JP2004122388A - Method for aligning electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To obtain an aligning method realizing highly accurate alignment. <P>SOLUTION: When electronic components are aligned, a first electronic component provided with alignment holes 27a and 27b at specified positions at a specified interval is disposed oppositely to a second electronic component provided with polygonal alignment marks 28a and 28b arranged concentrically with a plurality of alignment index parts of different size in alignment with the alignment holes 27a and 27b. The electronic components are adjusted roughly such that the entire image of a small alignment index part S of the alignment marks 28a and 28b can be captured in the alignment holes 27a and 27b, and the entire image of a large alignment index part L of the alignment marks 28a and 28b can be captured in the alignment holes 27a and 27b using the small alignment index part S. Furthermore, a positional correction amount is measured by the large alignment index part L or by both the large and small alignment index parts L and S, and then fine adjustment of the first and second electronic components is performed by moving the second electronic component relatively by the positional correction amount thus aligning the electronic component. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component alignment method for aligning two electronic components using an alignment mark device formed on two electronic components, and more particularly, to an alignment mark device for aligning two electronic components. In the same field of view of a mark recognition device, and by measuring the positions of the two, an electronic component positioning method that enables highly accurate positioning.
[0002]
[Prior art]
Conventionally, two electronic components are aligned and assembled using a bonding apparatus as shown in FIGS. The bonding apparatus includes a head movable unit 5 that is provided to be able to move up and down along a guide unit 3 provided on a side surface of a support member 2 erected on a gantry 1 and that drives a pressure head 4. A pressing means 6 fixed to 5 for applying a predetermined load to the pressing head 4; a stage 7 disposed on the gantry 1 so as to face the pressing head 4; And a mark recognition device 8 installed so as to be able to be inserted into the device.
[0003]
The stage 7 can be moved in the X and Y directions and rotated in the θ direction by an X-axis drive source 12, a Y-axis drive source 13, and a θ rotation drive source (not shown). The Z-axis drive source 14 has made it possible to move in the Z direction. Further, as shown in FIG. 10, the mark recognition device 8 arranges two cameras 8b and 8c in the camera unit 8a in a horizontal position with the optical axes of the photographing lenses coincident, and arranges the cameras 8b and 8c. A double-sided reflection mirror 8d having a parallel reflection surface on both sides is disposed between the reflection mirrors 8c at an angle of 45 degrees (for example, see Patent Document 1).
[0004]
In order to assemble the chip member 10 by aligning the chip member 10 with the plate-like or sheet-like substrate 9 by the conventional bonding apparatus having such a configuration, first, the head moving means 5 and the pressure head 4 are placed on the uppermost part. In the raised state, the substrate 9 is mounted on the mounting portion 11 of the stage 7, and the chip member 10 is held on the lower surface of the pressure head 4. Next, the mark recognition device 8 advances in the direction of arrow A in FIG. 9 and is inserted between the substrate 9 and the chip member 10. Thus, the mark recognition device 8 can recognize the alignment mark of the substrate 9 located below and the alignment mark of the chip member 10 located above at the same time.
[0005]
Next, in the above-described state, the Z-axis drive source 14 is driven to lower the head movable means 5 and stop at a position where the alignment mark of the chip member 10 can be clearly recognized by the mark recognition device 8. When the mark recognition device 8 recognizes the alignment marks on both the substrate 9 and the chip member 10 in this manner, the control means 15 shown in FIGS. 8 and 9 controls the X-axis drive source 12, the Y-axis drive source 13, The stage 7 is moved in the X and Y directions by driving a θ rotation drive source (not shown), and is further rotated in the θ direction so that the alignment marks on both the substrate 9 and the chip member 10 coincide.
[0006]
As described above, when the alignment marks of both the substrate 9 and the chip member 10 are aligned and the alignment of the substrate 9 and the chip member 10 is completed, the mark recognition device 8 is retracted in the direction of arrow B in FIG. 6, the pressing shaft 6a is extended to push down the pressure head 4, and the chip member 10 is brought into close contact with the substrate 9 and assembled and joined.
[0007]
[Patent Document 1]
JP-A-2000-94232 (page 4, FIG. 2)
[0008]
[Problems to be solved by the invention]
However, in such a conventional bonding apparatus, since the alignment between the substrate 9 and the chip member 10 is performed by the mark recognition device 8 inserted between the two, the position between the substrate 9 and the chip member 10 is limited. A sufficient distance is required to insert the mark recognition device 8. As a result, as shown in FIG. 11, even when the alignment mark 16 of the substrate 9 and the alignment mark 17 of the chip member 10 are accurately aligned in FIG. In FIG. 5B, the moving distance for lowering the chip member 10 in the direction of arrow C until the substrate 9 comes into close contact with the substrate 9 is long. For this reason, a movement error based on the precision of the mechanism for lowering the chip member 10 occurs, and a shift δ occurs between the alignment marks 16 and 17 between the substrate 9 and the chip member 10 as shown in FIG. was there. Therefore, the substrate 9 and the chip member 10 may not be accurately positioned.
[0009]
Further, in FIG. 10, the two images 8b and 8c have the inclination of the optical axis and the recognition error Δ of the two images due to the thickness of the double-sided reflection mirror 8d, and the like. Therefore, the substrate 9 and the chip member 10 may not be accurately positioned. In order to correct all of these errors and perform high-accuracy alignment of, for example, 1 μm or less, a precise correction mechanism and complicated mechanism control are required, and the apparatus may be expensive.
[0010]
Accordingly, an object of the present invention is to provide a positioning method that addresses such a problem and enables high-precision positioning.
[0011]
[Means for Solving the Problems]
In order to achieve the above object, an alignment method according to the present invention includes a first electronic component formed by separating a pair of alignment holes at predetermined positions by a predetermined interval, and a plurality of alignment mark portions having different sizes. Arranging a concentrically arranged polygonal alignment mark relative to a second electronic component formed in conformity with the alignment hole; and a small alignment mark of the alignment mark inside the alignment hole. The first and second electronic components are roughly adjusted so that the entire image of the alignment mark is captured using the small alignment mark portion so that the entire image of the large alignment mark portion of the alignment mark is captured inside the alignment hole. And positioning the alignment mark with respect to the center of the alignment hole by the large alignment mark portion or both the large and small alignment mark portions. Measuring a position correction amount for positioning, and relatively moving the second electronic component by the position correction amount to finely adjust the first and second electronic components to perform positioning; And performing the following steps.
[0012]
According to such a method, a plurality of alignments of different sizes arranged concentrically in the alignment holes of the first electronic component and in the alignment marks of the second electronic component arranged opposite to each other. Of the marking portions, the entire image of the small positioning marking portion is captured, and the small positioning marking portion performs coarse adjustment of the positioning of the first and second electronic components, and the entire positioning marking portion having a large alignment mark is obtained. When the image is captured inside the alignment hole, the large alignment indicator or both the large and small alignment indicators measure the position correction amount for aligning the alignment mark with the center of the alignment hole, and the position correction is performed. The second electronic component is relatively moved by the amount, and the first and second electronic components are finely adjusted for alignment. As a result, the first and second electronic components are aligned with high accuracy.
[0013]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
FIG. 1 is a schematic diagram showing an embodiment of an electronic component positioning method according to the present invention. This electronic component positioning method enables high-precision positioning by capturing a mark means for positioning two electronic components in the same field of view of a mark recognition device and measuring the positions of the two. As shown in FIG. 1, the process is performed using a device including a receiving stand 21 for one electronic component, a position adjusting mechanism 22 for the other electronic component, and a mark recognition device 23. Reference numeral 24 denotes a bonding tool for joining two electronic components.
[0014]
In FIG. 1, first, the first electronic component 25 is held by the receiving stand 21, and the second electronic component 26 is held by the position adjustment mechanism 22. Here, the first electronic component 25 is, for example, a substrate such as a printed circuit board or a glass substrate, or a nozzle member used for a print head of an image forming apparatus such as an ink jet printer. As shown in the figure, two positioning holes 27a and 27b are formed at predetermined positions of the sheet-like member at a predetermined interval p. The second electronic component 26 is, for example, an individual chip cut out from a semiconductor wafer, or an IC or the like used for a print head of an image forming apparatus such as an inkjet printer (hereinafter, simply referred to as “chip”). 2), as shown in FIG. 2B, two alignment marks 28a and 28b are formed at predetermined positions of the chip at a predetermined interval q that matches the interval p between the two alignment holes 27a and 27b.
[0015]
In FIG. 2A, the positioning holes 27a and 27b are circular holes having a diameter of about 50 to 60 μm. Reference numeral 29 denotes a nozzle having a diameter of about 17 μm, for example, formed in a nozzle member as the first electronic component 25, and the nozzles 29 are formed at a pitch of, for example, about 42 μm. In FIG. 2B, the alignment marks 28a and 28b are formed by concentrically arranging two large and small circles having an outer diameter of about 30 μm and an inner diameter of about 15 μm as shown in FIG. For example, a small circle S is formed by etching the center of a large circle L formed of a thin film of aluminum. Here, a great circle L indicates a large alignment mark portion of a polygonal alignment mark in which a plurality of alignment mark portions having different sizes are concentrically arranged, and a small circle S indicates a small one of the alignment marks. 3 shows an alignment mark section. In FIG. 2, reference numeral 30 indicates a heater of about 20 μm square formed on, for example, a chip for a print head as the second electronic component 26, and the heater 30 is located at a portion correlated with the nozzle 29. Like the nozzle 29, it is formed at a pitch of about 42 μm.
[0016]
Specifically, as shown in FIG. 4, the alignment marks 28a and 28b are formed by forming MOS (Metal Oxide Semiconductor) transistors 42 and 43, a first-layer wiring pattern 44, and a heater 30 on a silicon substrate 41. Two layers of a power supply wiring pattern 46, a grounding wiring pattern 47, and a wiring pattern 48 for connecting the MOS driver transistor 43 to the heater 30 are formed on the surface layer of the chip formed by sequentially laminating the layers via the interlayer insulating film 45. At the same time as forming the wiring pattern, the aluminum thin film is formed by etching the aluminum thin film outside the circuit forming region such as a transistor.
[0017]
As described above, the alignment marks 28a and 28b are double circles of the large circle L and the small circle S for the following reason. In general, the resolution of image processing has a positive correlation with the perimeter of the recognized image. Therefore, the great circle L having a longer peripheral length has an advantage that the positioning accuracy is higher. However, when the circular shape becomes large, the entire image of the great circle L of the alignment marks 28a and 28b is aligned with the alignment holes in the preliminary positioning stage in which the first electronic component 25 and the second electronic component 26 are mounted at predetermined positions. There is a drawback that the probability of being trapped inside the 27a, 27b is low, and the accuracy required for preliminary positioning is strict. On the other hand, a small circle S having a short perimeter has a low resolution of image processing and a low positioning accuracy. However, since the circular shape is small, the entire image of the small circle S is located inside the positioning holes 27a and 27b in the preliminary positioning stage. It has the advantage that the probability of being caught by a person is high. Therefore, the advantages of the great circle L and the small circle S are incorporated to form a double circle.
[0018]
More specifically, for example, assuming that the alignment holes 27a and 27b are φ60 μm and the alignment mark is formed by one circle of φ20 μm, the accuracy required for the preliminary positioning is as follows. 27b and the distance between the centers of the alignment marks is within ± 20 μm. The image processing accuracy at this time is considered to be proportional to the square root of the perimeter of each mark means, and the image processing accuracy ratio in the above case is expected to be 13.7: 7.9. On the other hand, assuming that the alignment marks 28a and 28b of the present invention are concentric double circles with the large circle L of φ30 μm and the small circle S of φ15 μm, the preliminary positioning accuracy is as small as the small circle S of the alignment marks 28a and 28b and the alignment hole 27a. , 27b within ± 22.5 μm, which is more relaxed than when the above-described alignment mark is formed by one circle. Since the image processing accuracy is determined by the ratio of the square root of the perimeter of the great circle L of the alignment marks 28a and 28b to the alignment holes 27a and 27b, the image processing accuracy ratio is 13.7: 11.9. Thus, the alignment accuracy of the alignment holes 27a, 27b and the alignment marks 28a, 28b is greatly improved.
[0019]
Therefore, by forming the alignment marks 28a and 28b in a double circle, the entire image of the small circle S of the alignment marks 28a and 28b can be captured in the alignment holes 27a and 27b with high probability. Further, using the small circle S, coarse adjustment is performed so that the entire image of the large circle L is captured inside the positioning holes 27a and 27b. As a result, when the entire image of the large circle L is captured, By performing fine adjustment using the large circle L or the large and small circles L and S, the alignment of the alignment marks 28a and 28b with the alignment holes 27a and 27b can be performed with high accuracy.
[0020]
The first electronic component 25 of the sheet-like member is adhered to, for example, a frame or the like, and is air-adsorbed by an air suction hole (not shown) provided in the receiver 21 as shown in FIG. 21 at a predetermined position. In this case, at the place where the first electronic component 25 is placed and held on the receiving table 21, two see-through holes 31a, 27b corresponding to the two alignment holes 27a, 27b of the first electronic component 25 are provided. 31b are formed. The see-through holes 31a and 31b are circular holes having a diameter of, for example, about 400 μm so that the alignment holes 27a and 27b can be sufficiently seen. Further, a heating means (not shown) such as a heater is built in the pedestal 21 so that a portion of the first electronic component 25 that comes into contact with the pedestal 21 can be heated.
[0021]
The second electronic component 26 is held at a predetermined position of the position adjustment mechanism 22 via the bonding tool 24. In this case, in FIG. 5, air is sucked and held by an air sucking hole (not shown) provided in the bonding tool 24. Then, the bonding tool 24 moves up and down in the Z direction together with the position adjusting mechanism 22 to form a chip transfer gap r on the lower surface side of the bonding tool 24. The bonding tool 24 has a built-in heating means (not shown) such as a heater, and can heat the second electronic component 26 that comes into contact with the bonding tool 24. On the lower surface of the second electronic component 26 held by the bonding tool 24, a dry film resist 32 serving as an adhesive is formed. In the dry film resist 32, two see-through holes 33a, 33b are formed at positions corresponding to the two alignment marks 28a, 28b of the second electronic component 26.
[0022]
As shown in FIG. 1, the position adjusting mechanism 22 that holds the second electronic component 26 via the bonding tool 24 moves the second electronic component 26 in the horizontal direction in the X and Y directions and rotates by θ. The first electronic component 25 and the second electronic component 26 can be joined together as a whole, and can be moved in the Z direction in a vertical plane. In this case, as shown in FIG. 5, an alignment gap s (for example, about 70 to 130 μm) for aligning the two electronic components is provided between the upper surface of the pedestal 21 and the lower surface of the second electronic component 26. Is set.
[0023]
In such a state, the alignment marks 28a and 28b of the second electronic component 26 are introduced into the alignment holes 27a and 27b of the first electronic component 25, and the alignment marks 28a and 28b are within the same field of view of the mark recognition device 23. And position measurement of both. Here, as shown in FIG. 5, the mark recognition device 23 is provided with two cameras 23a and 23b in accordance with an interval between two alignment holes 27a and 27b of the first electronic component 25. That is, the cameras 23a and 23b are provided corresponding to the positions of the two see-through holes 31a and 31b formed in the receiving table 21, respectively. These cameras 23a and 23b are composed of a lens having a predetermined magnification (for example, about 9 times) with a coaxial incident light, a video camera, or a CCD camera having a predetermined pixel density (for example, about 1/4 inch and 400,000 pixels). Note that the cameras 23a and 23b may be configured such that one camera is moved between the two see-through holes 31a and 31b and alternately switched to shoot.
[0024]
The lenses of the cameras 23a and 23b have a depth of focus of a predetermined distance, and the second electronic component 26 and the first electronic component 25 are aligned with respective alignment holes 27a and 27b and alignment marks. 28a and 28b are positioned and held within the above-mentioned depth of focus. From this, in a state where the cameras 23a and 23b are adjusted in height as shown by arrows D and E to approach the first electronic component 25, the alignment marks 28a and 28b of the second electronic component 26 and the first And the alignment holes 27a and 27b of the electronic component 25 can be photographed at the same time.
[0025]
In this manner, when the mark recognition device 23 recognizes the images of both the alignment holes 27a and 27b of the first electronic component 25 and the alignment marks 28a and 28b of the second electronic component 26, the processing procedure shown in FIG. Alignment of the alignment holes 27a, 27b and the alignment marks 28a, 28b is performed.
[0026]
First, in step S1, images of the alignment holes 27a and 27b and the alignment marks 28a and 28b are captured by the mark recognition device 23. Then, in step S2, a small circle S of the alignment marks 28a, 28b is searched inside the positioning holes 27a, 27b. Here, if the entire image of the small circle S is not recognized inside the alignment holes 27a and 27b due to a poor mounting accuracy of the second electronic component 26 with respect to the bonding tool 24, a lack of the alignment marks 28a and 28b, a processing error. (Step S3), and the stage of positioning ends. Then, the position adjusting mechanism 22 shown in FIG. 1 is raised, and as shown in FIG. 5, a chip transfer gap r is formed on the lower surface side of the bonding tool 24, and is replaced with a new second electronic component 26. In step S2, the search for the small circle S may be manually performed while visually observing the image of the small circle S inside the positioning holes 27a and 27b, instead of the automatic search as described above.
[0027]
On the other hand, in step S2, as shown in FIG. 7A, when the entire image of the small circle S is recognized, the process proceeds to step S4, and based on the image of the small circle S, the positioning holes 27a, The position correction amount of the small circle S with respect to the center position of 27b is measured. Then, the second electronic component 26 is moved or rotated by θ in the X and Y directions by driving the position adjusting mechanism 22 shown in FIG. 1, and the small circles S of the alignment marks 28a and 28b are aligned with the alignment holes 27a and 27b. Is drawn in the direction of arrow A toward the center O of FIG. Thereby, the first and second electronic components 25 and 26 are roughly adjusted (see FIG. 7B).
[0028]
Next, in step S5, the great circle L of the alignment marks 28a and 28b is searched. Here, when the whole image of the great circle L cannot be recognized, for example, when the image of the small circle S recognized in step S2 is a mistake of dust, or due to a formation error of the alignment marks 28a and 28b. Since the center positions of the large circle L and the small circle S are shifted, a part of the large circle L is hidden behind the positioning holes 27a and 27b and is chipped despite the pull-in operation of the small circle S in step S4. If the circle is not recognized as an orifice, or if the great circle L cannot be recognized as a circle due to system noise or the like, a processing error occurs (step S6), and the alignment step ends. Then, the position adjusting mechanism 22 shown in FIG. 1 is raised, and as shown in FIG. 5, a chip transfer gap r is formed on the lower surface side of the bonding tool 24, and is replaced with a new second electronic component 26.
[0029]
In step S5, as shown in FIG. 7B, when the entire image of the great circle L of the alignment marks 28a and 28b is recognized, the process proceeds to step S7, and the recognized alignment marks 28a and 28b Is determined to form a double circle. Here, the determination of the double circle is made based on whether or not the centers of the great circle L and the small circle S substantially coincide and form a concentric circle. If it is determined in step S7 that the circles are not double circles, that is, if the center positions of the large circle L and the small circle S are shifted due to the formation error of the alignment marks 28a and 28b, a processing error (step In step S8), the alignment step ends, and the second electronic component 26 is replaced with a new one in the same manner as described above.
[0030]
On the other hand, if it is determined in step S7 that the image-recognized alignment marks 28a and 28b are double circles, the process proceeds to step S9, in which the distance between the centers of the alignment holes 27a and 27b and the alignment marks 28a and 28b is determined. Is measured to obtain a position correction amount. For example, the position correction amount is measured based on the great circle L of the alignment marks 28a and 28b, or the average value of the respective correction amounts based on the great circle L and the small circle S, or the great circle L and the small circle L. This is a correction amount obtained by apportioning the size of the circle S and weighting according to the ratio. When the position correction amount is measured, the second electronic component 26 is moved or rotated by θ in the X and Y directions by driving the position adjustment mechanism 22, and the alignment marks 28a and 28b are aligned with the alignment holes 27a and 27b. Is drawn in the direction of arrow B toward the center O of FIG. As a result, the first and second electronic components 25 and 26 are finely adjusted, and are aligned so that the center positions of the alignment holes 27a and 27b and the alignment marks 28a and 28b match (FIG. 7 (c)). )reference). In addition, when the interval p between the alignment holes 27a and 27b and the interval q between the alignment marks 28a and 28b shown in FIG. 2 do not match due to a formation error of each mark unit, a difference in thermal expansion between the two electronic components, or the like. Are positioned symmetrically with respect to the center line connecting the alignment holes 27a, 27b with the alignment holes 27a, 27b and the alignment marks 28a, 28b.
[0031]
When the fine adjustment of the positioning of the first and second electronic components 25 and 26 is completed in this way, the process proceeds to step S10, in which the center position deviation between the positioning holes 27a and 27b and the alignment marks 28a and 28b falls within a specified value. It is determined whether there is. Here, if the amount of displacement between the two is within the specified value, the positioning ends (step S11). If the amount of displacement between the two is not within the specified value, steps S1 to S10 are repeated to perform positioning.
[0032]
When the positioning is completed in accordance with the above-described processing procedure, the position adjusting mechanism 22 shown in FIG. 1 is slowly lowered, and the first electronic component 25 and the second electronic component 26 are assembled. Then, a heating unit provided on the receiving table 21 and the bonding tool 32 is heated, and the first electronic component 25 and the second electronic component are interposed via the dry film resist 32 provided on the joint surface of the second electronic component 26. 26 are joined.
[0033]
As described above, according to the electronic component alignment method of the present invention, since the alignment marks 28a and 28b are formed as large and small double circles, the preliminary positioning of the first electronic component 25 and the second electronic component 26 is performed. In the stage, the whole image of the small circle S of the alignment marks 28a and 28b can be easily captured inside the alignment holes 27a and 27b, and the preliminary positioning accuracy can be eased. Therefore, the position correction amount is measured using the small circle S captured inside the alignment holes 27a and 27b, and the alignment marks 28a and 28b are roughly adjusted with respect to the alignment holes 27a and 27b, thereby obtaining the alignment marks. The entire image of the great circle L of 28a, 28b can be easily drawn into the positioning holes 27a, 27b. Thus, the position correction amount for aligning the alignment marks 28a, 28b with the center of the alignment holes 27a, 27b is measured using the large circle L or the large and small circles L, S, and the alignment marks 28a, 28b are measured. By finely adjusting 28b with respect to alignment holes 27a and 27b, first and second electronic components 25 and 26 can be aligned with high accuracy.
[0034]
In addition, since the alignment marks 28a and 28b are formed as double circles, even when dust is mistaken for a small circle S, if the large circle L cannot be found on the outer periphery of the small circle S, the mistake can be corrected. As a result, the recognition accuracy of the alignment mark can be improved.
[0035]
The alignment marks 28a and 28b are not limited to the double circles described above, but may be three or more circles arranged concentrically. Further, the positioning holes 27a and 27b and the alignment marks 28a and 28b are not limited to a circular shape, but may be a square shape or a triangular shape. However, these mark means are more preferably circular in that the digital images captured by the mark recognition device 23 have the same edge noise regardless of their orientation.
[0036]
【The invention's effect】
Since the present invention is configured as described above, according to the first aspect of the present invention, the alignment hole of the first electronic component is aligned with the second electronic component which is disposed inside the first electronic component. The mark captures the entire image of the small alignment marking section among the plurality of alignment marking sections of different sizes arranged concentrically, and the position of the first and second electronic components is captured by the small alignment marking section. After performing the coarse alignment adjustment and the entire image of the large alignment mark of the alignment mark is captured inside the alignment hole, the alignment mark is aligned with the center of the alignment hole by the large alignment mark or both the large and small alignment marks. Measuring the position correction amount for positioning the first electronic component and relatively adjusting the first and second electronic components by the amount of the position correction amount to perform the positioning. It can be. Therefore, the preliminary positioning accuracy can be eased, and the first and second electronic components can be positioned with high accuracy.
[0037]
According to the second and third aspects of the present invention, since the alignment mark is formed concentrically in a circular shape, the edge noise of the digital image captured by the mark recognition device is the same regardless of the orientation of the alignment mark. And the image recognition accuracy is improved.
[0038]
According to the invention according to claim 4, the first electronic component is formed as a nozzle member of the print head of the image forming apparatus, and the second electronic component is formed as a chip of the print head, thereby forming the nozzle member. The print head can be assembled with high accuracy by aligning the alignment mark formed on the chip with the alignment hole.
[0039]
According to the fifth aspect of the invention, when a chip is manufactured by forming a circuit on a substrate, an alignment mark can be formed outside the circuit formation region. Therefore, an alignment mark can be formed with high precision using a semiconductor process.
[Brief description of the drawings]
FIG. 1 is a schematic view showing an embodiment of an electronic component positioning method according to the present invention.
FIG. 2 is a plan view showing a formation state of a positioning hole of a first electronic component and an alignment mark of a second electronic component.
FIG. 3 is a plan view showing a shape of an alignment mark of a second electronic component.
FIG. 4 is a schematic cross-sectional view of a chip for explaining a position where an alignment mark is formed.
FIG. 5 is a cross-sectional view showing a state in which an alignment mark of a second electronic component is introduced into an alignment hole of the first electronic component and is captured in the same field of view of a mark recognition device, and the positions of the two are measured. FIG.
FIG. 6 is a flowchart illustrating a procedure for aligning an alignment mark with an alignment hole.
FIG. 7 is an explanatory diagram showing images of alignment holes and alignment marks recognized by the mark recognition device in the procedure of FIG. 6;
FIG. 8 is a side view showing a configuration of a conventional bonding apparatus.
FIG. 9 is a front view of FIG. 8;
FIG. 10 is an explanatory diagram showing a mark recognition device of a conventional bonding device.
FIG. 11 is an explanatory diagram illustrating an example of occurrence of misalignment of alignment marks of a substrate and a chip member in a conventional bonding apparatus.
[Explanation of symbols]
21 ... Cradle
22 Position adjustment mechanism
23 ... mark recognition device
25 ... First electronic component
26 ... second electronic component
27a, 27b ... alignment holes
28a, 28b ... alignment mark
31a, 31b ... see-through holes
41 ... Silicon substrate
L: Great circle
S ... small circle

Claims (5)

A first electronic component in which a pair of alignment holes are formed at predetermined positions and separated by a predetermined interval, and a polygonal alignment mark in which a plurality of alignment mark portions having different sizes are concentrically arranged are provided in the alignment holes. Arranging the second electronic component formed in conformity with the second electronic component;
The whole image of the small alignment mark portion of the alignment mark is captured inside the alignment hole, and the whole image of the large alignment mark portion of the alignment mark is captured inside the alignment hole using the small alignment mark portion. Coarsely adjusting the first and second electronic components so that
Measuring the position correction amount for aligning the alignment mark with respect to the center of the alignment hole, by the large alignment indicator or both the large and small alignment indicator;
Relatively moving the second electronic component by the position correction amount and finely adjusting the position of the first and second electronic components to perform positioning;
And an electronic component alignment method. The method according to claim 1, wherein the alignment mark is formed by arranging a plurality of circles having different sizes concentrically. 3. The method according to claim 2, wherein the alignment mark is a double circle. 2. The method according to claim 1, wherein the first electronic component is a nozzle member of a print head of an image forming apparatus, and the second electronic component is a chip of the print head. . 5. The electronic component positioning method according to claim 4, wherein when the chip is formed by forming a circuit on a substrate, the alignment mark is formed outside the circuit forming region.

Images