JP2004078244A5 - - Google Patents

Download PDF

Info

Publication number
JP2004078244A5
JP2004078244A5 JP2003350799A JP2003350799A JP2004078244A5 JP 2004078244 A5 JP2004078244 A5 JP 2004078244A5 JP 2003350799 A JP2003350799 A JP 2003350799A JP 2003350799 A JP2003350799 A JP 2003350799A JP 2004078244 A5 JP2004078244 A5 JP 2004078244A5
Authority
JP
Japan
Prior art keywords
rubbing
substrate
suction
rubbing roller
roller
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2003350799A
Other languages
English (en)
Japanese (ja)
Other versions
JP4007303B2 (ja
JP2004078244A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2003350799A priority Critical patent/JP4007303B2/ja
Priority claimed from JP2003350799A external-priority patent/JP4007303B2/ja
Publication of JP2004078244A publication Critical patent/JP2004078244A/ja
Publication of JP2004078244A5 publication Critical patent/JP2004078244A5/ja
Application granted granted Critical
Publication of JP4007303B2 publication Critical patent/JP4007303B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2003350799A 1997-01-08 2003-10-09 基板のラビング方法及びラビング装置 Expired - Fee Related JP4007303B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003350799A JP4007303B2 (ja) 1997-01-08 2003-10-09 基板のラビング方法及びラビング装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP157797 1997-01-08
JP2003350799A JP4007303B2 (ja) 1997-01-08 2003-10-09 基板のラビング方法及びラビング装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP189498A Division JP3792384B2 (ja) 1997-01-08 1998-01-07 基板のラビング方法、液晶電気光学素子の製造方法及び基板のラビング装置

Publications (3)

Publication Number Publication Date
JP2004078244A JP2004078244A (ja) 2004-03-11
JP2004078244A5 true JP2004078244A5 (enrdf_load_stackoverflow) 2005-07-07
JP4007303B2 JP4007303B2 (ja) 2007-11-14

Family

ID=32031928

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003350799A Expired - Fee Related JP4007303B2 (ja) 1997-01-08 2003-10-09 基板のラビング方法及びラビング装置

Country Status (1)

Country Link
JP (1) JP4007303B2 (enrdf_load_stackoverflow)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010112968A (ja) * 2008-11-04 2010-05-20 Suzuki Ritsuko ラビング処理装置
KR100987662B1 (ko) 2009-03-20 2010-10-21 (주) 태영이엔지 액정표시장치의 배향막 인쇄장치용 애니록스 롤 상의 이물질 제거장치
CN103676329B (zh) * 2013-12-20 2016-03-30 深圳市华星光电技术有限公司 液晶光配向设备
CN105032875A (zh) * 2015-08-12 2015-11-11 柳州利元光电技术有限公司 具有pi摩擦、除静电条纹和清洗功能的pi摩擦一体机
US10421105B2 (en) 2017-06-19 2019-09-24 Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd Light alignment device, assembly and method for removing light alignment impurities
CN107121845A (zh) * 2017-06-19 2017-09-01 深圳市华星光电技术有限公司 光配向装置及其去除光配向杂质的组件和方法

Similar Documents

Publication Publication Date Title
DE60304505D1 (de) Polierartikel zum elektrochemisch-mechanischen Polieren von Substraten
JP2005081297A (ja) 基板表面清掃装置
JP4091372B2 (ja) 基板処理装置
JP5181147B2 (ja) 樹脂成形品のパートライン研磨方法
DE602007003506D1 (de) Flüssigkeitsverarbeitungsvorrichtung
TW200802526A (en) Substrate treatment apparatus and substrate treatment method
US20090193609A1 (en) Apparatus for Cleaning a Rubbing Cloth
JP2004078244A5 (enrdf_load_stackoverflow)
CN107377441B (zh) 清洗装置、清洗设备及清洗方法
KR101352387B1 (ko) 건식 글라스 패널 세정 장치
CN104950522B (zh) 摩擦配向方法及其装置
WO2015027657A1 (zh) 配向摩擦装置及配向摩擦方法
KR101217442B1 (ko) 도포장치, 도포방법 및 피막형성장치
KR20160049227A (ko) 은페이스트 충진장치
CN100383621C (zh) 液晶显示装置用摩擦装置
JP2013130639A (ja) 液晶パネルの配向膜のラビング装置およびラビング方法
JP2004046247A5 (enrdf_load_stackoverflow)
TW200812709A (en) Coating method for die coater
JP4664198B2 (ja) 基板の処理装置
JP2004046248A5 (enrdf_load_stackoverflow)
JP2005322873A5 (enrdf_load_stackoverflow)
JP2007178553A (ja) ラビング装置
JP6218621B2 (ja) 半導体ウェハの方向整列装置および半導体ウェハの方向整列方法
JP2020136488A5 (enrdf_load_stackoverflow)
CN204256332U (zh) 配向装置