiconductor wafer is housed in a cassette (also called a “carrier”) made of an insulating material such as tetrafluoride resin having chemical resistance. Let it soak. A cassette made of such an insulating material is liable to be charged by friction with a liquid when the cassette is pulled up from a chemical solution tank or a pure water tank. In addition, in the manufacturing process of the liquid crystal panel, the quartz substrate itself constituting the liquid crystal panel itself is an insulating material, and therefore, is easily charged by friction with the liquid.
[0004]
Conventionally, in order to prevent such charging, a method is provided in which an ionizer (a device for ionizing air using corona discharge) is provided along the lower surface of a HEPA filter provided above the inside of a clean bench (washing room). It has been proposed (for example, see Patent Document 1). A cleaning tank is placed below the clean bench, and the objects to be cleaned are treated in the cleaning tank while being exposed to ionized air.
[0005]
Also, in order to prevent electrification of the semiconductor wafer, the air outlet and exhaust duct of clean air are arranged so as to face each other at the same height as the upper edge of the cleaning tank with the cleaning tank interposed, and an ionizer is installed in the air outlet. There has been proposed a method of providing such a device (for example, see Patent Document 2).
[0006]
[Patent Document 1]
JP-A-3-34424 (page 3, upper right column, line 20 to lower left column, line 5, FIG. 1)
[Patent Document 2]
JP-A-4-11728 (Claims 1 and 2 on page 1)
[0007]
[Problems to be solved by the invention]
However, if the ionizer is provided along the lower surface of the HEPA filter disposed above the inside of the clean bench as in Patent Literature 1, the distance between the ionizer and the object to be cleaned is long, so that the static elimination is insufficient. Become.
[0008]
In addition, if the ionizer is arranged at substantially the same height as the upper edge of the cleaning tank as in Patent Document 2, it takes a short time for the semiconductor wafer to be lifted out of the cleaning tank (the time for exposure to ionized clean air is 1 hour). Within seconds), static elimination becomes insufficient. In addition, in this method, since an ionizer is provided for each tank, the number of ionizers installed in a cleaning apparatus having a large number of tanks increases, resulting in a high cost. Furthermore, this method is difficult to apply to commercially available spin dryers (rotary dryers that open and close a large lid in a hinged manner) used after the cleaning process, from the viewpoint of arrangement space. is there.
[0009]
Therefore, an object of the present invention is an apparatus for transporting an object to be processed while removing electricity (this is referred to as a “static elimination transport apparatus”), which effectively charges an object to be treated such as a semiconductor wafer or a quartz substrate. An object of the present invention is to provide a device which can be prevented, is low in cost, and has few restrictions on arrangement.
[0010]
Another object of the present invention is to provide a processing apparatus that transports an object to be processed while removing electricity by such an electricity removing and transporting apparatus, and performs processing using a chemical solution or pure water on the object to be processed.
[0011]
[Means for Solving the Problems]
In order to solve the above-mentioned problems, the static elimination transfer device of the present invention includes:
A body to be moved by the driving means;
An arm that is provided to extend downward from the main body, and that holds the processing target downward with respect to the main body;
An ionizer attached to a lower surface of the main body and emitting ions toward the object to be processed is provided.
[0012]
The “processing object” basically means an object to be processed using a chemical solution or pure water, such as a semiconductor wafer or a quartz substrate. However, the "object to be processed" may include a cassette for storing a semiconductor wafer or a quartz substrate.
[0013]
"Ionizer" refers to a device that includes an electrode to which a high voltage is applied and ionizes air using corona discharge from the electrode.
[0014]
According to the static eliminator / transport device of the present invention, compared with the system in which an ionizer is provided along the lower surface of the HEPA filter disposed above the inside of the clean bench (the system of Patent Document 1), the processing target is reduced. The ionizer is arranged at a position close to the ionizer. Also, unlike the method of disposing the ionizer at substantially the same height as the upper edge of the cleaning tank (the method of Patent Document 2), while the object to be processed is held on the arm, the ionizer always emits ions from the ionizer. The object to be processed can be discharged. Therefore, charging of the processing target can be effectively prevented. As a result, it is possible to suppress the adsorption of particles to the object to be processed and the electrostatic breakdown, thereby improving the product yield (yield).
[0015]
Also, for example, even if the processing apparatus to which the charge removing and transporting apparatus is applied includes a plurality of processing units such as a chemical tank, a pure water tank, and a spin dryer, it is not necessary to provide an ionizer for each processing unit, and the driving unit may be used. It suffices if an ionizer is provided for each main body of the static elimination transport device to be moved. Therefore, the number of installed ionizers can be reduced, and the cost is excellent.
[0016]
Further, since the charge removing and transporting device is moved by the driving means, even if the applied processing device is provided with, for example, a spin dryer, the object to be processed can be easily placed inside the spin dryer with the lid of the spin dryer opened. Can be put in and out. That is, since the discharging and conveying device is moved by the driving means, there are few restrictions on the arrangement. Then, during this transport, the object to be treated can be neutralized by the ions emitted from the ionizer.
[0017]
In one embodiment, the static elimination transport device includes a cassette that stores the object to be processed, and the object to be processed is held by the arm via the cassette.
[0018]
In the static elimination transport device of this embodiment, the object to be processed is held by the arm via the cassette, so that the object to be processed is securely held. This cassette is neutralized together with the object to be processed, and is processed together with the object to be processed.
[0019]
In one embodiment of the invention, the vertical distance between the ionizer and the object to be processed is 100 mm or more and 220 mm or less.
[0020]
In the static eliminator / transport device of this embodiment, the vertical distance between the ionizer and the object to be processed is 220 mm or less, and they are close to each other, so that the object to be processed can be neutralized in a short time. For example, if the charging is within the range of about +15000 V to -20,000 V that can occur in the processing apparatus, the charge can be removed to about 0 V within 10 seconds, more certainly within 20 seconds.
[0021]
On the other hand, considering the range of the emission angle of the ions from the ionizer, it is desirable that the processing object is at least 100 mm away from the ionizer so that the entire processing object falls within the emission angle range.
[0022]
The ionizer desirably emits cations and anions simultaneously. In such a case, the object to be treated can be reliably discharged while preventing reverse charging due to supply ions.
[0023]
It is desirable that the arm is provided in a pair, and the processing object and / or the cassette is held between the pair of arms. In such a case, the processing object and the cassette are securely held.
[0024]
It is desirable that the material of the arm has resistance to a chemical solution into which the object to be treated is immersed.
[0025]
Desirably, the material of the arm has heat resistance to the temperature at which the processing object is processed.
[0026]
It is desirable that the material of the arm has an insulating property. In such a case, leakage of ions generated by the ionizer can be prevented.
[0027]
Further, it is preferable that the arm is configured by covering a metal frame with an insulating material. In such a case, the leakage of ions generated by the ionizer can be prevented, and the strength for holding the processing object can be easily obtained.
[0028]
In one embodiment of the present invention, the ionizing and transporting device moves N from the ionizer toward the processing object. ₂ It is desirable to provide a means for flowing gas. N from the ionizer to the object to be treated ₂ By flowing gas, ions generated by the ionizer can be diffused. Further, it is possible to prevent particles from being generated from the electrode tip of the ionizer.
[0029]
The processing apparatus of the present invention
A charge removing and transporting device according to claim 1,
A chemical solution tank for immersing the object to be treated in a chemical solution, a pure water cleaning tank for cleaning with pure water, and a spin dryer for drying,
A drive unit for moving the main body of the charge removing and transporting device so that the object to be treated is subjected to the treatment of the chemical solution immersion, pure water cleaning, and drying in the chemical solution tank, the pure water cleaning tank, and the spin dryer, respectively. Features.
[0030]
The processing apparatus of the present invention can transport the object to be treated while removing electricity by the above-described electricity removing / transporting device, and subject the object to be treated to immersion in a chemical solution, washing with pure water, and drying.
[0031]
More specifically, the object to be processed is held by the arm of the static eliminator / transport device, for example, in a load section (a place where the object to be processed is placed before the processing is started) of the processing apparatus. The object to be processed is transported from the load section to the chemical solution tank by the static elimination transport device. The object to be treated is immersed in a chemical solution in this chemical solution tank. Next, the object to be treated is transported from the chemical solution tank to the pure water cleaning tank by the charge eliminating transport device. The object to be treated is washed with pure water in the pure water washing tank. Next, the object to be treated is transported from the pure water washing tank to the spin dryer by the static elimination transport device. The object to be processed is dried by the spin dryer. Next, the object to be processed is transported from the spin dryer to, for example, an unloading unit by the static elimination transport device.
[0032]
In this series of processing steps, while the object to be processed is held on the arm of the static elimination transfer device, that is, between the load section and the chemical solution tank, between the chemical solution tank and the cleaning tank, between the cleaning tank and the spin dryer, and between the spin dryer and the unloader. At any time between the sections, the object to be treated can be neutralized by ions emitted from the ionizer. Therefore, charging of the processing target can be effectively prevented. As a result, it is possible to suppress the adsorption of particles to the object to be processed and the electrostatic breakdown, thereby improving the product yield (yield).
[0033]
Further, in this processing apparatus, it is not necessary to provide an ionizer for each processing section such as a chemical solution tank, a pure water tank, and a spin dryer, and it is sufficient to provide an ionizer for each main body of the charge removing and transporting apparatus to be moved by the driving means. Therefore, the number of installed ionizers can be reduced, and the cost is excellent.
[0034]
Further, in this processing apparatus, since the charge removing and transporting device is moved by the driving means, the object to be processed can be easily put in and out of the spin dryer with the lid of the spin dryer opened. That is, there are few restrictions on the arrangement. Therefore, the charge removing and transporting device is easily applied to the spin dryer.
[0035]
In one embodiment of the processing apparatus, at least during a period from immersion in the chemical solution in the chemical solution tank to pure water cleaning in the pure water cleaning tank, the ionizer of the static elimination transfer device continuously ionizes toward the processing target. It is characterized in that it emits.
[0036]
As described later, during the period from the immersion of the chemical in the chemical bath to the pure water cleaning in the pure water cleaning bath, the object to be treated tends to be charged. Therefore, according to the processing apparatus of the embodiment, the charging of the processing target can be effectively prevented.
[0037]
The processing apparatus according to one embodiment includes an unload section on which the object to be processed is placed after the drying processing by the spin dryer, and the object to be processed is conveyed by the unloading section at least after leaving the spin dryer. Until the ionizer is removed from the arm of the apparatus, the ionizer of the charge removing and transporting apparatus continuously emits ions toward the object to be processed.
[0038]
As will be described later, there is a strong tendency that the processing object tends to be charged from the time when the processing object leaves the spin dryer to the time when the processing object is removed from the arm of the charge removing and transporting device at the unloading section. Therefore, according to the processing apparatus of the embodiment, the charging of the processing target can be effectively prevented.
[0039]
In one embodiment of the processing apparatus, it is desirable that the processing object receives ions from the ionizer for 10 seconds or more, more preferably 20 seconds or more.
[0040]
For example, if the charging is performed within a range of about +15000 V to -20,000 V that can occur in the processing apparatus, as described later, the charge can be removed to about 0 V within 10 seconds, more certainly within 20 seconds.
[0041]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, a static elimination transport device and a processing device of the present invention will be described in detail with reference to the illustrated embodiments.
[0042]
FIG. 1 shows a schematic configuration of a processing apparatus 90 provided with a charge removing and transporting apparatus 1A, 1B, 1C according to an embodiment of the present invention. This processing apparatus is used in a manufacturing process of a semiconductor integrated circuit.
[0043]
Specifically, the processing apparatus 90 includes a clean bench 91 placed in a semiconductor manufacturing plant, a load section 2 installed in the lower part of the clean bench 91 along the floor from the right, and a chemical solution tank 3. 4, 5, a pure water washing tank 6, 7, 8, a spin dryer 9 and an unloading section 10, and static elimination transporting apparatuses 1A, 1B, 1C supported at positions above these processing sections 2 to 10. ing. Immediately below the unload unit 10, a controller 30 for controlling the operation of the processing device 90 is provided.
[0044]
The clean bench 91 down-flows clean air through HEPA filters (or ULPA filters) 81, 82,... The air is exhausted from the exhaust ports 21, 22, 23 provided at the bottom and the exhaust port (not shown) below. The rear panel 41 of the clean bench 91 is provided with a guide groove (not shown) for allowing movement of the charge removing and transporting devices 1A, 1B, and 1C. As will be described in detail later, the charge removing and transporting devices 1A, 1B, and 1C are supported by support members extending in the front-rear direction through the guide grooves, and along the guide grooves in the up-down direction (± z direction) and the left-right direction (± x direction).
[0045]
The load unit 2 is a place where a cassette (also referred to as a “carrier”) 101 on which a semiconductor wafer 100 as a processing target is mounted is first placed. When the cassettes 101 on which the semiconductor wafers 100 are mounted are placed on the load section 2, they are conveyed horizontally in a belt conveyer manner to a position near the next chemical solution tank 3 and stand by.
[0046]
The chemical liquid tanks 3, 4, and 5 are filled with predetermined chemical liquids, respectively, and are used for immersing the semiconductor wafer 100 in the chemical liquid together with the cassette 101 to perform processing such as etching required in a semiconductor manufacturing process. In each of the chemical tanks 3, 4, and 5, the chemical is supplied into the tank by a pump and overflows. The overflowed chemical solution is filtered by a filter to remove particles therein. Thereafter, the chemical is again supplied into the tank by the pump and circulated.
[0047]
The pure water cleaning tanks 6, 7, and 8 are used for cleaning the semiconductor wafer 100 together with the cassette 101 with pure water. In each of the pure water washing tanks 6, 7, and 8, pure water is supplied from the lower part of the tank into the tank and overflows. The overflowed water is discharged through a drain pipe (not shown) and led to a drainage facility in a factory.
[0048]
The spin dryer 9 is a commercially-available rotary drier, accommodates a cassette 101 on which the semiconductor wafer 100 is mounted, and shakes off moisture by centrifugal force at a high speed of about 1000 revolutions per minute to dry. When the object to be processed is put in and taken out of the spin dryer 9, the lid 9a is rotated around one side at the back to open and close in a hinged manner.
[0049]
The controller 30 controls the semiconductor wafer 100 and the cassette 101 so that the semiconductor wafer 100 and the cassette 101 are subjected to chemical liquid immersion, pure water cleaning, and drying in the chemical liquid tanks 3, 4, 5, the pure water cleaning tanks 6, 7, 8, and the spin dryer 9, respectively. The operation of the entire processing device 90 is controlled.
[0050]
The unload section 10 is a place where the cassette 101 on which the semiconductor wafer 100 is mounted is placed after the drying process by the spin dryer 9.
[0051]
FIG. 2 shows a configuration of the charge removing and transporting device 1 which is the same as each of the charge removing and transferring devices 1A, 1B, and 1C shown in FIG.
[0052]
The charge removing and transporting device 1 includes a main body 112 having a rectangular parallelepiped outer shape supported by a support member 111. A pair of left and right turning shafts 123 and 124 extending in the front-rear direction (± y direction) are provided through the main body 112.
[0053]
A pair of front and rear substantially columnar auxiliary arms 113A and 113B are integrally attached to one of the pivot shafts 123 so as to protrude in the radial direction. A substantially U-shaped engagement arm 115 is attached to extend over these auxiliary arms 113A and 113B. The engagement arm 115 includes a portion 115a extending linearly concentrically with the auxiliary arm 113A, a portion 115c linearly extending concentrically with the auxiliary arm 113B, and a straight line extending in front and rear directions between the tips of the linear portions 115a and 115c. And a hook portion 115b connected in a shape. The length of the hook 115b in the front-rear direction is set to be substantially the same as the length of the cassette 101 to be transported in the front-rear direction.
[0054]
Similarly, a pair of front and rear substantially columnar auxiliary arms 114A and 114B and an engagement arm 116 are attached to the other pivot shaft 124 in the same manner. The engaging arm 116 includes linear portions 116a and 116c and a hook 116b, and the length of the hook 116b in the front-rear direction is set to be substantially the same as the length of the cassette 101 to be transported in the front-rear direction. .
[0055]
Inside the main body 112, a stepping motor for rotating the turning shafts 123 and 124 around their respective centers is provided. When the pivot shafts 123 and 124 are rotated around their respective centers, the engagement arms 115 and 116 (and the hook portions 115b and 116b thereof) together with the auxiliary arms 113A and 113B are arcuate as indicated by α and β in the figure. And rotate.
[0056]
On the other hand, the cassette 101 is a commercially available wafer carrier made of tetrafluoride resin. Specifically, the cassette 101 has a body 102 having a substantially semi-cylindrical outer shape and a pair of legs 103 projecting downward from a lower portion of the body 102. 103, and a pair of flange portions 104, 104 protruding outward from the upper edge of the body 102. In the body 102, a plurality of grooves (not shown) for vertically holding the disc-shaped semiconductor wafer 100 are formed.
[0057]
When the engaging arms 115 and 116 are rotated and closed together with the auxiliary arms 113A and 113B, and the hooks 115b and 116b of the engaging arms 115 and 116 come directly below the flanges 104 and 104 of the cassette 101, the hooks 115b and 116b engage with flange portions 104 and 104, respectively. As a result, the cassette 101 on which the semiconductor wafer 100 is mounted is securely held below the main body 112 of the charge removing and transporting device 1. The semiconductor wafer 100 and the cassette 101 can be transported by the static elimination transport device 1 while being held as such.
[0058]
Ionizers 51 and 52 that emit ions toward the semiconductor wafer 100 and the cassette 101 are attached to the lower surface of the main body 112 of the charge removing and transporting device 1.
One ionizer 51 includes a positive electrode, and the other ionizer 52 includes a negative electrode. This ionizer is of a pulse DC type, and by applying a high DC voltage alternately to the plus electrode of the ionizer 51 and the minus electrode of the ionizer 52, positive and negative ions are separately generated in parallel. Has become. The generated ions reach the lower semiconductor wafer 100 and the cassette 101 while being diffused along the downflow of clean air in the clean bench. Therefore, by adjusting the amounts of the positive ions and the negative ions generated by the ionizers 51 and 52, the charge of the semiconductor wafer 100 and the cassette 101 can be reliably removed while preventing reverse charging due to supply ions. The DC high voltage is supplied to the electrodes 51 and 52 through a cable passing through the inside of the support member 111.
[0059]
In addition, these ionizers 51 and 52 are supplied with N through pipes passing through the support member 111. ₂ Gas is being supplied. N from the ionizers 51 and 52 toward the semiconductor wafer 100 and the cassette 101 ₂ By flowing the gas, the ions generated by the ionizers 51 and 52 can be further diffused. Further, it is possible to prevent particles from being generated from the electrode tips of the ionizers 51 and 52.
[0060]
The vertical interval H between the ionizers 51 and 52 and the semiconductor wafer 100 and the cassette 101 is set to about 220 mm in this example. If the vertical distance between the ionizers 51 and 52 and the semiconductor wafer 100 and the cassette 101 is 220 mm or less, and if they are close, the semiconductor wafer 100 and the cassette 101 can be neutralized in a short time. For example, if the charging is within the range of about +15000 V to -20,000 V that can occur in the processing device 90, the charge can be removed to approximately 0 V within 10 seconds, more certainly within 20 seconds.
[0061]
On the other hand, it is desirable that the semiconductor wafer 100 and the cassette 101 are separated from the ionizers 51 and 52 by 100 mm or more so that the entire semiconductor wafer 100 and the cassette 101 fall within the emission angle range. Considering the range of the emission angles of the ions from the ionizers 51 and 52, the range D reached by the ions on the surface on which the cassette 101 is placed is the vertical distance (H + H) from the ionizers 51 and 52 to the surface. ₀ Because it depends on it.
[0062]
FIG. 3 shows the lapse of time of the charged potential when the processing target (semiconductor wafer 100 and cassette 101) that has been positively charged is subjected to ion irradiation from the DC pulse type ionizers 51 and 52. As shown in the figure, the charged potential of the object to be processed gradually decreases in response to ions emitted from the ionizer, and is discharged to around 0V. In addition, even when the processing target is negatively charged, the charge is similarly removed to around 0V.
[0063]
Quantitatively, when the charged potential of the silicon wafer was 10,000 to 15,000 V or -15000 V to 20,000 V, the charge was removed to about 0 V in about 10 seconds to 20 seconds. When the charging potential of the silicon wafer was about 5000 V or -5000 V, the charge was removed to about 0 V in about 2 to 5 seconds by ion irradiation.
[0064]
Now, the main body 112 of the static eliminator / transporter 1 is supported by the support member 111 shown in FIG. The support member 111 extends in the front-rear direction (± y direction), penetrates the rear panel 41 shown in FIG. 1, and is connected to a drive mechanism (not shown) provided on the back side of the rear panel 41. The main body 112 of the charge removing and transporting device 1 is moved along with the support member 111 along the above-described guide groove via a drive mechanism thereof in accordance with a control signal from the controller 30. The controller 30, the driving mechanism, the guide groove, and the support member 111 are organically integrated to constitute a driving unit. As a result, the charge removing and transporting apparatus 1 is moved in the vertical direction (± z direction) and the horizontal direction (± x direction) while holding the semiconductor wafer 100 and the cassette 101.
[0065]
Therefore, the semiconductor wafer 100 and the cassette 101 are transported to the respective processing units 2 to 10 while being neutralized by the above-described neutralization transport device 1 in accordance with the setting contents of the controller 30, and the semiconductor wafer 100 and the cassette 101 are immersed in the chemical solution in the semiconductor wafer 100 and the cassette 101. Water washing and drying can be performed.
[0066]
More specifically, referring to FIG. 1, the semiconductor wafer 100 and the cassette 101 are held by the arms 115 and 116 of the charge removing and transporting apparatus 1A in the loading section 2 of the processing apparatus 90. The semiconductor wafer 100 and the cassette 101 are sequentially transferred from the loading unit 2 to the chemical tanks 3, 4, and 5 by the charge removing and transferring apparatus 1A. The semiconductor wafer 100 and the cassette 101 are immersed in predetermined chemical solutions in these chemical solution tanks 3, 4, and 5, respectively. Next, the semiconductor wafer 100 and the cassette 101 are sequentially transferred from the chemical solution tank 5 to the pure water cleaning tanks 6, 7, and 8 by the charge removing and transferring apparatus 1A. The semiconductor wafer 100 and the cassette 101 are cleaned with pure water in the pure water cleaning tanks 6, 7, and 8, respectively. Next, the semiconductor wafer 100 and the cassette 101 are transported from the pure water cleaning tank 8 to the spin dryer 9 by the static elimination transport device 1B. The semiconductor wafer 100 and the cassette 101 are dried by the spin dryer 9. Next, the semiconductor wafer 100 and the cassette 101 are transported from the spin dryer 9 to the unload unit 10 by the static elimination transport device 1C.
[0067]
In this series of processing steps, while the semiconductor wafer 100 and the cassette 101 are held by the arms 115 and 116 of the charge removing and transporting devices 1A, 1B and 1C, that is, between the load unit 2 and the chemical solution tank 3, Ions emitted from the ionizers 51 and 52 always between 4, 5 and 5, between the chemical tank 5 and the washing tank 6, between the washing tank 8 and the spin dryer 9, and between the spin dryer 9 and the unloading section 10. As a result, the semiconductor wafer 100 and the cassette 101 can be discharged. Therefore, charging of the semiconductor wafer 100 and the cassette 101 can be effectively prevented. As a result, adsorption of particles to the semiconductor wafer 100 and the cassette 101 and electrostatic breakdown can be suppressed low, and the yield (yield) of the product can be improved.
[0068]
Further, in the processing apparatus 90, there is no need to provide the ionizers 51 and 52 for each processing section such as the chemical solution tanks 3, 4, and 5, the pure water tanks 6, 7, and 8, and the spin dryer 9, and the charge removing and transporting apparatuses 1A and 1B. , 1C only need to be provided for each of the main bodies 112. Therefore, the number of installed ionizers 51 and 52 can be reduced, and the cost is excellent.
[0069]
Further, in the processing apparatus 90, since the charge removing and conveying apparatuses 1B and 1C are moved, the semiconductor wafer 100 and the cassette 101 can be easily put in and out of the spin dryer 9 with the lid 9a of the spin dryer 9 opened. it can. That is, there are few restrictions on the arrangement. Therefore, the static elimination transport device can be easily applied to the spin dryer 9.
[0070]
FIG. 4 shows the charging tendency in the above-described series of processing steps (processing proceeds from right to left) when the ionizers 51 and 52 are not operated in the processing apparatus 90. In this example, the processing objects are the silicon wafer 100 and the Teflon carrier 101.
[0071]
As can be seen from FIG. 4, the chemical baths 3, 4, and 5 (in FIG. 4, denoted as “chemical bath 1”, “chemical bath 2”, and “chemical bath 3”) are immersed in the chemical baths, and the pure water cleaning baths 6 and 7 are moved. , 8 (referred to as “cleaning tank 1” in FIG. 4) until silicon wafer 100 and Teflon carrier 101 tend to be charged. The reason for this is that friction occurs between the processing object pulled up by the arm of the static eliminator / transfer device 1A (referred to as “arm 1” in FIG. 4) and the chemical solution or pure water. Similarly, when the object to be processed is put into the spin dryer 9 by the arm of the charge removing and transporting device 1B (in FIG. 4, denoted as “arm 2”), the silicon wafer 100 and the Teflon carrier 101 have a strong tendency to be charged. . Further, even during the drying process by the spin dryer 9, frictional electrification between the pure water and the wafer surface occurs, and therefore, the pull-up after drying by the arm (in FIG. 4, represented as "Arm 3") of the static elimination transfer device 1C. At times, the charging potential rises rapidly due to an increase in the capacitance. The value of the charging potential ranges from 10,000 V to 15000 V according to the data of FIG. For this reason, there is a high necessity to remove electricity after spin-drying the processing object.
[0072]
Therefore, the semiconductor wafer 100 and the cassette 101 can be obtained by irradiating ions from the ionizers 51 and 52 at least from the time when the chemicals are immersed in the chemicals tanks 3, 4 and 5 to the time when the pure waters are washed in the pure water washing tanks 6, 7 and 8. Can be effectively prevented. Irradiating the semiconductor wafer 100 and the cassette 101 with ions from the ionizers 51 and 52 at least until the semiconductor wafer 100 and the cassette 101 are removed from the arm of the charge removing and transporting device by the unloading unit 10 after leaving the spin dryer 9, 101 can be effectively prevented from being charged.
[0073]
In this embodiment, the object to be processed is a cassette on which the semiconductor wafer 100, for example, a silicon wafer is mounted, but is not limited to this. Instead of the semiconductor wafer 100, a quartz substrate may be used as a processing target. Further, the type in which one cassette is transported is shown, but a type in which two cassettes are transported simultaneously may be used. Further, a type in which only a substrate is transported as an object to be processed without using a cassette may be used.
[0074]
It is desirable that the material of the arms 115 and 116 be resistant to the chemical solution into which the semiconductor wafer 100 and the cassette 101 are immersed.
[0075]
Further, it is desirable that the material of the arms 115 and 116 has heat resistance to the temperature at which the semiconductor wafer 100 and the cassette 101 are processed.
[0076]
Further, it is desirable that the material of the arms 115 and 116 has an insulating property. In such a case, leakage of ions generated by the ionizers 51 and 52 can be prevented.
[0077]
The arms 115 and 116 are preferably formed by covering a metal frame with an insulating material. In such a case, leakage of ions generated by the ionizers 51 and 52 can be prevented, and the strength for holding the semiconductor wafer 100 and the cassette 101 can be easily provided.
[0078]
Further, the ion generation method using the ionizers 51 and 52 is not limited to the pulse DC method, and various known methods can be adopted.
[0079]
【The invention's effect】
As is clear from the above, according to the static elimination transport device of the present invention. Moreover, the static eliminator / transporter of the present invention is low in cost and has few restrictions on the arrangement.
[0080]
Further, according to the processing apparatus of the present invention, the object to be processed is transported while being neutralized by such a neutralizing and transporting device, and the object to be processed is subjected to processing using a chemical solution or pure water. And the like, the charging of the object to be treated can be effectively prevented.
[Brief description of the drawings]
FIG. 1 is a diagram showing a schematic configuration of a processing apparatus provided with a charge removing and transporting device according to an embodiment of the present invention.
FIG. 2 is a diagram illustrating a configuration of the charge removing and transporting device.
FIG. 3 is a diagram showing a lapse of time of a charged potential when a positively charged processing target is subjected to ion irradiation from a DC pulse type ionizer.
FIG. 4 is a diagram showing a charging tendency in a series of processing steps (processing proceeds from right to left) when the ionizer is not operated in the processing apparatus.
[Explanation of symbols]
1,1A, 1B, 1C Static elimination transfer device
51,52 Ionizer
90 processing equipment
91 clean bench
100 semiconductor wafer
101 cassette
111 support member
112 body
113A, 113B, 114A, 114B Auxiliary arm
115, 116 engagement arm

Claims (7)

A body to be moved by the driving means;
An arm that is provided to extend downward from the main body, and that holds the processing target downward with respect to the main body;
A static eliminator / transfer device, comprising: an ionizer attached to a lower surface of the main body to emit ions toward the object to be processed. The static elimination transport device according to claim 1,
A cassette for storing the object to be processed;
The static eliminator / transport device, wherein the object to be processed is held by the arm via the cassette. The static elimination transport device according to claim 1,
A vertical distance between the ionizer and the object to be processed is 100 mm or more and 220 mm or less. A charge removing and transporting device according to claim 1,
A chemical solution tank for immersing the object to be treated in a chemical solution, a pure water cleaning tank for cleaning with pure water, and a spin dryer for drying,
A drive unit for moving the main body of the charge removing and transporting device so that the object to be treated is subjected to the treatment of the chemical solution immersion, pure water cleaning, and drying in the chemical solution tank, the pure water cleaning tank, and the spin dryer, respectively. Characteristic processing device. The processing device according to claim 4,
At least during the period from the immersion of the chemical solution in the chemical solution tank to the pure water cleaning in the pure water cleaning tank, the ionizer of the charge removing and transporting device continuously emits ions toward the object to be treated. A processing device characterized by the above-mentioned. The processing device according to claim 4,
An unloading unit where the object to be processed is placed after the drying process with the spin dryer,
At least during the period from when the spin dryer exits until the object to be processed is removed from the arm of the static eliminator / transporter at the unloading section, the ionizer of the static eliminator / transporter continuously emits ions toward the target to be treated. A processing device characterized in that the processing is performed. The processing device according to claim 4,
A processing apparatus wherein the processing object receives ions from the ionizer for 10 seconds or more.

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