JP2004109253A - Pattern form and method for manufacturing same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a pattern form which can form patterns in a simple step and can form patterns even if the form is not irradiated with energy in the form of the patterns by a method using a photomask, a method using electron beam lithography, etc. <P>SOLUTION: The pattern form has a photocatalytic reaction inhibitive substrate which has an effect of inhibiting or lowering the effect of a photocatalyst and contains a photocatalytic reaction inhibitive base material, shielding layers which are formed in the form of the patterns on the photocatalytic reaction inhibitive base material, and a photocatalyst-containing layer which is deposited on the photocatalytic reaction inhibitive substrate surface with the shielding layers formed in the form of the patterns and is changed in the wettability of the surface by irradiation with the energy. <P>COPYRIGHT: (C)2004,JPO

Description

ただし、ｎは２以上の整数であり、Ｒ^１，Ｒ^２はそれぞれ炭素数１〜１０の置換もしくは非置換のアルキル、アルケニル、アリールあるいはシアノアルキル基であり、モル比で全体の４０％以下がビニル、フェニル、ハロゲン化フェニルである。また、Ｒ^１、Ｒ^２がメチル基のものが表面エネルギーが最も小さくなるので好ましく、モル比でメチル基が６０％以上であることが好ましい。また、鎖末端もしくは側鎖には、分子鎖中に少なくとも１個以上の水酸基等の反応性基を有する。
【００９１】
また、上記のオルガノポリシロキサンとともに、ジメチルポリシロキサンのような架橋反応をしない安定なオルガノシリコーン化合物を混合してもよい。
【００９２】
さらに、本実施態様における光触媒含有層には、上記光触媒およびバインダの他に、界面活性剤を含有させることができる。具体的には、日光ケミカルズ（株）製ＮＩＫＫＯＬ　ＢＬ、ＢＣ、ＢＯ、ＢＢの各シリーズ等の炭化水素系、デュポン社製ＺＯＮＹＬ　ＦＳＮ、ＦＳＯ、旭硝子（株）製サーフロンＳ−１４１、１４５、大日本インキ化学工業（株）製メガファックＦ−１４１、１４４、ネオス（株）製フタージェントＦ−２００、Ｆ２５１、ダイキン工業（株）製ユニダインＤＳ−４０１、４０２、スリーエム（株）製フロラードＦＣ−１７０、１７６等のフッ素系あるいはシリコーン系の非イオン界面活性剤を挙げることかでき、また、カチオン系界面活性剤、アニオン系界面活性剤、両性界面活性剤を用いることもできる。
【００９３】
また、光触媒含有層には上記の界面活性剤の他にも、添加剤としてポリビニルアルコール、不飽和ポリエステル、アクリル樹脂、ポリエチレン、ジアリルフタレート、エチレンプロピレンジエンモノマー、エポキシ樹脂、フェノール樹脂、ポリウレタン、メラミン樹脂、ポリカーボネート、ポリ塩化ビニル、ポリアミド、ポリイミド、スチレンブタジエンゴム、クロロプレンゴム、ポリプロピレン、ポリブチレン、ポリスチレン、ポリ酢酸ビニル、ポリエステル、ポリブタジエン、ポリベンズイミダゾール、ポリアクリルニトリル、エピクロルヒドリン、ポリサルファイド、ポリイソプレン等のオリゴマー、ポリマー等を含有させることができる。
【００９４】
（ｉｉ）少なくとも光触媒と光触媒分解性物質とからなる場合
次に、光触媒含有層が、光触媒と、光触媒含有層の表面に存在し光触媒の作用により分解されて濡れ性が変化する光触媒分解性物質とから少なくともなる場合について説明する。
【００９５】
このような場合からなる光触媒含有層は、光触媒分解性物質を光触媒の作用により分解させて濡れ性を変化させているため、この場合の光触媒含有層に用いられるバインダにおいては、光触媒の作用により濡れ性が変化する機能を特に必要としない。
【００９６】
以下、このような場合からなる光触媒含有層の構成について説明するが、光触媒については、上記「（ｉ）少なくとも光触媒とバインダとからなる場合」の中に記載した光触媒と同様のものを用いることができるため、ここでの説明は省略する。以下、光触媒分解性物質およびこの場合に用いられるバインダについて説明する。
【００９７】
ａ．光触媒分解性物質
本実施態様で用いられる光触媒分解性物質としては、エネルギー照射に伴う光触媒の作用により分解される物質であれば特に限定はされないが、特に、分解されることにより濡れ性が変化する物質であることが好ましい。さらにその中でも、液体との接触角が低下する方向に濡れ性が変化する物質であることが好ましい。このような光触媒分解性物質を添加することにより、光触媒含有層表面に濡れ性の変化を起こさせることができ、もしくはそのような変化を補助することができるのである。このような光触媒分解性物質を含有する光触媒含有層とすると、遮蔽層上に位置するこの光触媒含有層は、エネルギー照射の際、光触媒の作用が阻止されることがなく、液体との濡れ性が低下する方向に濡れ性が変化し、親液性領域を形成することができる。
【００９８】
このような光触媒分解性物質としては、光触媒の作用により分解し、かつ分解されることにより光触媒含有層表面の濡れ性を変化させる機能を有する界面活性剤を挙げることができる。具体的にこのような界面活性剤としては、上述した（３）光触媒含有層の「（ｉ）少なくとも光触媒およびバインダからなる場合」の項目の中に記載した界面活性剤と同様のものを挙げることができる。また、その他にも上記項目の中に記載した添加剤も本実施態様における光触媒分解性物質として用いることが可能である。
【００９９】
ｂ．バインダ
このような場合に用いられるバインダ、すなわち光触媒の作用により光触媒含有層上の濡れ性を変化させる機能を特に必要としないバインダとしては、主骨格が上記光触媒の光励起により分解されないような高い結合エネルギーを有するものであれば特に限定されるものではない。具体的には、有機置換基を有さないもしくは多少有機置換基を有するポリシロキサンを挙げることができ、これらはテトラメトキシシラン、テトラエトキシシラン等を加水分解、重縮合することにより得ることができる。
【０１００】
２．第２実施態様
第２実施態様は、光触媒の機能を阻害または低下させる作用を及ぼす側として、上述した光触媒反応阻害物質を含有する光触媒反応阻害物質含有層を光触媒の作用に影響を与えない基体上にパターン状に形成したものを用い、一方、パターンが形成される側として、エネルギー照射に伴う光触媒の作用により濡れ性が変化する光触媒含有層を用いた態様である。
【０１０１】
このような本実施態様におけるパターン形成体は、基体と、前記基体上にパターン状に形成され、光触媒の作用を阻害しまたは低下させる光触媒反応阻害物質を含有する光触媒反応阻害物質含有層と、前記光触媒反応阻害物質含有層がパターン状に形成されている基体上に成膜され、エネルギー照射により表面の濡れ性が変化する光触媒含有層とを有することを特徴とするものである。
【０１０２】
なお、ここでいう「基体」とは、通常の基体として機能するものであれば特に限定されないが、一般的には、光触媒の作用に対して影響を与えないものが用いられる。
【０１０３】
本実施態様においては、このように光触媒の作用に影響を及ぼさない基体上に、光触媒反応阻害物質含有層をパターン状に形成し、さらに、この光触媒反応阻害物質含有層がパターン状に形成されている基体上に光触媒含有層を成膜することから、基体と接触している光触媒含有層は、エネルギー照射の際に、光触媒が触媒として機能し濡れ性を変化させるが、光触媒反応阻害物質含有層と接触する光触媒含有層は、光触媒反応阻害物質含有層の影響により、エネルギーを照射しても光触媒が触媒として十分に機能しないため、濡れ性の変化は生じない。従って、本実施態様においては、光触媒含有層表面にエネルギーを全面照射する場合であっても、パターン状に形成された光触媒反応阻害物質含有層のパターンに沿って、光触媒含有層表面に濡れ性の違いによるパターンを形成することができるのである。さらに、エネルギー照射後に現像・洗浄といった後処理を施す必要がないことから、簡便な製造方法によりパターン形成体を得ることができるのである。
【０１０４】
このような本実施態様のパターン形成体について図面を用いて説明する。
【０１０５】
図２は、本実施態様のパターン形成体の一例を示すものである。図２においては、光触媒の作用に影響を及ぼさない基体２１と、当該基体２１上にパターン状に形成され、光触媒の作用を阻害または低下させる光触媒反応阻害物質を含有する光触媒反応阻害物質含有層２２が示されている。さらに、このような光触媒反応阻害物質含有層２２がパターン状に形成されている基体２１上には、光触媒含有層３が成膜されている。ここで、光触媒含有層３のうち基体２１と接触している部分は、光触媒の作用が阻害されないため、エネルギー照射により、液体との接触角が低下する方向に濡れ性が変化した親液性領域５となる。一方、光触媒反応阻害物質含有層２２上に位置する光触媒含有層３は、光触媒反応阻害物質含有層２２の影響から光触媒の作用が阻害されるため、エネルギーを照射しても濡れ性が変化せず撥液性領域４となる。
【０１０６】
このような本実施態様について、光触媒反応阻害物質含有層および基体について詳細に説明する。なお、光触媒含有層に関しては、上述した第１実施態様の中に記載したものと同様であるので、ここでの説明は省略する。
【０１０７】
（１）光触媒反応阻害物質含有層
本実施態様における光触媒反応阻害物質含有層とは、少なくとも光触媒反応阻害物質を含有する層を意味し、近傍する光触媒に対して、その触媒として機能を阻害または低下させる影響を及ぼす機能を保持している。
【０１０８】
このような光触媒反応阻害物質含有層としては、バインダおよび光触媒反応阻害物質を少なくとも有している。このバインダに用いることが可能な材料としては、内部に光触媒反応阻害物質を含有させることができるものであれば特に限定されないが、具体的には、上述した光触媒含有層に用いたバインダや、樹脂系の材料等を挙げることができる。
【０１０９】
さらに、光触媒反応阻害物質および含有量については、上述した第１実施態様の「（１）光触媒反応阻害性基材」の中に記載したものと同様なのでここでの説明は省略する。
【０１１０】
このような光触媒反応阻害物質含有層の膜厚は、１０ｎｍ〜１５μｍの範囲内その中でも、１０ｎｍ〜７μｍの範囲内であることが好ましい。上記範囲よりも膜厚を厚くすると、パターン形成体全体としての平滑性が損なわれるからであり、一方、上記範囲よりも膜厚を薄くすると、上述した光触媒反応阻害物質の濃度との関係から、光触媒の作用を阻害または低下させる効果が十分得られないからである。
【０１１１】
（２）基体
本実施態様における基体とは、基体として機能する部材であれば、特に限定されないが、好ましくは、光触媒の作用に影響を与えない部材である。このような基体を形成する材料として具体的には、石英ガラス、無アルカリガラス、アルミニウムおよびアルミニウム合金等の金属、プラスチック等を挙げることができる。
【０１１２】
また、本発明のパターン形成体は、光触媒含有層および基体の間、または光触媒反応阻害物質含有層および光触媒含有層の間の接着性向上、表面粗度の改善、光触媒の作用による基体の劣化防止等を目的として基体上にプライマー層を形成してもよい。プライマー層としては、シロキサン構造を主成分とする樹脂、フッ素樹脂、エポキシ樹脂、ポリウレタン樹脂を挙げることができる。
【０１１３】
３．第３実施態様
次に、第３実施態様について説明する。第３実施態様は、光触媒の機能を阻害または低下させる作用を及ぼす側として、上述した光触媒反応阻害物質を含有する部分がパターン状に存在する光触媒反応阻害物質含有基材を用い、一方、パターンが形成される側として、エネルギー照射に伴う光触媒の作用により濡れ性が変化する光触媒含有層を用いた態様である。
【０１１４】
このような本実施態様におけるパターン形成体は、光触媒の作用を阻害しまたは低下させる光触媒反応阻害物質を含有する部分がパターン状に存在する光触媒反応阻害物質含有基材と、前記光触媒反応阻害物質含有基材上に成膜され、エネルギー照射により表面の濡れ性が変化する光触媒含有層とを有することを特徴とするものである。
【０１１５】
なお、ここでいう「光触媒反応阻害物質含有基材」とは、上述した光触媒反応阻害物質が、含有されている領域と含有されていない領域とが基材内に予め形成されており、かつ一般的な基材として機能する部材を意味している。従って、このような光触媒反応阻害物質含有基材上に光触媒含有層が成膜されると、光触媒反応阻害物質の有無のパターンに沿って光触媒含有層の内部には、光触媒の作用が阻害または低下される領域およびそのような影響を受けない領域が形成される。このような光触媒反応阻害物質含有基材が光触媒含有層に及ぼす影響を利用することにより、エネルギーを全面に照射する場合であっても、光触媒含有層表面に濡れ性の違いによるパターンを形成することができるのである。
【０１１６】
本実施態様におけるパターン形成体について図面を用いて説明する。
【０１１７】
図３は、本実施態様におけるパターン形成体の一例を示したものである。図３に示すように、上述した光触媒反応阻害物質を含有している領域３１および含有していない領域３２のパターンを有する光触媒反応阻害物質含有基材３３と、当該光触媒反応阻害物質含有基材３３上に成膜されている光触媒含有層３が示されている。ここで、光触媒含有層３は、光触媒反応阻害物質含有基材３３の影響から、光触媒反応阻害物質を含有している領域３１上に位置する部分は、エネルギー照射されても光触媒の作用が阻害されるため、撥液性領域４となる。一方、光触媒反応阻害物質を含有していない領域３２上に位置する光触媒含有層３は、エネルギー照射により光触媒が作用し液体との接触角が低下する方向に濡れ性が変化した親液性領域５となる。
【０１１８】
このような本実施態様における光触媒反応阻害物質含有基材を形成する材料としては、内部に光触媒反応阻害物質が含有している領域と、含有していない領域とをパターン状に形成することが可能であり、かつ、自己支持性を有するものであれば特に限定はされない。
【０１１９】
また、このような光触媒反応阻害物質含有層を形成する方法としては、光触媒反応阻害物質の有無のパターンを内部に形成することが可能な方法であれば特に限定されない。
【０１２０】
４．第４実施態様
次に、第４実施態様について説明する。第４実施態様は、光触媒の機能を阻害または低下させる作用を及ぼす側として、上述した第１実施態様と同様に光触媒反応阻害性基材を用い、一方、パターンが形成される側として、エネルギー照射に伴う光触媒の作用により特性が変化する特性変化層を用いた態様である。
【０１２１】
このような本実施態様におけるパターン形成体は、光触媒の作用を阻害しまたは低下させる作用を有し、かつ光触媒反応阻害物質を含有する光触媒反応阻害性基材と、前記光触媒反応阻害性基材上にパターン状に形成されている遮蔽層と、前記遮蔽層がパターン状に形成されている前記光触媒反応阻害性基材上に成膜され、少なくとも光触媒からなる光触媒処理層と、前記光触媒処理層上に成膜され、エネルギー照射に伴う光触媒の作用により特性が変化する特性変化層とを有することを特徴とするものである。
【０１２２】
このような特徴を有する本実施態様においては、上述した第１実施態様と同様に、遮蔽層がパターン状に形成されている光触媒反応阻害性基材を用いている。このような光触媒反応阻害性基材上に少なくとも光触媒を有する光触媒処理層を成膜することにより、光触媒処理層内部には、光触媒の作用が阻害または低下される領域と、そのような影響を受けない領域とが存在する。このように光触媒反応阻害性基材の影響から、光触媒の作用に違いが生じている光触媒処理層上に、エネルギー照射に伴う光触媒の作用により特性が変化する特性変化層を成膜することにより、全面にエネルギーを照射することにより、パターン状にエネルギーを照射しなくても特性の違いによるパターンを特性変化層に容易に形成することができる。
【０１２３】
このような本実施態様におけるパターン形成体について図面を用いて説明する。
【０１２４】
図４は、本実施態様のパターン形成体の一例を示したものである。また、特性変化層としては、種々の特性の変化を有するものが考えられるが、図４では、一例としてエネルギー照射に伴う光触媒の作用により分解除去される分解除去層を用いた場合を図示している。
【０１２５】
図４においては、光触媒の作用を阻害または低下させる機能を有する光触媒反応阻害性基材１上にパターン状に遮蔽層２が形成されている。さらに、遮蔽層２がパターン状に形成されている光触媒反応阻害性基材１上に少なくとも光触媒を有する光触媒処理層４１が全面に形成されている。さらに、当該光触媒処理層４１上には、エネルギー照射に伴う光触媒の作用により分解除去された分解除去層４２がパターン状に形成されている。遮蔽層２が形成されている領域上に位置していた分解除去層４２は、遮蔽層２の効果により光触媒反応阻害性基材１の影響が及ばず、エネルギー照射により分解除去されるため、遮蔽層２が形成されていない上のみ分解除去層４２は残存するのである。
【０１２６】
本実施態様のパターン形成体は、光触媒反応阻害性基材、遮蔽層、光触媒処理層および特性変化層により構成されているが、遮蔽層および光触媒反応阻害性基材に関しては、上述した第１実施態様の中に記載したものと同様であるので、ここでの説明は省略する。以下、特性変化層および光触媒処理層について説明する。
【０１２７】
（１）特性変化層
本実施態様における特性変化層とは、光触媒の作用により特性が変化する層であればいかなる層であってもよく、例えば、ポリエチレン、ポリプロピレン等のポリオレフィンなどのポリマー材料等を用いることにより、エネルギー照射した部分が光触媒の作用により、極性基が導入されたり、表面の状態が粗い状態となったりして種々の物質との接着性が向上するようにした層を特性変化層としてもよい。このように特性変化層を接着性が変化する接着性変化層とすることにより、エネルギー照射により遮蔽層のパターンに沿って、接着性の良好なパターンを形成することが可能となる。このような接着性の良好な部位のパターンを有するパターン形成体は、例えば、後述する機能性素子における機能性部が金属である場合には、このようなパターン形成体に金属成分を蒸着し、金属の薄膜を形成し、次いで接着性の違いを利用して金属薄膜を例えば粘着剤や薬剤等により剥離することにより、金属の薄膜のパターンを形成することが可能となる。この方法によれば、レジストのパターンを形成することなく金属薄膜のパターンを形成することが可能となり、また印刷法によるものよりも容易にプリント基板や電子回路素子等をパターン状に形成することができる。
【０１２８】
また、本実施態様においては、このような特性変化層が、乾式法、すなわち真空蒸着法等により形成されたものであってもよく、また、スピンコート法やディップコート法等の湿式法、インクジェットやディスペンサ等の吐出法等の方法により形成されたものであってもよい。
【０１２９】
このように、特性変化層は光触媒の作用により変化する種々の特性を有する層であれば特に限定されないのであるが、本実施態様においては中でも特性変化層が光触媒の作用により濡れ性が変化して濡れ性によるパターンが形成される濡れ性変化層である場合、および特性変化層が光触媒の作用により分解除去され凹凸によるパターンが形成される分解除去層である場合の二つの場合が、特に得られる機能性素子等の関係からより本実施態様の有効性を引き出すものであるので好ましい。
【０１３０】
（ｉ）濡れ性変化層
本実施態様における濡れ性変化層は、上記光触媒の作用により表面の濡れ性が変化する層であれば特に限定されるものではないが、一般にはエネルギーの照射に伴う光触媒の作用により、その濡れ性変化層表面における液体との接触角が低下するように濡れ性が変化する層であることが好ましい。
【０１３１】
このように、エネルギー照射により液体との接触角が低下するように濡れ性が変化する濡れ性変化層とすることにより、エネルギー照射のみで容易に濡れ性を遮蔽層のパターンに沿って変化させることができ、かつ、エネルギー照射後は、現像・洗浄といった後処理を施す必要がないことから、そのような手間が省かれ製造工程を簡略化することができる。また、遮蔽層上に位置し光触媒反応阻害性基材の影響が及ばず、光触媒の作用により濡れ性が向上した親液性領域に機能性部用組成物を付着させることにより、容易に機能性素子を形成することができる。したがって、効率的かつコスト的に有利に機能性素子を製造することができる。
【０１３２】
このような濡れ性変化層に関して、親液性領域および撥液性領域が示す濡れ性や、濡れ性変化層を構成するバインダ、その他添加剤等については、上述した第１実施態様の光触媒含有層における「（ｉ）少なくとも光触媒およびバインダからなる場合」の項目の中に記載したものと同様であるので、ここでの説明は省略する。
【０１３３】
また、本実施態様において、この濡れ性変化層の厚みは、光触媒による濡れ性の変化速度等の関係より、０．００１μｍ〜１μｍの範囲内であることが好ましく、特に好ましくは０．０１μｍ〜０．１μｍの範囲内である。
【０１３４】
本実施態様において上述した成分の濡れ性変化層を用いることにより、遮蔽層上に位置し、接触する光触媒処理層中の光触媒の作用により、上記成分の一部である有機基や添加剤の酸化、分解等の作用を用いて、濡れ性を変化させて親液性とし、光触媒が触媒として機能せず、濡れ性が変化しない領域との濡れ性に大きな差を生じさせることができる。よって、後述する機能性部を形成する塗工液等との受容性（親液性）および反撥性（撥液性）を高めることによって、品質の良好でかつコスト的にも有利なパターン形成体を得ることができる。
【０１３５】
（ｉｉ）分解除去層
次に分解除去層について説明する。図４に示すように、分解除去層４２は、遮蔽層２が形成されている領域上に位置する部分は、エネルギー照射の際に、光触媒反応阻害性基材１の影響が及ばず、光触媒の作用により分解除去されるが、一方、遮蔽層２が形成されていない領域上に位置する部分は、光触媒反応阻害性基材１の影響により光触媒の作用が阻害または低下することにより、分解除去されずに残存する。
【０１３６】
このように分解除去層は、エネルギー照射される際に、遮蔽層上に位置する部分は、光触媒の作用により分解除去されることから、現像工程や洗浄工程を行うことなく分解除去層のある部分と無い部分からなるパターン、すなわち凹凸を有するパターンを形成することができる。
【０１３７】
なお、この分解除去層は、エネルギー照射による光触媒の作用により酸化分解され、気化等されることから、現像・洗浄工程等の特別な後処理なしに除去されるものであるが、分解除去層の材質によっては、洗浄工程等を行ってもよい。
【０１３８】
また、この分解除去層を用いた場合は、凹凸を形成するのみならず、分解除去されて露出する光触媒処理層と分解除去層との特性の相違によりパターンを形成することも可能である。このような特性としては、接着性、発色性等種々のものを挙げることができるが、本実施態様においては中でも濡れ性を挙げることができ、この濡れ性の相違によりパターンを形成することが、最終的に素子を形成した場合の有効性の点で好ましい。
【０１３９】
すなわち、本実施態様においては、分解除去層とこの分解除去層が分解除去されて露出する光触媒処理層との液体の接触角が異なるように構成されていることが好ましい。例えば、後述する機能性素子における機能性部を分解除去層上に形成する場合には、分解除去層の液体に対する接触角の方が、光触媒処理層のそれよりも小さくなる。逆に、分解除去層が分解除去され光触媒処理層が露出している領域上に機能性部を形成する場合には、光触媒処理層の液体に対する接触角のほうが、分解除去層のそれよりも小さくなる。
【０１４０】
このような分解除去層に用いることができる材料としては、上述した分解除去層の特性、すなわちエネルギー照射に伴う光触媒の作用により分解除去される材料であり、かつ好ましくは、上記範囲内の液体との接触角を有する材料である。
【０１４１】
上記分解除去層の成膜方法としては、特に限定されるものではないが、上述したような材料を選択し、適切な溶剤に希釈させ塗工液としたものをスピンコーティング等の一般的な塗布法を用いて成膜する方法を挙げることができる。このような薄膜の形成方法は、容易でかつコスト的に有利な方法であるといえる。一方、機能性薄膜、すなわち、自己組織化単分子膜、ラングミュア−ブロケット膜、および交互吸着膜等の成膜方法により形成することも可能である。これらの方法は、緻密で欠陥の少ない薄膜の形成を可能とするため好ましい方法であるといえる。
【０１４２】
ここで、本実施態様に用いられる自己組織化単分子膜、ラングミュア−ブロケット膜、および交互吸着膜について具体的に説明する。
【０１４３】
ａ．自己組織化単分子膜
自己組織化単分子膜（Ｓｅｌｆ−Ａｓｓｅｍｂｌｅｄ　Ｍｏｎｏｌａｙｅｒ）の公式な定義の存在を発明者らは知らないが、一般的に自己組織化膜として認識されているものの解説文としては、例えばＡｂｒａｈａｍ　Ｕｌｍａｎによる総説“Ｆｏｒｍａｔｉｏｎ　ａｎｄ　Ｓｔｒｕｃｔｕｒｅ　ｏｆ　Ｓｅｌｆ−Ａｓｓｅｍｂｌｅｄ　Ｍｏｎｏｌａｙｅｒｓ”，　Ｃｈｅｍｉｃａｌ　Ｒｅｖｉｅｗ，　９６，　１５３３−１５５４　（１９９６）が優れている。本総説を参考にすれば、自己組織化単分子膜とは、適当な分子が適当な基材表面に吸着・結合（自己組織化）した結果生じた単分子層のことと言える。自己組織化膜形成能のある材料としては、例えば、脂肪酸などの界面活性剤分子、アルキルトリクロロシラン類やアルキルアルコキシド類などの有機ケイ素分子、アルカンチオール類などの有機イオウ分子、アルキルフォスフェート類などの有機リン酸分子などが挙げられる。分子構造の一般的な共通性は、比較的長いアルキル鎖を有し、片方の分子末端に基材表面と相互作用する官能基が存在することである。アルキル鎖の部分は分子同士が２次元的にパッキングする際の分子間力の源である。もっとも、ここに示した例は最も単純な構造であり、分子のもう一方の末端にアミノ基やカルボキシル基などの官能基を有するもの、アルキレン鎖の部分がオキシエチレン鎖のもの、フルオロカーボン鎖のもの、これらが複合したタイプの鎖のものなど様々な分子から成る自己組織化単分子膜が報告されている。また、複数の分子種から成る複合タイプの自己組織化単分子膜もある。また、最近では、デンドリマーに代表されるような粒子状で複数の官能基（官能基が一つの場合もある）を有する高分子や直鎖状（分岐構造のある場合もある）の高分子が一層基材表面に形成されたもの（後者はポリマーブラシと総称される）も自己組織化単分子膜と考えられる場合もあるようである。本実施態様は、これらも自己組織化単分子膜に含める。
【０１４４】
ｂ．ラングミュア−ブロジェット膜
本実施態様に用いられるおけるラングミュア−ブロジェット膜（Ｌａｎｇｍｕｉｒ−Ｂｌｏｄｇｅｔｔ　Ｆｉｌｍ）は、基材上に形成されてしまえば形態上は上述した自己組織化単分子膜との大きな相違はない。ラングミュア−ブロジェット膜の特徴はその形成方法とそれに起因する高度な２次元分子パッキング性（高配向性、高秩序性）にあると言える。すなわち、一般にラングミュア−ブロジェット膜形成分子は気液界面上に先ず展開され、その展開膜がトラフによって凝縮されて高度にパッキングした凝縮膜に変化する。実際は、これを適当な基材に移しとって用いる。ここに概略を示した手法により単分子膜から任意の分子層の多層膜まで形成することが可能である。また、低分子のみならず、高分子、コロイド粒子なども膜材料とすることができる。様々な材料を適用した最近の事例に関しては宮下徳治らの総説“ソフト系ナノデバイス創製のナノテクノロジーへの展望”　高分子　５０巻　９月号　６４４−６４７　（２００１）に詳しく述べられている。
【０１４５】
ｃ．交互吸着膜
交互吸着膜（Ｌａｙｅｒ−ｂｙ−Ｌａｙｅｒ　Ｓｅｌｆ−Ａｓｓｅｍｂｌｅｄ　Ｆｉｌｍ）は、一般的には、最低２個の正または負の電荷を有する官能基を有する材料を逐次的に基材上に吸着・結合させて積層することにより形成される膜である。多数の官能基を有する材料の方が膜の強度や耐久性が増すなど利点が多いので、最近ではイオン性高分子（高分子電解質）を材料として用いることが多い。また、タンパク質や金属や酸化物などの表面電荷を有する粒子、いわゆる“コロイド粒子”も膜形成物質として多用される。さらに最近では、水素結合、配位結合、疎水性相互作用などのイオン結合よりも弱い相互作用を積極的に利用した膜も報告されている。比較的最近の交互吸着膜の事例については、静電的相互作用を駆動力にした材料系に少々偏っているがＰａｕｌａ　Ｔ．　Ｈａｍｍｏｎｄによる総説“Ｒｅｃｅｎｔ　Ｅｘｐｌｏｒａｔｉｏｎｓ　ｉｎ　Ｅｌｅｃｔｒｏｓｔａｔｉｃ　Ｍｕｌｔｉｌａｙｅｒ　Ｔｈｉｎ　Ｆｉｌｍ　Ａｓｓｅｍｂｌｙ”　Ｃｕｒｒｅｎｔ　Ｏｐｉｎｉｏｎ　ｉｎ　Ｃｏｌｌｏｉｄ　＆　Ｉｎｔｅｒｆａｃｅ　Ｓｃｉｅｎｃｅ，　４，　４３０−４４２　（２０００）に詳しい。交互吸着膜は、最も単純なプロセスを例として説明すれば、正（負）電荷を有する材料の吸着−洗浄−負（正）電荷を有する材料の吸着−洗浄のサイクルを所定の回数繰り返すことにより形成される膜である。ラングミュア−ブロジェット膜のように展開−凝縮−移し取りの操作は全く必要ない。また、これら製法の違いより明らかなように、交互吸着膜はラングミュア−ブロジェット膜のような２次元的な高配向性・高秩序性は一般に有さない。しかし、交互吸着膜及びその作製法は、欠陥のない緻密な膜を容易に形成できること、微細な凹凸面やチューブ内面や球面などにも均一に成膜できることなど、従来の成膜法にない利点を数多く有している。
【０１４６】
また、分解除去層の膜厚としては、照射されるエネルギーにより分解除去される程度の膜厚であれば特に限定されるものではない。具体的な膜厚としては、照射されるエネルギーの種類や分解除去層の材料等により大きく異なるものではあるが、一般的には、０．００１μｍ〜１μｍの範囲内、特に０．０１μｍ〜０．１μｍの範囲内とすることが好ましい。
【０１４７】
（２）光触媒処理層
本実施態様に用いられる光触媒処理層は、光触媒処理層中の光触媒が、対象とする特性変化層の特性を変化させるような構成であれば、特に限定されるものではなく、光触媒とバインダとから構成されているものであってもよいし、光触媒単体で成膜されたものであってもよい。
【０１４８】
このような光触媒処理層に使用する光触媒としては、上述した第１実施態様における「（３）光触媒含有層」の中に記載したことと同様である。従って、ここでの説明は省略する。
【０１４９】
本実施態様における光触媒処理層において、光触媒のみからなる光触媒処理層の場合は、特性変化層に対する特性を変化させる効率が向上し、処理時間の短縮化等のコスト面で有利である。一方、光触媒とバインダとからなる光触媒処理層の場合は、光触媒処理層の形成が容易であるという利点を有する。
【０１５０】
光触媒のみからなる光触媒処理層の形成方法としては、例えば、スパッタリング法、ＣＶＤ法、真空蒸着法等の真空製膜法を用いる方法を挙げることができる。真空製膜法により光触媒処理層を形成することにより、均一な膜でかつ光触媒のみを含有する光触媒処理層とすることが可能であり、これにより特性変化層の特性を速やかに変化させることができる。
【０１５１】
このような光触媒処理層の膜厚としては、３０ｎｍ〜５００ｎｍの範囲内であることが好ましい。上記範囲よりも膜厚を薄くすると、均一な膜状に形成することが難しくなり、特性変化層に光触媒の作用を均一に及ぼすことができなくくなるため好ましくない。一方、上記範囲よりも膜厚を厚くすると、光触媒処理層の下に位置する、光触媒反応阻害性基材または光触媒反応阻害物質含有層の作用が、それらと接触している部分の光触媒処理層全体に及ばす、その結果、特性変化層に明確なパターンを形成することができなくなるおそれがあるから好ましくない。
【０１５２】
なお、光触媒処理層が少なくとも光触媒およびバインダからなる場合には、上述した第１実施態様における「（３）光触媒含有層（ｉ）少なくとも光触媒およびバインダからなる場合」と同様なのでここでの説明は省略する。
【０１５３】
５．第５実施態様
次に、第５実施態様について説明する。第５実施態様は、光触媒の機能を阻害または低下させる作用を及ぼす側として、上述した光触媒反応阻害物質を含有する光触媒反応阻害物質含有層を光触媒の作用に影響を与えない基体上にパターン状に形成したものを用い、一方、パターンが形成される側として、エネルギー照射に伴う光触媒の作用により特性が変化する特性変化層を用いた態様である。
【０１５４】
このような本実施態様におけるパターン形成体は、基体と、前記基体上にパターン状に形成され、光触媒の作用を阻害しまたは低下させる光触媒反応阻害物質を有する光触媒反応阻害物質含有層と、前記光触媒反応阻害物質含有層がパターン状に形成されている前記基体上に成膜され、少なくとも光触媒からなる光触媒処理層と、前記光触媒処理層上に成膜され、エネルギー照射に伴う光触媒の作用により特性が変化する特性変化層とを有することを特徴とするものである。
【０１５５】
このような特徴を有する第５実施態様のパターン形成体について図面を用いて説明する。
【０１５６】
図５は、本実施態様のパターン形成体の一例を示している。また、特性変化層として、エネルギー照射に伴う光触媒の作用により分解除去される分解除去層を用いた場合を示している。
【０１５７】
図５においては、光触媒の作用に影響を及ぼさない基体２１上に、光触媒の作用を阻害または低下させる機能を有する光触媒反応阻害物質を含有する光触媒反応阻害物質含有層２２がパターン状に形成されている。さらに、少なくとも光触媒からなる光触媒処理層４１が、光触媒反応阻害物質含有層２２および基体２１を被覆するように成膜され、当該光触媒処理層４１上に分解除去層４２がパターン状に形成されている。光触媒反応阻害物質含有層２２が形成されていない領域上に位置していた分解除去層４２は、エネルギー照射の際、光触媒の作用が阻害されることがないため、光触媒処理層４１の作用により分解除去され、これにより分解除去層４２は、光触媒反応阻害物質含有層２２上のみ残存するようにパターン状に形成されるのである。
【０１５８】
本実施態様においては、光触媒の作用に影響を及ぼさない基体上に、光触媒の作用を阻害または低下させる機能を有する光触媒反応阻害物質含有層がパターン状に形成されていることにより、光触媒反応阻害物質含有層が形成されていない領域上に位置する特性変化層においては、エネルギー照射の際、光触媒処理層に含有されている光触媒の作用により特性が変化する。一方、光触媒反応阻害物質含有層が形成されている領域上に位置する特性変化層は、エネルギー照射の際、当該光触媒反応阻害物質含有層の影響から光触媒処理層に含有される光触媒の作用が阻害または低下することから、特性が変化しない。これにより、フォトマスクを介する等の方法によりエネルギーをパターン状に照射しなくとも、全面に照射することにより、容易に特性変化層表面に特性の違いによるパターンを形成することができるのである。
【０１５９】
このような利点を有する本実施態様を構成する光触媒反応阻害物質含有層、光触媒処理層および特性変化層は、上述したものと同様なのでここでの説明は省略する。
【０１６０】
６．第６実施態様
次いで、第６実施態様について説明する。第６実施態様は、光触媒の機能を阻害または低下させる作用を及ぼす側として、上述した光触媒反応阻害物質を含有する部分がパターン状に存在する光触媒反応阻害物質含有基材を用い、一方、パターンが形成される側として、エネルギー照射に伴う光触媒の作用により特性が変化する特性変化層を用いた態様である。
【０１６１】
このような本実施態様におけるパターン形成体は、光触媒の作用を阻害しまたは低下させる作用を有する光触媒反応阻害物質を含有する部分がパターン状に存在する光触媒反応阻害物質含有基材と、前記光触媒反応阻害物質含有基材上に成膜され、少なくとも光触媒からなる光触媒処理層と、前記光触媒処理層上に成膜され、エネルギー照射に伴う光触媒の作用により特性が変化する特性変化層とを有することを特徴とするものである。
【０１６２】
このような特徴を有する本実施態様について図面を用いて説明する。
【０１６３】
図６は、本実施態様のパターン形成体の一例を示している。また、特性変化層としては、エネルギー照射に伴う光触媒の作用により分解除去される分解除去層の場合について図示している。
【０１６４】
図６に示すように、光触媒反応阻害物質含有基材３３には、光触媒反応阻害物質を含有している領域３１および含有していない領域３２からなるパターンが形成されている。また、当該光触媒反応阻害物質含有基材３３上には、少なくとも光触媒からなる光触媒処理層４１が成膜されており、さらに、光触媒処理層４１上には、光触媒反応阻害物質含有層３３のパターンに沿って、分解除去層４２がパターン状に形成されている。光触媒反応阻害物質を含有していない領域３２上に位置していた分解除去層４２は、エネルギー照射の際、光触媒処理層４１に含有されている光触媒が触媒として機能することにより、分解除去されるため、分解除去層４２は、光触媒反応阻害物質を含有している領域３１上のみ残存するようにパターン状に形成されるのである。
【０１６５】
このような本実施態様のパターン形成体においては、予め、光触媒反応阻害物質含有層自体に光触媒反応阻害物質を含有している領域および含有していない領域からなるパターンが形成されていることから、光触媒反応阻害物質を含有している領域上に位置する特性変化層は、エネルギーが照射されても光触媒処理層に含有されている光触媒が作用しないため特性が変化しない。一方、光触媒反応阻害物質を含有していない領域上に位置する特性変化層は、光触媒処理層に含有されている光触媒がエネルギー照射により作用することから、特性が変化する。
【０１６６】
従って、フォトマスクを介する等の方法によりエネルギーをパターン状に照射しなくとも、単に全面にエネルギーを照射することにより、容易に特性変化層表面に特性の違いによるパターンを形成することができるのである。また、上述したような特性変化層を用いることによりエネルギー照射後に、現像・洗浄といった後処理を施さなくともよいため、製造工程を簡略化することができるのである。
【０１６７】
本実施態様のパターン形成体を構成する光触媒反応阻害物質含有基材および特性変化層に関しては、第３実施態様および第４実施態様のおいて記載したものと同様であるのでここでの説明は省略する。
【０１６８】
ＩＩ．パターン形成体の製造方法
次に、パターン形成体の製造方法について説明する。
【０１６９】
本実施態様のパターン形成体の製造方法は、パターン形成体と同様に、光触媒の機能を阻害または低下させる作用を及ぼす側と、パターンが形成される側との組合せにより複数の態様が挙げられる。その中でも、光触媒の機能を阻害または低下させる作用を及ぼす側として、光触媒反応阻害性基材を用いる場合および光触媒反応阻害物質含有層を用いる場合、さらに、パターンが形成される側として光触媒含有層および特性変化層を用いた場合について説明する。
【０１７０】
１．第７実施態様
第７実施態様は、光触媒の機能を阻害または低下させる作用を及ぼす側として光触媒反応阻害性基材を用い、パターンが形成される側として光触媒含有層を用いた態様におけるパターン形成体の製造方法に関する態様である。
【０１７１】
このような本実施態様におけるパターン形成体の製造方法は、光触媒の作用を阻害しまたは低下させる作用を有し、かつ光触媒反応阻害物質を含有する光触媒反応阻害性基材上に、パターン状に遮蔽層を形成する遮蔽層形成工程と、前記遮蔽層がパターン状に形成されている前記光触媒反応阻害性基材上に、エネルギー照射により濡れ性が変化する光触媒含有層を形成する光触媒含有層形成工程と、前記光触媒含有層の表面にエネルギーを照射し、光触媒含有層に濡れ性の違いによるパターンを形成するパターニング工程とを少なくとも有することを特徴とするものである。
【０１７２】
このような本実施態様の一例について図面を用いて説明する。
【０１７３】
図７は、本実施態様における製造方法の一例を示している。まず、図７（ａ）に示すように、光触媒の作用を阻害または低下させる作用を有する光触媒反応阻害性基材１上に遮蔽層２をパターン状に形成する。これにより、光触媒反応阻害性基材１上には、後に成膜される光触媒含有層に対して、光触媒の作用を阻害する領域および光触媒の作用に影響を及ぼさない領域からなるパターンが形成される。
【０１７４】
次に、図７（ｂ）に示すように、遮蔽層２がパターン状に形成されている光触媒反応阻害性基材１上に光触媒含有層３を形成する。さらに、図７（ｃ）に示すように、光触媒含有層３の全面にエネルギーを照射する。このエネルギー照射の際に、遮蔽層２が形成されている領域上に位置する光触媒含有層３は、光触媒反応阻害性基材１から影響を受けないため光触媒の作用により、液体との接触角が低下する方向に濡れ性が変化し、図７（ｄ）に示すように、親液性領域５が形成される。一方、遮蔽層２が形成されておらず、光触媒反応阻害性基材１と接触している部分の光触媒含有層３は、光触媒反応阻害性基材１の影響により、エネルギーを照射しても濡れ性は変化しないので、撥液性領域４となる。
【０１７５】
このような本実施態様におけるパターン形成体の製造方法においては、光触媒反応阻害性基材上に、遮蔽層がパターン状に形成されていることから、遮蔽層のパターンに沿って光触媒の作用が阻害または低下される領域およびそのような影響を受けない領域からなるパターンが形成されている。従って、このような光触媒反応阻害性基材上に光触媒含有層を成膜することにより、このパターンを利用して光触媒含有層をパターニングすることが可能である。すなわち、エネルギーを全面に照射する場合であっても光触媒含有層表面に濡れ性の違いによるパターンを形成することができるのである。さらに、エネルギー照射後に現像・洗浄といった後処理を行う必要がなく、製造工程を簡略化することができる。
【０１７６】
このような利点を有する本実施態様におけるパターン形成体の製造方法について、各工程ごとに説明する。
【０１７７】
（１）遮蔽層形成工程
本実施態様における遮蔽層形成工程とは、光触媒の作用を阻害または低下させる作用を有する光触媒反応阻害性基材上に、光触媒反応阻害性基材のそのような作用が、後に成膜される光触媒含有層に及ぶことを防止する遮蔽層をパターン状に形成する工程である。
【０１７８】
本工程において、光触媒反応阻害性基材上に遮蔽層をパターン状に形成することにより、遮蔽層が形成された領域は、後に成膜される光触媒含有層に光触媒反応阻害性基材の作用が及ばず、一方、遮蔽層が形成されていない領域は、光触媒含有層に光触媒反応阻害性基材の作用が及ぶこととなる。
【０１７９】
このような本工程においてパターン状に形成される遮蔽層のパターニング方法としては、高精細なパターンに形成することが可能な方法であれば特に限定されない。具体的には、マスクを用いた蒸着法、フォトリソグラフィー法等を挙げることができる。
【０１８０】
その他、遮蔽層を形成する材料等、また、光触媒反応阻害性基材に関することは、第１実施態様の中に記載したものと同様なのでここでの記載は省略する。
【０１８１】
（２）光触媒含有層形成工程
次に、本実施態様における光触媒含有層形成工程について説明する。本工程は、上記遮蔽層形成工程により、遮蔽層がパターン状に形成されている光触媒反応阻害性基材上に、エネルギー照射に伴う光触媒の作用により濡れ性が変化する光触媒含有層を成膜する工程である。
【０１８２】
本工程においては、遮蔽層がパターン状に形成されている光触媒反応阻害性基材上に光触媒含有層を成膜しているので、光触媒含有層内部にそのパターンの影響が及ぶ。すなわち、遮蔽層上に位置する光触媒含有層には、光触媒反応阻害性基材の影響が及ばないため、光触媒含有層に含有される光触媒の機能は損なわれることはない。一方、光触媒反応阻害性基材と接触している部分は、光触媒反応阻害性基材の影響を受けるため、後述するパターニング工程においてエネルギーを照射しても、光触媒が触媒として十分に機能せず、光触媒含有層の濡れ性は変化しない。
【０１８３】
このような光触媒含有層の形成方法として、光触媒含有層が少なくとも光触媒およびバインダからなり、さらに上述したようにオルガノポリシロキサンをバインダとして用いた場合は、上記光触媒含有層は、光触媒とバインダであるオルガノポリシロキサンとを必要に応じて他の添加剤とともに溶剤中に分散して塗布液を調整し、この塗布液を光触媒反応阻害性基材上に塗布することにより形成することができる。使用する溶剤としては、エタノール、イソプロパノール等のアルコール系の有機溶剤および水等が好ましい。塗布は、スピンコート、スプレーコート、ディッブコート、ロールコート、ビードコート等の公知の塗布方法により行うことができる。バインダとして紫外線硬化型の成分を含有している場合は、紫外線を照射して硬化処理を行うことにより光触媒含有層を形成することができる。
【０１８４】
一方、光触媒含有層が少なくとも光触媒と光触媒分解性物質とからなる場合の光触媒含有層の形成方法においても同様に、光触媒、バインダおよび光触媒分解性物質を溶剤中に分散して塗布液を調整し、上述した公知の塗布方法により形成することができる。また、この場合に用いる溶剤も、上述したエタノール、イソプロパノール等のアルコール系の有機溶剤および水等を同様に用いることができる。
【０１８５】
また、本実施態様においては、加熱処理を行いながら本工程を行うことにより、上述した形成方法により光触媒反応阻害性基材上に成膜された光触媒含有層を、光触媒反応阻害性基材上に十分に定着および固定させることができ、また、光触媒反応阻害性基材内に含有される光触媒反応阻害物質を遮蔽層のパターンに応じて光触媒含有層内に十分に拡散させることができるため、後述するパターニング工程の際に、光触媒含有層に濡れ性の違いによるパターンをより明確に形成することが可能となる。このような加熱処理における温度は、光触媒含有層内に光触媒反応阻害物質を拡散させることが可能な温度であれば特に限定はされないが、具体的には、１００℃〜８００℃の範囲内、その中でも、１５０℃〜５００℃の範囲内であることが好ましい。
【０１８６】
その他、光触媒含有層に関することは、第１実施態様の中に記載したことと同様であるのでここでの説明は省略する。
【０１８７】
（３）パターニング工程
次に、本実施態様におけるパターニング工程について説明する。本工程では、パターン状に遮蔽層が形成されている光触媒反応阻害性基材上に、成膜されている光触媒含有層に対し、エネルギーを照射し、濡れ性の違いによるパターンを形成する工程である。
【０１８８】
通常、パターンを形成する際には、フォトマスクを介する方法や、電子線描画によりパターン状にエネルギーを照射することによりパターニングを行うことが多い。しかしながら、本実施態様においては、予め、光触媒の作用に影響を与えるパターンが形成されている光触媒反応阻害性基材上に、光触媒含有層を成膜することにより、光触媒反応阻害性層のパターンの影響が光触媒含有層に及ぶため、このパターンを利用したパターニングが可能である。従って、エネルギーをパターン状に照射しなくとも、遮蔽層のパターンに沿って光触媒含有層に濡れ性の違いによるパターンを形成することができるのである。
【０１８９】
なお、本実施態様においては、エネルギーを全面に照射する方法に限定されるものではなく、パターン状にエネルギーを照射する場合であってもよい。例えばフォトマスクを介する等のエネルギーのパターン照射の方法により、遮蔽層により形成されたパターンの効果およびフォトマスクによる効果の両方の効果により、より明確なパターンの形成が可能となり、高精細なパターンを形成することができる。
【０１９０】
このようなパターニング工程において用いる光の波長は、４００ｎｍ以下の範囲、好ましくは３８０ｎｍ以下の範囲から設定される。これは、上述したように光触媒含有層に用いられる好ましい光触媒が二酸化チタンであり、この二酸化チタンにより光触媒作用を活性化させるエネルギーとして、上述した波長の光が好ましいからである。
【０１９１】
このようなエネルギーとして、用いることができる光源としては、水銀ランプ、メタルハライドランプ、キセノンランプ、エキシマランプ、その他種々の光源を挙げることができる。
【０１９２】
また、エネルギーの照射量としては、光触媒含有層および特性変化層の濡れ性及び特性を変化させるのに必要な照射量とする。
【０１９３】
２．第８実施態様
次に、第８実施態様について説明する。第８実施態様は、光触媒の機能を阻害または低下させる作用を及ぼす側として、上述した光触媒反応阻害物質を含有する光触媒反応阻害物質含有層を光触媒の作用に影響を与えない基体上にパターン状に形成したものを用い、一方、パターンが形成される側として、エネルギー照射に伴う光触媒の作用により濡れ性が変化する光触媒含有層を用いた場合のパターン形成体の製造方法に関する態様である。
【０１９４】
このような第８実施態様におけるパターン形成体の製造方法は、基体上に、光触媒の作用を阻害しまたは低下させる作用を有する光触媒反応阻害物質を含有する光触媒反応阻害物質含有層をパターン状に形成する光触媒反応阻害物質含有層形成工程と、前記光触媒反応阻害物質含有層がパターン状に形成された前記基体上に、エネルギー照射により濡れ性が変化する光触媒含有層を形成する光触媒含有層形成工程と、前記光触媒含有層の表面にエネルギーを照射し、光触媒含有層に濡れ性の違いによるパターンを形成するパターニング工程とを少なくとも有することを特徴とするものである。
【０１９５】
本実施態様におけるパターン形成体の製造方法について図面を用いて説明する。
【０１９６】
図８は、本実施態様におけるパターン形成体の製造方法を示している。まず、図８（ａ）に示すように、光触媒の作用に影響を与えない基体２１上に、光触媒の作用を阻害または低下させる機能を有する光触媒反応阻害物質を含有する光触媒反応阻害物質含有層２２をパターン状に形成する。これにより、基体２１上には、光触媒の作用に影響が及ぼされる領域と、及ぼされない領域とからなるパターンが形成されることとなる。
【０１９７】
さらに、図８（ｂ）に示すように、光触媒反応阻害物質含有層２２がパターン状に形成されている基体２１上に、光触媒含有層３を成膜する。
【０１９８】
次いで、図８（ｃ）に示すように、光触媒含有層３の全面にエネルギーを照射すると、光触媒反応阻害物質含有層２２上に位置する光触媒含有層３は、光触媒含有層３内に含有されている光触媒の作用が、光触媒反応阻害物質含有層２２の影響により阻害され、濡れ性に変化が起こらず図８（ｄ）に示すように、撥液性領域４となる。一方、光触媒反応阻害物質含有層２２が形成されていない領域であり、基体２１と接触している部分の光触媒含有層３は、光触媒の作用により液体との接触角が低下する方向に濡れ性が変化し、親液性領域５を形成する。
【０１９９】
本実施態様においては、基体上に光触媒反応阻害物質含有層をパターン状に形成し、そのような基体上に光触媒含有層を成膜することから、フォトマスクを介する等の方法によるパターン照射を行わなくとも、単に全面にエネルギーを照射することにより、容易に光触媒含有層に濡れ性の違いによるパターンを形成することができる。
【０２００】
また、光触媒含有層は、エネルギー照射により濡れ性を変化させることができることから、エネルギーを照射した後は、現像・洗浄といった後処理を施す必要がないため、製造工程を簡略化することができる。
【０２０１】
このような利点を有する本実施態様におけるパターン形成体の製造方法について説明する。なお、本実施態様における、光触媒含有層形成工程およびパターニング工程に関しては、上述した第７実施態様の中に記載したことと同様であるためここでの説明は省略する。以下、光触媒反応阻害物質含有層形成工程について説明する。
【０２０２】
（光触媒反応阻害物質含有層形成工程）
本実施態様における、光触媒反応阻害物質含有層形成工程とは、光触媒の作用に影響を及ぼさない基体上に、光触媒の作用を阻害または低下させる作用を有する光触媒反応阻害物質から少なくともなる光触媒反応阻害物質含有層をパターン状に形成する工程である。
【０２０３】
このような本工程において、光触媒反応阻害物質含有層を形成する方法としては、高精細なパターニングを可能とする方法であれば特に限定はされない。具体的には、マスクを用いた蒸着法、フォトリソグラフィー法等を挙げることができる。
【０２０４】
３．第９実施態様
次に、第９実施態様について説明する。第９実施態様は、光触媒の機能を阻害または低下させる作用を及ぼす側として、上述した光触媒反応阻害性基材を用い、一方、パターンが形成される側として、エネルギー照射に伴う光触媒の作用により特性が変化する特性変化層を用いた場合のパターン形成体の製造方法に関する態様である。
【０２０５】
このような第９実施態様におけるパターン形成体の製造方法は、光触媒の作用を阻害しまたは低下させる作用を有し、かつ光触媒反応阻害物質を含有する光触媒反応阻害性基材上に、パターン状に遮蔽層を形成する遮蔽層形成工程と、前記遮蔽層がパターン状に形成されている前記光触媒反応阻害性基材上に、少なくとも光触媒からなる光触媒処理層を形成する光触媒処理層形成工程と、前記光触媒処理層上に、エネルギー照射に伴う前記光触媒の作用により特性が変化する特性変化層を形成する特性変化層形成工程と、前記特性変化層の表面にエネルギーを照射し、特性変化層に特性の変化によるパターンを形成するパターニング工程とを少なくとも有することを特徴とするものである。
【０２０６】
このような本実施態様におけるパターン形成体について図面を用いて説明する。
【０２０７】
図９は、第９実施態様におけるパターン形成体の製造方法の一例を示している。また、図９では、特性変化層として分解除去層を用いた場合の一例を示している。
【０２０８】
まず、図９（ａ）に示すように、光触媒の作用を阻害または低下させる機能を有する基材である光触媒反応阻害性基材１上に、当該光触媒反応阻害性基材１の作用が後に成膜される特性変化層に及ぶことを防止する遮蔽層２をパターン状に形成する。
【０２０９】
次いで、遮蔽層２がパターン状に形成されている光触媒反応阻害性基材１上に図９（ｂ）に示すように、少なくとも光触媒からなる光触媒処理層４１を成膜する。
【０２１０】
さらに、図９（ｃ）に示すように、当該光触媒処理層４１上にエネルギー照射に伴う光触媒の作用により分解除去される分解除去層４２を形成する。
【０２１１】
次いで、図９（ｄ）に示すように、特性変化層４２の全面にエネルギーを照射する。このエネルギー照射の際、遮蔽層２上に位置する部分の分解除去層４２は、その下の光触媒処理層４１が光触媒反応阻害性基材１から影響を受けないため、光触媒の作用により分解除去される。一方、遮蔽層２が形成されていない領域上に位置する部分の分解除去層４２は、その下に形成されている光触媒処理層４１が光触媒反応阻害性基材１の影響から、光触媒の作用が阻害しまたは低下するため、分解除去されずに残る（図９（ｅ）参照）。
【０２１２】
このように、本実施態様では、光触媒反応阻害性基材上に遮蔽層を形成することにより、予め、光触媒の作用に影響を与える領域と与えない領域とからなるパターンを、光触媒反応阻害性基材に形成しているため、特性変化層、例えば図９に示すような分解除去層等をパターニングする際、エネルギーを全面照射してもパターニングすることが可能となる。
【０２１３】
このような本実施態様の製造方法について各工程ごとに説明する。なお、遮蔽層形成工程は上記第７実施態様の中に記載したことと同様であるのでここでの説明は省略する。
【０２１４】
（１）光触媒処理層形成工程
本実施態様における光触媒処理層形成工程とは、パターン状に遮蔽層が形成されている光触媒反応阻害性基材上に、少なくとも光触媒からなる光触媒処理層を形成する工程である。
【０２１５】
また、本実施態様においても、上述した第７実施態様における光触媒含有層形成工程と同様に、加熱処理を行いながら本工程を行うことにより、光触媒反応阻害性基材内に含有される光触媒反応阻害物質が遮蔽層のパターンに応じて光触媒処理層内に十分に拡散するため、後述するパターニング工程において、より一層明確な特性の違いによるパターンを特性変化層に形成することができる。当該加熱処理に関することは、上述した第７実施態様に記載したものと同様であるのでここでの記載は省略する。
【０２１６】
本工程において成膜される光触媒処理層は、エネルギー照射に伴う光触媒の作用により特性が変化する特性変化層に、光触媒の作用を及ぼすため設けられる層である。このような光触媒処理層としては、少なくとも光触媒が含有されていればよく、このような光触媒処理層に関しては、上述した第４実施態様に記載したものと同様であるのでここでの説明は省略する。
【０２１７】
（２）特性変化層形成工程
次に、特性変化層形成工程について説明する。本実施態様における特性変化層形成工程は、上述した光触媒処理層形成工程により成膜された光触媒処理層上にエネルギー照射に伴う光触媒の作用により特性が変化する特性変化層を成膜する工程である。
【０２１８】
本工程により成膜される特性変化層についても、上述した第４実施態様の中に記載したことと同様であるので、ここでの説明は省略する。
【０２１９】
（３）パターニング工程
本実施態様におけるパターニング工程とは、特性変化層に対し、エネルギーを照射することにより、特性の違いによるパターンを特性変化層に形成する工程である。
【０２２０】
本工程によりエネルギー照射をする際には、通常、エネルギーをパターン照射することにより特性変化層のパターニングを行うことが一般的であるが、本実施態様においては、特性変化層を、予め、光触媒の作用に影響を及ぼす領域および及ぼさない領域からなるパターンが形成されている光触媒反応阻害性基材上に成膜していることから、そのようなパターン照射を行わなくとも、特性変化層をパターニングすることができるのである。なお、上述したように、本実施態様においてもエネルギーを全面に照射する方法に限定されるものではなく、エネルギーをパターン状に照射する場合であってもよい。これにより、より高精度なパターンを形成することができるからである。
【０２２１】
４．第１０実施態様
最後に、第１０実施態様について説明する。第１０実施態様は、光触媒の機能を阻害または低下させる作用を及ぼす側として、上述した光触媒反応阻害物質を含有する光触媒反応阻害物質含有層を光触媒の作用に影響を与えない基体上にパターン状に形成したものを用い、一方、パターンが形成される側として、エネルギー照射に伴う光触媒の作用により特性が変化する特性変化層を用いた場合のパターン形成体の製造方法である。
【０２２２】
このような第１０実施態様としては、基体上に、光触媒の作用を阻害しまたは低下させる作用を有する光触媒反応阻害物質を含有する光触媒反応阻害物質含有層をパターン状に形成する工程と、前記パターン状に形成された光触媒反応阻害物質含有層を有する前記基体上に、少なくとも光触媒からなる光触媒処理層を形成する工程と、前記光触媒処理層上に、エネルギー照射に伴う前記光触媒の作用により特性が変化する特性変化層を形成する工程と、前記特性変化層の表面にエネルギーを照射し、特性変化層に特性の違いによるパターンを形成する工程とを少なくとも有することを特徴とするものである。
【０２２３】
このような第１０実施態様について図面を用いて説明する。
【０２２４】
図１０は、本実施態様におけるパターン形成体の製造方法の一例を示しており、特性変化層として分解除去層を用いた場合について示している。
【０２２５】
まず、図１０（ａ）に示すように、光触媒の作用に影響を及ぼさない基体２１上に、光触媒の作用を阻害または低下させる機能を有する光触媒反応阻害物質を少なくとも含有する光触媒反応阻害物質含有層２２をパターン状に形成する。
【０２２６】
次に、図１０（ｂ）に示すように、光触媒反応阻害物質含有層２２がパターン状に形成されている基体２１上に、少なくとも光触媒からなる光触媒処理層４１を成膜する。さらに、図１０（ｃ）に示すように、光触媒処理層４１上に、エネルギー照射により分解除去される分解除去層４２を成膜する。
【０２２７】
次いで、１０（ｄ）に示すように、分解除去層４２の全面にエネルギーを照射する。このエネルギー照射の際、光触媒反応阻害物質含有層２２上に位置する部分の特性変化層４２は、光触媒反応阻害物質含有層２２の影響により光触媒処理層４１に含有されている光触媒の作用が阻害または低下されるため、分解除去されず残存する（図１０（ｅ）参照）。一方、光触媒反応阻害物質含有層２２が形成されていない領域上に位置する分解除去層４２は、その下の光触媒処理層４１の光触媒の作用により分解除去される。従って、フォトマスク等を介することなく、全面にエネルギーを照射する場合であっても、本実施態様においては、分解除去層をパターン状に形成することができる。
【０２２８】
なお、本実施態様における各工程については、上述した各態様に記載したものと同様であるためここでの説明は省略する。
【０２２９】
ＩＩＩ．機能性素子
上述したパターン形成体のパターンに沿って、機能性部形成用組成物を付着させることにより、種々の機能性素子を得ることができる。
【０２３０】
このような機能性素子は、上述したパターン形成体のパターンに沿って機能性部が形成されてなる点に特徴を有するものである。
【０２３１】
ここで機能性とは、光学的（光選択吸収、反射性、偏光性、光選択透過性、非線形光学性、蛍光あるいはリン光等のルミネッセンス、フォトクロミック性等）、磁気的（硬磁性、軟磁性、非磁性、透磁性等）、電気・電子的（導電性、絶縁性、圧電性、焦電性、誘電性等）、化学的（吸着性、脱着性、触媒性、吸水性、イオン伝導性、酸化還元性、電気化学特性、エレクトロクロミック性等）、機械的（耐摩耗性等）、熱的（伝熱性、断熱性、赤外線放射性等）、生体機能的（生体適合性、抗血栓性等）な各種の機能を意味するものである。
【０２３２】
このような機能性部のパターン形成体のパターンに対応した部位への配置は、親液性領域および撥液性領域の濡れ性の差を利用した方法や、親液性領域および撥液性領域の密着性の差を利用した方法等により行われる。
【０２３３】
例えば、濡れ性変化層上における濡れ性パターンの密着性の差を利用する場合としては、濡れ性変化層上に全面にわたって機能性部用組成物として、例えば金属を蒸着させ、その後粘着剤等により引き剥がすことにより、密着性が良好な親液性領域のみ機能性部としての金属のパターンが形成される。これにより容易にプリント基板等を形成することができる。
【０２３４】
また、濡れ性変化層上における濡れ性パターンの濡れ性の差を利用する場合としては、機能性部用組成物をパターン形成体上に塗布することにより、濡れ性の良好な親液性領域のみ機能性部用組成物が付着することになり、容易にパターン形成体の親液性領域上にのみ機能性部を配置することができる。
【０２３５】
本実施態様に用いられる機能性部用組成物としては、上述したように機能性素子の機能、機能性素子の形成方法等によって大きく異なるものであり、例えば上述した密着性の相違により金属のパターンを形成するような場合は、この機能性部用組成物は金属となり、また濡れ性の相違によりパターンを形成する場合には、紫外線硬化型モノマー等に代表される溶剤で希釈されていない組成物や、溶剤で希釈した液体状の組成物等を用いることができる。
【０２３６】
溶剤で希釈した液体状組成物の場合は、溶剤が水、エチレングリコール等の高表面張力、具体的には、有機溶剤を含めて２０ｍＮ／ｍ以上の表面張力を示すものであることが好ましい。また、機能性部用組成物としては粘度が低いほど短時間にパターンが形成できることから特に好ましい。ただし、溶剤で希釈した液体状組成物の場合には、パターン形成時に溶剤の揮発による粘度の上昇、表面張力の変化が起こるため、溶剤が低揮発性であることが望ましい。
【０２３７】
本実施態様に用いられる機能性部用組成物としては、パターン形成体に付着等させて配置されることにより機能性部となるものであってもよく、またパターン形成体上に配置された後、薬剤により処理され、もしくは紫外線、熱等により処理された後に機能性部となるものであってもよい。この場合、機能性部用組成物の結着剤として、紫外線、熱、電子線等で硬化する成分を含有している場合には、硬化処理を行うことにより素早く機能性部が形成できることから好ましい。
【０２３８】
このような機能性素子の形成方法を具体的に説明すると、例えば機能性部用組成物をディップコート、ロールコート、ブレードコート、スピンコート等の塗布手段、インクジェット等を含むノズル吐出手段等の手段を用いて塗布することにより、パターン形成体表面の親液性領域パターン上に機能性部を形成する。
【０２３９】
さらに、無電解めっきによる金属膜形成方法に本実施態様のパターン形成体を用いることにより、機能性部として金属膜のパターンを有する機能性素子を得ることができる。具体的には、濡れ性の差を利用することにより、パターン形成体の濡れ性変化層表面における親液性領域にのみ化学めっきの前処理液によって処理を行い、次いで処理したパターン形成体を化学めっき液に浸漬することにより、所望の金属パターンを濡れ性変化層上に有する機能性素子を得ることができる。この方法によれば、レジストパターンを形成することなく、金属のパターンを形成することができるので、機能性素子として、プリント基板や電子回路素子を製造することができる。
【０２４０】
また、全面に機能性部用組成物を配置した後、撥液性領域と親液性領域との濡れ性の差異を利用して不要な部分を取り除くことにより、パターンに沿って機能性部を形成するようにしてもよい。これは濡れ性変化層上の親液性領域と撥液性領域との密着性の差を利用して、例えば、粘着テープを密着した後に引き剥がすことによる剥離、空気の吹き付け、溶剤による処理等の後処理により不要部分を除去して機能性部のパターンを得ることができる。
【０２４１】
この場合は、本実施態様のパターン形成体の濡れ性変化層表面に全面に機能性部用組成物を配置する必要があるが、この方法としては、例えばＰＶＤ、ＣＶＤ等の真空製膜手段を挙げることができる。
【０２４２】
このようにして得られる機能性素子として具体的には、カラーフィルタ、マイクロレンズ、エレクトロルミネッセント素子、プリント基板、電子回路素子等を挙げることができる。
【０２４３】
ＩＶ．カラーフィルタ
カラーフィルタは、液晶表示装置等に用いられるものであり、赤、緑、青等の複数の画素部がガラス基板等上に高精細なパターンで形成されたものである。本発明のパターン形成体をこのカラーフィルタの製造に用いることにより、低コストで高精細なカラーフィルタとすることができる。
【０２４４】
すなわち、上述したパターン形成体の親液性領域に、例えばインクジェット装置等によりインク（機能性部用組成物）を付着・硬化させることにより、容易に画素部（機能性部）を形成することができ、これにより少ない工程数で高精細なカラーフィルタを得ることができる。
【０２４５】
Ｖ．マイクロレンズ
機能性素子がマイクロレンズである場合は、光触媒含有層または特性変化層上に濡れ性が変化した円形のパターンを有するパターン形成体を製造する。次いで、濡れ性が変化した部位上にレンズ形成用組成物（機能性部用組成物）を滴下すると、濡れ性が変化した親液性領域のみに広がり、さらに滴下することにより液滴の接触角を変化させることができる。このレンズ形成用組成物を硬化させることにより種々の形状あるいは焦点距離のものを得ることが可能となり、高精細なマイクロレンズを得ることができる。
【０２４６】
ＶＩ．ＥＬ素子
機能性素子がＥＬ素子である場合には、有機ＥＬ層を本発明のパターン形成体のパターンを利用してパターン状に形成することができる。また、有機ＥＬ層には発光層が含まれていることが必須であることから、発光層を本発明のパターン形成体のパターンを利用して形成することが好ましい。この場合、発光層を形成する材料を適切な溶媒に溶解させ塗工液としたものを、光触媒含有層上または特性変化層上に塗布することにより、親液性領域のみ発光層を形成することができる。また、発光層以外の有機ＥＬ層として電荷注入層または電荷輸送層を本発明のパターン形成体のパターンを利用してパターン状に形成する場合であってもよい。
【０２４７】
なお、本実施態様は、上記実施形態に限定されるものではない。上記実施形態は例示であり、本実施態様の特許請求の範囲に記載された技術的思想と実質的に同一な構成を有し、同様な作用効果を奏するものは、いかなるものであっても本実施態様の技術的範囲に包含される。
【０２４８】
【実施例】
以下に実施例を示し、本実施態様をさらに説明する。
【０２４９】
［実施例１］
光触媒含有層に用いる分散液をイソプロピルアルコール１５ｇ、塩酸（１Ｎ）４ｇ、フルオロアルコキシシラン（トーケムプロダクツ製ＭＦ−１６０Ｅ：Ｎ−［３−（トリメトキシシリル）プロピル］−Ｎ−エチルパーフルオロオクタンスルホンアミドのイソプロピルエーテル５０％重量溶液）０．０２４ｇ、酸化チタン（石原産業（株）製ＳＴＫ−０３）４ｇを添加し、温度を１００℃に保持し、攪拌装置にて６０分間攪拌し作製した。光触媒反応阻害性基材としてアルカリガラスを使用した。当該アルカリガラス上に遮蔽層として機能するＩＴＯが９４／３２μｍにパターニングされたものを用い、その上に分散液をスピンコーティグ法により塗布した。これを１５０℃の温度で１０分間乾燥することにより、加水分解、重縮合反応を進行させ、８００Åの光触媒含有層を形成した。得られた光触媒含有層の表面の平均粗さを触針法により測定したところ、約Ｒａ＝２０ｎｍであった。また、超高圧水銀灯（ウシオ電機製ＵＸＭ−３５００，ＭＬ−４０型ランプハウス）から、熱線を取り除いて、２４１ｎｍ〜２７１ｎｍの紫外光のみを４２０秒間５．６ｍＷ／ｃｍ^２の強度で全面照射を行った。水および表面張力が３５ｍＮ／ｍの有機溶媒に対する接触角を接触角測定器（協和界面科学製ＣＡ−Ｚ型）により測定した結果を図１１および図１２に示す。
【０２５０】
図１１および図１２の結果から、遮蔽層が形成されている領域は露光により、速やかに水および表面張力が３５ｍＮ／ｍの有機溶媒に対する接触角が低下していることを考慮すれば、露光の結果、ケイ素原子に結合していたメチル基、フルオロアルキル基等の有機基が、水酸基等の酸素含有基に置換されたものと考えられる。
【０２５１】
［実施例２］
実施例１と同様の方法で、厚さ８００Åの光触媒含有層を形成した。５．６ｍＷ／ｃｍ^２の照度で全面紫外線照射およびライン／スペースが９４／３２μｍのフォトマスクパターンを介して７分間紫外線照射を行った。高分子発光材料をインクジェットによって塗布すると、紫外線の露光領域である親液性領域に濡れ広がり、画素を形成することができた。
【０２５２】
［実施例３］
実施例１と同様の方法で、厚さ８００Åの光触媒含有層を形成した。５．６ｍＷ／ｃｍ^２の照度で全面紫外線照射およびライン／スペースが９４／３２μｍのフォトマスクパターンを介して７分間紫外線を照射した。高分子発光材料をディスペンサーによって塗布すると、紫外線の露光領域である親液性領域に濡れ広がり、画素を形成することができた。
【０２５３】
【発明の効果】
本発明によれば、光触媒反応阻害性基材上に遮蔽層をパターン状に形成することにより、その上に形成される光触媒含有層に含まれる光触媒の作用が阻害または低下される領域および阻害または低下されない領域からなるパターンを形成することができる。このようなパターンが形成された光触媒反応阻害性基材上に光触媒含有層を成膜することにより、光触媒含有層には、遮蔽層のパターンに沿って光触媒の機能が発揮される領域とされない領域とが存在するため、エネルギーを全面照射することによりフォトマスクを介する等の方法によりエネルギーをパターン状に照射しなくとも、光触媒含有層表面に濡れ性の違いによるパターンを形成することができるのである。また、エネルギー照射後に現像・洗浄といった後処理を施す必要がないことから製造工程を簡略化することができるといった効果を奏する。
【図面の簡単な説明】
【図１】本発明のパターン形成体の一例を示す概略断面図である。
【図２】本発明のパターン形成体の他の例を示す概略断面図である。
【図３】本発明のパターン形成体の他の例を示す概略断面図である。
【図４】本発明のパターン形成体の他の例を示す概略断面図である。
【図５】本発明のパターン形成体の他の例を示す概略断面図である。
【図６】本発明のパターン形成体の他の例を示す概略断面図である。
【図７】本発明のパターン形成体の製造方法の一例を示す工程図である。
【図８】本発明のパターン形成体の製造方法の他の例を示す工程図である。
【図９】本発明のパターン形成体の製造方法の他の例を示す工程図である。
【図１０】本発明のパターン形成体の製造方法の他の例を示す工程図である。
【図１１】実施例１により作製されたパターン形成体において、光触媒含有層の表面張力が３５ｍＮ／ｍの有機溶媒に対する接触角の経時的な変化を示すグラフである。
【図１２】実施例１により作製されたパターン形成体において、光触媒含有層の水に対する接触角の経時的な変化を示すグラフである。
【符号の説明】
１　…　光触媒反応阻害性基材
２　…　遮蔽層
３　…　光触媒含有層
４　…　撥液性領域
５　…　親液性領域[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a pattern formed body that can be used for various uses such as a color filter, a micro lens, and an electroluminescent device.
[0002]
[Prior art]
Conventionally, as a method of forming a high-definition pattern, pattern exposure is performed on a photoresist layer applied on a substrate, and after exposure, the photoresist is developed and further etched, or the photoresist has functionality. 2. Description of the Related Art There is known a method of manufacturing a pattern formed body by photolithography, for example, by directly forming a target pattern by exposing a photoresist using a substance.
[0003]
The formation of high-definition patterns by photolithography includes the formation of colored patterns for color filters used in liquid crystal displays, etc., the formation of microlenses, the manufacture of fine electrical circuit substrates, and the manufacture of chrome masks used for pattern exposure. However, depending on these methods, it is necessary to use a photoresist, develop with a liquid developer after exposure, or perform etching, so that it is necessary to treat a waste liquid. In addition, when a functional substance is used as a photoresist, there is also a problem that the photoresist is deteriorated by an alkali solution or the like used at the time of development.
[0004]
On the other hand, in order to solve such a problem, the present inventors have studied a method of manufacturing a pattern-formed body that forms a pattern using a substance whose characteristics are changed by the action of a photocatalyst. However, the conventional method for producing a pattern-formed body by the action of a photocatalyst is mainly a method of producing a pattern using a mask such as a photomask at the time of exposure. In order to form a pattern based on digital data, a problem is that a pattern cannot be formed directly based on digital data, such as forming a photomask based on these data and performing exposure using the photomask. May occur.
[0005]
In view of such problems, the inventors have proposed to form a pattern by photolithography without using a photomask. However, the light drawing irradiation proposed so far is intended to form a pattern by the energy for starting a photocatalytic reaction of a photocatalyst such as ultraviolet light, and therefore uses an expensive and difficult-to-handle device such as an ultraviolet laser. There is a problem that it is necessary.
[0006]
Note that no prior art document relating to the present invention has been found.
[0007]
[Problems to be solved by the invention]
The present invention has been made in view of the above problems, and can be formed in a simple process, and can be performed without irradiating energy in a pattern by a method using a photomask, a method using electron beam drawing, or the like. It is an object of the present invention to provide a pattern formed body capable of forming a pattern and a method of manufacturing the same.
[0008]
[Means for Solving the Problems]
In order to achieve the above object, the present invention provides, as described in claim 1, a photocatalytic reaction-inhibiting base material having an effect of inhibiting or reducing the action of a photocatalyst, and containing a photocatalytic reaction-inhibiting substance, A shielding layer formed in a pattern on the photocatalytic reaction-inhibiting substrate, and a film formed on the photocatalytic reaction-inhibiting substrate in which the shielding layer is formed in a pattern, and the surface is wetted by energy irradiation. And a photocatalyst-containing layer having a variable property.
[0009]
In the present invention, by forming a shielding layer in a pattern on the photocatalytic reaction-inhibiting substrate, the region where the action of the photocatalyst contained in the photocatalyst containing layer formed thereon is inhibited or reduced, and the inhibition or reduction It is possible to form a pattern consisting of regions that are not formed. By forming a photocatalyst-containing layer on the photocatalytic reaction-inhibiting substrate on which such a pattern is formed, the photocatalyst-containing layer has a region where the photocatalyst function is exhibited according to the pattern of the shielding layer and a region where the photocatalyst function is not exhibited. Therefore, a pattern due to the difference in wettability can be formed on the surface of the photocatalyst-containing layer without irradiating the entire surface with the energy and irradiating the energy in a pattern by a method such as through a photomask. is there. Further, since there is no need to perform post-processing such as development and cleaning after the energy irradiation, the manufacturing process can be simplified.
[0010]
In the present invention, as described in claim 2, a photocatalytic reaction inhibitor comprising a substrate and a photocatalytic reaction inhibitor formed on the substrate in a pattern and having an effect of inhibiting or reducing the activity of the photocatalyst. A pattern formation comprising: a substance-containing layer; and a photocatalyst-containing layer formed on a substrate on which the photocatalytic reaction-inhibiting substance-containing layer is formed in a pattern and whose surface wettability changes by energy irradiation. Provide body.
[0011]
The substrate here is a member that does not affect the action of a general photocatalyst, and a photocatalytic reaction-inhibiting substance-containing layer containing a substance that inhibits the action of the photocatalyst is patterned on such a substrate. By forming, a pattern composed of a region where the action of the photocatalyst is inhibited or reduced and a region where the action of the photocatalyst is not inhibited or reduced is formed on the substrate. Since the photocatalyst-containing layer formed on the substrate on which such a pattern is formed has a difference in the action of the photocatalyst along the pattern of the photocatalytic reaction-inhibiting substance-containing layer, energy is applied to the surface of the photocatalyst-containing layer. A pattern due to the difference in wettability can be formed only by irradiation. Further, since there is no need to perform post-processing such as development and cleaning after the energy irradiation, the manufacturing process can be simplified.
[0012]
Further, in the present invention, as described in claim 3, a photocatalytic reaction inhibitor-containing substrate in which a portion containing a photocatalytic reaction inhibitor that inhibits or reduces the action of a photocatalyst exists in a pattern, Provided is a pattern-forming body, characterized by having a photocatalyst-containing layer formed on a reaction-inhibiting substance-containing substrate and having a surface wettability changed by energy irradiation.
[0013]
In the present invention, by forming a photocatalyst-containing layer on a photocatalyst reaction-inhibiting substance-containing substrate in which the portion containing the photocatalytic reaction-inhibiting substance is present in a pattern, the function of the photocatalyst in the photocatalyst-containing layer is improved. Differences occur along the pattern of the reaction inhibitor-containing substrate. Therefore, when such a photocatalyst-containing layer is irradiated with energy, it is possible to easily obtain a pattern-formed body in which a pattern due to a difference in wettability is formed.
[0014]
In the invention described in any one of claims 1 to 3, as described in claim 4, the photocatalyst-containing layer preferably has at least a photocatalyst and a binder. This is because with such a photocatalyst-containing layer, the wettability of the surface can be easily changed by the action of the photocatalyst accompanying the energy irradiation.
[0015]
In the invention described in any one of claims 1 to 3, as described in claim 5, the photocatalyst-containing layer is decomposed by a photocatalyst and a photocatalyst present on the surface. It is preferable to have at least a photocatalytically decomposable substance that changes its wettability upon exposure. By using such a photocatalyst containing layer, the photocatalytic decomposable substance is decomposed by the action of the photocatalyst accompanying the energy irradiation, and a pattern having a good difference in wettability can be easily formed on the surface of the photocatalyst containing layer. It is.
[0016]
In the invention described in any one of claims 1 to 5, as described in claim 6, the thickness of the photocatalyst-containing layer is in the range of 30 nm to 500 nm. Is preferred. If the thickness of the photocatalyst-containing layer is larger than the above range, the entire photocatalyst-containing layer may not be affected by the photocatalytic reaction-inhibiting substrate and the like formed under the photocatalyst-containing layer. If the thickness is smaller than the above range, it is difficult to form the photocatalyst-containing layer into a uniform film.
[0017]
In the present invention, as described in claim 7, a photocatalytic reaction-inhibiting base material having an effect of inhibiting or reducing the action of a photocatalyst and containing a photocatalytic reaction-inhibiting substance, A shielding layer formed in a pattern on the substrate, a photocatalyst treatment layer having at least a photocatalyst formed on the photocatalytic reaction-inhibiting substrate in which the shielding layer is formed in a pattern, and the photocatalyst There is provided a pattern forming body characterized by having a property changing layer formed on a processing layer and having a property changed by the action of a photocatalyst accompanying energy irradiation.
[0018]
In the present invention, by forming the characteristic change layer on the photocatalytic reaction-inhibiting substrate in which the shielding layer is formed in a pattern, the influence of the photocatalytic reaction-inhibiting substrate is adjusted along the pattern of the shielding layer. Therefore, a pattern having changed characteristics can be easily formed on the characteristic change layer only by energy irradiation.
[0019]
Further, in the present invention, as described in claim 8, a photocatalytic reaction containing a substrate and a photocatalytic reaction inhibitor formed on the substrate in a pattern and having an action of inhibiting or reducing the action of the photocatalyst. An inhibitory substance-containing layer and a photocatalyst treatment layer having at least a photocatalyst formed on the substrate on which the photocatalytic reaction inhibitory substance-containing layer is formed in a pattern, and an energy irradiation And a characteristic change layer whose characteristics change by the action of a photocatalyst accompanying the above.
[0020]
The substrate here is a member that does not affect the action of a general photocatalyst. By forming a photocatalytic reaction-inhibiting substance-containing layer on such a substrate in a pattern, the action of the photocatalyst is inhibited or A pattern consisting of a region to be reduced and a region not to be inhibited or reduced can be formed on the substrate. Further, since the photocatalyst treatment layer is formed on such a substrate, the photocatalyst treatment layer has a region where the action of the photocatalyst formed on the substrate is inhibited or reduced and a region where the operation of the photocatalyst is not inhibited or reduced. Will be affected. Therefore, by forming a characteristic change layer on such a photocatalyst treatment layer, a pattern whose characteristics have changed easily along the pattern of the photocatalytic reaction inhibitor-containing layer can be easily formed on the characteristic change layer only by energy irradiation. can do.
[0021]
Further, in the present invention, as described in claim 9, a photocatalytic reaction inhibitor-containing base material in which a portion containing a photocatalytic reaction inhibitor that inhibits or reduces the action of a photocatalyst exists in a pattern, A photocatalyst treatment layer having at least a photocatalyst formed on the reaction-inhibiting substance-containing base material, and a property change layer formed on the photocatalyst treatment layer and having properties changed by the action of the photocatalyst accompanying energy irradiation. And a pattern forming body characterized by the following.
[0022]
In the present invention, a photocatalytic reaction inhibitor-containing base material having a pattern formed by a part where the photocatalytic reaction inhibitor is present and a part where the photocatalytic reaction inhibitor is not present is used. By forming the characteristic change layer on the substrate, a pattern having characteristics changed along the pattern of the photocatalytic reaction-inhibiting substance-containing substrate can be easily formed on the characteristic change layer only by energy irradiation.
[0023]
In the invention described in any one of claims 7 to 9, as described in claim 10, the thickness of the photocatalyst treatment layer is in the range of 30 nm to 500 nm. Is preferred. If the film thickness is larger than the above range, the influence of the photocatalytic reaction-inhibiting substrate or the like does not reach the entire photocatalyst treatment layer, and it is difficult to form a clear pattern. On the other hand, if the film thickness is smaller than the above range, it is difficult to form a uniform film.
[0024]
In the invention described in any one of claims 7 to 10, as described in claim 11, the property change layer changes wettability by the action of a photocatalyst accompanying energy irradiation. It is preferably a wettability changing layer. There are various characteristics of the characteristic change layer. Among them, an important one is a change in wettability. In this way, the property change layer is used as a wettability change layer, and a pattern formed body having a pattern due to the difference in wettability is formed by irradiating energy to the surface of the wettability change layer. This is because various functional elements, for example, a color filter, a microlens, an EL element, and the like can be formed by attaching the composition for a functional part as described later.
[0025]
In the invention described in any one of the seventh to tenth aspects, as described in the twelfth aspect, the characteristic change layer is decomposed and removed by the action of a photocatalyst accompanying energy irradiation. It is preferably a decomposition removal layer. When energy irradiation is performed by using the decomposition removal layer, the decomposition removal layer is decomposed and removed, and a pattern is formed depending on the presence or absence of the decomposition removal layer. For example, when such a decomposition removal layer is made to exhibit different wettability from a member exposed when the decomposition removal layer is decomposed and removed, a pattern due to a difference in wettability is formed by forming the decomposition removal layer in a pattern. Can be formed. By attaching a functional part composition such as ink using the pattern of the decomposition removal layer, various functional elements such as a color filter, a microlens or an EL element can be easily formed as described later. This is because it can be formed.
[0026]
In the invention described in claim 1 or claim 7, as described in claim 13, the thickness of the shielding layer is preferably 10 μm or less. When the thickness of the shielding layer is thinner than the above range, the shielding effect of the shielding layer is weakened, and the action of the photocatalytic reaction-inhibiting substrate may reach the photocatalyst containing layer. This is because if the thickness of the shielding layer is increased, the smoothness of the entire pattern formed body may be impaired.
[0027]
In the invention described in claim 2 or 8, as described in claim 14, the thickness of the photocatalytic reaction inhibitor-containing layer is preferably in the range of 10 nm to 15 μm. When the film thickness is larger than the above range, the smoothness of the entire pattern formed body may be impaired, and when the film thickness is smaller than the above range, the function of inhibiting or reducing the action of the photocatalyst is sufficient. This is because there is a possibility that it will not be exhibited.
[0028]
In the invention described in any one of the first to fourteenth aspects, as described in the fifteenth aspect, the photocatalytic reaction-inhibiting substance is an alkali metal, an alkaline earth metal, alumina, zirconia. , Silica, antimony oxide, amorphous titanium oxide, aluminum, and manganese. This is because such a substance has a particularly high effect of inhibiting the action of the photocatalyst accompanying the energy irradiation.
[0029]
In the invention described in any one of claims 1 to 15, as described in claim 16, the photocatalyst is made of titanium oxide (TiO 2).₂) Is preferable. This is because titanium oxide is effective as a photocatalyst due to its high band cap energy, and is chemically stable, has no toxicity, and is easily available.
[0030]
According to a further aspect of the present invention, there is provided a photocatalyst-containing layer or a property-changing layer in the pattern-formed body according to any one of the above-described claims 1 to 16. The functional element is characterized in that the parts are arranged in a pattern. Thus, a functional element can be easily obtained by using the pattern forming body of the present invention.
[0031]
In the invention described in claim 17, as described in claim 18, it is preferable that the functional portion is a metal. In this case, for example, it can be applied to a high-definition electric circuit board or the like. Furthermore, as described in claim 19, when the functional part of the functional element according to claim 17 is a color filter characterized by being a pixel part, and as described in claim 20, In the case where the functional part of the functional element according to claim 17 is a microlens characterized by being a lens, the functional element according to claim 17 is as described in claim 21. An EL element in which the functional part is a light-emitting layer can be a preferable use mode.
[0032]
In order to achieve the above object, in the present invention, on a photocatalytic reaction-inhibiting substrate containing a photocatalytic reaction-inhibiting substance and having an effect of inhibiting or reducing the action of a photocatalyst, as described in claim 22 A step of forming a shielding layer in a pattern, and a step of forming a photocatalyst-containing layer whose wettability is changed by energy irradiation on the photocatalytic reaction-inhibiting substrate on which the shielding layer is formed in a pattern. Irradiating the surface of the photocatalyst-containing layer with energy to form a pattern on the photocatalyst-containing layer due to a difference in wettability.
[0033]
In the method for producing a pattern-formed body according to the present invention, since the shielding layer is formed in a pattern on the photocatalytic reaction-inhibiting substrate, the action of the photocatalyst is inhibited or reduced along the pattern of the shielding layer. A pattern consisting of regions and such unaffected regions is formed. Therefore, by forming a photocatalyst containing layer on such a photocatalytic reaction inhibiting substrate, it is possible to pattern the photocatalyst containing layer using this pattern. That is, a pattern due to a difference in wettability can be formed on the surface of the photocatalyst-containing layer even when the entire surface is irradiated without irradiating the pattern with energy. Further, there is no need to perform post-processing such as development and washing after the energy irradiation, and the manufacturing process can be simplified.
[0034]
Further, in the present invention, as described in claim 23, a photocatalytic reaction inhibitor-containing layer containing a photocatalytic reaction inhibitor having an action of inhibiting or reducing the action of the photocatalyst is formed in a pattern on the substrate. And a step of forming a photocatalyst-containing layer whose wettability changes upon irradiation with energy on the substrate on which the photocatalytic reaction inhibitor-containing layer is formed in a pattern, and irradiating the surface of the photocatalyst-containing layer with energy. And a step of forming a pattern based on a difference in wettability in the photocatalyst-containing layer.
[0035]
In the present invention, a photocatalytic reaction-inhibiting substance-containing layer that inhibits or reduces the action of the photocatalyst is formed in a pattern on a substrate that does not affect the action of the photocatalyst, so that a region where the photocatalyst functions on the substrate is previously formed. And a non-functional area can be formed. Further, when a photocatalyst-containing layer is formed on a substrate on which such a pattern is formed, the influence of this pattern is exerted, and a pattern due to a difference in wettability can be easily formed on the photocatalyst-containing layer surface by energy irradiation. It is.
[0036]
In the invention described in claim 22 or claim 23, as described in claim 24, the photocatalyst-containing layer preferably has at least a photocatalyst and a binder. This is because with such a photocatalyst-containing layer, the wettability of the surface can be easily changed by the action of the photocatalyst accompanying the energy irradiation.
[0037]
In the invention described in claim 22 or claim 23, as described in claim 25, the photocatalyst containing layer is decomposed by the action of the photocatalyst and the photocatalyst accompanying energy irradiation, and the wettability is changed. It is preferable to have at least a decomposable substance. By using such a photocatalyst containing layer, the photocatalytic decomposable substance is decomposed by the action of the photocatalyst accompanying the energy irradiation, and a pattern having a good difference in wettability can be easily formed on the surface of the photocatalyst containing layer. It is.
[0038]
In the present invention, as described in claim 26, the photocatalytic reaction-inhibiting substance which has an action of inhibiting or reducing the action of the photocatalyst and contains a photocatalytic reaction-inhibiting substance is formed in a pattern. A step of forming a shielding layer, a step of forming a photocatalyst treatment layer having at least a photocatalyst on the photocatalytic reaction-inhibiting substrate on which the shielding layer is formed in a pattern, and an energy step on the photocatalyst treatment layer. Forming at least a step of forming a characteristic-change layer whose characteristics are changed by the action of the photocatalyst accompanying irradiation; and irradiating energy to the surface of the characteristic-change layer to form a pattern on the characteristic-change layer by a change in characteristics A method for manufacturing a pattern forming body is provided.
[0039]
In the present invention, the photocatalytic reaction-inhibiting substrate comprises a region to which the action of the photocatalytic reaction-inhibiting substrate reaches and a region to which the effect does not extend by patterning the shielding layer on the photocatalytic reaction-inhibiting substrate having an effect of inhibiting the function of the photocatalyst as a catalyst. Since the pattern is formed on the photocatalytic reaction-inhibiting substrate, when the photocatalyst treatment layer is formed on the photocatalytic reaction-inhibiting substrate, the effect of the pattern extends to the photocatalyst treatment layer, and the characteristic change layer has different characteristics. The pattern can be formed by energy irradiation.
[0040]
In the present invention, as described in claim 27, a photocatalytic reaction inhibitor-containing layer containing a photocatalytic reaction inhibitor having an action of inhibiting or reducing the action of the photocatalyst is formed in a pattern on the substrate. And a step of forming a photocatalyst treatment layer having at least a photocatalyst on the substrate having the photocatalytic reaction inhibitor-containing layer formed in the pattern, and, on the photocatalyst treatment layer, the photocatalyst accompanying energy irradiation A pattern comprising a step of forming a characteristic change layer whose characteristics are changed by action, and a step of irradiating energy to the surface of the characteristic change layer to form a pattern on the characteristic change layer due to a difference in characteristics. A method for producing a formed body is provided.
[0041]
In the present invention, a photocatalytic reaction-inhibiting substance-containing layer having an effect of inhibiting or reducing the action of the photocatalyst is formed in a pattern on a substrate that does not affect the action of the photocatalyst. A pattern composed of a region where the photocatalyst functions and a region where the photocatalyst does not function can be formed. When the photocatalytic treatment layer is formed on the substrate on which such a pattern is formed, the influence of the photocatalytic reaction inhibitor extends to the photocatalyst treatment layer, and the characteristics of the characteristic change layer are changed along the pattern of the photocatalytic reaction inhibitor-containing layer. The pattern due to the difference can be formed by energy irradiation.
[0042]
In the invention described in claim 26 or claim 27, as described in claim 28, the property change layer is a wettability change layer whose wettability changes by the action of a photocatalyst accompanying energy irradiation. Is preferred. There are various characteristics of the characteristic change layer. Among them, an important one is a change in wettability. In this way, the property change layer is used as a wettability change layer, and a pattern formed body having a pattern due to the difference in wettability is formed by irradiating energy to the surface of the wettability change layer. This is because various functional elements, for example, a color filter, a microlens, an EL element, and the like can be formed by attaching the composition for a functional part as described later.
[0043]
In the invention described in claim 26 or claim 27, as described in claim 29, the characteristic change layer may be a decomposition removal layer that is decomposed and removed by the action of a photocatalyst accompanying energy irradiation. preferable. When energy irradiation is performed by using the decomposition removal layer, the decomposition removal layer is decomposed and removed, and a pattern is formed depending on the presence or absence of the decomposition removal layer. For example, when such a decomposition removal layer is made to have a different wettability from a member exposed when the decomposition removal layer is decomposed and removed, a pattern due to a difference in wettability is formed by forming the decomposition removal layer in a pattern. Can be formed. By attaching a functional part composition such as ink using the pattern of the decomposition removal layer, various functional elements such as a color filter, a microlens or an EL element can be easily formed as described later. This is because it can be formed.
[0044]
In the invention described in any one of claims 22 to 29, as described in claim 30, the photocatalytic reaction inhibitor is an alkali metal, an alkaline earth metal, alumina, zirconia. , Silica, antimony oxide, amorphous titanium oxide, aluminum, and manganese. This is because such a substance has a particularly high effect of inhibiting the action of the photocatalyst accompanying the energy irradiation.
[0045]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, the pattern forming body of the present invention and the method of manufacturing the same will be described. First, the pattern forming body of the present invention will be described.
[0046]
I. Pattern forming body
The pattern forming body of the present invention uses a substance or the like having an action of inhibiting or reducing the function of the photocatalyst, and converts the action of such a substance into a layer whose wettability or the like changes by the action of the photocatalyst accompanying energy irradiation. It is characterized in that a pattern is formed by being extended.
[0047]
Such a pattern forming body in the present invention may be divided into a plurality of modes by a combination of a side having a function of inhibiting or reducing the function of a photocatalyst and a side on which a pattern is formed by utilizing such a function. Can be.
[0048]
Specifically, as the side that exerts the effect of inhibiting or reducing the function of the photocatalyst, when having a function of inhibiting or reducing the function of the photocatalyst, and using a photocatalytic reaction-inhibiting substrate containing a photocatalytic reaction-inhibiting substance, When the photocatalytic reaction inhibitor-containing layer containing the photocatalytic reaction inhibitor is formed in a pattern on a substrate that does not affect the action of the photocatalyst, and when the portion containing the photocatalytic reaction inhibitor exists in a pattern An inhibitor-containing substrate may be used.
[0049]
On the other hand, as the side on which the pattern is formed, there are a case where a photocatalyst-containing layer whose wettability is changed by the action of a photocatalyst accompanying energy irradiation and a case where a decomposition removal layer which is decomposed and removed by the same action are used.
[0050]
Hereinafter, each mode by the combination of the side which exerts the effect of inhibiting or reducing the function of the photocatalyst and the side on which the pattern is formed will be described.
[0051]
1. First embodiment
The first embodiment uses a photocatalytic reaction-inhibiting base material containing a photocatalytic reaction-inhibiting substance as a side that exerts an action of inhibiting or reducing the function of a photocatalyst, and on the other hand, a side associated with energy irradiation as a pattern-formed side. This is an embodiment in which a photocatalyst-containing layer whose wettability changes by the action of a photocatalyst is used.
[0052]
Such an embodiment has an action of inhibiting or reducing the action of the photocatalyst, and a photocatalytic reaction-inhibiting substrate containing a photocatalytic reaction-inhibiting substance, and a pattern formed on the photocatalytic reaction-inhibiting substrate. And a photocatalyst-containing layer that is formed on the photocatalytic reaction-inhibiting substrate in which the shielding layer is formed in a pattern, and whose surface wettability changes by energy irradiation. It is assumed that.
[0053]
Here, the “photocatalytic reaction inhibitor” means a substance having a function of inhibiting or reducing the action of the photocatalyst, and the “photocatalytic reaction inhibitor base material” includes the aforementioned photocatalytic reaction inhibitor. Means a member that retains the function of inhibiting or reducing the action of the photocatalyst and functions as a substrate. Therefore, the photocatalyst near the photocatalytic reaction-inhibiting substrate is prevented from functioning sufficiently as a catalyst even when irradiated with energy due to the influence of the photocatalytic reaction-inhibiting substrate.
[0054]
The term “shielding layer” as used herein means that the photocatalytic reaction-inhibiting substrate is prevented from contacting the photocatalyst-containing layer and the photocatalytic reaction-inhibiting substrate by being formed in a pattern on the photocatalytic reaction-inhibiting substrate. FIG. 3 shows a layer that shields the reaction-inhibiting substrate from affecting the photocatalyst-containing layer.
[0055]
According to this embodiment, by forming the shielding layer in a pattern on the photocatalytic reaction-inhibiting substrate, a pattern consisting of a region where the action of the photocatalyst is inhibited or reduced and a region that is not formed is previously formed. It can be formed on a substrate. Furthermore, when a photocatalyst-containing layer is formed on a photocatalytic reaction-inhibiting substrate on which such a pattern is formed, the effect of this pattern affects the photocatalyst-containing layer, and the effect of the photocatalyst inside the photocatalyst-containing layer differs. Occurs. In other words, if the photocatalyst-containing layer in such a state is used, even if the entire surface is irradiated with energy, a pattern due to the difference in wettability due to the difference in the action of the photocatalyst inside the photocatalyst-containing layer is formed on the photocatalyst-containing layer. You can do it. Therefore, it is not necessary to perform the alignment process between the photomask and the photocatalyst-containing layer at the time of energy irradiation, and it is not necessary to perform post-processing such as development and cleaning after the energy irradiation. It has the advantage that it can be greatly simplified.
[0056]
The pattern forming body in this embodiment having such advantages will be described with reference to the drawings.
[0057]
FIG. 1 shows an example of the pattern forming body of the present embodiment. In FIG. 1, a photocatalytic reaction-inhibiting substrate 1 having an action of inhibiting or reducing the function of a photocatalyst, a shielding layer 2 formed in a pattern on the photocatalytic reaction-inhibiting substrate 1, and a shielding layer 2 A photocatalyst containing layer 3 formed on a photocatalytic reaction inhibiting substrate 1 formed in a pattern is shown. In such a pattern forming body in the present embodiment, the region where the photocatalyst containing layer 3 is in contact with the photocatalytic reaction-inhibiting substrate 1 has an effect of the photocatalyst due to the effect of the photocatalytic reaction-inhibiting substrate 1. The wettability does not change, and the liquid-repellent region 4 is obtained. On the other hand, since the photocatalyst-containing layer 3 located on the shielding layer 2 is not affected by the photocatalytic reaction-inhibiting substrate 1, when irradiated with energy, the contact angle with the liquid decreases due to the action of the photocatalyst. The lyophilic region 5 having changed wettability is obtained.
[0058]
Hereinafter, the photocatalytic reaction-inhibiting substrate, the shielding layer, and the photocatalyst-containing layer constituting the present embodiment will be described in detail.
[0059]
(1) Photocatalytic reaction inhibiting substrate
First, the photocatalytic reaction-inhibiting substrate in the present embodiment will be described. The photocatalytic reaction-inhibiting substrate in this embodiment is a member that contains a photocatalytic reaction-inhibiting substance therein, thereby retaining the function of inhibiting or reducing the action of the photocatalyst, and functioning as a general substrate. .
[0060]
Such a photocatalytic reaction-inhibiting substrate is not particularly limited as long as the substrate member that generally functions as a substrate contains at least a photocatalytic reaction-inhibiting substance.
[0061]
The material for forming the base member used in the present embodiment is not particularly limited as long as the material can contain a photocatalytic reaction inhibitor. Specifically, glass, plastic (film), ceramic, metal and the like can be mentioned. A photocatalytic reaction-inhibiting substrate can be formed by adding the above-described photocatalytic reaction-inhibiting substance to such a material.
[0062]
Further, the photocatalytic reaction-inhibiting substance contained in such a photocatalytic reaction-inhibiting substrate is not particularly limited as long as it has a function of inhibiting or reducing the photocatalytic reaction. Specifically, it is preferably at least one substance selected from alkali metals, alkaline earth metals, alumina, zirconia, silica, antimony oxide, amorphous titanium oxide, aluminum, and manganese. Among them, an alkali metal is preferable.
[0063]
In addition, the content of such a photocatalytic reaction inhibitory substance is different from the above-mentioned content in which the effect of inhibiting or reducing the action of the photocatalyst is obtained depending on each of the above-described substances. Is the content.
[0064]
In addition, although the photocatalytic reaction-inhibiting substrate itself in this embodiment may not have self-supporting property, in this case, the photocatalytic reaction-inhibiting substance-containing layer is formed on the entire surface of the substrate described later. , And the description here is omitted.
[0065]
(2) Shielding layer
The shielding layer in the present embodiment is a layer formed in a pattern on the above-described photocatalytic reaction-inhibiting substrate and provided to prevent the action of the photocatalytic reaction-inhibiting substrate from affecting the photocatalyst-containing layer. In other words, the photocatalyst-containing layer located on the region where the shielding layer is formed is shielded from the influence of the photocatalytic reaction-inhibiting substrate by the shielding layer. Functions as a catalyst, and the wettability changes in the direction in which the contact angle with the liquid decreases.
[0066]
The material for forming such a shielding layer is not particularly limited as long as it is a material that can prevent the action of the photocatalytic reaction-inhibiting substrate from affecting the photocatalyst-containing layer and the photocatalyst-treated layer described below. A case where a material that retains another function may be selected. For example, in the case where the function as an electrode layer is used in combination, it is generally used as a transparent electrode such as In-Zn-O (IZO), In-Sn-O (ITO), ZnO-Al, or Zn-Sn-O. Materials, metals such as Au, Ag, and Cu. On the other hand, when the function as the electrode layer is not used together,₂And the like.
[0067]
In addition, the method of patterning the shielding layer is not particularly limited as long as it enables high-definition patterning. Specifically, a photolithography method, an etching method, and the like can be given.
[0068]
The thickness of such a shielding layer is not particularly limited as long as the thickness is such that an effect of preventing the influence of the photocatalytic reaction-inhibiting substrate from affecting the photocatalyst-containing layer can be obtained. Specifically, the thickness is 10 μm or less, preferably within the range of 10 nm to 7 μm, more preferably within the range of 100 nm to 0.5 μm, and most preferably 0.1 μm to 0.2 μm. Is within the range. If the film thickness is larger than the above range, it is sufficient to prevent the influence of the photocatalytic reaction-inhibiting substrate, but the smoothness of the entire pattern formed body may be impaired, which is not preferable. On the other hand, if the thickness is smaller than the above range, the shielding effect of the shielding layer cannot be sufficiently obtained, and even if the photocatalyst-containing layer is located on the shielding layer, the photocatalytic reaction-inhibiting base material is affected by the photocatalytic reaction-inhibiting substrate. This is because there is a possibility that the action of the above may be inhibited or reduced, and a good pattern may not be formed.
[0069]
(3) Photocatalyst containing layer
Next, the photocatalyst containing layer will be described.
[0070]
The photocatalyst-containing layer in the present embodiment is a layer containing at least a photocatalyst therein, and is not particularly limited as long as the layer has a property that the wettability changes due to the action of the photocatalyst contained therein with energy irradiation. Although not performed, the photocatalyst-containing layer in this embodiment includes at least a photocatalyst and a binder, and at least a photocatalyst and a photocatalyst decomposable substance present on the surface and decomposed by the action of the photocatalyst to change the wettability. And the case is preferred. This is because a photocatalyst-containing layer having such a case can easily form a pattern due to a difference in wettability without performing post-processing such as development and washing after energy irradiation. Hereinafter, the photocatalyst containing layer in each case will be described in detail.
[0071]
(I) When composed of at least a photocatalyst and a binder
First, the case where the photocatalyst-containing layer in the present embodiment includes at least a photocatalyst and a binder will be described.
[0072]
Such a photocatalyst-containing layer contains at least a photocatalyst and a binder, and is not particularly limited as long as the wettability is changed by the action of a photocatalyst contained therein when energy is irradiated. It is preferable that the photocatalyst-containing layer changes the wettability in the direction in which the contact angle with the photocatalyst decreases. By using such a photocatalyst containing layer, the portion of the photocatalyst containing layer located on the shielding layer is not affected by the photocatalytic reaction inhibiting substrate due to the shielding effect of the shielding layer. This is because the wettability changes in the direction of functioning as a catalyst and the contact angle with the liquid decreases, and a lyophilic region can be formed. On the other hand, the photocatalyst-containing layer in a portion that is in direct contact with the photocatalytic reaction-inhibiting substrate is prevented from functioning as a catalyst even if energy is irradiated by the action of the photocatalytic reaction-inhibiting substrate, and has sufficient wettability. The liquid-repellent region is formed without any change. Therefore, only by irradiating the surface of the photocatalyst-containing layer with energy, a pattern-formed body can be efficiently manufactured.
[0073]
Here, the lyophilic region is a region where the contact angle with the liquid is small, and if the functional component composition, for example, the functional element is a color filter, an ink for forming a pixel portion (colored layer), Further, when the functional element is an EL element, it refers to a region having good wettability to a coating liquid for forming an organic EL layer for forming an organic EL layer. Further, the lyophobic region is a region having a large contact angle with the liquid, and is a region having poor wettability to the above-described composition for a functional part.
[0074]
The photocatalyst-containing layer has a surface tension of 40 mN / m in a region in contact with the above-described photocatalytic reaction-inhibiting substrate, that is, a region that does not change in wettability even when irradiated with energy and becomes a lyophobic region. Shows wettability when the contact angle with a liquid is 10 ° or more, preferably 10 ° or more with a liquid having a surface tension of 30 mN / m, particularly 10 ° or more with a liquid having a surface tension of 20 mN / m. Is preferred. This is because the region in contact with the photocatalytic reaction-inhibiting substrate is a portion where liquid repellency is required in the present embodiment, and when the contact angle with the liquid is small, the liquid repellency is sufficient. This is not preferable because the above-mentioned composition for forming a functional part may remain.
[0075]
In the photocatalyst-containing layer, the portion located on the shielding layer, when irradiated with energy, has a reduced contact angle with a liquid and a contact angle with a liquid having a surface tension of 40 mN / m of 9 ° or less, preferably It is preferable that the layer has a contact angle of 10 ° or less with a liquid having a surface tension of 50 mN / m, particularly 10 ° or less with a liquid having a surface tension of 60 mN / m. If the contact angle with the liquid in the region that is located on the shielding layer and is not affected by the photocatalytic reaction-inhibiting substrate, that is, in the lyophilic region, is high, the spread of the composition for forming a functional part in this region may be poor. This is because there is a possibility that a problem such as lack of a functional unit may occur.
[0076]
In addition, the contact angle with the liquid referred to here is a contact angle with a liquid having various surface tensions measured using a contact angle measuring device (CA-Z type manufactured by Kyowa Interface Science Co., Ltd.) (from the micro syringe to the liquid). 30 seconds after dropping) and obtained from the results or as a graph. In this measurement, wetting index standard liquids manufactured by Kanto Chemical Co., Ltd. were used as liquids having various surface tensions.
[0077]
In the photocatalyst-containing layer as described above, the action mechanism of the photocatalyst represented by titanium dioxide as described below is not necessarily clear, but the carrier generated by light irradiation is a direct reaction with a nearby compound, Alternatively, it is considered that active oxygen species generated in the presence of oxygen and water change the chemical structure of an organic substance. In the present embodiment, it is considered that the carrier acts on the binder compound in the photocatalyst-containing layer to change the wettability of the surface.
[0078]
The photocatalyst used in the present embodiment is, for example, titanium dioxide (TiO 2) which is known as an optical semiconductor.₂), Zinc oxide (ZnO), tin oxide (SnO)₂), Strontium titanate (SrTiO)₃), Tungsten oxide (WO₃), Bismuth oxide (Bi₂O₃), And iron oxide (Fe₂O₃), And one or more of them may be used in combination.
[0079]
In this embodiment, titanium dioxide is particularly preferably used because it has a high band gap energy, is chemically stable, has no toxicity, and is easily available. Titanium dioxide includes an anatase type and a rutile type, and any of them can be used in this embodiment. Anatase type titanium dioxide is preferable. Anatase type titanium dioxide has an excitation wavelength of 380 nm or less.
[0080]
Examples of such anatase-type titanium dioxide include, for example, anatase-type titania sol of peptic hydrochloride type (STS-02 (average particle size: 7 nm) manufactured by Ishihara Sangyo Co., Ltd .; ST-K01 manufactured by Ishihara Sangyo Co., Ltd.); Glue-type anatase titania sol (TA-15 (average particle diameter: 12 nm) manufactured by Nissan Chemical Industries, Ltd.) and the like can be mentioned.
[0081]
The smaller the particle size of the photocatalyst is, the more effective the photocatalytic reaction takes place. The average particle size is preferably 50 nm or less, more preferably 20 nm or less.
[0082]
The content of the photocatalyst in the photocatalyst containing layer used in the present embodiment can be set in the range of 5 to 60% by weight, preferably 20 to 40% by weight. Further, the thickness of the photocatalyst-containing layer is preferably in the range of 30 nm to 500 nm, and more preferably in the range of 30 nm to 200 nm. When the thickness of the photocatalyst-containing layer is larger than the above range, the entire photocatalyst-containing layer in contact with the photocatalytic reaction-inhibiting substrate is not affected by the photocatalytic reaction-inhibiting substrate, and the pattern accuracy is poor. On the other hand, if the thickness is smaller than the above range, it is difficult to form the photocatalyst-containing layer as a uniform film, which is not preferable.
[0083]
Furthermore, the binder component in the photocatalyst-containing layer is not particularly limited as long as it is a material whose wettability changes by the action of the photocatalyst in the photocatalyst-containing layer and has a main chain that is hardly deteriorated or decomposed by the action of the photocatalyst. However, specific examples include organopolysiloxane. In the present embodiment, among these, an organopolysiloxane containing a fluoroalkyl group is preferable.
[0084]
Such organopolysiloxanes include, for example, (1) an organopolysiloxane which exerts a large strength by hydrolyzing and polycondensing chloro or alkoxysilane by a sol-gel reaction or the like, and (2) a liquid repellency or oil repellency. An organopolysiloxane such as an organopolysiloxane obtained by crosslinking an excellent reactive silicone can be used.
[0085]
In the case of the above (1), the general formula:
Y_nSix_(4-n)
(Here, Y represents an alkyl group, a fluoroalkyl group, a vinyl group, an amino group, a phenyl group or an epoxy group, X represents an alkoxyl group, an acetyl group or a halogen. N is an integer of 0 to 3. )
Is preferably an organopolysiloxane which is one or more hydrolytic condensates or cohydrolytic condensates of the silicon compound represented by Here, the carbon number of the group represented by Y is preferably in the range of 1 to 20, and the alkoxy group represented by X is preferably a methoxy group, an ethoxy group, a propoxy group, or a butoxy group. preferable.
[0086]
Further, in particular, an organopolysiloxane containing a fluoroalkyl group can be preferably used, and specific examples thereof include one or more hydrolytic condensates and co-hydrolytic condensates of the following fluoroalkylsilanes. What is generally known as a fluorine-based silane coupling agent can be used.
[0087]
CF₃(CF₂)₃CH₂CH₂Si (OCH₃)₃;
CF₃(CF₂)₅CH₂CH₂Si (OCH₃)₃;
CF₃(CF₂)₇CH₂CH₂Si (OCH₃)₃;
CF₃(CF₂)₉CH₂CH₂Si (OCH₃)₃;
(CF₃)₂CF (CF₂)₄CH₂CH₂Si (OCH₃)₃;
(CF₃)₂CF (CF₂)₆CH₂CH₂Si (OCH₃)₃;
(CF₃)₂CF (CF₂)₈CH₂CH₂Si (OCH₃)₃;
CF₃(C₆H₄) C₂H₄Si (OCH₃)₃;
CF₃(CF₂)₃(C₆H₄) C₂H₄Si (OCH₃)₃;
CF₃(CF₂)₅(C₆H₄) C₂H₄Si (OCH₃)₃;
CF₃(CF₂)₇(C₆H₄) C₂H₄Si (OCH₃)₃;
CF₃(CF₂)₃CH₂CH₂SiCH₃(OCH₃)₂;
CF₃(CF₂)₅CH₂CH₂SiCH₃(OCH₃)₂;
CF₃(CF₂)₇CH₂CH₂SiCH₃(OCH₃)₂;
CF₃(CF₂)₉CH₂CH₂SiCH₃(OCH₃)₂;
(CF₃)₂CF (CF₂)₄CH₂CH₂SiCH₃(OCH₃)₂;
(CF₃)₂CF (CF₂)₆CH₂CH₂Si CH₃(OCH₃)₂;
(CF₃)₂CF (CF₂)₈CH₂CH₂Si CH₃(OCH₃)₂;
CF₃(C₆H₄) C₂H₄SiCH₃(OCH₃)₂;
CF₃(CF₂)₃(C₆H₄) C₂H₄SiCH₃(OCH₃)₂;
CF₃(CF₂)₅(C₆H₄) C₂H₄SiCH₃(OCH₃)₂;
CF₃(CF₂)₇(C₆H₄) C₂H₄SiCH₃(OCH₃)₂;
CF₃(CF₂)₃CH₂CH₂Si (OCH₂CH₃)₃;
CF₃(CF₂)₅CH₂CH₂Si (OCH₂CH₃)₃;
CF₃(CF₂)₇CH₂CH₂Si (OCH₂CH₃)₃;
CF₃(CF₂)₉CH₂CH₂Si (OCH₂CH₃)₃;and
CF₃(CF₂)₇SO₂N (C₂H₅) C₂H₄CH₂Si (OCH₃)₃.
[0088]
By using a polysiloxane containing a fluoroalkyl group as described above as a binder, the lyophobic property of the photocatalyst-containing layer is greatly improved, and the functional part is formed on a region in contact with the photocatalytic reaction-inhibiting substrate. The adhesion of the composition can be prevented, and the composition for a functional part can be adhered only to the lyophilic region located on the shielding layer and having improved wettability with a liquid by energy irradiation.
[0089]
Examples of the reactive silicone of the above (2) include compounds having a skeleton represented by the following general formula.
[0090]
Embedded image

Here, n is an integer of 2 or more, and R¹, R²Is a substituted or unsubstituted alkyl, alkenyl, aryl or cyanoalkyl group having 1 to 10 carbon atoms, and the vinyl, phenyl or halogenated phenyl accounts for 40% or less of the whole in a molar ratio. Also, R¹, R²Is preferably a group having a methyl group since the surface energy is minimized, and the molar ratio of the methyl group is preferably 60% or more. Further, the chain terminal or the side chain has at least one or more reactive group such as a hydroxyl group in the molecular chain.
[0091]
Further, a stable organosilicone compound which does not undergo a cross-linking reaction, such as dimethylpolysiloxane, may be mixed with the above-mentioned organopolysiloxane.
[0092]
Further, the photocatalyst-containing layer in this embodiment may contain a surfactant in addition to the photocatalyst and the binder. Specifically, hydrocarbons such as NIKKOL @ BL, BC, BO, and BB series manufactured by Nikko Chemicals Co., Ltd., ZONYL @ FSN, FSO manufactured by DuPont, Surflon S-141, 145 manufactured by Asahi Glass Co., Ltd., and Dainippon Japan Megafac F-141 and 144 manufactured by Ink Chemical Industry Co., Ltd., Futagent F-200 and F251 manufactured by Neos Co., Ltd., Unidyne DS-401 and 402 manufactured by Daikin Industries, Ltd., and Florad FC-170 manufactured by 3M Corporation. 176 and the like, and a fluorine-based or silicone-based nonionic surfactant can be mentioned, and a cationic surfactant, an anionic surfactant, and an amphoteric surfactant can also be used.
[0093]
In addition, in addition to the above-mentioned surfactant, the photocatalyst-containing layer also includes polyvinyl alcohol, unsaturated polyester, acrylic resin, polyethylene, diallyl phthalate, ethylene propylene diene monomer, epoxy resin, phenol resin, polyurethane, and melamine resin as additives. , Polycarbonate, polyvinyl chloride, polyamide, polyimide, styrene butadiene rubber, chloroprene rubber, polypropylene, polybutylene, polystyrene, polyvinyl acetate, polyester, polybutadiene, polybenzimidazole, polyacrylonitrile, oligomers such as epichlorohydrin, polysulfide, polyisoprene, A polymer or the like can be contained.
[0094]
(Ii) A case comprising at least a photocatalyst and a photocatalytic decomposable substance
Next, the case where the photocatalyst-containing layer is at least composed of a photocatalyst and a photocatalyst decomposable substance present on the surface of the photocatalyst-containing layer and decomposed by the action of the photocatalyst to change the wettability will be described.
[0095]
The photocatalyst-containing layer formed in such a case changes the wettability by decomposing the photocatalytic decomposable substance by the action of the photocatalyst, so that the binder used in the photocatalyst-containing layer in this case is wetted by the action of the photocatalyst. There is no need for a function that changes gender.
[0096]
Hereinafter, the configuration of the photocatalyst-containing layer having such a case will be described. As for the photocatalyst, the same photocatalyst as described in the above “(i) Case where at least photocatalyst and binder is used” may be used. Since it is possible, the description here is omitted. Hereinafter, the photocatalytic decomposable substance and the binder used in this case will be described.
[0097]
a. Photocatalytic decomposable substance
The photocatalytic decomposable substance used in the present embodiment is not particularly limited as long as it is a substance that is decomposed by the action of a photocatalyst accompanying energy irradiation, and in particular, is a substance that changes in wettability by being decomposed. Is preferred. Further, among them, a substance whose wettability changes in the direction in which the contact angle with the liquid decreases is preferable. By adding such a photocatalytic decomposable substance, a change in wettability can be caused on the surface of the photocatalyst-containing layer, or such a change can be assisted. When a photocatalyst-containing layer containing such a photocatalyst-decomposable substance is used, the photocatalyst-containing layer located on the shielding layer does not hinder the action of the photocatalyst during energy irradiation, and has a wettability with a liquid. The wettability changes in the decreasing direction, and a lyophilic region can be formed.
[0098]
Examples of such a photocatalytic decomposable substance include surfactants having a function of decomposing by the action of a photocatalyst and changing the wettability of the surface of the photocatalyst-containing layer by being decomposed. Specifically, examples of such a surfactant include those similar to the surfactant described in the item (3) of the photocatalyst-containing layer described above in the section “(i) When the photocatalyst and binder are included”. Can be. In addition, the additives described in the above items can also be used as the photocatalytic decomposable substance in the present embodiment.
[0099]
b. Binder
The binder used in such a case, that is, a binder that does not particularly require a function of changing the wettability on the photocatalyst-containing layer by the action of the photocatalyst, has a high binding energy such that the main skeleton is not decomposed by the photoexcitation of the photocatalyst. It is not particularly limited as long as it has. Specific examples include polysiloxanes having no organic substituents or having some organic substituents, and these can be obtained by hydrolysis and polycondensation of tetramethoxysilane, tetraethoxysilane, and the like. .
[0100]
2. Second embodiment
In the second embodiment, the photocatalytic reaction-inhibiting substance-containing layer containing the above-described photocatalytic reaction-inhibiting substance is patterned on a substrate that does not affect the action of the photocatalyst, as the side having the effect of inhibiting or reducing the function of the photocatalyst. On the other hand, a photocatalyst-containing layer whose wettability changes by the action of a photocatalyst accompanying energy irradiation is used on the side where a pattern is formed.
[0101]
Such a pattern forming body in this embodiment is a substrate, a photocatalytic reaction inhibitor-containing layer containing a photocatalytic reaction inhibitor that is formed in a pattern on the substrate and inhibits or reduces the action of the photocatalyst, A photocatalytic reaction-inhibiting substance-containing layer is formed on a substrate formed in a pattern, and has a photocatalyst-containing layer whose surface wettability changes by energy irradiation.
[0102]
The “substrate” here is not particularly limited as long as it functions as a normal substrate, but generally, a substance that does not affect the action of the photocatalyst is used.
[0103]
In the present embodiment, the photocatalytic reaction-inhibiting substance-containing layer is formed in a pattern on a substrate that does not affect the action of the photocatalyst, and the photocatalytic reaction-inhibiting substance-containing layer is formed in a pattern. Since the photocatalyst-containing layer is formed on the substrate, the photocatalyst-containing layer that is in contact with the substrate has the photocatalyst functioning as a catalyst and changes the wettability during energy irradiation. The photocatalyst-containing layer that comes into contact with the photocatalyst does not sufficiently function as a catalyst even when irradiated with energy due to the effect of the photocatalytic reaction-inhibiting substance-containing layer, so that the wettability does not change. Therefore, in the present embodiment, even when the entire surface of the photocatalyst containing layer is irradiated with energy, the photocatalyst containing layer surface has a wettability along the pattern of the photocatalytic reaction inhibitor containing layer formed in a pattern. A pattern based on the difference can be formed. Furthermore, since there is no need to perform post-processing such as development and washing after the energy irradiation, a pattern-formed body can be obtained by a simple manufacturing method.
[0104]
Such a pattern forming body of the present embodiment will be described with reference to the drawings.
[0105]
FIG. 2 shows an example of the pattern forming body of the present embodiment. In FIG. 2, a substrate 21 that does not affect the action of the photocatalyst, and a photocatalytic reaction inhibitor-containing layer 22 that is formed on the base 21 in a pattern and contains a photocatalytic reaction inhibitor that inhibits or reduces the action of the photocatalyst It is shown. Further, the photocatalyst containing layer 3 is formed on the substrate 21 on which the photocatalytic reaction inhibitor containing layer 22 is formed in a pattern. Here, the portion of the photocatalyst containing layer 3 that is in contact with the substrate 21 does not hinder the action of the photocatalyst, and therefore, the lyophilic region in which the wettability has changed in the direction in which the contact angle with the liquid is reduced by energy irradiation. It becomes 5. On the other hand, in the photocatalyst containing layer 3 located on the photocatalytic reaction inhibitor containing layer 22, the action of the photocatalyst is inhibited due to the effect of the photocatalytic reaction inhibitor containing layer 22, so that the wettability does not change even when irradiated with energy. The liquid-repellent area 4 is obtained.
[0106]
In this embodiment, the photocatalytic reaction inhibitor-containing layer and the substrate will be described in detail. The photocatalyst-containing layer is the same as that described in the first embodiment described above, and the description thereof is omitted.
[0107]
(1) Photocatalytic reaction inhibitor-containing layer
The photocatalytic reaction-inhibiting substance-containing layer in the present embodiment means a layer containing at least a photocatalytic reaction-inhibiting substance, and has a function of inhibiting or reducing the function as a catalyst for a nearby photocatalyst. I have.
[0108]
Such a photocatalytic reaction inhibitor-containing layer has at least a binder and a photocatalytic reaction inhibitor. The material that can be used for the binder is not particularly limited as long as it can contain a photocatalytic reaction inhibitor, and specifically, the binder used for the above-described photocatalyst-containing layer and the resin And the like.
[0109]
Further, the photocatalytic reaction-inhibiting substance and the content thereof are the same as those described in "(1) Photocatalytic reaction-inhibiting substrate" of the first embodiment described above, and thus description thereof will be omitted.
[0110]
The thickness of such a photocatalytic reaction inhibitor-containing layer is in the range of 10 nm to 15 μm, and preferably in the range of 10 nm to 7 μm. When the film thickness is larger than the above range, the smoothness of the entire pattern formed body is impaired.On the other hand, when the film thickness is smaller than the above range, from the relationship with the concentration of the photocatalytic reaction inhibitor described above, This is because the effect of inhibiting or reducing the action of the photocatalyst cannot be sufficiently obtained.
[0111]
(2) Substrate
The substrate in the present embodiment is not particularly limited as long as it functions as a substrate, but is preferably a member that does not affect the action of the photocatalyst. Specific examples of the material forming such a substrate include quartz glass, non-alkali glass, metals such as aluminum and aluminum alloys, and plastics.
[0112]
Further, the pattern formed body of the present invention provides improved adhesion between the photocatalyst-containing layer and the substrate or between the photocatalytic reaction-inhibiting substance-containing layer and the photocatalyst-containing layer, improved surface roughness, and prevention of deterioration of the substrate due to the action of the photocatalyst. A primer layer may be formed on a substrate for the purpose. Examples of the primer layer include a resin having a siloxane structure as a main component, a fluorine resin, an epoxy resin, and a polyurethane resin.
[0113]
3. Third embodiment
Next, a third embodiment will be described. The third embodiment uses a photocatalytic reaction-inhibiting substance-containing substrate in which a portion containing the above-described photocatalytic reaction-inhibiting substance is present in a pattern as a side having an effect of inhibiting or reducing the function of the photocatalyst. In this embodiment, a photocatalyst-containing layer whose wettability changes due to the action of a photocatalyst accompanying energy irradiation is used as the side to be formed.
[0114]
Such a pattern forming body in the present embodiment includes a photocatalytic reaction inhibitor-containing substrate in which a portion containing a photocatalytic reaction inhibitor that inhibits or reduces the action of a photocatalyst is present in a pattern, A photocatalyst-containing layer which is formed on a substrate and whose surface wettability changes by energy irradiation.
[0115]
Note that the “photocatalytic reaction-inhibiting substance-containing substrate” here means that a region in which the above-described photocatalytic reaction-inhibiting substance is contained and a region not containing the photocatalytic reaction-inhibiting material are previously formed in the substrate, and Means a member that functions as a basic substrate. Therefore, when a photocatalyst-containing layer is formed on such a photocatalytic reaction-inhibiting substance-containing substrate, the action of the photocatalyst is inhibited or reduced inside the photocatalyst-containing layer along the pattern of the presence or absence of the photocatalytic reaction-inhibiting substance. And the unaffected areas are formed. By utilizing the effect of such a substrate containing a photocatalytic reaction inhibitor on a photocatalyst-containing layer, a pattern due to a difference in wettability can be formed on the surface of the photocatalyst-containing layer even when the entire surface is irradiated with energy. You can do it.
[0116]
The pattern forming body in the present embodiment will be described with reference to the drawings.
[0117]
FIG. 3 shows an example of the pattern forming body in the present embodiment. As shown in FIG. 3, a photocatalytic reaction inhibitor-containing base material 33 having a pattern of a region 31 containing the photocatalytic reaction inhibitor and a region 32 not containing the photocatalytic reaction inhibitor, The photocatalyst containing layer 3 formed thereon is shown. Here, due to the effect of the photocatalytic reaction-inhibiting substance-containing substrate 33, the photocatalyst-containing layer 3 has a portion located on the region 31 containing the photocatalytic-reaction-inhibiting substance. Therefore, the liquid repellent area 4 is obtained. On the other hand, the photocatalyst-containing layer 3 located on the region 32 not containing the photocatalytic reaction-inhibiting substance has a lyophilic region 5 in which wettability is changed in a direction in which the photocatalyst acts by energy irradiation and the contact angle with the liquid decreases. It becomes.
[0118]
As the material for forming the photocatalytic reaction-inhibiting substance-containing base material in the present embodiment, a region containing the photocatalytic reaction-inhibiting substance inside and a region not containing the photocatalytic reaction-inhibiting substance can be formed in a pattern. Is not particularly limited as long as it has self-supporting properties.
[0119]
The method for forming such a photocatalytic reaction-inhibiting substance-containing layer is not particularly limited as long as it is a method capable of forming a pattern with or without a photocatalytic reaction-inhibiting substance therein.
[0120]
4. Fourth embodiment
Next, a fourth embodiment will be described. The fourth embodiment uses a photocatalytic reaction-inhibiting base material as in the first embodiment described above as a side having an effect of inhibiting or reducing the function of the photocatalyst, while using energy irradiation as a side on which a pattern is formed. This is an embodiment using a characteristic change layer whose characteristics change by the action of the photocatalyst accompanying the above.
[0121]
Such a pattern forming body in the present embodiment has an action of inhibiting or reducing the action of a photocatalyst, and a photocatalytic reaction-inhibiting substrate containing a photocatalytic reaction-inhibiting substance, and A shielding layer formed in a pattern on the photocatalytic reaction-inhibiting base material in which the shielding layer is formed in a pattern, and a photocatalyst treatment layer comprising at least a photocatalyst; And a characteristic change layer whose characteristics change by the action of a photocatalyst accompanying energy irradiation.
[0122]
In this embodiment having such features, as in the first embodiment described above, a photocatalytic reaction-inhibiting substrate having a shielding layer formed in a pattern is used. By forming a photocatalyst treatment layer having at least a photocatalyst on such a photocatalyst reaction-inhibiting substrate, a region where the action of the photocatalyst is inhibited or reduced, and the influence of such a region is formed inside the photocatalyst treatment layer. There is no area. In this way, by forming a characteristic change layer in which the characteristics change due to the action of the photocatalyst accompanying energy irradiation, on the photocatalyst treatment layer in which the action of the photocatalyst is different due to the influence of the photocatalytic reaction inhibiting substrate, By irradiating the entire surface with energy, a pattern due to a difference in characteristics can be easily formed on the characteristic change layer without irradiating energy in a pattern.
[0123]
The pattern forming body in this embodiment will be described with reference to the drawings.
[0124]
FIG. 4 shows an example of the pattern forming body of the present embodiment. Further, as the characteristic change layer, those having various changes in characteristics can be considered. FIG. 4 shows a case where a decomposition removal layer which is decomposed and removed by the action of a photocatalyst accompanying energy irradiation is used as an example. I have.
[0125]
In FIG. 4, a shielding layer 2 is formed in a pattern on a photocatalytic reaction-inhibiting substrate 1 having a function of inhibiting or reducing the action of a photocatalyst. Further, a photocatalyst treatment layer 41 having at least a photocatalyst is formed on the entire surface of the photocatalytic reaction-inhibiting substrate 1 on which the shielding layer 2 is formed in a pattern. Further, on the photocatalyst treatment layer 41, a decomposition removal layer 42 decomposed and removed by the action of the photocatalyst accompanying the energy irradiation is formed in a pattern. The decomposition removal layer 42 located on the area where the shielding layer 2 is formed is not affected by the photocatalytic reaction inhibiting substrate 1 due to the effect of the shielding layer 2 and is decomposed and removed by energy irradiation. The decomposition removal layer 42 remains only on the portion where the layer 2 is not formed.
[0126]
The pattern forming body of the present embodiment is composed of a photocatalytic reaction-inhibiting substrate, a shielding layer, a photocatalyst treatment layer, and a property changing layer. Since it is the same as that described in the embodiment, the description here is omitted. Hereinafter, the characteristic change layer and the photocatalyst treatment layer will be described.
[0127]
(1) Characteristic change layer
The property change layer in the present embodiment may be any layer as long as the property changes by the action of a photocatalyst. For example, by using a polymer material such as polyolefin such as polyethylene and polypropylene, energy irradiation can be performed. A layer in which a polar group is introduced or the surface state is roughened by the action of the photocatalyst to improve the adhesion to various substances may be used as the characteristic change layer. By using the property change layer as the adhesive property change layer whose adhesive property changes in this manner, it becomes possible to form a pattern having good adhesive property along the pattern of the shielding layer by energy irradiation. A pattern forming body having a pattern of such a good adhesive property is, for example, when a functional portion in a functional element described later is metal, a metal component is deposited on such a pattern forming body, A metal thin film is formed, and then the metal thin film is peeled off using, for example, an adhesive or a chemical agent by utilizing the difference in adhesiveness, whereby a metal thin film pattern can be formed. According to this method, a metal thin film pattern can be formed without forming a resist pattern, and a printed circuit board, an electronic circuit element, and the like can be formed in a pattern more easily than by a printing method. it can.
[0128]
Further, in the present embodiment, such a property change layer may be formed by a dry method, that is, a vacuum deposition method or the like, or may be formed by a wet method such as a spin coating method or a dip coating method, or an inkjet method. It may be formed by a method such as a discharge method such as a nozzle or a dispenser.
[0129]
As described above, the property change layer is not particularly limited as long as it is a layer having various properties that are changed by the action of the photocatalyst. In the present embodiment, among others, the property change layer is changed in wettability by the action of the photocatalyst. Two cases are particularly obtained: a wettability changing layer in which a pattern due to wettability is formed, and a decomposition removal layer in which the characteristic change layer is decomposed and removed by the action of a photocatalyst to form a pattern by unevenness. This is preferable because the effectiveness of the present embodiment is derived more from the relationship between the functional elements and the like.
[0130]
(I) wettability changing layer
The wettability changing layer in the present embodiment is not particularly limited as long as it is a layer whose surface wettability changes by the action of the photocatalyst. Generally, however, the wettability changes by the action of the photocatalyst accompanying energy irradiation. The layer is preferably a layer whose wettability changes so that the contact angle with the liquid on the surface of the variable layer decreases.
[0131]
In this way, by making the wettability changing layer such that the wettability changes so that the contact angle with the liquid is reduced by the energy irradiation, the wettability can be easily changed along the pattern of the shielding layer only by the energy irradiation. After the energy irradiation, there is no need to perform post-processing such as development and washing, so that such labor can be omitted and the manufacturing process can be simplified. In addition, by attaching the functional part composition to the lyophilic region where the photocatalytic action does not affect the photocatalytic reaction-inhibiting substrate and the wettability is improved by the action of the photocatalyst, the functionality is easily provided. An element can be formed. Therefore, it is possible to efficiently and cost effectively manufacture the functional element.
[0132]
Regarding such a wettability changing layer, the wettability exhibited by the lyophilic region and the liquid repellent region, the binder constituting the wettability changing layer, other additives, and the like are described in the photocatalyst-containing layer of the first embodiment described above. In (i) When at least composed of a photocatalyst and a binder, the description is omitted here.
[0133]
Further, in the present embodiment, the thickness of the wettability changing layer is preferably in the range of 0.001 μm to 1 μm, particularly preferably 0.01 μm to 0, in view of the change rate of the wettability by the photocatalyst. .1 μm.
[0134]
In the present embodiment, by using the wettability changing layer of the components described above, the action of the photocatalyst in the photocatalyst treatment layer located on and in contact with the shielding layer causes the oxidation of the organic groups and additives that are a part of the components. By using an action such as decomposition or the like, the wettability can be changed to be lyophilic, and the photocatalyst does not function as a catalyst, so that a large difference can be caused in the wettability from a region where the wettability does not change. Therefore, by improving the receptivity (lyophilic property) and repellency (liquid repellency) with a coating liquid or the like that forms a functional portion described later, the pattern formed body has good quality and is advantageous in cost. Can be obtained.
[0135]
(Ii) Decomposition removal layer
Next, the decomposition removal layer will be described. As shown in FIG. 4, the portion of the decomposition removal layer 42 located on the region where the shielding layer 2 is formed is not affected by the photocatalytic reaction-inhibiting substrate 1 during energy irradiation, On the other hand, the portion located on the region where the shielding layer 2 is not formed is decomposed and removed by the action of the photocatalyst, which is inhibited or reduced by the influence of the photocatalytic reaction-inhibiting substrate 1. Survive.
[0136]
As described above, when the energy is applied to the decomposed / removed layer, the portion located on the shielding layer is decomposed and removed by the action of the photocatalyst. A pattern consisting of portions that do not exist, that is, a pattern having irregularities can be formed.
[0137]
In addition, since this decomposition removal layer is oxidized and decomposed by the action of a photocatalyst by energy irradiation and is vaporized, it is removed without a special post-treatment such as a development / washing step. Depending on the material, a washing step or the like may be performed.
[0138]
When this decomposition removal layer is used, it is possible not only to form irregularities, but also to form a pattern due to the difference in characteristics between the photocatalyst treatment layer exposed by decomposition removal and the decomposition removal layer. Examples of such properties include various properties such as adhesiveness and color developing properties.In the present embodiment, wettability can be mentioned, and a pattern can be formed by the difference in wettability. This is preferable from the viewpoint of effectiveness when the element is finally formed.
[0139]
That is, in the present embodiment, it is preferable that the decomposition removal layer and the photocatalyst treatment layer exposed by the decomposition removal of the decomposition removal layer have different contact angles with each other. For example, when a functional portion of a functional element described later is formed on the decomposition removal layer, the contact angle of the decomposition removal layer with the liquid is smaller than that of the photocatalyst treatment layer. Conversely, when a functional part is formed on an area where the decomposition removal layer is decomposed and removed and the photocatalyst treatment layer is exposed, the contact angle of the photocatalyst treatment layer with respect to the liquid is smaller than that of the decomposition removal layer. Become.
[0140]
The material that can be used for such a decomposition removal layer is a material that is decomposed and removed by the above-described properties of the decomposition removal layer, that is, a photocatalyst accompanying energy irradiation, and is preferably a liquid within the above range. Is a material having a contact angle of
[0141]
The method for forming the decomposition removal layer is not particularly limited, but a material such as described above is selected and diluted with an appropriate solvent to form a coating liquid, and a general coating method such as spin coating is used. A method of forming a film using a method can be given. It can be said that such a method of forming a thin film is an easy and cost-effective method. On the other hand, a functional thin film, that is, a self-assembled monomolecular film, a Langmuir-Brocket film, and an alternately adsorbing film can be formed by a film forming method. These methods are preferable because they enable formation of a dense and thin film with few defects.
[0142]
Here, the self-assembled monolayer, the Langmuir-Brocket film, and the alternating adsorption film used in the present embodiment will be specifically described.
[0143]
a. Self-assembled monolayer
Although the inventors do not know the existence of an official definition of a self-assembled monolayer (Self-Assembled @ Monolayer), a commentary on what is generally recognized as a self-assembled monolayer is, for example, a review by Abraham @ Ulman. “Formation and Structure of the Self-Assembled Monolayers”, Chemical Review, 96, 1533-1554 (1996) are excellent. With reference to this review, a self-assembled monolayer can be said to be a monolayer formed as a result of adsorption and binding (self-assembly) of appropriate molecules to an appropriate substrate surface. Materials capable of forming a self-assembled film include, for example, surfactant molecules such as fatty acids, organic silicon molecules such as alkyltrichlorosilanes and alkylalkoxides, organic sulfur molecules such as alkanethiols, and alkyl phosphates. Organic phosphoric acid molecule. A general commonality of molecular structures is that they have a relatively long alkyl chain, and a functional group that interacts with the substrate surface is present at one molecular end. The portion of the alkyl chain is a source of intermolecular force when the molecules are packed two-dimensionally. However, the example shown here is the simplest structure, having a functional group such as an amino group or a carboxyl group at the other end of the molecule, an alkylene chain having an oxyethylene chain, or a fluorocarbon chain. A self-assembled monolayer composed of various molecules, such as a complex-type chain, has been reported. There is also a composite self-assembled monolayer composed of a plurality of molecular species. Recently, a polymer having a plurality of functional groups (in some cases, one functional group) or a linear (in some cases having a branched structure) polymer in the form of particles, such as a dendrimer, has been developed. It seems that the one formed on the surface of the substrate (the latter is collectively referred to as a polymer brush) may be considered as a self-assembled monolayer. In the present embodiment, these are also included in the self-assembled monolayer.
[0144]
b. Langmuir-Blodgett membrane
The Langmuir-Blodgett (Film) used in the present embodiment is not significantly different from the above-described self-assembled monolayer as long as it is formed on a substrate. The characteristics of the Langmuir-Blodgett film can be said to be its formation method and the resulting high two-dimensional molecular packing properties (high orientation and high ordering). That is, in general, Langmuir-Blodgett film-forming molecules are first developed on the gas-liquid interface, and the developed film is condensed by the trough and changes into a highly packed condensed film. In practice, this is transferred to a suitable substrate and used. It is possible to form from a monomolecular film to a multilayer film of an arbitrary molecular layer by the method outlined here. In addition, not only low molecules but also polymers, colloid particles, etc. can be used as the film material. A recent example of the application of various materials is described in detail in a review by Tokuharu Miyashita et al., "Prospects for Nanotechnology for Creating Soft Nanodevices", {Polymer} 50, September, 644-647 (2001).
[0145]
c. Alternate adsorption film
An alternating adsorption film (Layer-by-Layer @ Self-Assembled @ Film) is generally formed by sequentially adsorbing and bonding at least two materials having a functional group having a positive or negative charge onto a substrate. This is a film formed by stacking. Since a material having a larger number of functional groups has more advantages such as an increase in the strength and durability of the membrane, an ionic polymer (polymer electrolyte) is often used recently as a material. Particles having a surface charge such as proteins, metals and oxides, so-called "colloidal particles" are also frequently used as film-forming substances. More recently, membranes have been reported that actively utilize weaker interactions than ionic bonds, such as hydrogen bonds, coordinate bonds, and hydrophobic interactions. In the case of a relatively recent alternately adsorbed film, although slightly biased toward a material system using electrostatic interaction as a driving force, Paula @ T. Review by Hammond, "Recent \ Explorations \ in \ Electrostatic \ Multilayer \ Thin \ Film \ Assembly" \ Current \ Opinion \ in \ Colloid & Interface \ Science, \ 4, \ 4, 2000, 4-30. In the alternate adsorption film, taking the simplest process as an example, the cycle of adsorption-washing of a material having a positive (negative) charge-adsorption-washing of a material having a negative (positive) charge is repeated a predetermined number of times. It is a film to be formed. No development-condensation-transfer operation is required at all like a Langmuir-Blodgett membrane. Further, as is apparent from the difference between these production methods, the alternating adsorption film generally does not have a two-dimensional high orientation and high order unlike the Langmuir-Blodgett film. However, the alternate adsorption film and its manufacturing method have advantages over conventional film forming methods, such as being able to easily form a dense film without defects and being able to uniformly form a film on a fine uneven surface, a tube inner surface, a spherical surface, and the like. Have many.
[0146]
In addition, the thickness of the decomposition removal layer is not particularly limited as long as it is a thickness that can be decomposed and removed by irradiation energy. The specific film thickness varies greatly depending on the type of energy to be irradiated, the material of the decomposition removal layer, and the like, but is generally in the range of 0.001 μm to 1 μm, particularly 0.01 μm to 0.1 μm. It is preferable that the thickness be in the range of 1 μm.
[0147]
(2) Photocatalyst treatment layer
The photocatalyst treatment layer used in the present embodiment is not particularly limited as long as the photocatalyst in the photocatalyst treatment layer changes the characteristics of the target property change layer. It may be configured, or may be formed by a single photocatalyst.
[0148]
The photocatalyst used for such a photocatalyst treatment layer is the same as that described in “(3) Photocatalyst containing layer” in the first embodiment described above. Therefore, the description here is omitted.
[0149]
In the photocatalyst treatment layer according to the present embodiment, in the case of a photocatalyst treatment layer comprising only a photocatalyst, the efficiency of changing the characteristics of the characteristic change layer is improved, which is advantageous in terms of cost such as reduction in processing time. On the other hand, the photocatalyst treatment layer including the photocatalyst and the binder has an advantage that the photocatalyst treatment layer can be easily formed.
[0150]
Examples of the method for forming the photocatalyst treatment layer composed of only the photocatalyst include a method using a vacuum film forming method such as a sputtering method, a CVD method, and a vacuum evaporation method. By forming the photocatalyst treatment layer by the vacuum film formation method, it is possible to form a uniform film and a photocatalyst treatment layer containing only the photocatalyst, thereby quickly changing the characteristics of the characteristic change layer. .
[0151]
The thickness of such a photocatalyst treatment layer is preferably in the range of 30 nm to 500 nm. If the film thickness is smaller than the above range, it is difficult to form a uniform film, and it is not preferable because the action of the photocatalyst cannot be uniformly exerted on the property changing layer. On the other hand, when the film thickness is larger than the above range, the action of the photocatalytic reaction-inhibiting substrate or the layer containing the photocatalytic reaction-inhibiting substance located below the photocatalyst-treated layer causes the entire portion of the photocatalyst-treated layer in contact with them. As a result, a clear pattern may not be formed in the characteristic change layer, which is not preferable.
[0152]
When the photocatalyst-treated layer is composed of at least a photocatalyst and a binder, it is the same as “(3) Photocatalyst-containing layer (i) composed of at least a photocatalyst and a binder” in the first embodiment described above, and the description is omitted here. I do.
[0153]
5. Fifth embodiment
Next, a fifth embodiment will be described. In the fifth embodiment, the photocatalytic reaction-inhibiting substance-containing layer containing the above-described photocatalytic reaction-inhibiting substance is patterned on a substrate that does not affect the action of the photocatalyst, as the side having the effect of inhibiting or reducing the function of the photocatalyst. This is an embodiment in which a formed layer is used, and on the other hand, a characteristic changing layer whose characteristics are changed by the action of a photocatalyst accompanying energy irradiation is used as a side on which a pattern is formed.
[0154]
The pattern forming body in this embodiment is a substrate, a photocatalytic reaction inhibitor-containing layer having a photocatalytic reaction inhibitor that is formed in a pattern on the substrate and inhibits or reduces the action of a photocatalyst, A reaction-inhibiting substance-containing layer is formed on the substrate in a pattern, and a photocatalyst treatment layer composed of at least a photocatalyst, and a film is formed on the photocatalyst treatment layer, and the characteristics are formed by the action of the photocatalyst accompanying energy irradiation. And a characteristic changing layer that changes.
[0155]
The pattern forming body of the fifth embodiment having such features will be described with reference to the drawings.
[0156]
FIG. 5 shows an example of the pattern forming body of the present embodiment. Further, a case is shown in which a decomposition removal layer that is decomposed and removed by the action of a photocatalyst accompanying energy irradiation is used as the characteristic change layer.
[0157]
In FIG. 5, a photocatalytic reaction inhibiting substance-containing layer 22 containing a photocatalytic reaction inhibiting substance having a function of inhibiting or reducing the action of the photocatalyst is formed in a pattern on a substrate 21 which does not affect the action of the photocatalyst. I have. Further, a photocatalyst treatment layer 41 made of at least a photocatalyst is formed so as to cover the photocatalyst reaction inhibitor-containing layer 22 and the substrate 21, and a decomposition removal layer 42 is formed on the photocatalyst treatment layer 41 in a pattern. . The decomposition / removal layer 42 located on the region where the photocatalytic reaction inhibitor-containing layer 22 is not formed does not hinder the action of the photocatalyst during energy irradiation. As a result, the decomposition removal layer 42 is formed in a pattern so as to remain only on the photocatalytic reaction inhibitor-containing layer 22.
[0158]
In the present embodiment, a photocatalytic reaction inhibitor-containing layer having a function of inhibiting or reducing the action of the photocatalyst is formed in a pattern on a substrate that does not affect the action of the photocatalyst. In the property change layer located on the region where the containing layer is not formed, the property is changed by the action of the photocatalyst contained in the photocatalyst treatment layer during energy irradiation. On the other hand, the characteristic change layer located on the region where the photocatalytic reaction inhibitor-containing layer is formed inhibits the action of the photocatalyst contained in the photocatalyst treatment layer due to the effect of the photocatalytic reaction inhibitor-containing layer during energy irradiation. Alternatively, the characteristics do not change due to the decrease. This makes it possible to easily form a pattern due to a difference in characteristics on the surface of the characteristic change layer by irradiating the entire surface without irradiating energy in a pattern by a method such as through a photomask.
[0159]
The photocatalytic reaction-inhibiting substance-containing layer, the photocatalyst-treated layer, and the property change layer which constitute the present embodiment having such advantages are the same as those described above, and thus description thereof will be omitted.
[0160]
6. Sixth embodiment
Next, a sixth embodiment will be described. The sixth embodiment uses a photocatalytic reaction-inhibiting substance-containing substrate in which a portion containing the above-described photocatalytic reaction-inhibiting substance is present in a pattern as a side having an effect of inhibiting or reducing the function of the photocatalyst. In this embodiment, a characteristic change layer whose characteristics are changed by the action of a photocatalyst accompanying energy irradiation is used as the side to be formed.
[0161]
Such a pattern forming body in the present embodiment comprises a photocatalytic reaction inhibitor-containing substrate in which a portion containing a photocatalytic reaction inhibitor having an action of inhibiting or reducing the action of a photocatalyst is present in a pattern, A film formed on the inhibitor-containing base material, a photocatalyst treatment layer composed of at least a photocatalyst, and a film formed on the photocatalyst treatment layer, having a characteristic change layer whose characteristics are changed by the action of the photocatalyst accompanying energy irradiation. It is a feature.
[0162]
This embodiment having such features will be described with reference to the drawings.
[0163]
FIG. 6 shows an example of the pattern forming body of the present embodiment. Also, the case where the characteristic change layer is a decomposition removal layer that is decomposed and removed by the action of a photocatalyst accompanying energy irradiation is illustrated.
[0164]
As shown in FIG. 6, a pattern comprising a region 31 containing the photocatalytic reaction inhibitor and a region 32 not containing the photocatalytic reaction inhibitor is formed on the photocatalytic reaction inhibitor-containing base material 33. Further, a photocatalyst treatment layer 41 made of at least a photocatalyst is formed on the photocatalyst reaction inhibitor-containing base material 33, and further, on the photocatalyst treatment layer 41, a pattern of the photocatalyst reaction inhibitor substance-containing layer 33 is formed. Along the line, a decomposition removal layer 42 is formed in a pattern. The decomposition removal layer 42 located on the region 32 not containing the photocatalytic reaction inhibitor is decomposed and removed by the photocatalyst contained in the photocatalyst treatment layer 41 functioning as a catalyst during energy irradiation. Therefore, the decomposition removal layer 42 is formed in a pattern so as to remain only on the region 31 containing the photocatalytic reaction inhibitor.
[0165]
In such a pattern forming body of the present embodiment, since a pattern comprising a region containing a photocatalytic reaction inhibitor and a region not containing the photocatalytic reaction inhibitor is formed in the photocatalytic reaction inhibitor-containing layer itself, The characteristic change layer located on the region containing the photocatalytic reaction inhibitor does not change its characteristics because the photocatalyst contained in the photocatalyst treatment layer does not act even when energy is irradiated. On the other hand, the characteristics of the property change layer located on the region not containing the photocatalytic reaction inhibitor change because the photocatalyst contained in the photocatalyst treatment layer acts by energy irradiation.
[0166]
Therefore, a pattern due to a difference in characteristics can be easily formed on the surface of the characteristic change layer by simply irradiating energy to the entire surface without irradiating energy in a pattern by a method such as through a photomask. . Further, by using the above-described characteristic change layer, it is not necessary to perform post-processing such as development and cleaning after the energy irradiation, so that the manufacturing process can be simplified.
[0167]
The photocatalytic reaction-inhibiting substance-containing base material and the property change layer constituting the pattern forming body of the present embodiment are the same as those described in the third embodiment and the fourth embodiment, and therefore description thereof is omitted here. I do.
[0168]
II. Method for manufacturing pattern-formed body
Next, a method for manufacturing the pattern forming body will be described.
[0169]
As in the case of the pattern forming body, the manufacturing method of the pattern forming body of the present embodiment has a plurality of modes depending on the combination of the side having the effect of inhibiting or reducing the function of the photocatalyst and the side on which the pattern is formed. Among them, when the photocatalytic reaction-inhibiting substrate is used and the photocatalytic reaction-inhibiting substance-containing layer is used as the side that exerts the action of inhibiting or reducing the function of the photocatalyst, further, the photocatalyst-containing layer and The case where the characteristic change layer is used will be described.
[0170]
1. Seventh embodiment
The seventh embodiment relates to a method for producing a pattern-formed body in a mode in which a photocatalytic reaction-inhibiting substrate is used as a side that exerts an action of inhibiting or reducing the function of a photocatalyst, and a photocatalyst-containing layer is used as a side on which a pattern is formed. It is an aspect.
[0171]
The method for producing a pattern forming body in this embodiment has a function of inhibiting or reducing the action of the photocatalyst, and is formed in such a manner that it is shielded in a pattern on a photocatalytic reaction-inhibiting substrate containing a photocatalytic reaction-inhibiting substance. A shielding layer forming step of forming a layer, and a photocatalyst containing layer forming step of forming a photocatalyst containing layer whose wettability changes by energy irradiation on the photocatalytic reaction inhibiting substrate on which the shielding layer is formed in a pattern. And a patterning step of irradiating the surface of the photocatalyst-containing layer with energy and forming a pattern on the photocatalyst-containing layer due to a difference in wettability.
[0172]
An example of such an embodiment will be described with reference to the drawings.
[0173]
FIG. 7 shows an example of a manufacturing method according to the present embodiment. First, as shown in FIG. 7A, a shielding layer 2 is formed in a pattern on a photocatalytic reaction-inhibiting substrate 1 having an action of inhibiting or reducing the action of a photocatalyst. As a result, a pattern is formed on the photocatalytic reaction-inhibiting substrate 1, in which a photocatalyst-containing layer to be formed later is formed of a region that inhibits the action of the photocatalyst and a region that does not affect the action of the photocatalyst. .
[0174]
Next, as shown in FIG. 7B, a photocatalyst-containing layer 3 is formed on the photocatalytic reaction-inhibiting substrate 1 on which the shielding layer 2 is formed in a pattern. Further, as shown in FIG. 7C, the entire surface of the photocatalyst containing layer 3 is irradiated with energy. At the time of this energy irradiation, the photocatalyst-containing layer 3 located on the region where the shielding layer 2 is formed is not affected by the photocatalytic reaction-inhibiting substrate 1, so that the contact angle with the liquid is reduced by the action of the photocatalyst. The wettability changes in the decreasing direction, and the lyophilic region 5 is formed as shown in FIG. On the other hand, the photocatalyst-containing layer 3 in a portion where the shielding layer 2 is not formed and which is in contact with the photocatalytic reaction-inhibiting substrate 1 is wet due to the influence of the photocatalytic reaction-inhibiting substrate 1 even when irradiated with energy. Since the property does not change, the liquid repellent area 4 is obtained.
[0175]
In the method for manufacturing a pattern-formed body according to the present embodiment, since the shielding layer is formed in a pattern on the photocatalytic reaction-inhibiting substrate, the action of the photocatalyst is inhibited along the pattern of the shielding layer. Alternatively, a pattern composed of a region to be reduced and a region not affected by such a reduction is formed. Therefore, by forming a photocatalyst containing layer on such a photocatalytic reaction inhibiting substrate, it is possible to pattern the photocatalyst containing layer using this pattern. That is, even when the entire surface is irradiated with energy, a pattern due to a difference in wettability can be formed on the surface of the photocatalyst-containing layer. Further, there is no need to perform post-processing such as development and washing after the energy irradiation, and the manufacturing process can be simplified.
[0176]
The method for manufacturing the pattern forming body in this embodiment having such advantages will be described for each step.
[0177]
(1) Shielding layer forming step
The shielding layer forming step in the present embodiment means that, on a photocatalytic reaction-inhibiting substrate having an effect of inhibiting or reducing the effect of the photocatalyst, such an effect of the photocatalytic reaction-inhibiting substrate is formed by forming a photocatalyst that is later formed into a film. This is a step of forming a shielding layer in a pattern so as to prevent the shielding layer from reaching the containing layer.
[0178]
In this step, by forming the shielding layer in a pattern on the photocatalytic reaction-inhibiting substrate, the region where the shielding layer is formed has an effect of the photocatalytic reaction-inhibiting substrate on the photocatalyst-containing layer to be formed later. On the other hand, in a region where the shielding layer is not formed, the action of the photocatalytic reaction-inhibiting substrate affects the photocatalyst-containing layer.
[0179]
The method for patterning the shielding layer formed in a pattern in this step is not particularly limited as long as the method can form a high-definition pattern. Specifically, an evaporation method using a mask, a photolithography method, and the like can be given.
[0180]
In addition, the material for forming the shielding layer and the like, and the photocatalytic reaction-inhibiting substrate are the same as those described in the first embodiment, and thus description thereof will be omitted.
[0181]
(2) Photocatalyst containing layer forming step
Next, the photocatalyst containing layer forming step in the present embodiment will be described. In this step, a photocatalyst-containing layer whose wettability is changed by the action of a photocatalyst accompanying energy irradiation is formed on the photocatalytic reaction-inhibiting substrate on which the shielding layer is formed in a pattern by the above-described shielding layer forming step. It is a process.
[0182]
In this step, since the photocatalyst-containing layer is formed on the photocatalytic reaction-inhibiting substrate in which the shielding layer is formed in a pattern, the pattern affects the inside of the photocatalyst-containing layer. That is, the photocatalyst-containing layer located on the shielding layer is not affected by the photocatalytic reaction-inhibiting substrate, so that the function of the photocatalyst contained in the photocatalyst-containing layer is not impaired. On the other hand, the portion that is in contact with the photocatalytic reaction-inhibiting substrate is affected by the photocatalytic reaction-inhibiting substrate, so that even when irradiated with energy in the patterning step described below, the photocatalyst does not function sufficiently as a catalyst. The wettability of the photocatalyst containing layer does not change.
[0183]
As a method for forming such a photocatalyst-containing layer, when the photocatalyst-containing layer is composed of at least a photocatalyst and a binder, and when the organopolysiloxane is used as a binder as described above, the photocatalyst-containing layer is composed of a photocatalyst and an organo that is a binder. Polysiloxane can be dispersed in a solvent together with other additives, if necessary, to prepare a coating solution, and this coating solution can be applied to a photocatalytic reaction-inhibiting substrate to form a coating solution. As a solvent to be used, an alcoholic organic solvent such as ethanol and isopropanol, and water are preferable. The coating can be performed by a known coating method such as spin coating, spray coating, dip coating, roll coating, and bead coating. When an ultraviolet-curable component is contained as a binder, the photocatalyst-containing layer can be formed by performing a curing treatment by irradiating ultraviolet rays.
[0184]
On the other hand, in the method of forming a photocatalyst-containing layer when the photocatalyst-containing layer is composed of at least a photocatalyst and a photocatalyst decomposable substance, similarly, a photocatalyst, a binder and a photocatalyst decomposable substance are dispersed in a solvent to prepare a coating solution, It can be formed by the known coating method described above. Further, as the solvent used in this case, the above-mentioned alcohol-based organic solvents such as ethanol and isopropanol, water, and the like can also be used.
[0185]
Further, in the present embodiment, by performing this step while performing the heat treatment, the photocatalyst containing layer formed on the photocatalytic reaction inhibiting substrate by the above-described forming method, the photocatalytic reaction inhibiting substrate It can be sufficiently fixed and fixed, and because the photocatalytic reaction inhibiting substance contained in the photocatalytic reaction inhibiting substrate can be sufficiently diffused into the photocatalyst containing layer according to the pattern of the shielding layer, In the patterning step, the pattern due to the difference in wettability can be more clearly formed on the photocatalyst-containing layer. The temperature in such a heat treatment is not particularly limited as long as it is a temperature capable of diffusing the photocatalytic reaction-inhibiting substance into the photocatalyst-containing layer, and specifically, in the range of 100 ° C to 800 ° C. Especially, it is preferable that it is in the range of 150 ° C to 500 ° C.
[0186]
The other aspects relating to the photocatalyst-containing layer are the same as those described in the first embodiment, and thus description thereof will be omitted.
[0187]
(3) Patterning process
Next, the patterning step in the present embodiment will be described. In this step, the photocatalyst-containing layer formed on the photocatalytic reaction-inhibiting substrate on which the shielding layer is formed in a pattern is irradiated with energy to form a pattern due to the difference in wettability. is there.
[0188]
Usually, when a pattern is formed, patterning is often performed by irradiating energy in a pattern by a method using a photomask or electron beam drawing. However, in this embodiment, by forming a photocatalyst-containing layer on a photocatalytic reaction-inhibiting substrate on which a pattern that affects the action of the photocatalyst is formed in advance, the pattern of the photocatalytic reaction-inhibiting layer is formed. Since the influence is exerted on the photocatalyst containing layer, patterning using this pattern is possible. Therefore, a pattern due to a difference in wettability can be formed on the photocatalyst-containing layer along the pattern of the shielding layer without irradiating energy in a pattern.
[0189]
In the present embodiment, the method is not limited to the method of irradiating energy to the entire surface, but may be the case of irradiating energy in a pattern. For example, by a method of irradiating a pattern of energy such as through a photomask, a clearer pattern can be formed by both the effect of the pattern formed by the shielding layer and the effect of the photomask. Can be formed.
[0190]
The wavelength of light used in such a patterning step is set in a range of 400 nm or less, preferably in a range of 380 nm or less. This is because the preferable photocatalyst used for the photocatalyst-containing layer is titanium dioxide as described above, and light having the above-mentioned wavelength is preferable as the energy for activating the photocatalysis by the titanium dioxide.
[0191]
Examples of the light source that can be used as such energy include a mercury lamp, a metal halide lamp, a xenon lamp, an excimer lamp, and various other light sources.
[0192]
The energy irradiation amount is an irradiation amount necessary for changing the wettability and characteristics of the photocatalyst-containing layer and the property changing layer.
[0193]
2. Eighth embodiment
Next, an eighth embodiment will be described. In the eighth embodiment, as a side having an effect of inhibiting or reducing the function of a photocatalyst, a photocatalytic reaction inhibitor-containing layer containing the above-described photocatalytic reaction inhibitor is formed in a pattern on a substrate that does not affect the action of the photocatalyst. This is an aspect relating to a method for producing a pattern-formed body in the case where a photocatalyst-containing layer whose wettability changes by the action of a photocatalyst accompanying energy irradiation is used as the side on which a pattern is formed, on the other hand, on the side on which a pattern is formed.
[0194]
According to the method for manufacturing a pattern forming body in the eighth embodiment, a photocatalytic reaction inhibitor-containing layer containing a photocatalytic reaction inhibitor having an action of inhibiting or reducing the action of a photocatalyst is formed in a pattern on a substrate. A photocatalytic reaction inhibitor-containing layer forming step, and a photocatalyst-containing layer forming step of forming a photocatalyst-containing layer whose wettability changes by energy irradiation on the substrate on which the photocatalytic reaction inhibitor-containing layer is formed in a pattern. A patterning step of irradiating the surface of the photocatalyst-containing layer with energy and forming a pattern on the photocatalyst-containing layer due to a difference in wettability.
[0195]
A method for manufacturing a pattern forming body according to this embodiment will be described with reference to the drawings.
[0196]
FIG. 8 shows a method for manufacturing a pattern forming body in the present embodiment. First, as shown in FIG. 8A, a photocatalytic reaction inhibiting substance-containing layer 22 containing a photocatalytic reaction inhibiting substance having a function of inhibiting or reducing the action of the photocatalyst is provided on a substrate 21 which does not affect the action of the photocatalyst. Are formed in a pattern. As a result, a pattern is formed on the base 21 that includes a region that affects the action of the photocatalyst and a region that does not.
[0197]
Further, as shown in FIG. 8B, the photocatalyst containing layer 3 is formed on the substrate 21 on which the photocatalytic reaction inhibitor containing layer 22 is formed in a pattern.
[0198]
Next, as shown in FIG. 8C, when the entire surface of the photocatalyst containing layer 3 is irradiated with energy, the photocatalyst containing layer 3 located on the photocatalytic reaction inhibitor containing layer 22 is contained in the photocatalyst containing layer 3. The action of the existing photocatalyst is inhibited by the effect of the photocatalytic reaction inhibitor-containing layer 22, and the wettability does not change, and the liquid repellent region 4 is formed as shown in FIG. On the other hand, the photocatalyst-containing layer 3 in a region where the photocatalytic reaction-inhibiting substance-containing layer 22 is not formed and in contact with the substrate 21 has wettability in the direction in which the contact angle with the liquid is reduced by the action of the photocatalyst. Change to form a lyophilic region 5.
[0199]
In the present embodiment, since the photocatalytic reaction-inhibiting substance-containing layer is formed in a pattern on the substrate and the photocatalyst-containing layer is formed on such a substrate, pattern irradiation is performed by a method such as through a photomask. At least, by simply irradiating the entire surface with energy, a pattern due to a difference in wettability can be easily formed on the photocatalyst-containing layer.
[0200]
In addition, since the photocatalyst-containing layer can change the wettability by irradiating energy, it is not necessary to perform post-processing such as development and washing after irradiating energy, so that the manufacturing process can be simplified.
[0201]
A method for manufacturing a pattern forming body according to this embodiment having such advantages will be described. Note that the photocatalyst-containing layer forming step and the patterning step in this embodiment are the same as those described in the above-described seventh embodiment, and thus description thereof will be omitted. Hereinafter, the photocatalytic reaction inhibitor-containing layer forming step will be described.
[0202]
(Step of forming photocatalytic reaction inhibitor-containing layer)
In the present embodiment, the step of forming a photocatalytic reaction inhibitor-containing layer includes, on a substrate that does not affect the action of the photocatalyst, at least a photocatalytic reaction inhibitor having an action of inhibiting or reducing the action of the photocatalyst. This is a step of forming the containing layer in a pattern.
[0203]
In this step, the method for forming the photocatalytic reaction-inhibiting substance-containing layer is not particularly limited as long as it enables high-definition patterning. Specifically, an evaporation method using a mask, a photolithography method, and the like can be given.
[0204]
3. Ninth embodiment
Next, a ninth embodiment will be described. The ninth embodiment uses the above-described photocatalytic reaction-inhibiting substrate as a side that exerts an effect of inhibiting or reducing the function of the photocatalyst, while using a photocatalyst effect accompanying energy irradiation as a side on which a pattern is formed. This is an embodiment relating to a method for manufacturing a pattern-formed body in the case of using a characteristic change layer in which the characteristic changes.
[0205]
The method for producing a pattern-formed body according to the ninth embodiment has a function of inhibiting or reducing the action of a photocatalyst, and is patterned on a photocatalytic reaction-inhibiting substrate containing a photocatalytic reaction-inhibiting substance. A shielding layer forming step of forming a shielding layer, and a photocatalyst processing layer forming step of forming a photocatalyst processing layer composed of at least a photocatalyst on the photocatalytic reaction-inhibiting substrate on which the shielding layer is formed in a pattern. On the photocatalyst treatment layer, a property change layer forming step of forming a property change layer in which properties change due to the action of the photocatalyst accompanying energy irradiation, and irradiating energy to the surface of the property change layer to apply a property to the property change layer. And a patterning step of forming a pattern by the change.
[0206]
The pattern forming body in this embodiment will be described with reference to the drawings.
[0207]
FIG. 9 shows an example of a method for manufacturing a pattern forming body according to the ninth embodiment. FIG. 9 shows an example in which a decomposition removal layer is used as the characteristic change layer.
[0208]
First, as shown in FIG. 9A, the action of the photocatalytic reaction-inhibiting substrate 1 is later formed on the photocatalytic reaction-inhibiting substrate 1 which is a substrate having a function of inhibiting or reducing the action of the photocatalyst. A shielding layer 2 for preventing the property change layer to be formed is formed in a pattern.
[0209]
Next, as shown in FIG. 9B, a photocatalyst treatment layer 41 composed of at least a photocatalyst is formed on the photocatalytic reaction-inhibiting substrate 1 on which the shielding layer 2 is formed in a pattern.
[0210]
Further, as shown in FIG. 9C, a decomposition removal layer 42 which is decomposed and removed by the action of the photocatalyst accompanying the energy irradiation is formed on the photocatalyst treatment layer 41.
[0211]
Next, as shown in FIG. 9D, the entire surface of the characteristic change layer 42 is irradiated with energy. At the time of this energy irradiation, the photocatalyst treatment layer 41 under the portion located on the shielding layer 2 is decomposed and removed by the action of the photocatalyst because the photocatalyst treatment layer 41 thereunder is not affected by the photocatalytic reaction inhibiting substrate 1. You. On the other hand, the decomposition / removal layer 42 located on the area where the shielding layer 2 is not formed has a photocatalytic treatment layer 41 formed thereunder. Since they are inhibited or reduced, they remain without being decomposed and removed (see FIG. 9E).
[0212]
As described above, in this embodiment, by forming the shielding layer on the photocatalytic reaction-inhibiting substrate, a pattern consisting of a region that affects the action of the photocatalyst and a region that does not affect the photocatalyst is previously formed. Since it is formed of a material, when patterning a characteristic change layer, for example, a decomposition removal layer as shown in FIG.
[0213]
Such a manufacturing method of the present embodiment will be described for each step. Since the shielding layer forming step is the same as that described in the seventh embodiment, the description is omitted here.
[0214]
(1) Photocatalyst treatment layer forming step
The photocatalyst treatment layer forming step in this embodiment is a step of forming a photocatalyst treatment layer composed of at least a photocatalyst on a photocatalytic reaction-inhibiting substrate on which a shielding layer is formed in a pattern.
[0215]
Also, in this embodiment, similarly to the photocatalyst-containing layer forming step in the above-described seventh embodiment, by performing this step while performing a heat treatment, the photocatalytic reaction inhibition contained in the photocatalytic reaction-inhibiting substrate is suppressed. Since the substance is sufficiently diffused into the photocatalyst treatment layer according to the pattern of the shielding layer, a pattern with a more distinctive characteristic difference can be formed in the characteristic change layer in the patterning step described later. Since the heat treatment is the same as that described in the seventh embodiment, the description thereof is omitted.
[0216]
The photocatalyst treatment layer formed in this step is a layer provided to exert the action of the photocatalyst on the property change layer in which the properties change due to the action of the photocatalyst accompanying energy irradiation. Such a photocatalyst-treated layer only needs to contain at least a photocatalyst, and such a photocatalyst-treated layer is the same as that described in the above-described fourth embodiment, and a description thereof will be omitted. .
[0219]
(2) Characteristic change layer forming step
Next, the characteristic change layer forming step will be described. The characteristic change layer forming step in the present embodiment is a step of forming a characteristic change layer whose characteristics change by the action of a photocatalyst accompanying energy irradiation on the photocatalyst processing layer formed in the above-described photocatalyst processing layer forming step. .
[0218]
The characteristic change layer formed in this step is the same as that described in the fourth embodiment, and the description is omitted here.
[0219]
(3) Patterning process
The patterning step in the present embodiment is a step of irradiating the property change layer with energy to form a pattern on the property change layer due to a difference in properties.
[0220]
When irradiating energy in this step, it is general to pattern the characteristic change layer by irradiating the energy with a pattern, but in the present embodiment, the characteristic change layer is formed in advance of a photocatalyst. Since the film is formed on the photocatalytic reaction-inhibiting substrate on which the pattern consisting of the region affecting the action and the region having no effect is formed, the characteristic change layer is patterned without performing such pattern irradiation. You can do it. Note that, as described above, the present embodiment is not limited to the method of irradiating energy to the entire surface, and may be a case of irradiating energy in a pattern. Thereby, a more accurate pattern can be formed.
[0221]
4. Tenth embodiment
Finally, a tenth embodiment will be described. The tenth embodiment has a photocatalytic reaction inhibitor-containing layer containing the above-described photocatalytic reaction inhibitor as a side having an effect of inhibiting or reducing the function of the photocatalyst in a pattern on a substrate that does not affect the action of the photocatalyst. This is a method for producing a pattern-formed body in the case where a formed layer is used and, on the other hand, a characteristic change layer whose characteristics are changed by the action of a photocatalyst accompanying energy irradiation is used as a pattern-formed side.
[0222]
Such a tenth embodiment includes a step of forming a photocatalytic reaction inhibitor-containing layer containing a photocatalytic reaction inhibitor having an action of inhibiting or reducing the action of a photocatalyst on a substrate in a pattern, Forming a photocatalyst treatment layer comprising at least a photocatalyst on the substrate having a photocatalytic reaction-inhibiting substance-containing layer formed in a shape, and changing the characteristics on the photocatalyst treatment layer by the action of the photocatalyst accompanying energy irradiation. Forming a characteristic-change layer, and irradiating the surface of the characteristic-change layer with energy to form a pattern on the characteristic-change layer due to a difference in characteristics.
[0223]
The tenth embodiment will be described with reference to the drawings.
[0224]
FIG. 10 shows an example of a method for manufacturing a pattern forming body in the present embodiment, and shows a case where a decomposition removal layer is used as a characteristic change layer.
[0225]
First, as shown in FIG. 10A, a photocatalytic reaction inhibitor-containing layer containing at least a photocatalytic reaction inhibitor having a function of inhibiting or reducing the action of the photocatalyst on a substrate 21 that does not affect the action of the photocatalyst. 22 are formed in a pattern.
[0226]
Next, as shown in FIG. 10B, a photocatalyst processing layer 41 made of at least a photocatalyst is formed on the substrate 21 on which the photocatalytic reaction inhibitor-containing layer 22 is formed in a pattern. Further, as shown in FIG. 10C, a decomposition removal layer 42 which is decomposed and removed by energy irradiation is formed on the photocatalyst treatment layer 41.
[0227]
Next, as shown in FIG. 10D, the entire surface of the decomposition removal layer 42 is irradiated with energy. At the time of this energy irradiation, the portion of the property change layer 42 located on the photocatalytic reaction inhibitor-containing layer 22 inhibits the action of the photocatalyst contained in the photocatalyst treatment layer 41 due to the influence of the photocatalytic reaction inhibitor-containing layer 22 or Since it is lowered, it remains without being decomposed and removed (see FIG. 10E). On the other hand, the decomposition removal layer 42 located on the region where the photocatalytic reaction inhibitor-containing layer 22 is not formed is decomposed and removed by the photocatalyst of the photocatalyst treatment layer 41 thereunder. Therefore, even when the entire surface is irradiated with energy without passing through a photomask or the like, in the present embodiment, the decomposition removal layer can be formed in a pattern.
[0228]
In addition, since each step in this embodiment is the same as that described in each of the above-described embodiments, description thereof will be omitted.
[0229]
III. Functional element
Various functional elements can be obtained by attaching the composition for forming a functional part along the pattern of the pattern forming body described above.
[0230]
Such a functional element is characterized in that a functional portion is formed along the pattern of the pattern forming body described above.
[0231]
Here, the functionalities include optical (light selective absorption, reflectivity, polarization, light selective transmittance, nonlinear optical properties, luminescence such as fluorescence or phosphorescence, photochromic properties, etc.) and magnetic (hard magnetic, soft magnetic) , Non-magnetic, magnetic permeability, etc., electric / electronic (conductive, insulating, piezoelectric, pyroelectric, dielectric, etc.), chemical (adsorbing, desorbing, catalytic, water absorbing, ionic conductivity) , Redox properties, electrochemical properties, electrochromic properties, etc.), mechanical properties (abrasion resistance properties, etc.), thermal properties (thermal conductivity, thermal insulation properties, infrared radiation properties, etc.), biofunctional properties (biocompatibility, antithrombotic properties, etc.) ) Means various functions.
[0232]
The arrangement of such a functional portion in a portion corresponding to the pattern of the pattern forming body is performed by a method using a difference in wettability between a lyophilic region and a lyophobic region, or a lyophilic region and a lyophobic region. This is performed by a method utilizing the difference in adhesion between the two.
[0233]
For example, when utilizing the difference in the adhesion of the wettability pattern on the wettability changing layer, as a functional part composition over the entire surface of the wettability changing layer, for example, metal is vapor-deposited, and then an adhesive or the like is used. By peeling off, a metal pattern as a functional portion is formed only in the lyophilic region having good adhesion. As a result, a printed board or the like can be easily formed.
[0234]
Further, when utilizing the difference in wettability of the wettability pattern on the wettability changing layer, the composition for the functional portion is applied on the pattern forming body, so that only the lyophilic region having good wettability is used. Since the composition for a functional part adheres, the functional part can be easily arranged only on the lyophilic region of the pattern formed body.
[0235]
The composition for the functional part used in the present embodiment is, as described above, greatly different depending on the function of the functional element, the method of forming the functional element, and the like. When such a composition is formed, the composition for a functional part becomes a metal, and when a pattern is formed due to a difference in wettability, a composition not diluted with a solvent represented by an ultraviolet curable monomer or the like. Alternatively, a liquid composition diluted with a solvent or the like can be used.
[0236]
In the case of a liquid composition diluted with a solvent, the solvent preferably has a high surface tension of water, ethylene glycol or the like, specifically, a surface tension of 20 mN / m or more including an organic solvent. Further, as the composition for a functional part, a lower viscosity is particularly preferable because a pattern can be formed in a shorter time. However, in the case of a liquid composition diluted with a solvent, it is desirable that the solvent has low volatility, because the viscosity increases and the surface tension changes due to evaporation of the solvent during pattern formation.
[0237]
The composition for a functional part used in the present embodiment may be a functional part by being attached to a pattern formed body or the like, and may be a functional part, or after being arranged on the pattern formed body. It may be a functional part after being treated with a chemical or treated with ultraviolet rays, heat or the like. In this case, as a binder of the composition for a functional part, when a component curable by ultraviolet rays, heat, an electron beam or the like is contained, it is preferable because the functional part can be quickly formed by performing a curing treatment. .
[0238]
The method for forming such a functional element will be specifically described. For example, the composition for the functional part is applied by means of dip coating, roll coating, blade coating, spin coating or the like, means such as a nozzle discharge means including an inkjet or the like. A functional part is formed on the lyophilic region pattern on the surface of the pattern forming body by applying the varnish.
[0239]
Further, by using the pattern forming body of the present embodiment in the method of forming a metal film by electroless plating, a functional element having a metal film pattern as a functional portion can be obtained. Specifically, by utilizing the difference in wettability, only the lyophilic region on the surface of the wettability changing layer of the pattern formed body is treated with the pretreatment liquid for chemical plating, and then the treated pattern formed body is chemically treated. By immersing in a plating solution, a functional element having a desired metal pattern on the wettability changing layer can be obtained. According to this method, since a metal pattern can be formed without forming a resist pattern, a printed circuit board or an electronic circuit element can be manufactured as a functional element.
[0240]
In addition, after disposing the functional part composition on the entire surface, the functional part is formed along the pattern by removing unnecessary parts by utilizing the difference in wettability between the lyophobic region and the lyophilic region. It may be formed. This utilizes the difference in adhesion between the lyophilic region and the liquid-repellent region on the wettability changing layer, for example, peeling by sticking an adhesive tape and then peeling, blowing with air, treatment with a solvent, etc. Unnecessary portions can be removed by post-processing to obtain a pattern of the functional portion.
[0241]
In this case, it is necessary to dispose the functional part composition on the entire surface of the wettability changing layer of the pattern formed body of the present embodiment. For example, a vacuum film forming means such as PVD or CVD may be used. Can be mentioned.
[0242]
Specific examples of the functional element obtained in this manner include a color filter, a microlens, an electroluminescent element, a printed circuit board, and an electronic circuit element.
[0243]
IV. Color filter
The color filter is used for a liquid crystal display device or the like, and has a plurality of pixel portions such as red, green, and blue formed on a glass substrate or the like in a high-definition pattern. By using the pattern forming body of the present invention for manufacturing this color filter, a low-cost, high-definition color filter can be obtained.
[0244]
That is, a pixel portion (functional portion) can be easily formed by attaching and curing ink (composition for a functional portion) to the lyophilic region of the pattern formed body by, for example, an inkjet device or the like. Thus, a high-definition color filter can be obtained with a small number of steps.
[0245]
V. Micro lens
When the functional element is a microlens, a pattern formed body having a circular pattern with changed wettability on the photocatalyst-containing layer or the property change layer is manufactured. Next, when the composition for forming a lens (composition for a functional part) is dropped on the site where the wettability has changed, the composition spreads only to the lyophilic region where the wettability has changed, and the contact angle of the droplet is further dropped. Can be changed. By curing this lens-forming composition, it becomes possible to obtain various shapes or focal lengths, and a high-definition microlens can be obtained.
[0246]
VI. EL element
When the functional element is an EL element, the organic EL layer can be formed in a pattern using the pattern of the pattern forming body of the present invention. Since it is essential that the organic EL layer contains a light emitting layer, the light emitting layer is preferably formed using the pattern of the pattern forming body of the present invention. In this case, the light emitting layer is formed only in the lyophilic region by applying a coating solution obtained by dissolving the material for forming the light emitting layer in an appropriate solvent and applying the coating solution on the photocatalyst containing layer or the property change layer. Can be. In addition, the charge injection layer or the charge transport layer may be formed in a pattern using the pattern of the pattern forming body of the present invention as the organic EL layer other than the light emitting layer.
[0247]
This embodiment is not limited to the above embodiment. The above embodiment is an exemplification, and the present invention has substantially the same configuration as the technical idea described in the claims of the present embodiment, and any device having the same function and effect can be realized by the present invention. It is within the technical scope of the embodiments.
[0248]
【Example】
Examples are shown below to further describe the present embodiment.
[0249]
[Example 1]
15 g of isopropyl alcohol, 4 g of hydrochloric acid (1N), and fluoroalkoxysilane (MF-160E manufactured by Tochem Products: N- [3- (trimethoxysilyl) propyl] -N-ethylperfluorooctane sulfone) were used for the dispersion used for the photocatalyst-containing layer. 0.024 g of amide ether (50% by weight solution in isopropyl ether) and 4 g of titanium oxide (STK-03 manufactured by Ishihara Sangyo Co., Ltd.) were added, the temperature was maintained at 100 ° C., and the mixture was stirred for 60 minutes with a stirrer. Alkali glass was used as a photocatalytic reaction inhibiting substrate. A layer of ITO that functions as a shielding layer patterned to 94/32 μm on the alkali glass was used, and a dispersion was applied thereon by a spin coating method. This was dried at a temperature of 150 ° C. for 10 minutes to allow hydrolysis and polycondensation reactions to proceed, thereby forming a photocatalyst-containing layer at 800 °. When the average roughness of the surface of the obtained photocatalyst-containing layer was measured by a stylus method, it was about Ra = 20 nm. Further, the heat rays were removed from an ultra-high pressure mercury lamp (UXM-3500, ML-40 type lamp house manufactured by Ushio Inc.), and only ultraviolet light of 241 nm to 271 nm was emitted at 5.6 mW / cm for 420 seconds.²Irradiation was performed at an intensity of. FIGS. 11 and 12 show the results obtained by measuring the contact angle with water and an organic solvent having a surface tension of 35 mN / m using a contact angle measurement device (CA-Z type manufactured by Kyowa Interface Science).
[0250]
From the results of FIG. 11 and FIG. 12, considering that the contact angle to the water and the organic solvent having a surface tension of 35 mN / m is rapidly reduced by exposure in the region where the shielding layer is formed, As a result, it is considered that an organic group such as a methyl group or a fluoroalkyl group bonded to the silicon atom was replaced with an oxygen-containing group such as a hydroxyl group.
[0251]
[Example 2]
In the same manner as in Example 1, a photocatalyst-containing layer having a thickness of 800 ° was formed. 5.6mW / cm²Irradiation was performed for 7 minutes through a photomask pattern having a total of 94/32 μm lines / spaces. When the polymer light-emitting material was applied by ink jet, it spread out in the lyophilic region, which is the region exposed to the ultraviolet light, and a pixel could be formed.
[0252]
[Example 3]
In the same manner as in Example 1, a photocatalyst-containing layer having a thickness of 800 ° was formed. 5.6mW / cm²Irradiation was performed for 7 minutes through a photomask pattern having a total of 94/32 μm and a line / space of 94/32 μm. When the polymer light-emitting material was applied by a dispenser, the polymer was wetted and spread in the lyophilic region, which was the region exposed to ultraviolet rays, and pixels could be formed.
[0253]
【The invention's effect】
According to the present invention, by forming a shielding layer on the photocatalytic reaction-inhibiting substrate in a pattern, a region where the action of the photocatalyst contained or inhibited in the photocatalyst containing layer formed thereon is inhibited or reduced and the inhibition or It is possible to form a pattern including a region that is not reduced. By forming the photocatalyst-containing layer on the photocatalytic reaction-inhibiting substrate on which such a pattern is formed, the photocatalyst-containing layer has an area where the function of the photocatalyst is exhibited along the pattern of the shielding layer and an area where the photocatalyst function is not exhibited. Therefore, a pattern due to a difference in wettability can be formed on the surface of the photocatalyst-containing layer without irradiating energy in a pattern by a method such as through a photomask by irradiating the entire surface with energy. . In addition, since it is not necessary to perform post-processing such as development and cleaning after the energy irradiation, there is an effect that the manufacturing process can be simplified.
[Brief description of the drawings]
FIG. 1 is a schematic sectional view showing an example of a pattern forming body of the present invention.
FIG. 2 is a schematic sectional view showing another example of the pattern forming body of the present invention.
FIG. 3 is a schematic sectional view showing another example of the pattern forming body of the present invention.
FIG. 4 is a schematic sectional view showing another example of the pattern forming body of the present invention.
FIG. 5 is a schematic sectional view showing another example of the pattern forming body of the present invention.
FIG. 6 is a schematic sectional view showing another example of the pattern forming body of the present invention.
FIG. 7 is a process chart showing an example of a method for manufacturing a pattern forming body of the present invention.
FIG. 8 is a process chart showing another example of the method for manufacturing a pattern forming body of the present invention.
FIG. 9 is a process chart showing another example of the method for producing a pattern forming body of the present invention.
FIG. 10 is a process chart showing another example of the method for manufacturing a pattern forming body of the present invention.
FIG. 11 is a graph showing a change over time of a contact angle with respect to an organic solvent having a surface tension of a photocatalyst-containing layer of 35 mN / m in a pattern formed body produced in Example 1.
FIG. 12 is a graph showing the change over time in the contact angle of the photocatalyst-containing layer with water in the pattern formed body produced in Example 1.
[Explanation of symbols]
1 ... Photocatalytic reaction inhibiting substrate
2 ... Shielding layer
3) Photocatalyst containing layer
4: Liquid repellent area
5 ... Lyophile area

Claims (30)

Having a function of inhibiting or reducing the action of the photocatalyst, and a photocatalytic reaction-inhibiting substrate containing a photocatalytic reaction-inhibiting substance, a shielding layer formed in a pattern on the photocatalytic reaction-inhibiting substrate, A photocatalyst-containing layer formed on the photocatalytic reaction-inhibiting substrate, wherein the shielding layer is formed in a pattern, and a photocatalyst-containing layer whose surface wettability changes by energy irradiation. A substrate, a photocatalytic reaction inhibitor-containing layer containing a photocatalytic reaction inhibitor that is formed in a pattern on the substrate and has an action of inhibiting or reducing the action of the photocatalyst; and And a photocatalyst-containing layer having a surface wettability changed by energy irradiation. A portion containing a photocatalytic reaction inhibitor that inhibits or reduces the action of the photocatalyst, a photocatalytic reaction inhibitor-containing substrate having a pattern, and a film is formed on the photocatalytic reaction inhibitor-containing substrate, and the surface is irradiated with energy. And a photocatalyst-containing layer having a variable wettability. 4. The pattern forming body according to claim 1, wherein the photocatalyst-containing layer has at least a photocatalyst and a binder. 5. The photocatalyst-containing layer has at least a photocatalyst and a photocatalyst decomposable substance which is present on the surface and is decomposed by the action of the photocatalyst to change wettability. The pattern forming body according to claim. The pattern forming body according to any one of claims 1 to 5, wherein the photocatalyst-containing layer has a thickness in a range of 30 nm to 500 nm. Having a function of inhibiting or reducing the action of the photocatalyst, and a photocatalytic reaction-inhibiting substrate containing a photocatalytic reaction-inhibiting substance, a shielding layer formed in a pattern on the photocatalytic reaction-inhibiting substrate, The shielding layer is formed on the photocatalytic reaction-inhibiting substrate formed in a pattern, and a photocatalyst treatment layer having at least a photocatalyst, and a photocatalyst effect formed on the photocatalyst treatment layer and accompanying energy irradiation And a characteristic change layer whose characteristics change according to the pattern formation. A substrate, a photocatalytic reaction inhibitor-containing layer containing a photocatalytic reaction inhibitor that is formed in a pattern on the substrate and has an action of inhibiting or reducing the action of the photocatalyst; and A photocatalyst treatment layer having at least a photocatalyst formed on the substrate formed on the substrate, and a property change layer formed on the photocatalyst treatment layer and having characteristics changed by the action of the photocatalyst accompanying energy irradiation. A pattern forming body, characterized in that: A portion containing a photocatalytic reaction inhibitor that inhibits or reduces the action of the photocatalyst, a photocatalytic reaction inhibitor-containing substrate having a pattern, and a film formed on the photocatalytic reaction inhibitor-containing substrate, having at least a photocatalyst. A pattern forming body comprising: a photocatalyst treatment layer; and a characteristic change layer formed on the photocatalyst treatment layer and having characteristics changed by the action of a photocatalyst accompanying energy irradiation. The pattern forming body according to any one of claims 7 to 9, wherein a thickness of the photocatalyst processing layer is in a range of 30 nm to 500 nm. The pattern forming body according to any one of claims 7 to 10, wherein the property change layer is a wettability change layer whose wettability changes by the action of a photocatalyst accompanying energy irradiation. . The pattern forming body according to any one of claims 7 to 10, wherein the characteristic change layer is a decomposition removal layer that is decomposed and removed by the action of a photocatalyst accompanying energy irradiation. The pattern forming body according to claim 1, wherein a thickness of the shielding layer is 10 μm or less. 9. The pattern forming body according to claim 2, wherein the thickness of the photocatalytic reaction inhibitor-containing layer is in a range of 10 nm to 15 μm. 10. 2. The photocatalytic reaction-inhibiting substance is at least one substance selected from alkali metals, alkaline earth metals, alumina, zirconia, silica, antimony oxide, amorphous titanium oxide, aluminum, and manganese. The pattern forming body according to any one of claims 1 to 14. Patterned product according to any one of claims of claims 1 to 15, wherein the photocatalyst is titanium oxide (TiO _2). A functional part, wherein the functional part is arranged in a pattern on the photocatalyst containing layer or the characteristic change layer in the pattern forming body according to any one of claims 1 to 16. element. The functional element according to claim 17, wherein the functional part is a metal. A color filter, wherein the functional part of the functional element according to claim 17 is a pixel part. A microlens, wherein the functional part of the functional element according to claim 17 is a lens. An electroluminescent element, wherein the functional part of the functional element according to claim 17 is a light emitting layer. A step of forming a shielding layer in a pattern on a photocatalytic reaction-inhibiting substrate having a function of inhibiting or reducing the action of the photocatalyst, and containing a photocatalytic reaction-inhibiting substance,
Forming a photocatalyst-containing layer on which the shielding layer is formed in a pattern on the photocatalytic reaction-inhibiting substrate, the wettability of which changes with energy irradiation;
Irradiating energy to the surface of the photocatalyst containing layer, a step of forming a pattern due to the difference in wettability in the photocatalyst containing layer,
A method for producing a pattern-formed body, comprising at least: Forming a photocatalytic reaction-inhibiting substance-containing layer containing a photocatalytic reaction-inhibiting substance having an action of inhibiting or reducing the action of the photocatalyst on the substrate in a pattern,
A step of forming a photocatalyst-containing layer having a wettability changed by energy irradiation on the substrate on which the photocatalytic reaction inhibitor-containing layer is formed in a pattern;
Irradiating energy to the surface of the photocatalyst containing layer, a step of forming a pattern due to the difference in wettability in the photocatalyst containing layer,
A method for producing a pattern-formed body, comprising at least: The method according to claim 22 or claim 23, wherein the photocatalyst-containing layer has at least a photocatalyst and a binder. The pattern forming body according to claim 22 or 23, wherein the photocatalyst-containing layer is decomposed by a photocatalyst and a photocatalyst accompanying energy irradiation, and has at least a photocatalytic decomposable substance whose wettability changes. Production method. A step of forming a shielding layer in a pattern on a photocatalytic reaction-inhibiting substrate containing a photocatalytic reaction-inhibiting substance, which has an effect of inhibiting or reducing the action of the photocatalyst,
A step of forming a photocatalyst treatment layer having at least a photocatalyst on the photocatalytic reaction-inhibiting substrate in which the shielding layer is formed in a pattern,
Forming a property change layer on the photocatalyst treatment layer, the property of which changes due to the action of the photocatalyst accompanying energy irradiation,
Irradiating energy to the surface of the property change layer, forming a pattern by changing the property in the property change layer,
A method for producing a pattern-formed body, comprising at least: Forming a photocatalytic reaction-inhibiting substance-containing layer containing a photocatalytic reaction-inhibiting substance having an action of inhibiting or reducing the action of the photocatalyst on the substrate in a pattern,
Forming a photocatalyst treatment layer having at least a photocatalyst on the substrate having the photocatalytic reaction inhibitor-containing layer formed in the pattern,
Forming a property change layer on the photocatalyst treatment layer, the property of which changes due to the action of the photocatalyst accompanying energy irradiation,
Irradiating energy to the surface of the characteristic change layer, forming a pattern in the characteristic change layer by a difference in characteristics,
A method for producing a pattern-formed body, comprising at least: The method according to claim 26 or claim 27, wherein the property change layer is a wettability change layer whose wettability changes by the action of a photocatalyst accompanying energy irradiation. The method according to claim 26 or claim 27, wherein the characteristic change layer is a decomposition removal layer that is decomposed and removed by the action of a photocatalyst accompanying energy irradiation. 23. The photocatalytic reaction-inhibiting substance is at least one substance selected from alkali metals, alkaline earth metals, alumina, zirconia, silica, antimony oxide, amorphous titanium oxide, aluminum, and manganese. A method for producing a pattern forming body according to any one of claims 1 to 29.

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