JPH11348177A - Copper foil with resin, manufacture thereof, and multilayer printed wiring board using same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent struck marks from developing on the rear surface of a copper foil with resins by a method wherein resins are formed at one or a plurality of parts of the surface of the copper foil so as to leave a blank space part, in which the copper foil is exposed, at the fringe of the copper foil. SOLUTION: A copper foil with resins 10 consists of the copper foil 11 and insulating and thermosetting resins 13 formed on one side of the copper foil. The resins 13 are formed on the surface of the copper foil 11 so as to leave a blank space part 12 at the copper foil 11. As for the resin 13, a resin paste or a sheet-like resin film made of an epoxy-like resin, a polyimide resin or the like is used. As the thermosetting resin, a resin, which does not melt once after its complete hardening, is employed. The width of the blank space part 12 is set to have an enough width as the flowing allowance of the resin at a laminating pressing. The blank space part is provided along the four sides of the copper foil with resins so as to confine the resins forced out of the resin 13 at the laminating pressing within the blank space part 12 in order not to reach the edge parts of the copper foil with resins 10, resulting in not staining an intermediate plate. Thus, no cut waste resin under semi-hardened state does fly at its cutting and after its cutting and struck marks can be prevented from developing on the rear surface of the copper foil at the laminating pressing.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a resin-coated copper foil, a method for producing the same, and a multilayer printed wiring board using the resin-coated copper foil.

[0002]

2. Description of the Related Art As shown in FIG. 6, a copper foil with resin 1 is a copper foil 1a.
Is formed by forming an insulating resin 5 such as an epoxy resin on one side of the inner core material 2 having, for example, a circuit pattern 2a formed on both sides thereof, with the resin 5 side facing the inner layer core material 2 side. It is used to manufacture the multilayer printed wiring board 6 by arranging and pressing each other. Reference numeral 3 denotes an intermediate plate of the press device.

As shown in FIG. 7, a resin-coated copper foil 1 is coated on a large copper foil 4 and then cut to a required size within a range where the resin 5 is coated. It is set to 1. Therefore, as shown in FIG.
resin 5 is applied to the edge of the upper surface of
And the surface area of the applied resin 5 is the same.

When the multilayer printed wiring board 6 is manufactured by using the above-described resin-coated copper foil 1, a discard plate portion is provided at the edge of the multilayer printed wiring board to prevent the occurrence of defects in the laminating press process. Is normal.

[0005]

Since the resin-coated copper foil 1 is sent to the lamination pressing step in a state where the resin 5 is semi-cured, the copper foil 4 is changed from a large size to a small resin-coated copper foil as shown in FIG. The operation of cutting into pieces 1 is also performed with the resin 5 in a semi-cured state. Therefore, the chips of the semi-cured resin 5 are scattered at the time of cutting, and the chips of the semi-cured resin 5 remaining on the cut surface after cutting are removed from the back surface of the copper foil 1a on which the resin is not applied (copper). The exposed surface of the foil 1 a) wraps around and adheres to the side 1 b (FIG. 8), and is pressed by the intermediate plate 3 (FIG. 6) in the lamination pressing step, and a dent is formed on the back surface 1 b of the resin-coated copper foil 1 to cause a defective product. It may be.

Further, in the conventional resin-coated copper foil 1, since the resin 5 is applied to the edge of the surface of the copper foil 1a, the resin 5 melted by heating at the time of laminating press starts from the edge of the copper foil 1a. The copper foil 1a protrudes, adheres to the intermediate plate 3 and hardens, and causes dents on the back surface 1b of another copper foil 1a in the subsequent laminating press.

In order to prevent the resin 5 from sticking to the intermediate plate 3 due to protrusion, for example, as shown in FIG. 9, a mold release made of a fluorine-based resin or the like is provided between the resin-coated copper foil 1 and the intermediate plate 3 as shown in FIG. The film 7 and the like may be arranged, but this requires labor and cost.

An object of the present invention is to provide a resin-coated copper foil which prevents the occurrence of dents on the back surface of the resin-coated copper foil, a method of manufacturing the same, and a multilayer printed wiring board using the resin-coated copper foil. I have.

[0009]

Means for Solving the Problems The resin-coated copper foil of the present invention comprises:
A resin is formed on one or more portions of the surface of the copper foil so that there is a margin where the copper foil is exposed in the periphery.

[0010] The method for producing a resin-coated copper foil according to the present invention is characterized in that the resin is formed on one or more portions of the surface of the copper foil so that a margin where the copper foil is exposed is left around the resin. I do.

Further, the multilayer printed wiring board of the present invention is formed by laminating a resin-coated copper foil having a margin where the copper foil is exposed around the resin on the inner layer core material on which the circuit pattern is formed. It is characterized by having.

[0012]

1 and 2, a resin-coated copper foil 10 of the present invention comprises a copper foil 11 and an insulating thermosetting resin 13 formed on one side thereof, and the surface of the copper foil is The resin 13 is formed leaving the exposed margin 12 at the edge. Examples of the method of forming the resin 13 include a method of applying a resin paste and a method of laminating a resin film.

The size of the copper foil with resin 10 is, for example, 500 m.
mx 600mm, 400mm x 500mm, 340mm
It is determined according to the use such as × 400 mm. The thickness of the copper foil 11 is, for example, 9 μm to 35 μm.

The resin 13 is an epoxy resin,
Polyimide resin, bismaleide triazine resin (B
Resin paste or sheet-like resin film such as T-resin) and thermosetting PPE (polyphenylene ether), preferably a resin film with an adhesive, can be used, but is not limited thereto. The thickness of the resin 13 is, for example, 25 μm to 100 μm, but may be other thicknesses depending on the application. It is preferable to use a thermosetting resin which does not dissolve once it is completely cured.

The width of the margin portion 12 is set to a width sufficient to allow the resin to flow in the laminating press, for example, from 10 mm to 20 mm, and increases or decreases according to the amount of the resin 13. May be. It is preferable that the margins 12 are provided on all four sides of the resin-coated copper foil 10.

Further, as shown in FIGS. 3 and 4, a plurality of resins 13A having a margin 12 where the copper foil is exposed may be provided, and the shape of the resin and the margin of the margin may be provided. The shape is not limited to those shown in FIGS. In the case of the resin-attached copper foil 20, it may be used after cutting the copper foil along the cutting line 14, or may be used without cutting.

The resin 1 of the resin-coated copper foils 10 and 20 of the present invention
3 and 13A are formed by printing an insulating resin paste using, for example, a screen plate so as to leave a margin 12 where a copper foil is exposed, or a sheet having an insulating adhesive. It is formed by arranging (roll coating) a resin film.

The resin-coated copper foil 10 of the present invention (the resin-coated copper foil 20
While the resin 13 is in a semi-dry state,
As shown in FIG. 5, for example, the multilayer printed wiring board 15 is manufactured by arranging the circuit patterns 2a on both sides of the inner layer core material 2 formed on both sides, placing the intermediate plate 3 and performing lamination pressing. The release film 7 is not used.

The resin that has overflowed from the resin 13 during the laminating press is contained in the blank portion 12 and does not reach the edge of the copper foil 10 with resin, so that the intermediate plate 3 is not stained.

It is to be noted that a part or all of the margin portion 12 may be a discard plate portion.

In the above embodiment, a four-layer printed wiring board has been described as an example, but the same applies to a multilayer printed wiring board having three or five or more layers. Further, it is needless to say that the present invention can be applied to a case where two or more multilayer printed wiring boards are multi-faced and formed simultaneously.

[0022]

According to the present invention, since the resin is not cut when the resin is in a semi-cured state, the chips of the resin in the semi-cured state are not scattered at the time of cutting or after the cutting, and the chips can be cut during laminating press. No dents occur on the back surface of the resin-coated copper foil.

Further, in the present invention, the margin is formed as a margin for the resin in a semi-cured state at the time of laminating press, thereby preventing the resin from protruding out of the resin-coated copper foil. It is possible to prevent dents from being formed on the back surface of another copper foil.

Further, labor and cost, such as the use of a release film, can be omitted.

[Brief description of the drawings]

FIG. 1 is a plan view of a copper foil with resin of the present invention.

FIG. 2 is a sectional view of FIG.

FIG. 3 is a plan view of another copper foil with resin of the present invention.

FIG. 4 is a sectional view of FIG. 3;

FIG. 5 is a view showing a state in which a laminating press is performed in a production process of the copper foil with resin of the present invention.

FIG. 6 is a view showing a state in which a laminating press is performed in a conventional manufacturing process of a copper foil with resin.

FIG. 7 is a view showing a conventional process of cutting a copper foil with resin.

FIG. 8 is a sectional view of a conventional copper foil with resin.

FIG. 9 is a view showing a state in which a laminating press is performed in a manufacturing process of a conventional copper foil with resin.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Copper foil with resin 11 Copper foil 12 Margin 13 Resin 14 Cutting line 15 Multilayer printed wiring board 20 Copper foil with resin

Claims (7)

[Claims] 1. A resin-coated copper foil, wherein a resin is formed on the surface of the copper foil such that there is a margin where the copper foil is exposed in the periphery. 2. A resin-coated copper foil, wherein a plurality of portions of resin are formed on the surface of the copper foil so that there is a margin where the copper foil is exposed. 3. The method according to claim 1, wherein the margin is a discarded plate.
The copper foil with resin described in 1. 4. A method for manufacturing a resin-coated copper foil, comprising forming a resin on one or more portions of the surface of the copper foil so that a margin where the copper foil is exposed is left around the resin. 5. A resin-coated copper foil, wherein a resin is partially applied to the surface of the copper foil by using a screen plate so that a margin where the copper foil is exposed remains around the resin. Production method. 6. A method for producing a resin-coated copper foil, comprising forming a resin by arranging a sheet-like resin film such that a margin where the copper foil is exposed remains around the resin. 7. An inner core material on which a circuit pattern is formed,
A multilayer printed wiring board formed by laminating a resin-attached copper foil having a margin where the copper foil is exposed around the resin.