JP2004153254A - 挿入モジュール、部品冷却方法および冷却要求適合方法 - Google Patents

挿入モジュール、部品冷却方法および冷却要求適合方法 Download PDF

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Publication number
JP2004153254A
JP2004153254A JP2003345529A JP2003345529A JP2004153254A JP 2004153254 A JP2004153254 A JP 2004153254A JP 2003345529 A JP2003345529 A JP 2003345529A JP 2003345529 A JP2003345529 A JP 2003345529A JP 2004153254 A JP2004153254 A JP 2004153254A
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JP
Japan
Prior art keywords
insertion module
housing
cooling
component
area
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2003345529A
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English (en)
Japanese (ja)
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JP2004153254A5 (enExample
Inventor
Christian Muennich
メンニヒ クリスチャン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Agilent Technologies Inc
Original Assignee
Agilent Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agilent Technologies Inc filed Critical Agilent Technologies Inc
Publication of JP2004153254A publication Critical patent/JP2004153254A/ja
Publication of JP2004153254A5 publication Critical patent/JP2004153254A5/ja
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/20554—Forced ventilation of a gaseous coolant
    • H05K7/20563—Forced ventilation of a gaseous coolant within sub-racks for removing heat from electronic boards

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  • Engineering & Computer Science (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP2003345529A 2002-10-29 2003-10-03 挿入モジュール、部品冷却方法および冷却要求適合方法 Withdrawn JP2004153254A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP02024081A EP1416782B1 (en) 2002-10-29 2002-10-29 Insert module for a modular measurement device

Publications (2)

Publication Number Publication Date
JP2004153254A true JP2004153254A (ja) 2004-05-27
JP2004153254A5 JP2004153254A5 (enExample) 2006-10-19

Family

ID=32087960

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003345529A Withdrawn JP2004153254A (ja) 2002-10-29 2003-10-03 挿入モジュール、部品冷却方法および冷却要求適合方法

Country Status (4)

Country Link
US (1) US6937469B2 (enExample)
EP (1) EP1416782B1 (enExample)
JP (1) JP2004153254A (enExample)
DE (1) DE60203915T2 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7167368B2 (en) * 2005-03-31 2007-01-23 Inventec Corporation Electronic equipment case structure
TWI511655B (zh) * 2013-03-14 2015-12-01 Wistron Corp 流道調變裝置及其相關散熱系統

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3967874A (en) * 1975-09-30 1976-07-06 Calabro Anthony Denis Uniformly cooled printed circuit board mounting assembly
US4644443A (en) * 1985-09-27 1987-02-17 Texas Instruments Incorporated Computer cooling system using recycled coolant
US4821145A (en) * 1987-11-17 1989-04-11 International Business Machines Corporation Pluggable assembly for printed circuit cards
US4977532A (en) * 1988-04-06 1990-12-11 Xycom, Inc. Industrial computer system with removable equipment drawer
US5027254A (en) * 1989-11-09 1991-06-25 International Business Machines Corporation Apparatus for cooling electronics components
DE4035211C2 (de) * 1990-11-06 1994-12-01 Vero Electronics Gmbh Montageeinheit für Gehäuse, Baugruppenträger oder Einschubgehäuse
US5523917A (en) * 1994-09-06 1996-06-04 Hewlett-Packard Co. Power supply cover
DE69630677T2 (de) * 1996-05-14 2004-09-30 Hewlett-Packard Co. (N.D.Ges.D.Staates Delaware), Palo Alto Einrichtung zur Kühlung von Komponenten in einem elektrischen Gerät mit interner Stromversorgungseinheit
US5940266A (en) * 1997-10-14 1999-08-17 International Business Machines Corporation Bi-directional cooling arrangement for use with an electronic component enclosure
US5923532A (en) * 1998-04-21 1999-07-13 Rockwell Science Center, Inc. Lanced card guide
US5940288A (en) * 1998-06-08 1999-08-17 Tracewell Power, Inc. Card cage mounted power supply with heat dissipating architecture
EP1017263B1 (en) * 1998-12-30 2003-09-17 Edward C. Koplin Computer cabinet design
US6058011A (en) * 1999-02-12 2000-05-02 Compaq Computer Corporation Computer chassis with integrated cooling features

Also Published As

Publication number Publication date
US20040100774A1 (en) 2004-05-27
EP1416782B1 (en) 2005-04-27
DE60203915D1 (de) 2005-06-02
DE60203915T2 (de) 2005-09-29
EP1416782A1 (en) 2004-05-06
US6937469B2 (en) 2005-08-30

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