JP2004114327A - Printing plate and printing method using the plate - Google Patents

Printing plate and printing method using the plate Download PDF

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Publication number
JP2004114327A
JP2004114327A JP2002277011A JP2002277011A JP2004114327A JP 2004114327 A JP2004114327 A JP 2004114327A JP 2002277011 A JP2002277011 A JP 2002277011A JP 2002277011 A JP2002277011 A JP 2002277011A JP 2004114327 A JP2004114327 A JP 2004114327A
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JP
Japan
Prior art keywords
squeegee
printing plate
printing
paste
mask
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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JP2002277011A
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Japanese (ja)
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JP3922146B2 (en
Inventor
Toshiaki Takenaka
竹中 敏昭
Toshihiro Nishii
西井 利浩
Hideaki Komoda
菰田 英明
Toshikazu Kondo
近藤 俊和
Shinji Nakamura
中村 眞治
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2002277011A priority Critical patent/JP3922146B2/en
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to CNB038011743A priority patent/CN1318228C/en
Priority to CN2007101034429A priority patent/CN101048031B/en
Priority to DE60323549T priority patent/DE60323549D1/en
Priority to US10/490,482 priority patent/US7105277B2/en
Priority to DE60312947T priority patent/DE60312947T2/en
Priority to EP07000982A priority patent/EP1780034B1/en
Priority to EP03787306A priority patent/EP1428677B1/en
Priority to PCT/JP2003/011999 priority patent/WO2004028823A1/en
Priority to TW092126097A priority patent/TWI291846B/en
Publication of JP2004114327A publication Critical patent/JP2004114327A/en
Application granted granted Critical
Publication of JP3922146B2 publication Critical patent/JP3922146B2/en
Anticipated expiration legal-status Critical
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  • Screen Printers (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a printing plate which prevents a high viscosity paste sticking to a squeegee edge from residing existing over a through hole in a circuit board during packing the paste in a squeegee process. <P>SOLUTION: A metallic sheet 3 which forms a squeegee cleaning part 7 is anchored to the back of an inclined part 5 of a mask 2 for a plate frame 1 and after the high viscosity paste sticking to the squeegee edge is removed by the squeegee cleaning part 7, the through hole of a finished product is filled with the paste. Thus the paste is prevented from remaining over the through hole and thereby, obtain the circuit board of high quality. <P>COPYRIGHT: (C)2004,JPO

Description

【0001】
【発明の属する技術分野】
本発明は、各種電子機器に使用される両面あるいは多層配線基板などに用いられるペーストのパターンあるいは貫通孔への充填等に用いられる印刷用版およびそれを用いた印刷方法に関するものである。
【0002】
【従来の技術】
近年、電子機器の小型化、高密度化に伴い、産業用にとどまらず民生用の分野においても回路基板の多層化が強く要望されるようになってきた。
【0003】
このような回路基板では、複数層の回路パターンの間をインナービアホール接続する接続方法および信頼度の高い構造の新規開発が不可欠なものになっているが、導電性ペーストによりインナービアホール接続した新規な構成の高密度の回路基板製造法が提案されている。
【0004】
以下従来の両面の回路基板の製造方法について説明する。
【0005】
図7(a)〜(f)は従来の回路基板の製造方法の工程断面図、図8は従来例の開口部を有するマスクを取り付けた版枠を示す斜視図、図9は従来例の開口部を有するマスクを取り付けた版枠の断面図、図10(a)〜(g)はスキージング法によるペースト充填の工程断面図、図11は従来例の回路基板を用いたペースト充填時の一部断面図である。
【0006】
図7において、21は300mm×500mm、厚さ約150μmのプリプレグシートであり、例えば不織布の全芳香族ポリアミド繊維に熱硬化性エポキシ樹脂を含浸させた複合材からなる基材が用いられる。22a,22bはマスクフィルムでありプリプレグシート21と接着する面に0.01μm以下の厚みでSi系の離型層部を形成した厚さ約16μm、幅300mmのプラスチックフィルム、例えばポリエチレンテレフタレートが用いられる。
【0007】
プリプレグシート21とマスクフィルム22a,22bの張り合わせはラミネート装置を用いてプリプレグシート21の樹脂成分を溶融させてマスクフィルム22a,22bが連続的に接着する方法が提案されている。23は貫通孔であり、プリプレグシート21の両面に貼り付ける厚さ35μmの銅などの金属箔25a,25bと電気的に接続する導電性ペースト24が充填されている。
【0008】
回路基板の製造は、まず、両面にマスクフィルム22a,22bが接着されたプリプレグシート21(図7(a))の所定の箇所に図7(b)に示すようにレーザ加工法などを利用して貫通孔23が形成される。
【0009】
次に図7(c)に示すように、貫通孔23に導電性ペースト24が充填される。導電性ペースト24を充填する方法としては、貫通孔23を有するプリプレグシート21を一般の印刷機(図示せず)のステージ6上に設置し、ウレタンゴムなどの2本のスキージを交互に用いて往復させることで直接導電性ペースト24がマスクフィルム22aの上から充填される。このとき、上面のマスクフィルム22a,22bは印刷マスクの役割と、プリプレグシート21の表面の汚染防止の役割を果たしている。
【0010】
導電性ペースト24の充填方法について図8、図9、図10(a)〜(g)を用いてさらに説明する。
【0011】
導電性ペースト24の充填にはスキージング法が用いられているが、プリプレグシート21には専用のマスクフィルム22a,22bが配置されているため、図8、図9に示すように充填用の版10の版枠1にはプリプレグシート21のペースト充填有効面積より広い250mm×450mmの開口部4を設けた厚さ約3mmのステンレス製のマスク2が取り付けられている。
【0012】
導電性ペースト24の充填は、まず、図10(a)に示すように印刷機(図示せず)のステージ6に置載した両面にマスクフィルムが接着され、貫通孔23が形成されたプリプレグシート21にマスク2がセットされる。
【0013】
次に、上方に設けられた上下左右に移動・加圧可能な往側スキージ8aと復側スキージ8bのうち往側スキージ8aのみをマスク2上の所定位置に降下させ、圧力をかけて導電性ペースト24をローリングさせながら前進させている。
【0014】
次に図10(b)に示すように、マスク2の開口縁部5bを通過してプリプレグシート21上に到達する。往復のスキージ8a,8bは圧力を保持しながら位置に応じて自由に上下可能な機能を有している。
【0015】
次に図10(c)に示すように、往側スキージ8aはプリプレグシート21上と再度マスク2の傾斜部を通過してマスク2上の定位置でストップした後、上昇させて導電性ペースト24を自然落下させている。
【0016】
次に図10(d)に示すように、復側スキージ8bのみをマスク2上の所定位置に下降させる。その後図10(e)〜(g)に示すように往側スキージ8aと同様に復側スキージ8bをマスク2とプリプレグシート21上を通過させることで貫通孔23への導電性ペースト24の充填が完了する。
【0017】
そして図7(d)に示すように、プリプレグシート21の両面からマスクフィルム22a,22bを剥離する。
【0018】
次に図7(e)に示すように、プリプレグシート21の両面に銅などの金属箔25a,25bを重ねる。
【0019】
この状態で熱プレスで加熱加圧することにより、図7(f)に示すように、プリプレグシート21の厚みが圧縮される(t2=約100μm)とともにプリプレグシート21と金属箔25a,25bとが接着され、両面の金属箔25a,25bは所定位置に設けた貫通孔23に充填された導電性ペースト24により電気的に接続されている。
【0020】
そして、両面の金属箔25a,25bを選択的にエッチングして回路パターンが形成され(図示せず)て両面の回路基板が得られる。
【0021】
なお、この出願の発明に関連する先行技術文献情報としては、例えば、特許文献1、特許文献2が知られている。
【0022】
【特許文献1】
特開平6−268345号公報
【特許文献2】
特開平7−106760号公報
【0023】
【発明が解決しようとする課題】
しかしながら上記の従来のペースト充填法における課題を図11に示す。
【0024】
すなわち(導電性ペースト24粘度が高い場合、)、印刷を開始する際、マスク2の開口縁部5bを下降した時に、導電性ペースト24がプリプレグシート21面に押しつけられ、これによってスキージ8bエッジ周辺のペースト中の樹脂成分が押し出され、スキージ8bエッジ全面により高粘度の導電性ペースト24が固着する。
【0025】
この固着した導電性ペースト24がプリプレグシート21に形成された貫通孔23を通過する際、特にスキージ8bのペースト充填幅全面で、かつスキージ進行方向の最初での貫通孔23上に堅いペーストが残りやすく、マスクフィルム22a,22bを剥がす際に、導電性ペースト24の一部がマスクフィルム22a側に転写して品質に影響を及ぼす場合があるという問題があった。
【0026】
【課題を解決するための手段】
上記目的を達成するために、本発明の印刷用版や回路基板およびそれを用いたペースト充填方法は、製品の貫通孔をスキージが通過する前に、印刷用版上に設けたスキージクリーニング部を通過させてスキージエッジの高粘度のペーストを除去するもので品質に優れた回路基板が得られる。
【0027】
【発明の実施の形態】
本発明の請求項1に記載の発明は、基板材料の全周あるいは一部の略外周部を覆う額縁状の開口部を有し、傾斜部の裏面先端と他の2辺に金属シートを所定量突出させて固着した印刷用版であり、少なくとも傾斜部の一方の金属シートの突出部の上面の所定位置に凸部を設けることで、傾斜部で形成されるスキージエッジ部の高粘度ペーストを除去することができ、製品の貫通孔への堅いペースト残りがなくなり、マスクフィルムを剥がす際に、ペーストの一部がマスクフィルム側に転写して品質に悪影響を及ぼす可能性を解消するという作用を有し、ペースト充填品質の高い印刷方法を行うための印刷用版を提供するものである。
【0028】
本発明の請求項2に記載の発明は、金属シートの凸部が所定長の直線状の凸部からなる請求項1に記載の印刷用版であり、スキージ全体に付着したペーストを残らず、効率的に除去できるというものである。
【0029】
本発明の請求項3及び請求項4に記載の発明は、金属シートの凸部が所定長に千鳥状に設けた凸部からなり、この構成によりスキージに付着したペーストを効率的に除去できるものである。また前記凸部を逐次重なり合う間隔で設ける、スキージ全体に付着したペーストを残らず除去できるというものである。
【0030】
本発明の請求項5に記載の発明は、金属シートをエッチングして凸部を形成した請求項1に記載の印刷用版であり、千鳥状に設けた凸部であっても容易に形成することができるものである。
【0031】
本発明の請求項6に記載の発明は、金属シートの凸部を成型法を用いて安価で容易に行えるものである。
【0032】
本発明の請求項7に記載の発明は、凸部の高さは3μm以上40μm以下である請求項1に記載の印刷用版であり、スキージに付着したペーストを効率的に除去するとともにスキージエッジにダメージを与えないというものである。
【0033】
本発明の請求項8に記載の発明は、傾斜部は15°の傾斜を備えている請求項1に記載の印刷用版であり、スキージの通過を容易にするものである。
【0034】
本発明の請求項9に記載の発明は、凸部のエッジは丸め処理されている請求項1に記載の印刷用版であり、スキージエッジへのダメージを防止するものである。
【0035】
本発明の請求項10に記載の発明は、請求項1記載の印刷用版を用いて、スキージを往復させペーストを被印刷物に印刷する方法であって、印刷する前に印刷用版の凸部でスキージエッジに付着したペーストを除去する印刷方法であり、傾斜部で形成されるスキージエッジ部の高粘度ペーストを除去することができ、製品の貫通孔への堅いペースト残りがなくなり、マスクフィルムを剥がす際に、ペーストの一部がマスクフィルム側に転写して品質に悪影響を及ぼす可能性を解消するという作用を有し、ペースト充填品質の高い印刷方法を提供するものである。
【0036】
本発明の請求項11に記載の発明は、印刷用版の凸部の前でスキージを所定時間停止する請求項10に記載の印刷方法であり、これによりスキージエッジ部の高粘度ペーストを確実に除去することができる。
【0037】
以下、本発明の実施の形態について図面を用いて説明する。
【0038】
(実施の形態1)
ペースト充填方法と充填用の版について以下に説明する。
【0039】
図1は本発明の印刷用版の平面図、図2は本発明の印刷用版の断面図である。
【0040】
また、図3(a)〜(c)は本発明の第1の金属シートであり、図3(a)はその平面図、図3(b)、図3(c)はその断面図である。
【0041】
図4(a)〜(c)は本発明の第2の金属シートであり、図4(a)はその平面図、図4(b)はその断面図、図4(c)はその拡大平面図である。図5は本発明のスキージング法によるペースト充填の工程断面図であり、図6は本発明の印刷用版を用いたペースト充填時の一部断面図である。
【0042】
なお、従来の技術で説明した同一の構成部分や部品には同一の番号を付与して詳細な説明は省略する。
【0043】
本発明の印刷用版は図1、図2に示すように、版枠1にはプリプレグシート21のペースト充填エリアより広い250mm×450mmの開口部4を有する厚さ約3mmのステンレス製のマスク2を取り付けている(なお、300×500mm、厚さ約150μmのプリプレグシート21には専用のマスクフィルムを配置している)。
【0044】
マスク2の開口部4のスキージ進行方向(450mm側)にはスキージの通過を容易にするため15°傾斜を備えた傾斜部5を設けている。
【0045】
そしてマスク2の2辺の傾斜部5の裏面と他方の2辺の裏面には接着剤などで固定した金属シート3を約5mm突出させている。
【0046】
そして、マスク2の傾斜部5裏面から突出した厚さ約100μmの金属シート3の上面の所定位置に図3(a)〜(c)に示すように直線上の約40μmの凸部や、図4(a)〜(c)に示すように約300μm径で500μmピッチに形成した高さ約40μmの凸部を500μmの間隔で千鳥状に配列したスキージクリーニング部7を形成している。
【0047】
凸部の高さは実施の形態では40μmとしたが、3μm以上あれば同等の効果が得られることを確認している。スキージエッジにダメージを与えない高さの40μm以下が望ましい。
【0048】
直線上の凸部の形成はエッチング法や成型法を用い、千鳥状の凸部はエッチング法を用いた。
【0049】
また、凸部のエッジはスキージエッジへのダメージを防止するため、エッチング法などを用いて丸め処理をするのが好ましい。
【0050】
特に千鳥状に形成した場合は、形成した凸部が図4(c)に示すように、各々の凸部が面一あるいは重なり合うよう配置するのが好ましい。また、実施の形態では凸部のみでスキージクリーニング部7を形成したが、凸部内に貫通孔や非貫通孔を設けても構わない。
【0051】
導電ペーストへの充填方法を、図5(a)〜(g)を用いて簡単に説明する。
【0052】
導電性ペースト24の充填は、まず、図5(a)に示すように印刷機(図示せず)のステージ6に置載した両面にマスクフィルム22a,22bが接着され、貫通孔23が形成されたプリプレグシート21にマスク2がセットされる。
【0053】
そして、上方に設けられた上下左右に移動・加圧可能な往側スキージ8aと復側スキージ8bのうち往側スキージ8aのみをマスク2上の所定位置に降下させ、圧力をかけて導電性ペースト24をローリングさせながら前進させている。
【0054】
そして図5(b)に示すようにマスク2の傾斜部5を通過してプリプレグシート21上に到達する。往復のスキージ8a,8bは圧力を保持しながら位置に応じて自由に上下可能な機能を有している。
【0055】
そして図5(c)に示すように往側スキージ8aはプリプレグシート21上と再度マスク2の傾斜部5を通過してマスク2上の定位置でストップした後、上昇させて導電性ペースト24を自然落下させている。
【0056】
次に図5(d)に示すように復側スキージ8bのみをマスク2上の所定位置に下降させる。
【0057】
その後図5(e)〜(g)に示すように往側スキージ8aと同様に復側スキージ8bをマスク2とプリプレグシート21上を通過させることで貫通孔23への導電性ペースト24の充填が完了する。本発明の印刷用版は復側スキージ8bのスタート側のマスク2の傾斜部5裏面に上面の所定位置に凸部で形成したスキージクリーニング部7を有する金属シート3を突出させている。
【0058】
図6は復側スキージ8bがスタートしてマスク2上、傾斜部5、金属シート3上のスキージクリーニング部7、製品内の貫通孔23を通過した時点の一部断面図である。
【0059】
その結果、復側スキージ8bで充填開始後、マスク2の傾斜部5を経由してスキージクリーニング部7を通過した際に、スキージクリーニング部7のマスク2の傾斜部5側の凸部エッジに除去された導電性ペースト24が残っているのを確認した。
【0060】
マスク2の傾斜部5からスキージクリーニング部7までの距離は傾斜部5下降時のスキージ8b変形の復帰が可能な距離とするか、スキージ8bの速度を低速にするか一旦停止してスキージ8bの変形を復帰してから通常の速度で充填するとよい。
【0061】
本実施の形態ではスキージクリーニング部7の前でスキージ8bを約1秒停止する方法で充填した。
【0062】
そして、スキージクリーニング部7に残った導電性ペースト24は次のプリプレグシート21充填時に往側スキージ8aで除去され、連続して効果のあることを確認した。
【0063】
また、貫通孔に導電性ペースト24が充填されたプリプレグシート21を100枚確認したが、スキージクリーニング部7通過後、貫通孔上にペースト残りはなく、マスクフィルム22a,22b剥離時もマスクフィルム22a,22bに導電性ペースト24が転写して品質に影響を及ぼすことがないことを確認した。
【0064】
【発明の効果】
以上のように本発明の印刷用版及び印刷方法は、回路基板の貫通孔にペースト充填する前に印刷用版に設けたスキージクリーニング部でスキージエッジの高粘度のペーストを除去することで、製品の貫通孔上に高粘度のペースト残りを防止することが可能となり、品質に優れた回路基板を提供できるという効果を有する。
【図面の簡単な説明】
【図1】本発明の印刷用版の平面図
【図2】本発明の印刷用版の断面図
【図3】(a)〜(c)はそれぞれ本発明の第1の金属シートを示す図
【図4】(a)〜(c)はそれぞれ本発明の第2の金属シートを示す図
【図5】(a)〜(g)はそれぞれ本発明のスキージング法によるペースト充填の工程断面図
【図6】本発明の印刷用版を用いたペースト充填時の一部断面図
【図7】(a)〜(f)はそれぞれ従来の両面の回路基板の製造方法の工程断面図
【図8】従来例の開口部を有するマスクを取り付けた版枠を示す斜視図
【図9】従来例の開口部を有するマスクを取り付けた版枠の断面図
【図10】(a)〜(g)はそれぞれ従来のスキージング法によるペースト充填の工程断面図
【図11】従来例の回路基板を用いたペースト充填時の一部断面図
【符号の説明】
1 版枠
2 マスク
3 金属シート
4 開口部
5 傾斜部
6 ステージ
7 スキージクリーニング部
8a 往側スキージ
8b 復側スキージ
21 プリプレグシート
22a,22b マスクフィルム
23 貫通孔
24 導電性ペースト
25a,25b 金属箔
[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a printing plate used for filling a paste pattern or a through hole used for a double-sided or multilayer wiring board used in various electronic devices, and a printing method using the same.
[0002]
[Prior art]
2. Description of the Related Art In recent years, with the miniaturization and high density of electronic devices, there has been a strong demand for multilayered circuit boards not only for industrial use but also for consumer use.
[0003]
In such a circuit board, it is essential to newly develop a connection method for connecting inner circuit holes between a plurality of layers of circuit patterns and a highly reliable structure. A high-density circuit board manufacturing method with a configuration has been proposed.
[0004]
Hereinafter, a conventional method for manufacturing a double-sided circuit board will be described.
[0005]
7 (a) to 7 (f) are sectional views showing steps of a conventional method for manufacturing a circuit board, FIG. 8 is a perspective view showing a plate frame to which a mask having an opening of a conventional example is attached, and FIG. 10 (a) to 10 (g) are cross-sectional views of a paste filling process using a squeezing method, and FIG. 11 is a cross-sectional view of a plate filling process using a conventional circuit board. It is a fragmentary sectional view.
[0006]
In FIG. 7, reference numeral 21 denotes a prepreg sheet having a size of 300 mm × 500 mm and a thickness of about 150 μm. For example, a base material made of a composite material in which a wholly aromatic polyamide fiber of a nonwoven fabric is impregnated with a thermosetting epoxy resin is used. Reference numerals 22a and 22b denote mask films, which are plastic films, for example, polyethylene terephthalate having a thickness of about 16 μm and a width of 300 mm in which a Si-based release layer portion having a thickness of 0.01 μm or less is formed on a surface to be bonded to the prepreg sheet 21. .
[0007]
For laminating the prepreg sheet 21 and the mask films 22a and 22b, a method has been proposed in which a resin component of the prepreg sheet 21 is melted by using a laminating apparatus to continuously bond the mask films 22a and 22b. Reference numeral 23 denotes a through hole, which is filled with a conductive paste 24 that is electrically connected to metal foils 25a and 25b such as copper having a thickness of 35 μm to be attached to both surfaces of the prepreg sheet 21.
[0008]
In the manufacture of the circuit board, first, as shown in FIG. 7B, a laser processing method or the like is used at a predetermined portion of a prepreg sheet 21 (FIG. 7A) having mask films 22a and 22b adhered to both sides. Thus, a through hole 23 is formed.
[0009]
Next, as shown in FIG. 7C, the conductive paste 24 is filled in the through holes 23. As a method of filling the conductive paste 24, a prepreg sheet 21 having a through hole 23 is placed on a stage 6 of a general printing machine (not shown), and two squeegees such as urethane rubber are alternately used. By reciprocating, the conductive paste 24 is directly filled from above the mask film 22a. At this time, the mask films 22a and 22b on the upper surface play a role of a printing mask and a role of preventing contamination of the surface of the prepreg sheet 21.
[0010]
The method of filling the conductive paste 24 will be further described with reference to FIGS. 8, 9, and 10A to 10G.
[0011]
The squeezing method is used for filling the conductive paste 24. However, since the prepreg sheet 21 has dedicated mask films 22a and 22b, the filling plate is filled as shown in FIGS. A stainless steel mask 2 having a thickness of about 3 mm provided with an opening 4 of 250 mm × 450 mm larger than the effective area of the prepreg sheet 21 for filling the paste is attached to the ten plate frames 1.
[0012]
First, as shown in FIG. 10A, the conductive paste 24 is filled with a prepreg sheet in which a mask film is adhered to both sides mounted on a stage 6 of a printing machine (not shown) and a through-hole 23 is formed. The mask 2 is set at 21.
[0013]
Next, only the forward squeegee 8a of the forward squeegee 8a and the backward squeegee 8b provided above and movable and pressurized vertically is lowered to a predetermined position on the mask 2, and a pressure is applied to the conductive squeegee 8a. The paste 24 is advanced while rolling.
[0014]
Next, as shown in FIG. 10B, the light passes through the opening edge 5 b of the mask 2 and reaches the prepreg sheet 21. The reciprocating squeegees 8a and 8b have a function of freely moving up and down according to the position while maintaining the pressure.
[0015]
Next, as shown in FIG. 10C, the forward squeegee 8a passes over the prepreg sheet 21 and the inclined portion of the mask 2 again, stops at a fixed position on the mask 2, and then rises to form the conductive paste 24. Is falling naturally.
[0016]
Next, as shown in FIG. 10D, only the return side squeegee 8b is lowered to a predetermined position on the mask 2. Thereafter, as shown in FIGS. 10E to 10G, the back side squeegee 8b is passed over the mask 2 and the prepreg sheet 21 in the same manner as the forward side squeegee 8a, thereby filling the through-hole 23 with the conductive paste 24. Complete.
[0017]
Then, as shown in FIG. 7D, the mask films 22a and 22b are peeled off from both surfaces of the prepreg sheet 21.
[0018]
Next, as shown in FIG. 7 (e), metal foils 25 a and 25 b such as copper are superimposed on both surfaces of the prepreg sheet 21.
[0019]
By heating and pressing with a hot press in this state, as shown in FIG. 7F, the thickness of the prepreg sheet 21 is compressed (t2 = about 100 μm) and the prepreg sheet 21 and the metal foils 25a and 25b are bonded. The metal foils 25a and 25b on both sides are electrically connected by a conductive paste 24 filling a through hole 23 provided at a predetermined position.
[0020]
Then, the metal foils 25a and 25b on both sides are selectively etched to form a circuit pattern (not shown), thereby obtaining a circuit board on both sides.
[0021]
As prior art document information related to the invention of this application, for example, Patent Document 1 and Patent Document 2 are known.
[0022]
[Patent Document 1]
JP-A-6-268345 [Patent Document 2]
JP-A-7-106760
[Problems to be solved by the invention]
However, the problem in the above-mentioned conventional paste filling method is shown in FIG.
[0024]
That is, (when the viscosity of the conductive paste 24 is high), when printing is started, when the opening edge 5b of the mask 2 is lowered, the conductive paste 24 is pressed against the surface of the prepreg sheet 21 and, thereby, around the edge of the squeegee 8b. Is extruded, and the high-viscosity conductive paste 24 adheres to the entire edge of the squeegee 8b.
[0025]
When the adhered conductive paste 24 passes through the through-hole 23 formed in the prepreg sheet 21, a hard paste remains on the through-hole 23 at the beginning of the squeegee traveling direction, especially over the entire paste filling width of the squeegee 8 b. When the mask films 22a and 22b are peeled off, a part of the conductive paste 24 may be transferred to the mask film 22a side to affect the quality.
[0026]
[Means for Solving the Problems]
In order to achieve the above object, a printing plate or a circuit board of the present invention and a paste filling method using the same include a squeegee cleaning unit provided on a printing plate before a squeegee passes through a through hole of a product. The high-viscosity paste on the squeegee edge is removed by passing the squeegee edge, and a high-quality circuit board can be obtained.
[0027]
BEST MODE FOR CARRYING OUT THE INVENTION
The invention according to claim 1 of the present invention has a frame-shaped opening that covers the entire circumference or a part of the outer circumference of the substrate material, and has a metal sheet at the front end of the inclined portion and the other two sides. It is a printing plate fixed and fixed by protruding, and by providing a convex portion at a predetermined position on the upper surface of the protruding portion of at least one metal sheet of the inclined portion, the high viscosity paste of the squeegee edge portion formed by the inclined portion is removed. It can be removed, leaving no hard paste residue in the through-hole of the product, and eliminating the possibility that when peeling off the mask film, part of the paste will be transferred to the mask film side and adversely affect the quality. And a printing plate for performing a printing method with high paste filling quality.
[0028]
The invention according to claim 2 of the present invention is the printing plate according to claim 1, wherein the protrusions of the metal sheet are formed of linear protrusions having a predetermined length, without leaving a paste attached to the entire squeegee, It can be removed efficiently.
[0029]
According to the third and fourth aspects of the present invention, the convex portion of the metal sheet comprises a staggered convex portion having a predetermined length, and this configuration can efficiently remove the paste attached to the squeegee. It is. Further, the projections are provided at successively overlapping intervals, so that the paste adhered to the entire squeegee can be removed without leaving.
[0030]
According to a fifth aspect of the present invention, there is provided the printing plate according to the first aspect, wherein the metal sheet is etched to form the projections, and even the projections provided in a staggered manner are easily formed. Is what you can do.
[0031]
According to the invention described in claim 6 of the present invention, the convex portion of the metal sheet can be easily formed at low cost by using a molding method.
[0032]
According to a seventh aspect of the present invention, there is provided the printing plate according to the first aspect, wherein the height of the convex portion is 3 μm or more and 40 μm or less, and the squeegee edge is efficiently removed from the paste attached to the squeegee. It does not damage the.
[0033]
The invention according to claim 8 of the present invention is the printing plate according to claim 1, wherein the inclined portion has an inclination of 15 °, and facilitates passage of a squeegee.
[0034]
According to a ninth aspect of the present invention, there is provided the printing plate according to the first aspect, wherein the edges of the convex portions are rounded, and prevent damage to the squeegee edge.
[0035]
According to a tenth aspect of the present invention, there is provided a method for printing a paste on a printing material by reciprocating a squeegee using the printing plate according to the first aspect, wherein the printing plate has convex portions before printing. This is a printing method that removes the paste adhered to the squeegee edge by removing the high-viscosity paste at the squeegee edge formed by the inclined portion, eliminating the hard paste residue in the through-hole of the product, and removing the mask film. The present invention has an effect of eliminating a possibility that a part of the paste is transferred to the mask film side when peeling off and adversely affects the quality, and provides a printing method with high paste filling quality.
[0036]
The invention according to claim 11 of the present invention is the printing method according to claim 10, wherein the squeegee is stopped for a predetermined time in front of the convex portion of the printing plate. Can be removed.
[0037]
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
[0038]
(Embodiment 1)
The paste filling method and the filling plate will be described below.
[0039]
FIG. 1 is a plan view of the printing plate of the present invention, and FIG. 2 is a cross-sectional view of the printing plate of the present invention.
[0040]
3 (a) to 3 (c) show a first metal sheet of the present invention. FIG. 3 (a) is a plan view thereof, and FIGS. 3 (b) and 3 (c) are sectional views thereof. .
[0041]
4 (a) to 4 (c) show a second metal sheet of the present invention. FIG. 4 (a) is a plan view thereof, FIG. 4 (b) is a sectional view thereof, and FIG. 4 (c) is an enlarged plan view thereof. FIG. FIG. 5 is a cross-sectional view of a step of filling a paste by the squeezing method of the present invention, and FIG. 6 is a partial cross-sectional view of filling a paste using the printing plate of the present invention.
[0042]
Note that the same components and parts described in the related art are assigned the same reference numerals, and detailed description is omitted.
[0043]
As shown in FIGS. 1 and 2, the printing plate of the present invention has a plate frame 1 made of a stainless steel mask 2 having a thickness of about 3 mm and an opening 4 of 250 mm × 450 mm wider than the paste filling area of the prepreg sheet 21. (Note that a dedicated mask film is disposed on the prepreg sheet 21 having a size of 300 × 500 mm and a thickness of about 150 μm).
[0044]
In the squeegee advancing direction (450 mm side) of the opening 4 of the mask 2, an inclined portion 5 having a 15 ° inclination is provided to facilitate passage of the squeegee.
[0045]
A metal sheet 3 fixed with an adhesive or the like protrudes about 5 mm from the back surface of the inclined portion 5 on the two sides of the mask 2 and the back surface of the other two sides.
[0046]
As shown in FIGS. 3 (a) to 3 (c), at a predetermined position on the upper surface of the metal sheet 3 having a thickness of about 100 μm which protrudes from the back surface of the inclined portion 5 of the mask 2, a convex part of about 40 μm on a straight line, As shown in FIGS. 4 (a) to 4 (c), a squeegee cleaning section 7 is formed in which protrusions having a diameter of about 300 μm and a pitch of 500 μm and a height of about 40 μm are arranged in a staggered manner at intervals of 500 μm.
[0047]
Although the height of the convex portion was set to 40 μm in the embodiment, it has been confirmed that the same effect can be obtained if the height is 3 μm or more. A height of 40 μm or less that does not damage the squeegee edge is desirable.
[0048]
The projections on the straight line were formed by etching or molding, and the staggered projections were formed by etching.
[0049]
In order to prevent damage to the squeegee edge, the edge of the convex portion is preferably rounded using an etching method or the like.
[0050]
In particular, when the protrusions are formed in a staggered manner, it is preferable that the formed protrusions are arranged so that the respective protrusions are flush with each other or overlap as shown in FIG. Further, in the embodiment, the squeegee cleaning portion 7 is formed only by the convex portion, but a through hole or a non-through hole may be provided in the convex portion.
[0051]
A method for filling the conductive paste will be briefly described with reference to FIGS.
[0052]
First, as shown in FIG. 5A, the mask films 22a and 22b are adhered to both sides of the conductive paste 24 placed on the stage 6 of a printing machine (not shown) to form the through holes 23. The mask 2 is set on the prepreg sheet 21.
[0053]
Then, only the forward squeegee 8a of the forward squeegee 8a and the backward squeegee 8b provided above and movable and pressurized up and down, left and right is lowered to a predetermined position on the mask 2, and the pressure is applied to the conductive paste. 24 is moving forward while rolling.
[0054]
Then, as shown in FIG. 5B, the light passes through the inclined portion 5 of the mask 2 and reaches the prepreg sheet 21. The reciprocating squeegees 8a and 8b have a function of freely moving up and down according to the position while maintaining the pressure.
[0055]
Then, as shown in FIG. 5C, the forward squeegee 8a passes over the prepreg sheet 21 and the inclined portion 5 of the mask 2 again, stops at a fixed position on the mask 2, and then rises to remove the conductive paste 24. Let it fall naturally.
[0056]
Next, as shown in FIG. 5D, only the return side squeegee 8b is lowered to a predetermined position on the mask 2.
[0057]
Then, as shown in FIGS. 5 (e) to 5 (g), the rear side squeegee 8b is passed over the mask 2 and the prepreg sheet 21 in the same manner as the forward side squeegee 8a, so that the conductive paste 24 is filled into the through holes 23. Complete. In the printing plate of the present invention, a metal sheet 3 having a squeegee cleaning portion 7 formed by a convex portion at a predetermined position on the upper surface is projected from the back surface of the inclined portion 5 of the mask 2 on the start side of the return side squeegee 8b.
[0058]
FIG. 6 is a partial cross-sectional view when the backward squeegee 8b starts and passes through the mask 2, the inclined portion 5, the squeegee cleaning portion 7 on the metal sheet 3, and the through hole 23 in the product.
[0059]
As a result, after the refilling squeegee 8b starts to be filled, when the squeegee cleaning unit 7 passes through the squeegee cleaning unit 7 via the inclined unit 5 of the mask 2, the squeegee cleaning unit 7 removes the convex edge on the inclined unit 5 side of the mask 2. It was confirmed that the conductive paste 24 remained.
[0060]
The distance from the inclined portion 5 of the mask 2 to the squeegee cleaning portion 7 is set to a distance that allows the deformation of the squeegee 8b to be restored when the inclined portion 5 is lowered, or the speed of the squeegee 8b is reduced or temporarily stopped. It is advisable to fill at a normal speed after the deformation is restored.
[0061]
In the present embodiment, the squeegee 8b is filled before stopping the squeegee cleaning unit 7 for about 1 second.
[0062]
Then, the conductive paste 24 remaining in the squeegee cleaning unit 7 was removed by the forward squeegee 8a when the next prepreg sheet 21 was filled, and it was confirmed that the effect was continuously effective.
[0063]
Further, 100 prepreg sheets 21 in which the conductive paste 24 was filled in the through holes were confirmed. However, after passing through the squeegee cleaning unit 7, no paste remained on the through holes, and the mask films 22a and 22b were peeled off when the mask films 22a and 22b were peeled off. , 22b were not transferred and did not affect the quality.
[0064]
【The invention's effect】
As described above, the printing plate and the printing method of the present invention provide a product by removing a high-viscosity paste at a squeegee edge at a squeegee cleaning unit provided on a printing plate before filling a paste into a through hole of a circuit board. It is possible to prevent a high-viscosity paste residue on the through-hole, and to provide a circuit board having excellent quality.
[Brief description of the drawings]
FIG. 1 is a plan view of a printing plate of the present invention. FIG. 2 is a cross-sectional view of the printing plate of the present invention. FIGS. 3A to 3C each show a first metal sheet of the present invention. FIGS. 4 (a) to 4 (c) each show a second metal sheet of the present invention. FIGS. 5 (a) to 5 (g) are cross-sectional views of steps of paste filling by the squeezing method of the present invention, respectively. FIG. 6 is a partial cross-sectional view when filling a paste using the printing plate of the present invention. FIGS. 7A to 7F are process cross-sectional views of a conventional method for manufacturing a double-sided circuit board, respectively. FIG. 9 is a perspective view showing a plate frame to which a conventional mask having an opening is mounted. FIG. 9 is a cross-sectional view of a plate frame to which a conventional mask having an opening is mounted. FIG. 11 is a cross-sectional view of a paste filling process using a conventional squeezing method. Part sectional view EXPLANATION OF REFERENCE NUMERALS
Reference Signs List 1 plate frame 2 mask 3 metal sheet 4 opening 5 inclined section 6 stage 7 squeegee cleaning section 8a forward squeegee 8b return side squeegee 21 prepreg sheets 22a, 22b mask film 23 through hole 24 conductive paste 25a, 25b metal foil

Claims (11)

基板材料の全周あるいは一部の略外周部を覆う額縁状の開口部を有し、前記開口部のスキージ進行方向2辺の上方に傾斜部を設けたマスクを少なくとも四辺の版枠に固定し、傾斜部の裏面先端と他の2辺に金属シートを所定量突出させて固着した印刷用版であり、少なくとも傾斜部の一方の金属シートの突出部の上面に凸部を設けた印刷用版。A mask having a frame-shaped opening covering the entire periphery or a part of the outer periphery of the substrate material, and having a slope provided above two sides of the opening in the squeegee traveling direction is fixed to at least four sides of the frame. A printing plate comprising a metal sheet protruding and fixing a predetermined amount to the rear end of the inclined portion and the other two sides, and a printing plate provided with a convex portion on at least the upper surface of the protruding portion of one of the inclined metal sheets. . 金属シートの凸部が所定長の直線状の凸部からなる請求項1に記載の印刷用版。The printing plate according to claim 1, wherein the convex portion of the metal sheet comprises a linear convex portion having a predetermined length. 金属シートの凸部が所定長に千鳥状に設けた凸部からなる請求項1に記載の印刷用版。The printing plate according to claim 1, wherein the protrusions of the metal sheet are formed in a staggered manner with a predetermined length. 金属シートに千鳥状に設けた凸部が逐次重なり合う間隔で設けた請求項3記載の印刷用版。4. The printing plate according to claim 3, wherein the protruding portions provided in a zigzag pattern on the metal sheet are provided at intervals such that they sequentially overlap. 金属シートをエッチングして凸部を形成した請求項1に記載の印刷用版。The printing plate according to claim 1, wherein the convex portion is formed by etching the metal sheet. 金属シートを成型して凸部を形成した請求項1に記載の印刷用版。The printing plate according to claim 1, wherein the metal sheet is molded to form the convex portion. 凸部の高さは3μm以上40μm以下である請求項1に記載の印刷用版。The printing plate according to claim 1, wherein the height of the protrusion is 3 μm or more and 40 μm or less. 傾斜部は15°の傾斜を備えている請求項1に記載の印刷用版。The printing plate according to claim 1, wherein the inclined portion has an inclination of 15 °. 凸部のエッジは丸め処理されている請求項1に記載の印刷用版。The printing plate according to claim 1, wherein an edge of the projection is rounded. 請求項1記載の印刷用版を用いて、スキージを往復させペーストを被印刷物に印刷する方法であって、印刷する前に印刷用版の凸部でスキージエッジに付着したペーストを除去する印刷方法。A method of printing a paste on a printing material by reciprocating a squeegee using the printing plate according to claim 1, wherein the printing method removes the paste attached to the squeegee edge at a convex portion of the printing plate before printing. . 印刷用版の凸部の前でスキージを所定時間停止する請求項10に記載の印刷方法。The printing method according to claim 10, wherein the squeegee is stopped for a predetermined time before the convex portion of the printing plate.
JP2002277011A 2002-09-24 2002-09-24 Printing plate and printing method using the same Expired - Fee Related JP3922146B2 (en)

Priority Applications (10)

Application Number Priority Date Filing Date Title
JP2002277011A JP3922146B2 (en) 2002-09-24 2002-09-24 Printing plate and printing method using the same
PCT/JP2003/011999 WO2004028823A1 (en) 2002-09-24 2003-09-19 Printing plate, circuit board and method of printing circuit board
DE60323549T DE60323549D1 (en) 2002-09-24 2003-09-19 Pressure plate, circuit board and printing process for a printed circuit board
US10/490,482 US7105277B2 (en) 2002-09-24 2003-09-19 Printing plate, circuit board and method of printing circuit board
DE60312947T DE60312947T2 (en) 2002-09-24 2003-09-19 PRESSURE PLATE, PCB AND METHOD FOR PRINTING A PCB
EP07000982A EP1780034B1 (en) 2002-09-24 2003-09-19 Printing plate, printing board, and printing method for printed board
CNB038011743A CN1318228C (en) 2002-09-24 2003-09-19 Printing plate, circuit board and method of printing circuit board
CN2007101034429A CN101048031B (en) 2002-09-24 2003-09-19 Printing plate, printing board, and printing method for printed board
EP03787306A EP1428677B1 (en) 2002-09-24 2003-09-19 Printing plate, circuit board and method of printing circuit board
TW092126097A TWI291846B (en) 2002-09-24 2003-09-22 Printing plate, circuit board and printing method for printing on the circuit board

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