JPH11238778A - Substrate-transferring device - Google Patents

Substrate-transferring device

Info

Publication number
JPH11238778A
JPH11238778A JP10040300A JP4030098A JPH11238778A JP H11238778 A JPH11238778 A JP H11238778A JP 10040300 A JP10040300 A JP 10040300A JP 4030098 A JP4030098 A JP 4030098A JP H11238778 A JPH11238778 A JP H11238778A
Authority
JP
Japan
Prior art keywords
substrate
cassette
transfer
substrates
transfer arm
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10040300A
Other languages
Japanese (ja)
Other versions
JP3260683B2 (en
Inventor
Tateo Nakano
健郎 中野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Electric Kagoshima Ltd
NEC Kagoshima Ltd
Original Assignee
Nippon Electric Kagoshima Ltd
NEC Kagoshima Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Kagoshima Ltd, NEC Kagoshima Ltd filed Critical Nippon Electric Kagoshima Ltd
Priority to JP4030098A priority Critical patent/JP3260683B2/en
Publication of JPH11238778A publication Critical patent/JPH11238778A/en
Application granted granted Critical
Publication of JP3260683B2 publication Critical patent/JP3260683B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Abstract

PROBLEM TO BE SOLVED: To eliminate static electricity that is generated at a lower substrate on a collective mounting by providing a plurality of static electricity eliminating devices equally between support arms for mounting the substrate. SOLUTION: A transfer arm X-axis drive part 21 is provided with a plurality of transfer arms 4, and ionizers 13 for emitting positive and derivative uons alternately arranged at the upper, lower, left, and right portions. The transfer arm 4 advances, while retaining substrates 2 and collectively inserts the substrate 2 into an exclusive cassette 3. Then, the transfer arm 4 descends due to the rotation and operation of upper/lower cylinders 14, while retaining the substrate 2 and lowers all substrates 2 into a substrate acceptor in the exclusive cassette 3. Then, when the transfer arm 4 descends to a position where it does not interfere with the substrates 2, it moves to a position where it does not interfere with a common cassette 1 and a treatment side cassette placement part and stands by. In this case, since the plurality of ionizers 13 are provided with a mechanism for discharging N2 gas, they discharge ions efficiently at all times and is able to charge-rneutrarize the equally charge nuetralize electrified static electricity for all substrates 2 to be transferred in batch.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、液晶表示用基板
(LCD用基板)、プラズマディスプレイ用基板(PD
P用基板)や半導体ウェハ等の基板移載装置に関する。
The present invention relates to a liquid crystal display substrate (LCD substrate) and a plasma display substrate (PD).
The present invention relates to an apparatus for transferring a substrate such as a P substrate) and a semiconductor wafer.

【0002】[0002]

【従来の技術】一般に、パソコンやワープロなどの表示
装置に用いられるLCD用基板は、ガラス基板表面に成
膜装置等の様々な装置による基板処理工程を経て製造が
なされる。基板処理を行う各工程間を搬送するために、
通常20枚程度の複数の基板が収納される共通のカセッ
トを使用している。この共通のカセットを受け入れる各
装置は、処理を行うために共通のカセットから自装置の
処理部へ導入するため専用のカセットを持っているもの
が多い。したがって、共通カセットから専用カセットへ
基板を移載する必要がある。
2. Description of the Related Art Generally, an LCD substrate used for a display device such as a personal computer or a word processor is manufactured on a glass substrate surface through a substrate processing step using various devices such as a film forming device. In order to transport between each process that performs substrate processing,
Usually, a common cassette in which about 20 substrates are stored is used. Many devices that receive the common cassette have a dedicated cassette for introducing the processing from the common cassette to the processing unit of the own device in order to perform processing. Therefore, it is necessary to transfer the substrate from the common cassette to the dedicated cassette.

【0003】このため、基板移載装置では共通カセット
と専用カセット間で基板を移載するために、基板を1枚
ずつ移載する方法や一括して移載する方法が取られてい
た。一般にカセット及び基板はほとんどが絶縁性材料に
よって形成されているため、基板移載装置による移載中
にカセットや基板は静電気を帯びることがあり、その静
電気を除去する手段を設けることが必要となる。
For this reason, in the substrate transfer apparatus, in order to transfer the substrates between the common cassette and the dedicated cassette, a method of transferring the substrates one by one or a method of collectively transferring the substrates has been adopted. Generally, most of the cassette and the substrate are formed of an insulating material. Therefore, the cassette or the substrate may be charged with static electricity during the transfer by the substrate transfer device, and it is necessary to provide a means for removing the static electricity. .

【0004】このような基板移載装置の第1の従来技術
として図5に示したような基板を一括して移載する装置
が使用されている。すなわち、複数の移載アーム4をそ
れらの基端部にスペーサを介装して積層することによ
り、ローダー30を構成する。このローダー30の下端
部には、ローダー30をX軸方向へ移動させるX軸駆動
部21,ローダー30およびX軸駆動部21を昇降し回
転させるための回転及び上下シリンダ14,Y軸方向に
移動させるY軸駆動部20を備えている。このローダー
30の複数の移載アーム4によって、共通カセット1内
に収納された複数の基板2を一括して取出し、処理装置
側の専用カセット3へ移載する。そして上部には、共通
カセット1や基板2の帯電を除去するためにイオナイザ
(静電気除去装置)15やバータイプイオナイザ16が
設けられている(例えば、実開平5−46839号公報
参照)。
As a first prior art of such a substrate transfer apparatus, an apparatus for collectively transferring substrates as shown in FIG. 5 is used. That is, the loader 30 is configured by stacking the plurality of transfer arms 4 with their spacers interposed at their base ends. At the lower end of the loader 30, an X-axis driving unit 21 for moving the loader 30 in the X-axis direction, a rotation for raising and lowering and rotating the loader 30 and the X-axis driving unit 21 and a vertical cylinder 14, moving in the Y-axis direction And a Y-axis driving unit 20 for driving the motor. The plurality of transfer arms 4 of the loader 30 collectively take out the plurality of substrates 2 stored in the common cassette 1 and transfer them to the dedicated cassette 3 on the processing apparatus side. An ionizer (static eliminator) 15 and a bar-type ionizer 16 are provided above the common cassette 1 and the substrate 2 (see, for example, Japanese Utility Model Laid-Open No. 5-46839).

【0005】また、第2の従来技術として特開平8−2
62091号公報には、複数のLCD用基板が収納され
たカセットからLCD用基板を1枚ずつ取出し、LCD
用基板の電気的検査を行う検査装置が示されており、こ
の検査装置には、カセットに帯電した静電気を除去する
第1のイオナイザと、搬送時にLCD用基板に帯電した
静電気を除去する第2のイオナイザが設けられている。
A second prior art is disclosed in Japanese Unexamined Patent Application Publication No.
No. 6,209,91 discloses that an LCD substrate is taken out one by one from a cassette in which a plurality of LCD substrates are stored, and the LCD substrate is taken out of the cassette.
1 shows an inspection apparatus for performing an electrical inspection of a substrate for use. The inspection apparatus includes a first ionizer for removing static electricity charged on a cassette and a second ionizer for removing static electricity charged on an LCD substrate during transportation. Is provided.

【0006】[0006]

【発明が解決しようとする課題】上記第1の従来技術に
おいては、基板を一括して移載する場合、中段部、下段
部の基板に発生した静電気が除去されにくく、静電破壊
による製品の歩留まりを低下させるという欠点がある。
その理由は、静電気除去装置を移載装置上部に配置して
いることにより、移載中に発生した静電気は、上部の基
板にしか静電気除去の効果が働かず、下側の基板は静電
気が除去されないためである。
In the first prior art, when the substrates are collectively transferred, static electricity generated on the middle and lower substrates is difficult to be removed, and the product is damaged due to electrostatic breakdown. There is a disadvantage that the yield is reduced.
The reason is that the static electricity removal device is located above the transfer device, so the static electricity generated during the transfer works only on the upper substrate, and the lower substrate removes the static electricity. Because it is not done.

【0007】また、処理装置側の専用カセットで発生し
た静電気は除去できず、静電破壊による製品の歩留まり
を低下させるという欠点がある。その理由は、成膜装置
等の真空となる専用カセットには静電気除去装置を載置
できないことにある。
In addition, static electricity generated in the dedicated cassette on the processing apparatus side cannot be removed, and there is a disadvantage that the yield of products due to electrostatic breakdown is reduced. The reason is that the static eliminator cannot be placed on a vacuum-dedicated cassette such as a film forming apparatus.

【0008】さらに、発生する静電気の場所を特定する
ことが難しいため、静電気を除去するためには、静電気
除去装置を多数あらゆる場所に配置しなければならない
という欠点がある。その理由は、カセットや多数の基板
の静電気を効果的に除去するためには、移動する移載部
の全ての範囲をカバーできる静電気除去装置が必要とな
ることにある。
Further, since it is difficult to specify the location of the generated static electricity, there is a drawback that a large number of static electricity removing devices must be arranged at every place in order to remove the static electricity. The reason is that in order to effectively remove static electricity from a cassette or a large number of substrates, a static electricity removing device that can cover the entire range of the moving transfer unit is required.

【0009】また、上記第2の従来技術においても、発
生する静電気の場所を特定することが難しいため、静電
気を除去するためには、静電気除去装置を多数あらゆる
場所に配置しなければならないという欠点がある。
In the second prior art as well, since it is difficult to identify the location of the generated static electricity, there is a drawback that a large number of static electricity removing devices must be arranged at every place in order to remove the static electricity. There is.

【0010】本発明の目的は、上記課題を解決するた
め、帯電された状態で供給された基板やカセットの静電
気及び、移載時に発生する静電気を全ての基板とカセッ
トに対して除去し、製品の歩留まり向上を図ることがで
きる基板移載装置を提供することである。
An object of the present invention is to eliminate the static electricity of a substrate or cassette supplied in a charged state and the static electricity generated at the time of transfer to all the substrates and cassettes in order to solve the above problem. It is an object of the present invention to provide a substrate transfer device which can improve the yield of the substrate.

【0011】[0011]

【課題を解決するための手段】本願の第1の発明の基板
移載装置は、第1のカセットから第2のカセットに複数
の基板を一括して移載するための複数基板支持アームを
持つ基板移載装置において、基板を移載するための各基
板支持アームの各支持アーム間に均等に複数の静電気除
去装置(イオナイザ)のイオン吹出口を有する。
According to a first aspect of the present invention, there is provided a substrate transfer apparatus having a plurality of substrate support arms for collectively transferring a plurality of substrates from a first cassette to a second cassette. In the substrate transfer apparatus, a plurality of ion discharge ports of a static eliminator (ionizer) are equally provided between each support arm of each substrate support arm for transferring a substrate.

【0012】本願の第2の発明の基板移載装置は、第1
のカセットから第2のカセットに基板を1枚ずつ移載す
るための基板支持アームを持つ基板移載装置において、
基板を移載するための基板支持アーム付け根に、複数の
静電気除去装置のイオン吹出口を有する。
A substrate transfer apparatus according to a second aspect of the present invention includes a first
A substrate transfer arm having a substrate support arm for transferring substrates one by one from a cassette to a second cassette,
At the base of the substrate support arm for transferring the substrate, a plurality of static eliminators are provided with ion outlets.

【0013】本願の第1の発明によれば、基板はカセッ
ト載置部に載置された複数の基板が収納されたカセット
から、基板処理を目的に複数の基板を収納するカセット
に一括して移載される。移動する基板移載部の各基板支
持アーム付け根に均等に取り付けられた静電気除去装置
が作用するので、移動しながら基板周辺、カセット、及
び一括移載される基板に帯電した静電気を均等に除去す
ることができる。
According to the first aspect of the present invention, the substrates are collectively transferred from a cassette storing a plurality of substrates mounted on the cassette mounting portion to a cassette storing a plurality of substrates for the purpose of substrate processing. Will be transferred. Since the static elimination device uniformly attached to the base of each substrate supporting arm of the moving substrate transfer portion operates, static electricity charged on the periphery of the substrate, the cassette, and the substrate to be collectively transferred is evenly removed while moving. be able to.

【0014】本願の第2の発明によれば、基板はカセッ
ト載置部に載置された複数の基板が収納されたカセット
から1枚ずつ基板処理を目的に複数の基板を収納するカ
セットに移載される。移動する基板移載部の基板支持ア
ーム付け根に取り付けられらた静電気除去装置が作用す
るので、移動しながら基板周辺、カセット、及び基板に
帯電した静電気を除去することができる。
According to the second aspect of the present invention, the substrates are transferred from the cassette storing a plurality of substrates mounted on the cassette mounting portion to the cassette storing a plurality of substrates for processing the substrates one by one. Will be posted. Since the static eliminator attached to the base of the substrate support arm of the moving substrate transfer section operates, static electricity charged on the periphery of the substrate, the cassette, and the substrate can be removed while moving.

【0015】また、本発明によれば、複数の基板を収納
した共通カセットが載置される載置台と、共通カセット
内の基板を一括して取り出す複数の移載アームを持ち該
移載アームを移動させる機構を有する移載部と、各移載
アームの付け根の上下左右に取り付けられた複数のイオ
ナイザと、移載部の複数の移載アームから一括して基板
を受け取る処理側カセット載置部の専用カセットとを有
する基板移載装置が得られる。
Further, according to the present invention, there are provided a mounting table on which a common cassette containing a plurality of substrates is mounted, and a plurality of transfer arms for taking out the substrates in the common cassette at once. A transfer unit having a mechanism for moving, a plurality of ionizers attached to the top, bottom, left, and right of the base of each transfer arm, and a processing-side cassette mounting unit that collectively receives substrates from the plurality of transfer arms of the transfer unit. And a substrate transfer device having the dedicated cassette described above.

【0016】さらに、本発明によれば、複数の基板を収
納した共通カセットが載置される載置台と、共通カセッ
ト内の基板を1枚づつ取り出す1つの移載アームを持つ
多関節ロボットと、移載アームの付け根の上下左右に取
り付けられらた複数のイオナイザと、移載アームの回転
と上下動作を行う回転及び上下シリンダと移載アームY
軸駆動部とを有する移載部と、移載部から基板を受け取
る処理側カセット載置部の専用カセットとを有する基板
移載装置が得られる。
Further, according to the present invention, there is provided a mounting table on which a common cassette containing a plurality of substrates is mounted, an articulated robot having one transfer arm for taking out the substrates in the common cassette one by one, A plurality of ionizers attached to the base of the transfer arm, up, down, left, and right;
A substrate transfer apparatus having a transfer unit having an axis driving unit and a dedicated cassette of a processing-side cassette mounting unit that receives a substrate from the transfer unit is obtained.

【0017】[0017]

【発明の実施の形態】次に本発明について図面を参照し
て詳細に説明する。図1は本発明の第1の実施の形態を
示す全体平面図であり、図2はその側面図、図3はその
移載機構部分の正面図である。第1の実施の形態の基板
移載装置は、図1に示すように他工程から搬送された複
数の基板2を搭載した共通カセット1が載置されるカセ
ット載置台18と、共通カセット1内の基板2を一括し
て取り出す複数の移載アーム4を持ち可動する移載部1
9と、各移載アーム4の付け根の上下左右に取り付けら
れた複数のイオナイザ13と、移載部19の複数の移載
アーム4から一括して基板2を受け取る処理側カセット
載置部11の専用カセット3とで構成されている。
DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described in detail with reference to the drawings. FIG. 1 is an overall plan view showing a first embodiment of the present invention, FIG. 2 is a side view thereof, and FIG. 3 is a front view of a transfer mechanism portion. As shown in FIG. 1, the substrate transfer device according to the first embodiment includes a cassette mounting table 18 on which a common cassette 1 on which a plurality of substrates 2 transported from another process is mounted is mounted. Transfer unit 1 having a plurality of transfer arms 4 for collectively removing substrates 2
9, a plurality of ionizers 13 attached to the base of each transfer arm 4, and a plurality of ionizers 13, and a processing-side cassette mounting unit 11 which receives the substrates 2 from the plurality of transfer arms 4 of the transfer unit 19 collectively. It is composed of a dedicated cassette 3.

【0018】そして移載部19の構成は、図1、図2、
図3に示すように、共通カセット1Aから1D及び専用
カセット3A、3Bの位置に移動する移載アームY軸駆
動部20とその走行を可能にするY軸線路8、8′、Y
軸ボールネジ9およびY軸ボールネジ駆動モータ10を
有し、Y軸駆動部20の上部には、X軸駆動部21の回
転と上下動作を可能にする回転及び上下シリンダ14を
介してX軸移載キャリア22が載置され、X軸移載キャ
リア22上には、共通カセット1Aから1D及び専用カ
セット3A、3Bへの進入を可能にする移載アームX軸
駆動部21が、X軸線路5、5′、X軸ボールネジ駆動
モータ7およびX軸ボールネジ6とともに載置される。
The structure of the transfer section 19 is shown in FIGS.
As shown in FIG. 3, the transfer arm Y-axis drive unit 20 which moves to the positions of the common cassettes 1A to 1D and the dedicated cassettes 3A and 3B, and the Y-axis lines 8, 8 'and Y which enable the traveling thereof.
It has a shaft ball screw 9 and a Y-axis ball screw drive motor 10, and is mounted on the upper part of a Y-axis drive unit 20 via a rotation and up-down cylinder 14 which enables rotation and vertical movement of an X-axis drive unit 21. A carrier 22 is mounted, and on the X-axis transfer carrier 22, a transfer arm X-axis drive unit 21 that enables entry from the common cassette 1 </ b> A to 1 </ b> D and dedicated cassettes 3 </ b> A, 3 </ b> B 5 'is mounted together with the X-axis ball screw drive motor 7 and the X-axis ball screw 6.

【0019】移載アームX軸駆動部21は、図2、図3
に示すように複数の移載アーム4とその上下左右に取り
付けられた複数のイオナイザ13を有し、イオナイザ1
3はそれぞれプラスイオンとマイナスイオンを放出する
専用のイオナイザであり、それらは互いに交互に配置さ
れる。
The transfer arm X-axis drive unit 21 is shown in FIGS.
As shown in FIG. 2, the ionizer 1 has a plurality of transfer arms 4 and a plurality of ionizers 13 attached to the upper, lower, left and right sides thereof.
Reference numeral 3 denotes a dedicated ionizer that emits positive ions and negative ions, respectively, which are arranged alternately with each other.

【0020】処理側カセット載置部11の専用カセット
3は、図1に示すように真空成膜装置基板投入部のよう
な処理側の装置配置に対応し斜めもしくは平行に配置さ
れる。
As shown in FIG. 1, the dedicated cassette 3 of the processing-side cassette mounting section 11 is arranged obliquely or parallel to the processing-side apparatus such as a vacuum film deposition apparatus substrate input section.

【0021】次に本発明の動作を図1、図2、図3を用
いて詳細に説明する。まず、他工程から搬送された複数
の基板2を搭載した共通カセット1がカセット載置台1
8に載置される。移載アーム4の移動は、まず共通カセ
ット1に対して垂直方向に進入できるようにY軸線路
8、8′とY軸ボールネジ駆動用モータ10によって駆
動されるY軸ボールネジ9によって共通カセット1Aの
位置に移載アームY軸駆動部20が移動し、共通カセッ
ト1に収納された複数の基板2の間に複数の移載アーム
4が挿入できる位置になるように回転及び上下シリンダ
14により配置される。
Next, the operation of the present invention will be described in detail with reference to FIGS. First, a common cassette 1 on which a plurality of substrates 2 transported from another process is mounted is placed on a cassette mounting table 1.
8. The transfer arm 4 is first moved by the Y-axis lines 8 and 8 'and the Y-axis ball screw 9 driven by the Y-axis ball screw driving motor 10 so that the transfer arm 4 can enter the common cassette 1 in the vertical direction. The transfer arm Y-axis drive unit 20 is moved to the position, and is arranged by the rotation and vertical cylinder 14 so that the transfer arm 4 can be inserted between the plurality of substrates 2 stored in the common cassette 1. You.

【0022】次に移載アームX軸駆動部21は、X軸線
路5、5′とモータ7によって駆動されるX軸ボールネ
ジ6によって共通カセット1側へ進入し、移載アーム4
が基板2を支持できる位置まで前進する。回転及び上下
シリンダ14によって移載アーム4は、すべての基板2
を共通カセット1内の基板受けから浮かせ基板2を取出
せる高さまで上昇する。基板受けと干渉しない高さにお
いて、移載アーム4は移載アームX軸駆動部21の動作
により、基板2を一括して引き出す。
Next, the transfer arm X-axis drive section 21 enters the common cassette 1 side by the X-axis lines 5, 5 'and the X-axis ball screw 6 driven by the motor 7, and the transfer arm 4
Moves forward to a position where it can support the substrate 2. The transfer arm 4 is moved by all the substrates 2
Is lifted from the substrate receiver in the common cassette 1 to a level at which the substrate 2 can be taken out. At a height that does not interfere with the substrate receiver, the transfer arm 4 collectively pulls out the substrate 2 by the operation of the transfer arm X-axis drive unit 21.

【0023】次に移載アーム4は基板2を保持したま
ま、移載アームY軸駆動部20の動作により、処理側カ
セット載置部11に載置された専用カセット11Bに対
向する位置まで移動する。移載アーム4は基板2を保持
したまま、回転及び上下シリンダ14により専用カセッ
ト3Bに挿入できる位置になるような回転方向と高さに
移動する。この際、専用カセット3B内基板受けに干渉
しない位置になるように動作する。
Next, the transfer arm 4 is moved to a position opposing the dedicated cassette 11B mounted on the processing-side cassette mount 11 by the operation of the transfer arm Y-axis drive unit 20 while holding the substrate 2. I do. While holding the substrate 2, the transfer arm 4 is moved by the rotation and up / down cylinder 14 in the rotation direction and height so that it can be inserted into the dedicated cassette 3B. At this time, the operation is performed so as not to interfere with the substrate receiver in the dedicated cassette 3B.

【0024】移載アーム4は基板2を保持したまま、移
載アームX軸駆動部21の動作により前進し、基板2を
一括して専用カセット3B内に挿入する。移載アーム4
は基板2を保持したまま、回転及び上下シリンダ14の
動作により下降し、すべての基板2を専用カセット3B
内の基板受け上に降ろす。移載アーム4は上下基板2に
干渉しない位置まで降下すると、移載アームX軸駆動部
21の動作により、共通カセット1と処理側カセット載
置部11と干渉しない位置まで移動し待機する。
The transfer arm 4 moves forward by the operation of the transfer arm X-axis drive unit 21 while holding the substrate 2, and inserts the substrate 2 collectively into the dedicated cassette 3B. Transfer arm 4
Is lowered by the rotation and the operation of the vertical cylinder 14 while holding the substrate 2, and all the substrates 2 are transferred to the dedicated cassette 3 </ b> B.
And drop it on the board receiver inside. When the transfer arm 4 descends to a position where the transfer arm 4 does not interfere with the upper and lower substrates 2, the operation of the transfer arm X-axis drive unit 21 moves to a position where the transfer arm 4 does not interfere with the common cassette 1 and the processing-side cassette mounting unit 11 and stands by.

【0025】以上の動作において、複数のイオナイザ1
3はN2ガス吹き出し機構を備えているため常時イオン
を効率良く放出し、一括移載される複数の基板2は上段
から下段まで全ての段の基板2に対して均等に帯電した
静電気を中和し静電気の除去を行うことができる。イオ
ナイザ13は移載される基板2を移載中常時除電しつづ
けるため、予期されない箇所で発生した静電気も除去す
る能力がある。
In the above operation, a plurality of ionizers 1
3 is equipped with a N2 gas blowing mechanism, so that ions are constantly emitted efficiently, and a plurality of substrates 2 which are collectively transferred neutralize static electricity charged uniformly on the substrates 2 in all stages from the upper stage to the lower stage. Static electricity can be removed. Since the ionizer 13 constantly removes static electricity during the transfer of the substrate 2 to be transferred, it has the ability to remove static electricity generated in unexpected places.

【0026】処理側において基板処理を終えた複数の基
板2は上記と逆の動作で共通カセット1Aへ移載され
る。この逆の動作の間も、複数のイオナイザ13は共通
カセット1、専用カセット3、基板2及び搬送中に基板
2に発生する静電気を除去する。共通カセット1Aに処
理を終えて戻った基板2は共通カセット1Aごと、次の
工程へ運ばれる。
The plurality of substrates 2 which have been processed on the processing side are transferred to the common cassette 1A by the reverse operation. During the reverse operation, the plurality of ionizers 13 remove static electricity generated on the common cassette 1, the dedicated cassette 3, the substrate 2, and the substrate 2 during transportation. The substrate 2 that has returned to the common cassette 1A after the processing is carried to the next step for each common cassette 1A.

【0027】次に本発明の第2の実施の形態について図
4を参照にして説明する。第2の実施の形態は、他工程
から搬送された複数の基板2を搭載した共通カセット1
が載置されるカセット載置台と、共通カセット1内の基
板2を一枚づつ取り出す一つの移載アーム4を持つ多関
節ロボット17と、移載アーム4の付け根の上下左右に
取り付けられた複数のイオナイザ13と、移載アーム4
の回転と上下動作を行う回転及び上下シリンダ14と移
載アームY軸駆動部20を持つ移載部19と、移載部1
9から基板2を受け取る処理側カセット載置部11の専
用カセット3とで構成されている。
Next, a second embodiment of the present invention will be described with reference to FIG. In the second embodiment, a common cassette 1 on which a plurality of substrates 2 conveyed from another process are mounted.
, A multi-joint robot 17 having one transfer arm 4 for taking out the substrates 2 in the common cassette 1 one by one, and a plurality of robots 17 mounted on the top, bottom, left and right of the base of the transfer arm 4 Ionizer 13 and transfer arm 4
A transfer unit 19 having a rotation and up / down cylinder 14 and a transfer arm Y-axis drive unit 20 for performing rotation and up / down operation of the transfer unit 1;
And a dedicated cassette 3 of the processing-side cassette mounting portion 11 which receives the substrate 2 from the substrate 9.

【0028】移載アーム4の付け根に付けられたN2ガ
ス送風式イオナイザ13は、移載アーム4の上下左右計
4箇所の位置に配置される。各イオナイザ13はそれぞ
れプラスイオンとマイナスイオンを放出する専用のイオ
ナイザであり、それらは互いに交互に配置される。
The N2 gas blowing type ionizer 13 attached to the base of the transfer arm 4 is arranged at a total of four positions of the transfer arm 4 in the upper, lower, left and right directions. Each of the ionizers 13 is a dedicated ionizer that emits positive ions and negative ions, and they are alternately arranged.

【0029】次に第2の実施の形態の動作について説明
する。移載部19は多関節ロボット17を使用して1枚
づつ基板2を移載する以外は、第1の実施の形態と動作
は同じである。第1の実施の形態の効果は一括移載する
基板2の下側基板2の除電を主目的にしたのに対し、本
実施の形態はN2ガス送風式イオナイザ13を使用する
ことで、移載する基板2と共通カセット1と専用カセッ
ト3とその周辺を効率良く除電することを目的としてい
る。
Next, the operation of the second embodiment will be described. The operation of the transfer unit 19 is the same as that of the first embodiment except that the transfer unit 19 transfers the substrates 2 one by one using the articulated robot 17. The effect of the first embodiment is mainly for the purpose of removing electricity from the lower substrate 2 on which the substrates 2 are collectively transferred. On the other hand, in the present embodiment, the transfer is performed by using the N2 gas blowing ionizer 13. The purpose is to efficiently remove electricity from the substrate 2, the common cassette 1, the dedicated cassette 3, and the periphery thereof.

【0030】[0030]

【発明の効果】以上説明した本発明の第一の効果は、一
括移載時の下側基板2に発生する静電気を除電できると
いうことである。これにより歩留まり向上ができる。そ
の理由は従来の静電気除電装置(イオナイザ)では最上
部の基板上の静電気しか除電できなかったからである。
The first effect of the present invention described above is that static electricity generated on the lower substrate 2 during batch transfer can be eliminated. Thereby, the yield can be improved. The reason is that the conventional static electricity eliminator (ionizer) can eliminate static electricity only on the uppermost substrate.

【0031】第二の効果は、静電気除電装置を配置でき
ない箇所の静電気を除電できるということである。これ
により、歩留まり向上ができる。その理由は、可動部で
ある移載アーム側に静電気除電装置を配置することによ
る。
The second effect is that static electricity can be removed from a portion where the static electricity removing device cannot be arranged. Thereby, the yield can be improved. The reason is that the static electricity eliminator is arranged on the transfer arm side which is a movable part.

【0032】第三の効果は、発生する箇所毎に静電気除
電装置を配置する必要がなくなった。その理由は、可動
部である移載アーム側に静電気除電装置を配置すること
によることと、特定できない静電気の発生箇所も同時に
除電できることによる。
The third effect is that it is no longer necessary to dispose an electrostatic discharger at each location where the static electricity is removed. The reason is that the static electricity eliminator is arranged on the transfer arm side, which is a movable part, and that the unspecified static electricity generating part can be simultaneously neutralized.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の基板移載装置の第1の実施の形態を示
す全体平面図である。
FIG. 1 is an overall plan view showing a first embodiment of a substrate transfer device according to the present invention.

【図2】本発明の第1の実施の形態の側面図である。FIG. 2 is a side view of the first embodiment of the present invention.

【図3】本発明の第1の実施の形態の移載機構部の正面
図である。
FIG. 3 is a front view of the transfer mechanism according to the first embodiment of the present invention.

【図4】本発明の基板載装置の第2の実施の形態の側面
図である。
FIG. 4 is a side view of a second embodiment of the substrate mounting apparatus according to the present invention.

【図5】従来の基板移載装置の側面図である。FIG. 5 is a side view of a conventional substrate transfer device.

【符号の説明】[Explanation of symbols]

1 共通カセット 2 基板 3 専用カセット 4 移載アーム 5、5′ X軸線路 6 X軸ボールネジ 7 X軸ボールネジ駆動モータ 8、8′ Y軸線路 9 Y軸ボールネジ 10 Y軸ボールネジ駆動用モータ 11 処理側カセット載置部 12 基板移載装置 13 イオナイザ(A〜V) 14 回転及び上下シリンダ 15 イオナイザ 16 バータイプイオナイザ 17 多関節ロボット 18 カセット載置台 19 移載部 20 移載アームY軸駆動部 21 移載アームX軸駆動部 22 X軸移載キャリア DESCRIPTION OF SYMBOLS 1 Common cassette 2 Substrate 3 Dedicated cassette 4 Transfer arm 5, 5 'X axis line 6 X axis ball screw 7 X axis ball screw drive motor 8, 8' Y axis line 9 Y axis ball screw 10 Y axis ball screw drive motor 11 Processing side Cassette placement unit 12 Substrate transfer device 13 Ionizer (A to V) 14 Rotation and vertical cylinder 15 Ionizer 16 Bar type ionizer 17 Articulated robot 18 Cassette mounting table 19 Transfer unit 20 Transfer arm Y-axis drive unit 21 Transfer Arm X-axis drive unit 22 X-axis transfer carrier

Claims (5)

【特許請求の範囲】[Claims] 【請求項1】 第1のカセットから第2のカセットに複
数の基板を一括して移載するための複数基板支持アーム
を持つ基板移載装置において、前記基板を移載するため
の各基板支持アームの各支持アーム間に均等に複数の静
電気除去装置(イオナイザ)を設けたことを特徴とする
基板移載装置。
1. A substrate transfer apparatus having a plurality of substrate support arms for collectively transferring a plurality of substrates from a first cassette to a second cassette, wherein each substrate support for transferring the substrates is provided. A substrate transfer device, wherein a plurality of static eliminators (ionizers) are provided evenly between each support arm of the arms.
【請求項2】 第1のカセットから第2のカセットに基
板を1枚ずつ移載するための基板支持アームを持つ基板
移載装置において、前記基板を移載するための基板支持
アーム付け根に、複数の静電気除去装置(イオナイザ)
を設けたことを特徴とする基板移載装置。
2. A substrate transfer apparatus having a substrate support arm for transferring substrates one by one from a first cassette to a second cassette, wherein: Multiple static eliminators (ionizers)
A substrate transfer device, comprising:
【請求項3】 複数の基板を収納した共通カセットが載
置される載置台と、前記共通カセット内の基板を一括し
て取り出す複数の移載アームを持ち該移載アームを移動
させる機構を有する移載部と、前記各移載アームの付け
根の上下左右に取り付けられた複数のイオナイザと、前
記移載部の複数の移載アームから一括して基板を受け取
る処理側カセット載置部の専用カセットとを有すること
を特徴とする基板移載装置。
3. A mounting table on which a common cassette accommodating a plurality of substrates is mounted, and a mechanism for moving the transfer arms having a plurality of transfer arms for collectively taking out the substrates in the common cassette. A transfer unit, a plurality of ionizers attached to the top, bottom, left and right of the base of each transfer arm, and a dedicated cassette for a processing-side cassette mounting unit that receives substrates from the plurality of transfer arms of the transfer unit at a time And a substrate transfer device.
【請求項4】 前記移載部は、共通カセットと専用カセ
ットの位置間を移動する移載アームY軸駆動部と、この
上部に設けられた移載アームX軸駆動部と、前記移載ア
ームX軸駆動部と移載アームY軸駆動部の間に設けられ
たX軸駆動部の回転と上下動作を可能にする回転及び上
下シリンダとを有する請求項3記載の基板移載装置。
4. The transfer unit includes a transfer arm Y-axis drive unit that moves between the position of a common cassette and a dedicated cassette, a transfer arm X-axis drive unit provided above the transfer arm, and the transfer arm. 4. The substrate transfer device according to claim 3, further comprising a rotation and up / down cylinder that enables rotation and up / down operation of the X-axis drive unit provided between the X-axis drive unit and the transfer arm Y-axis drive unit.
【請求項5】 複数の基板を収納した共通カセットが載
置される載置台と、前記共通カセット内の基板を1枚づ
つ取り出す1つの移載アームを持つ多関節ロボットと、
前記移載アームの付け根の上下左右に取り付けられた複
数のイオナイザと、前記移載アームの回転と上下動作を
行う回転及び上下シリンダと移載アームY軸駆動部とを
有する移載部と、前記移載部から基板を受け取る処理側
カセット載置部の専用カセットとを有することを特徴と
する基板移載装置。
5. A multi-joint robot having a mounting table on which a common cassette containing a plurality of substrates is mounted, and a transfer arm for taking out one substrate from the common cassette one by one;
A plurality of ionizers attached to the top, bottom, left and right of the base of the transfer arm, a transfer unit having a rotation and up / down cylinder for performing rotation and vertical movement of the transfer arm, and a transfer arm Y-axis drive unit; A substrate transfer device, comprising: a processing-side cassette mounting portion dedicated cassette for receiving a substrate from the transfer portion.
JP4030098A 1998-02-23 1998-02-23 Substrate transfer device Expired - Fee Related JP3260683B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4030098A JP3260683B2 (en) 1998-02-23 1998-02-23 Substrate transfer device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4030098A JP3260683B2 (en) 1998-02-23 1998-02-23 Substrate transfer device

Publications (2)

Publication Number Publication Date
JPH11238778A true JPH11238778A (en) 1999-08-31
JP3260683B2 JP3260683B2 (en) 2002-02-25

Family

ID=12576775

Family Applications (1)

Application Number Title Priority Date Filing Date
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Country Status (1)

Country Link
JP (1) JP3260683B2 (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004172546A (en) * 2002-11-22 2004-06-17 Sharp Corp Static eliminating transport device, and processor equipped with same
WO2007102426A1 (en) * 2006-03-06 2007-09-13 Hitachi Kokusai Electric Inc. Substrate processing apparatus and substrate processing method
KR100826102B1 (en) * 2006-12-08 2008-04-29 주식회사 케이씨텍 Device for dummping wafer
CN100389486C (en) * 2006-04-28 2008-05-21 友达光电股份有限公司 System for eliminating static
JP2010129776A (en) * 2008-11-27 2010-06-10 Disco Abrasive Syst Ltd Processing device and ionized-air supply program
KR100980280B1 (en) * 2007-05-01 2010-09-06 가부시키가이샤 퓨쳐비전 When carrier method for neutralization and neutralization carrier device
KR100982818B1 (en) 2007-12-14 2010-09-16 프라임 뷰 인터내셔널 코오포레이션 리미티드 Apparatus for transferring substrate
WO2014067171A1 (en) * 2012-11-02 2014-05-08 深圳市华星光电技术有限公司 Forklift and warehouse system
CN109454492A (en) * 2018-12-27 2019-03-12 珠海格力智能装备有限公司 The processing method of processing unit (plant) and the glass of mobile device

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0532342A (en) * 1991-06-13 1993-02-09 Ricoh Co Ltd Carriage device for sheet-like flexible substrate
JPH07112802A (en) * 1993-10-18 1995-05-02 Tokyo Electron Ltd Carrier device
JPH07142382A (en) * 1993-11-18 1995-06-02 Nikon Corp Substrate transporting device
JPH07321177A (en) * 1994-05-23 1995-12-08 Dainippon Screen Mfg Co Ltd Substrate carrying device
JPH08264619A (en) * 1995-03-24 1996-10-11 Tokyo Electron Ltd Transferring device and inspection device with transferring device
JPH10256344A (en) * 1997-03-13 1998-09-25 Tokyo Electron Ltd Method of cooling substrate, substrate treating apparatus and substrate transferring apparatus

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0532342A (en) * 1991-06-13 1993-02-09 Ricoh Co Ltd Carriage device for sheet-like flexible substrate
JPH07112802A (en) * 1993-10-18 1995-05-02 Tokyo Electron Ltd Carrier device
JPH07142382A (en) * 1993-11-18 1995-06-02 Nikon Corp Substrate transporting device
JPH07321177A (en) * 1994-05-23 1995-12-08 Dainippon Screen Mfg Co Ltd Substrate carrying device
JPH08264619A (en) * 1995-03-24 1996-10-11 Tokyo Electron Ltd Transferring device and inspection device with transferring device
JPH10256344A (en) * 1997-03-13 1998-09-25 Tokyo Electron Ltd Method of cooling substrate, substrate treating apparatus and substrate transferring apparatus

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004172546A (en) * 2002-11-22 2004-06-17 Sharp Corp Static eliminating transport device, and processor equipped with same
WO2007102426A1 (en) * 2006-03-06 2007-09-13 Hitachi Kokusai Electric Inc. Substrate processing apparatus and substrate processing method
JPWO2007102426A1 (en) * 2006-03-06 2009-07-23 株式会社日立国際電気 Substrate processing apparatus and substrate processing method
CN100389486C (en) * 2006-04-28 2008-05-21 友达光电股份有限公司 System for eliminating static
KR100826102B1 (en) * 2006-12-08 2008-04-29 주식회사 케이씨텍 Device for dummping wafer
KR100980280B1 (en) * 2007-05-01 2010-09-06 가부시키가이샤 퓨쳐비전 When carrier method for neutralization and neutralization carrier device
KR100982818B1 (en) 2007-12-14 2010-09-16 프라임 뷰 인터내셔널 코오포레이션 리미티드 Apparatus for transferring substrate
JP2010129776A (en) * 2008-11-27 2010-06-10 Disco Abrasive Syst Ltd Processing device and ionized-air supply program
WO2014067171A1 (en) * 2012-11-02 2014-05-08 深圳市华星光电技术有限公司 Forklift and warehouse system
CN109454492A (en) * 2018-12-27 2019-03-12 珠海格力智能装备有限公司 The processing method of processing unit (plant) and the glass of mobile device

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