JP2004103844A5 - - Google Patents

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Publication number
JP2004103844A5
JP2004103844A5 JP2002264052A JP2002264052A JP2004103844A5 JP 2004103844 A5 JP2004103844 A5 JP 2004103844A5 JP 2002264052 A JP2002264052 A JP 2002264052A JP 2002264052 A JP2002264052 A JP 2002264052A JP 2004103844 A5 JP2004103844 A5 JP 2004103844A5
Authority
JP
Japan
Prior art keywords
bump
bump material
heating
semiconductor substrate
predetermined position
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002264052A
Other languages
English (en)
Japanese (ja)
Other versions
JP2004103844A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2002264052A priority Critical patent/JP2004103844A/ja
Priority claimed from JP2002264052A external-priority patent/JP2004103844A/ja
Priority to US10/648,681 priority patent/US6911387B2/en
Priority to KR1020030062323A priority patent/KR20040023538A/ko
Priority to TW092124709A priority patent/TW200406828A/zh
Publication of JP2004103844A publication Critical patent/JP2004103844A/ja
Publication of JP2004103844A5 publication Critical patent/JP2004103844A5/ja
Pending legal-status Critical Current

Links

JP2002264052A 2002-09-10 2002-09-10 バンプ形成方法及び装置 Pending JP2004103844A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2002264052A JP2004103844A (ja) 2002-09-10 2002-09-10 バンプ形成方法及び装置
US10/648,681 US6911387B2 (en) 2002-09-10 2003-08-25 Bump forming method and apparatus for heating and compressing bump materials inserted in positioning holes
KR1020030062323A KR20040023538A (ko) 2002-09-10 2003-09-06 위치결정용 홀에 투입된 범프재를 가열 및 가압하는 범프형성 방법 및 장치
TW092124709A TW200406828A (en) 2002-09-10 2003-09-08 Bump forming method and apparatus for heating and compressing bump materials inserted in positioning holes

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002264052A JP2004103844A (ja) 2002-09-10 2002-09-10 バンプ形成方法及び装置

Publications (2)

Publication Number Publication Date
JP2004103844A JP2004103844A (ja) 2004-04-02
JP2004103844A5 true JP2004103844A5 (enExample) 2005-10-20

Family

ID=32104906

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002264052A Pending JP2004103844A (ja) 2002-09-10 2002-09-10 バンプ形成方法及び装置

Country Status (4)

Country Link
US (1) US6911387B2 (enExample)
JP (1) JP2004103844A (enExample)
KR (1) KR20040023538A (enExample)
TW (1) TW200406828A (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100808106B1 (ko) 2006-05-16 2008-02-29 오태성 반도체 칩 또는 반도체 칩 웨이퍼에 형성한 박막히터를이용한 솔더범프 형성방법과 그 장치
KR100808108B1 (ko) 2006-06-25 2008-02-29 오태성 반도체 칩에 형성한 박막히터를 이용한 반도체 칩의 플립칩실장 방법과 탈착 방법

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6025258A (en) * 1994-01-20 2000-02-15 Fujitsu Limited Method for fabricating solder bumps by forming solder balls with a solder ball forming member
US6271110B1 (en) * 1994-01-20 2001-08-07 Fujitsu Limited Bump-forming method using two plates and electronic device
US6528346B2 (en) * 1994-01-20 2003-03-04 Fujitsu Limited Bump-forming method using two plates and electronic device
JP3434674B2 (ja) 1997-07-11 2003-08-11 松下電器産業株式会社 バンプ形成装置およびその方法
TW406381B (en) * 1997-09-10 2000-09-21 Nittetsu Micro Metal K K Method and device for arraying metallic sphere
US6253992B1 (en) * 1998-03-18 2001-07-03 Tessera, Inc. Solder ball placement fixtures and methods
US6268275B1 (en) * 1998-10-08 2001-07-31 Micron Technology, Inc. Method of locating conductive spheres utilizing screen and hopper of solder balls
JP4130526B2 (ja) * 2000-11-10 2008-08-06 株式会社日立製作所 バンプ形成方法およびその装置

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