JP2004146210A5 - - Google Patents
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- Publication number
- JP2004146210A5 JP2004146210A5 JP2002310171A JP2002310171A JP2004146210A5 JP 2004146210 A5 JP2004146210 A5 JP 2004146210A5 JP 2002310171 A JP2002310171 A JP 2002310171A JP 2002310171 A JP2002310171 A JP 2002310171A JP 2004146210 A5 JP2004146210 A5 JP 2004146210A5
- Authority
- JP
- Japan
- Prior art keywords
- plating
- anisotropic conductive
- contact type
- pressure
- cured
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002310171A JP2004146210A (ja) | 2002-10-24 | 2002-10-24 | 異方導電性エラスチックコネクタ |
| US10/663,223 US20040082207A1 (en) | 2002-10-24 | 2003-09-15 | Anisotropic conductive elastic connector |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002310171A JP2004146210A (ja) | 2002-10-24 | 2002-10-24 | 異方導電性エラスチックコネクタ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2004146210A JP2004146210A (ja) | 2004-05-20 |
| JP2004146210A5 true JP2004146210A5 (enExample) | 2005-07-14 |
Family
ID=32105288
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002310171A Pending JP2004146210A (ja) | 2002-10-24 | 2002-10-24 | 異方導電性エラスチックコネクタ |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US20040082207A1 (enExample) |
| JP (1) | JP2004146210A (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040050911A1 (en) * | 2002-09-18 | 2004-03-18 | Ho-Young Lee | Solder-fill and its manufacturing method for using semiconductor package and its application for mounting semiconductor chip on PCB |
| US20060221590A1 (en) * | 2005-03-31 | 2006-10-05 | Edoardo Campini | System and method for Advanced Mezzanine Card connection |
| US7672006B2 (en) * | 2006-02-22 | 2010-03-02 | Xerox Corporation | Multi-marking engine printing platform |
| JP7153605B2 (ja) * | 2019-04-25 | 2022-10-14 | 信越ポリマー株式会社 | 異方導電性シートの製造方法 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3680037A (en) * | 1970-11-05 | 1972-07-25 | Tech Wire Prod Inc | Electrical interconnector |
| BE794428A (fr) * | 1972-01-29 | 1973-07-23 | Amp Inc | Connecteur electrique et son procede de fabrication |
| JP2536676B2 (ja) * | 1990-07-30 | 1996-09-18 | 日本電気株式会社 | マイクロピン集合体及びその製造方法 |
| US6103359A (en) * | 1996-05-22 | 2000-08-15 | Jsr Corporation | Process and apparatus for manufacturing an anisotropic conductor sheet and a magnetic mold piece for the same |
| EP0918371B1 (en) * | 1996-08-08 | 2007-11-14 | Nitto Denko Corporation | Anisotropic conductive film and method for manufacturing the same |
| TW588478B (en) * | 1999-09-16 | 2004-05-21 | Shinetsu Polymer Co | Method for electrically connecting two sets of electrode terminals in array on electronic board units |
| JP3870704B2 (ja) * | 2001-03-14 | 2007-01-24 | 松下電器産業株式会社 | 半導体装置 |
| JP4522604B2 (ja) * | 2001-03-19 | 2010-08-11 | 日東電工株式会社 | 異方導電性フィルム |
-
2002
- 2002-10-24 JP JP2002310171A patent/JP2004146210A/ja active Pending
-
2003
- 2003-09-15 US US10/663,223 patent/US20040082207A1/en not_active Abandoned
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