JP2004165562A - Substrate with speaker and manufacturing method thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate with a speaker and a manufacturing method thereof in which miniaturization is attained as a whole. <P>SOLUTION: A substrate 1 with a speaker is provided with a multilayer printed wiring board part 3 formed by laminating a plurality of thermoplastic films to which patterning is applied, and a speaker 4, a communication means 5 and a drive control means 6 are buried within the multilayer printed wiring board part 3. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a speaker-equipped board having a speaker inside a multilayer printed wiring board and a method of manufacturing the same.
[0002]
[Prior art]
2. Description of the Related Art Conventionally, in a product including a speaker, a configuration is known in which a speaker and a circuit board on which a drive control unit that drives and controls the speaker are mounted separately. In this case, assemblability and wiring configuration are complicated. To cope with this, there is a configuration in which a speaker is mounted on a circuit board.
[0003]
[Problems to be solved by the invention]
In the case of this configuration, there is a problem that an extra space for arranging the speakers is required on the circuit board, which causes an increase in the size of the board, and also increases the size of the board with speakers.
[0004]
SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a speaker-equipped substrate and a method of manufacturing the same, which can be downsized as a whole.
[0005]
[Means for Solving the Problems]
The present invention has been made by focusing on the following points. The present applicant has developed a printed wiring board formed by laminating a plurality of patterned thermoplastic resin films and integrally pressing them. Compared with the conventional substrate, that is, a printed wiring board manufactured by repeating lamination, curing, and patterning of wiring for each layer, a great improvement in quality and a reduction in the number of processes can be realized when a multi-layer structure is used. This enables shorter delivery times. Further, since a thermoplastic resin base material is used, a material cycle in which only the resin is separated and reused is enabled.
[0006]
In this new printed wiring board, the configuration in which electronic components are built in is also simplified. That is, the patterned thermoplastic resin film is cut off in a region where the electronic component is to be embedded, and the electronic component is arranged in the cut portion and integrally pressed, whereby an electronic component built-in substrate can be obtained.
[0007]
The invention of claim 1, which focuses on the above points, includes a multilayer printed wiring board portion formed by laminating a plurality of patterned thermoplastic films, and a speaker is embedded inside the multilayer printed wiring board portion. With the configuration, the size and thickness of the speaker-equipped substrate can be reduced.
[0008]
In this case, the multi-layer printed wiring board includes a command signal generating means for generating a command signal for controlling the speaker, and a drive control unit for driving and controlling the speaker based on the command signal. It may be buried inside the part. According to this, the speaker, the command signal generating means, and the drive control unit can be provided as one unit, so that the size and the configuration can be simplified as compared with a configuration separately provided.
[0009]
Further, if the command signal generating means is buried inside the multilayer printed wiring board portion as in the invention of claim 3, further downsizing can be achieved.
[0010]
As in the fourth aspect of the present invention, the command signal generating means may be constituted by a communication means. According to this, the speaker can be turned on and off by external communication. Further, the command signal generating means may be constituted by switch means as in the invention of claim 5, and in this case, the speaker is directly turned on / off by, for example, a user's on operation or an on operation by an external factor. Becomes possible.
[0011]
According to the method of manufacturing a substrate with a speaker according to the invention of claim 6, in the process of forming a multilayer printed wiring board portion by laminating a plurality of patterned thermoplastic films, the speaker is placed inside the multilayer printed wiring board portion. Since they are arranged and integrated, the speaker can be arranged inside the multilayer printed wiring board at the same time as the formation of the multilayer printed wiring board, and a small and thin board with speakers can be easily manufactured.
[0012]
In this case, a command signal generating means for generating a command signal for controlling the speaker, and a command signal generating means for generating a command signal for controlling the speaker, in addition to the speaker, may be provided. May be used as a drive control unit that drives and controls the speaker. According to this, it is possible to manufacture a speaker-equipped board including the speaker, the command signal generation unit, and the drive control unit as one unit. There is no need for separate installation as compared to the configuration that does.
[0013]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, a first embodiment of the present invention will be described with reference to FIGS. FIG. 2 shows a key holder 2 in which a speaker-equipped substrate 1 according to an embodiment of the present invention is housed. The speaker-equipped board 1 includes a multi-layer printed wiring board section 3 as a multi-layer printed wiring board section, a speaker 4 composed of, for example, a piezoelectric speaker, a wireless communication section 5 as a command signal generating section, a drive control section 6, and a battery 7. Is built in.
[0014]
The communication means 5 is composed of an IC chip and receives a communication signal from the external transmitter 8 to generate a command signal for controlling the speaker 4. The drive control means 6 is composed of an IC chip, and controls the drive of the speaker 4 based on the command signal. The speaker 4, the communication unit 5, the drive control unit 6, and the battery 7 are buried inside the multilayer printed wiring board 3.
[0015]
Now, the speaker-equipped substrate 1 is a so-called multilayer printed wiring board, and a basic concept of a method of manufacturing the multilayer printed wiring board will be described. FIG. 3 shows a manufacturing process of the multilayer printed wiring board. First, a wiring pattern designed as described above by etching a conductor foil, for example, a 18 μm thick copper foil (or an aluminum foil) attached to one surface of a thermoplastic resin film (thermoplastic film) as an insulating base material. (Step P1). When the patterning of each layer is completed, a protective film is attached to a surface on which no pattern is formed.
[0016]
After adhering the protective film, a carbon dioxide gas laser or an excimer laser is irradiated from the protective film side to form a bottomed via hole having a conductive pattern (copper foil) as a bottom surface at a predetermined position (step P2). In this step, mechanical processing such as drilling is also possible, but it is necessary to make a fine hole, so that laser processing is preferable in order to ensure high accuracy.
[0017]
After forming a via hole for each layer, the via hole is filled with a conductive paste (conductive material) as an interlayer connecting material (step P3). The conductive paste is obtained by adding a binder resin or an organic solvent to metal particles such as copper, silver, and tin and kneading the mixture to form a paste. The conductive paste is printed and filled in the via hole with the conductive pattern side of the one-sided conductive film facing down by a screen printing machine using a metal mask. After charging, the protective film is peeled off (Step P4).
[0018]
After peeling off the protective film, the respective layers are laminated with the conductor pattern side of the single-sided conductor film facing down (step P5). At this time, the electrodes formed on the respective elements (bare chips) such as the speaker, the drive control unit, the communication unit, and the battery are connected to the contact points of the conductors, and then heat-pressed and temporarily fixed. In order to embed the chip, it is necessary to previously form a hole serving as a guide at the embedding position of the number of resin films corresponding to the thickness of the chip. And no shavings. For this reason, workability is remarkably improved as compared with a conventional process of processing an epoxy substrate and embedding a chip.
[0019]
A cover layer is laminated on the lowermost layer so as to cover the conductor pattern. After lamination, pressure molding is performed by a vacuum pressure press at 200 ° C. to 350 ° C. at a pressure of 0.1 MPa to 10 MPa (step P6). FIG. 4 shows the pressurizing temperature condition at this time. Thereby, the integral formation of the resin film (formation of the multilayer printed wiring board portion 3), the internal arrangement of the speaker 4, the communication means 5, the drive control means 6, and the battery 7, and the three-dimensional wiring can be simultaneously performed.
[0020]
The speaker-equipped substrate 1 manufactured in this manner is provided in the key holder 2. The key holder 2 is used by connecting, for example, a car key to the strap 2a. When the user forgets where to place the key, the user causes the external transmitter 8 to transmit a speaker drive signal, and the communication means 5 receives the signal, and the communication means 5 drives the command signal. Output to the control means 6, the drive control means 6 causes the speaker 4 to sound, for example, in the form of an alarm sound. This allows the user to recognize the location of the key holder 2, that is, the location of the key of the car.
[0021]
As described above, according to the present embodiment, the speaker 4 is embedded in the multilayer printed wiring board unit 3 formed by laminating a plurality of patterned resin films. And a reduction in thickness can be achieved.
[0022]
A communication means 5 is provided as a command signal generating means for generating a command signal for controlling the speaker 4, and a drive control means 6 for driving and controlling the speaker 4 based on the command signal and a battery 7 are connected to the multilayer printed wiring board section. 3, the speaker 4, the communication means 5, the drive control means 6, and the battery 7 can be provided as one unit, so that miniaturization and simplification of the configuration can be achieved as compared with a configuration separately provided. Can be planned.
Further, since the command signal generating means is constituted by the communication means 5, the speaker 4 can be turned on and off by external communication.
[0023]
Further, in the process of forming a multilayer printed wiring board section 3 by laminating a plurality of patterned resin films, the speaker 4 is arranged inside the multilayer printed wiring board section 3 and integrated, so that the multilayer printed wiring board section 3 is integrated. The speaker 4 can be arranged inside the multilayer printed wiring board section 3 simultaneously with the formation of the section 3, and the small and thin speaker-equipped board 1 can be easily manufactured.
[0024]
FIGS. 5 and 6 show a second embodiment of the present invention. In the speaker-equipped board 11 of this embodiment, the command signal generating means is constituted by a switch means 12 comprising, for example, a piezoelectric element. The speaker-equipped substrate 11 is embedded in a thick cover of the book 13, paying attention to its thinness. The drive control means 6 controls the speaker 4 to sound a melody.
[0025]
When the book 13 is closed, the switch means 12 outputs a signal for turning off the speaker 4, and the speaker 4 does not sound. When the book 13 is opened, the switch means 12 operates to output a command signal for turning on the speaker, and the speaker 6 sounds a melody via the drive control means 6.
[0026]
Instead of the switch means 12, a switch means 14 comprising a fixed contact pattern 14a and a movable contact plate 14b may be used as shown in FIG. 7 as a third embodiment of the present invention. Alternatively, as shown in FIG. 8 as a fourth embodiment of the present invention, the switch means 15 may be constituted by a push button 15a and a switch section 15b which is turned on / off by the push button 15a. In this case, the push button 15a can be depressed from the state shown in FIG. 8, and when the push button 15a is depressed, the switch section 15b is turned on (a speaker off signal as a command signal).
[0027]
According to the second, third, and fourth embodiments, the speaker 4 is directly turned on / off by a direct switch-on factor, for example, a user's on-operation or an on-operation by an external factor (opening / closing a book). It is possible to do.
[0028]
In addition, the present invention is not limited to the above embodiments. For example, a battery may be separately provided, and the output from the speaker is not limited to an alarm sound or a melody, but may be a buzzer sound or a voice.
[Brief description of the drawings]
FIG. 1 is a longitudinal sectional side view of a board with speakers showing a first embodiment of the present invention. FIG. 2 is a perspective view of a key holder and an external transmitter. FIG. 3 is a view showing a manufacturing process of a multilayer printed wiring board. FIG. 5 shows a pressurized temperature condition in the case of manufacturing a multilayer printed wiring board. FIG. 5 is a view corresponding to FIG. 1 showing a second embodiment of the present invention. FIG. 6 (a) shows a closed state of a book. And (b) show the opened state. FIG. 7 is a view corresponding to FIG. 1 showing a third embodiment of the present invention. FIG. 8 is a view corresponding to FIG. 1 showing a fourth embodiment of the present invention. Description】
1 is a board with a speaker, 2 is a key holder, 3 is a multilayer printed wiring board section, 4 is a speaker, 5 is a communication means (command signal generation means), 6 is a drive control means, 11 is a board with a speaker, and 12 is a switch means ( Command signal generating means), 13 is a book, and 14 and 15 are switch means (command signal generating means).

Claims (7)

A substrate with a speaker, comprising: a multilayer printed wiring board portion formed by laminating a plurality of patterned thermoplastic films; and a speaker embedded in the multilayer printed wiring board portion. A command signal generating means for generating a command signal for controlling a speaker, and a drive control unit for driving and controlling the speaker based on the command signal is embedded in the multilayer printed wiring board. Item 2. The substrate with a speaker according to Item 1. 3. The multilayer printed circuit board according to claim 2, wherein said command signal generating means is buried inside a multilayer printed circuit board section. 4. The speaker-equipped board according to claim 2, wherein the command signal generating unit is a communication unit. 4. The board with a speaker according to claim 2, wherein said command signal generating means is a switch means. Manufacturing a speaker-equipped substrate, wherein a speaker is arranged and integrated in the multilayer printed wiring board portion in the process of forming a multilayer printed wiring board portion by laminating a plurality of patterned thermoplastic films. Method. The electronic components disposed inside the thermoplastic film are, in addition to the speaker, a command signal generating unit that generates a command signal for controlling the speaker and a drive control unit that drives and controls the speaker based on the command signal. 7. The method for manufacturing a substrate with a speaker according to claim 6, wherein:

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