JP2004156070A5 - - Google Patents

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Publication number
JP2004156070A5
JP2004156070A5 JP2002320278A JP2002320278A JP2004156070A5 JP 2004156070 A5 JP2004156070 A5 JP 2004156070A5 JP 2002320278 A JP2002320278 A JP 2002320278A JP 2002320278 A JP2002320278 A JP 2002320278A JP 2004156070 A5 JP2004156070 A5 JP 2004156070A5
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002320278A
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Japanese (ja)
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JP2004156070A (en
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Publication date
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Priority to JP2002320278A priority Critical patent/JP2004156070A/en
Priority claimed from JP2002320278A external-priority patent/JP2004156070A/en
Publication of JP2004156070A publication Critical patent/JP2004156070A/en
Publication of JP2004156070A5 publication Critical patent/JP2004156070A5/ja
Pending legal-status Critical Current

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JP2002320278A 2002-11-01 2002-11-01 Composition of etchant for multilayer film including transparent electroconductive film Pending JP2004156070A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002320278A JP2004156070A (en) 2002-11-01 2002-11-01 Composition of etchant for multilayer film including transparent electroconductive film

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002320278A JP2004156070A (en) 2002-11-01 2002-11-01 Composition of etchant for multilayer film including transparent electroconductive film

Publications (2)

Publication Number Publication Date
JP2004156070A JP2004156070A (en) 2004-06-03
JP2004156070A5 true JP2004156070A5 (en) 2005-12-08

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ID=32801236

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002320278A Pending JP2004156070A (en) 2002-11-01 2002-11-01 Composition of etchant for multilayer film including transparent electroconductive film

Country Status (1)

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JP (1) JP2004156070A (en)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004356616A (en) * 2003-05-28 2004-12-16 Samsung Electronics Co Ltd Etchant for wiring and method for manufacturing thin film transistor display panel using the same
JP4428995B2 (en) 2003-12-03 2010-03-10 関東化学株式会社 Etching solution composition for metal film
KR101160829B1 (en) * 2005-02-15 2012-06-29 삼성전자주식회사 Etchant composition and method for thin film transistor array panel
KR101124569B1 (en) * 2005-06-09 2012-03-15 삼성전자주식회사 Echant and method for fabricating interconnection line and method for fabricating thin film transistor substrate using the same
DE102005035255A1 (en) * 2005-07-25 2007-02-01 Merck Patent Gmbh Etching media for oxide, transparent, conductive layers
JP4920266B2 (en) * 2006-02-17 2012-04-18 株式会社フルヤ金属 Method for manufacturing substrate having laminated structure
JP5328083B2 (en) * 2006-08-01 2013-10-30 キヤノン株式会社 Oxide etching method
JP4957584B2 (en) * 2008-02-29 2012-06-20 東ソー株式会社 Etching composition and etching method
JP5007907B2 (en) * 2008-05-09 2012-08-22 株式会社豊田中央研究所 Etching solution and method for manufacturing semiconductor device
KR101146980B1 (en) * 2009-02-17 2012-05-22 삼성모바일디스플레이주식회사 Organic light emitting diode and manufacturing method thereof
JP2011108975A (en) * 2009-11-20 2011-06-02 Dnp Fine Chemicals Co Ltd Etchant for conductive film and method of etching conductive film
JP2014199565A (en) * 2013-03-29 2014-10-23 大日本印刷株式会社 Electrode member for touch panel and manufacturing method of electrode member for touch panel
WO2016111202A1 (en) * 2015-01-09 2016-07-14 三菱マテリアル株式会社 Multilayer film
JP2016130010A (en) * 2015-01-09 2016-07-21 三菱マテリアル株式会社 Laminated film
WO2017164209A1 (en) * 2016-03-23 2017-09-28 三菱マテリアル株式会社 Laminated transparent conductive film, laminated wiring film, and method for producing laminated wiring film
JP6776931B2 (en) 2016-03-23 2020-10-28 三菱マテリアル株式会社 Manufacturing method of laminated reflective electrode film, laminated reflective electrode pattern, laminated reflective electrode pattern
JP6888318B2 (en) * 2016-03-23 2021-06-16 三菱マテリアル株式会社 Method for manufacturing laminated transparent conductive film, laminated wiring film and laminated wiring film
CN109554711A (en) * 2019-01-31 2019-04-02 武汉华星光电半导体显示技术有限公司 Etchant

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