JP2004071704A - Resin sealing device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a resin sealing device which can be miniaturized and whose production efficiency can be improved while a top gate system is adopted. <P>SOLUTION: The resin sealing device is composed of a first block 310 which brings a lower chase 300 into close contact with an upper chase 200, can detach them, and can store an article to be shaped 368 with the upper chase 200; and a second block 350 which is brought into close contact with the first block 310, can be detached from it, and in which a runner groove 352 guiding resin 366 into a cavity 322 arranged in the first block 310 is formed on a surface of a first block 310 side. The device is also provided with a releasing means 370c for releasing at least a part 320 of the first block 310 from the second block 350 at the time of opening a mold, and a sliding means for moving at least a part 320 to a direction H1 perpendicular to a releasing direction V5. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a resin sealing device used when resin sealing a lead frame or the like by transfer molding.
[0002]
[Prior art]
Conventionally, a resin sealing device 100 as shown in FIG. 4 that employs a three-plate structure and encloses resin by a so-called top gate method has been proposed.
[0003]
The resin sealing device 100 includes three molds, an upper mold 102, a middle mold 104, and a lower mold 106. In this example, the upper mold 102 is fixed, and the middle mold 104 and the lower mold 106 are respectively V1 and V2 in FIG. It has a structure that can move up and down in the direction.
[0004]
A runner 109 and a gate 110 for guiding the resin into the cavity 112 are provided on an upper portion 104 a of the middle mold 104. After molding, cull remains on the runner 109 and the gate 110.
[0005]
On the other hand, a cavity 112 in which a resin is sealed from the gate 110 is formed in a lower portion 104b of the middle mold 104. The molded article 114 is previously placed in a portion corresponding to the cavity 112.
[0006]
At the center of the lower mold 106, there is provided a cylindrical pot 116 for accommodating a resin, and a plunger 118 disposed in the pot 116 so as to be vertically movable in the V3 direction in the figure.
[0007]
In this resin sealing device 100, after the molded article 114 is placed on the upper part of the lower mold 106 (on the side of the middle mold 104), the middle mold 104 and the lower mold 106 which are separated from the upper mold 102 move toward the upper mold 102. Move and adhere. Thereafter, the plasticized resin contained in the pot 116 is pushed upward by the plunger 118, passes through a resin path (not shown), passes through the runner 109 provided on the upper portion 104 a of the middle mold 104, and the cavity 112 through the gate 110. The molded article 114 is sealed with a resin.
[0008]
Since the resin sealing device 100 of the top gate type adopts a structure in which the resin is sealed from the gate 110 on the upper part of the molded article 114, compared with the side gate method in which the resin is sealed from the side surface of the molded article 114. The resin can be evenly filled in the cavity 112, and the performance of the so-called "gate cutting" can be improved by separating the molded article 114 from the resin remaining in the gate 110.
[0009]
[Problems to be solved by the invention]
However, the top gate type resin encapsulation apparatus 100 has a structure in which the take-out position of the molded article 114 after sealing and the take-out position of the cured resin (cal) remaining in the gate 110 and the runner 109 are two dimensional. Therefore, the number of the plates must be three, and the size of the mold is increased, and the movement control of the mold is complicated.
[0010]
In addition, since the removal position of the resin remaining in the molded article 114 is located at the upper portion 104a of the middle mold 104 and the lower portion 104b opposite to the upper portion 104a, the molded article 114 and the resin are removed and the mold after removal is removed. There was also a problem that cleaning could not be performed at once, resulting in low production efficiency.
[0011]
The present invention has been made in order to solve such a problem, and provides a resin sealing device capable of reducing the size of a device and improving production efficiency while employing a top gate method. The purpose is to:
[0012]
[Means for Solving the Problems]
The present invention provides a resin sealing device that includes a mold composed of an upper chase and a lower chase, encloses a resin in a cavity, and seals a molded product, wherein the lower chase can be in close contact with and separated from the upper chase. A first block capable of accommodating the article to be molded between the upper chase and a first block capable of being in close contact with or separated from the first block and guiding the resin into the cavity provided in the first block. Is constituted by at least two blocks of a second block formed on the surface on the first block side, and at least a part of the first block and the second block are opened by opening the mold. In this case, the above-mentioned problem has been solved by providing separating means for separating from each other, and sliding means for moving at least a part of the first block in a direction perpendicular to the separating direction. .
[0013]
According to the present invention, the molded article accommodated in the first block after resin sealing and the resin remaining in the runner groove of the second block remain on the same upper chase side, and at least the first block has The provision of the slide means for moving a part allows the molded article and the resin to be simultaneously taken out from the same side. Therefore, the work of taking out the molded article and the resin and the work of cleaning the mold after the take-out can be performed in a short time, and the production efficiency can be improved.
[0014]
In addition, when the mold is opened, there is provided a means for separating at least a part of the first block and the second block from each other, so that when the first block is slid, the second block is in contact with the first block. Can be prevented, and the movement of the first block becomes smooth. At the same time, it is possible to obtain the effect of cutting off the resin remaining in the runner groove from the molded article, that is, the effect of so-called “gate cutting”.
[0015]
The first block is divided into a cavity block in which the cavity is formed and in which the molded article can be accommodated, and a pair of runner blocks facing the runner grooves of the second block. In a case where the slide means is movable and the runner block can be opened integrally with the upper chase, the cavity block necessary for removing the resin remaining in the runner groove of the second block is removed. The slide amount can be reduced, and space saving can be realized. For example, a cross section in which the space for accommodating a part of the cavity block when the mold is closed is formed when the pair of runner blocks has a surface covering the runner groove of the second block. The same effect can be obtained by using an L-shaped block. Further, the upper chase and the pair of runner blocks, which can be opened together with the upper chase, can be separated from each other by a second minute. If the separating means is provided, at the same time, when the cavity block slides, interference with the runner block can be prevented, and the movement of the cavity block becomes smooth.
[0016]
Further, if a break mechanism (e.g., an eject pin) for allowing the resin accumulated in the runner groove formed in the second block to remain on the side of the second block is provided, the resin remaining in the runner groove of the second block is provided. It is possible to more reliably prevent the resin to be attached from adhering to the first block side facing the runner groove, and it is possible to reliably take out the resin.
[0017]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
[0018]
FIG. 1 schematically shows a side cross section of a resin sealing device 500 according to an embodiment of the present invention in a state immediately after completion of resin sealing.
[0019]
The resin sealing device 500 includes a mold including an upper chase 200 and a lower chase 300.
[0020]
The lower chase 300 includes a first block 310, a second block 350, and a third block 380 in this example.
[0021]
The first block 310 can be brought into close contact with and separated from the upper chase 200, and a molded article 368 can be accommodated between the first block 310 and the upper chase 200. Further, the first block 310 has a structure that can be divided into a cavity block 320 in which a molded article 368 can be arranged and a pair of runner blocks 330 facing a runner groove 352 of a second block 350 described later.
[0022]
In the cavity block 320 which is a part of the first block 310, a cavity 322 in which a resin 366 is sealed is formed. A gate 324 for guiding the resin 366 into the cavity 322 is formed below the cavity 322, and the resin 366 can be supplied from below the cavity 322. The cavity block 320 faces the third block 380 via a spring 370c provided in the third block 380. When the mold is opened, the cavity block 320 and the third block 380 can be slightly separated from each other in the direction V5 in the figure by the spring 370C as the first separating means, and can be separated from the direction H1 in the figure. (In a direction perpendicular to the separation direction V5) by a slide mechanism (not shown).
[0023]
On the other hand, the runner block 330 of the first block 310 has surfaces 350a and 350b covering the runner grooves 352 formed on the surface of the second block 350, and closes the upper chase 200 and the lower chase 300. This is a block having an L-shaped cross section in which a space capable of accommodating a part of the cavity block 320 is formed. The runner block 330 is opposed to the upper chase 200 via a spring 370b provided on the upper chase 200 and can be opened integrally with the upper chase 200. The upper chase 200 and the runner block 330 can be slightly separated from each other in the V6 direction in the drawing by the spring 370b as the second separating means. Further, the runner block 330 has an eject pin (break mechanism) for pushing out the cured resin 366b shown in FIG. 2 remaining in the runner groove 352 of the second block 350 after sealing toward the second block 350 side. 332 are provided.
[0024]
The second block 350 can be brought into close contact with and separated from the first block 310. The second block 350 has a runner groove 352, a plunger 354, and a pot 356, and is movable by a slide mechanism (not shown) in the V4 direction in the drawing.
[0025]
The runner groove 352 is a groove for guiding the resin 366a into the cavity 322 provided in the cavity block 320. The runner groove 352 is formed along the two surfaces 350a and 350b of the pair of runner blocks 330 along the surface of the second block 350 ( (The first block 310 side). The pot 356 contains a resin 366a to be sealed in the cavity 322 via the runner groove 352. The plunger 354 is disposed in the pot 356 and is movable up and down in a V7 direction in the figure to push up the resin 366a in the pot 356 upward.
[0026]
Next, the operation of the resin sealing device 500 according to the embodiment of the present invention will be described.
[0027]
The plasticized resin 366a contained in the pot 356 is pushed upward (upward in the figure) by a plunger 354 provided in the pot 356. The resin 366a is sealed in the cavity 322 provided in the cavity block 320 from below (in the figure, below) the cavity 322 provided in the cavity block 320 through a runner groove 352 formed in the second block 350. Thereafter, pressure is applied to the molded product 368, and resin sealing is performed.
[0028]
Next, the operation of the resin sealing device 500 according to the embodiment of the present invention when the mold is opened will be described with reference to FIG. FIG. 2 schematically shows a side cross section of the resin sealing device 500 in a mold open state.
[0029]
When the above-described resin sealing operation of the molded article 368 is completed, the cavity block (the first block 350) facing and closely contacting the second block 350 and the third block 380 with respect to the upper chase 200 maintained in a fixed state. (Part of block 310) 320 is lowered in the V4 direction in the figure, and mold opening is started. When the cavity block 320 is lowered, the pressing of the cavity block 320 which has been pressed to the third block 380 side (the lower side in the figure) by the fixing member 372 via the spring 370a is released, and the third block 380 By the action of the provided spring 370c, the cavity block 320 is separated from the third block 380 by a minute distance e1 in the V5 direction in the drawing. At the same time, the cavity block 320 and the third block 380 facing the cavity block 320 slide integrally in the direction H11 in the figure.
[0030]
Further, when the second block 350 is lowered, the runner block 330 facing the upper chase 200 is separated from the upper chase 200 by a minute distance e2 in the V6 direction in FIG. The eject pin 332 provided on the runner block 330 protrudes toward the second block 350, and separates the cured resin 366 b remaining in the runner groove of the second block 350 from the runner block 330.
[0031]
The lower chase 300 of the resin sealing device 500 according to the embodiment of the present invention includes a cavity block 320 in which a molded article 368 can be accommodated, and a second block 350 in which a runner groove 352 is formed on the cavity block 320 side. Therefore, the molded article 368 after resin sealing accommodated in the cavity block 320 and the cured resin 366b remaining in the runner groove 352 of the second block 350 remain on the same upper chase 200 side. The molded article 368 and the resin 366b can be taken out from the same side (the upper chase 200 side). Therefore, the work of taking out the molded article 368 and the cured resin 366b and the work of cleaning the cavity block 320 and the second block 350 after the take-out can be performed in a short time, and the production efficiency can be improved.
[0032]
Also, a spring (separating means) 370c for separating the cavity block 320 and the second block 350 by minutely separating the cavity block 320 and the third block 380 from each other is provided, and the upper chase 200 and the runner block 330 are separated from each other. (Second separating means), the spring 370b is provided so that when the cavity block 320 is slid in the direction H11 in the figure, the spring block 370b interferes with the second block 350 and the runner block 330 which are in contact with the cavity block 320. Can be prevented, and the movement of the cavity block 320 becomes smooth. Moreover, by separating the cavity 322 of the cavity block 320 from the runner groove 352 of the second block 350, the molded product 368 and the cured resin 366b remaining in the runner groove 352 can be separated, so-called “gate cutting”. Can also be obtained.
[0033]
Further, the first block 310 is divided into a cavity block 320 and a runner block 330, and the cavity block 320 can be moved in the H11 direction by a slide mechanism (not shown). Can be opened integrally with the upper chase 200, so that the sliding amount e3 of the cavity block 320 required for taking out the hardened resin 366b remaining in the runner groove 352 of the second block 350 can be reduced, and the cost can be reduced. Space can be realized.
[0034]
Since the eject pin 332 is provided on the runner block 330, it is possible to prevent the cured resin 366 b remaining in the runner groove 352 of the second block 350 from adhering to the runner block 330 facing the runner groove 352. Thus, the cured resin 366b can be reliably taken out.
[0035]
In the above embodiment, the lower chase 300 is divided into the cavity block 320, the pair of runner blocks 330, the second block 350, and the third block 380. However, the present invention is not limited to this, and each block may be divided into four blocks. The shape is not limited to the shape shown in the drawing.
[0036]
That is, as shown in the schematic diagram of FIG. 3, for example, a first block 410 capable of adhering and separating the lower chase 400 from the upper chase 200 and accommodating a molded article 368 between the lower chase 400 and the upper chase 200, A second block formed on the surface on the first block 410 side and having a runner groove 452 that can be brought into close contact with and separated from the first block 410 and guides the resin into the cavity 422 provided in the first block 410. When the mold is opened, the first block 410 and the second block 450 are separated from each other in a direction V5 in the figure, and the first block 410 is slid in a direction H11 perpendicular to the separation direction V5. May be.
[0037]
By doing so, although the sliding amount of the first block 410 is slightly larger than that of the above-described embodiment, it is easy to remove the molded product 368 and the cured resin remaining in the runner groove 452. The effect can be obtained, and the configuration of the mold can be simplified.
[0038]
Further, although the eject pin 332 is provided on the runner block 330, the eject pin 332 may be installed at a place other than the runner block 330, and the cured resin 366b accumulated in the runner groove 352 of the second block 350 is removed by the second pin 350. Any mechanism that remains on the side of the two blocks 350 may be used. That is, for example, a mechanism for adsorbing the cured resin 366b may be provided below the runner groove 352 of the second block 350.
[0039]
Further, although a spring is provided as the separating means, the present invention is not limited to this.
[0040]
【The invention's effect】
According to the present invention, it is possible to provide a resin sealing device that can achieve miniaturization of the device and improvement of production efficiency while adopting the top gate method.
[Brief description of the drawings]
FIG. 1 is a schematic cross-sectional view of a resin sealing device according to an embodiment of the present invention in a state immediately after completion of resin sealing. FIG. 2 is a side cross-section of the resin sealing device in FIG. FIG. 3 is a schematic view of a resin sealing device in which a lower chase is formed of two blocks. FIG. 4 is a top gate type resin sealing device employing a conventional three-plate structure.
100: Conventional resin sealing device 102: Upper mold 104: Middle mold 106: Lower mold 109: Runner 110: Gate 112, 322: Cavity 114, 368: Molded product 116, 356: Pot 118, 354: Plunger 200: Upper Chase 300 Lower chase 310 First block 320 Cavity block 330 Runner block 332 Eject pin 350 Second block 352 Runner groove 366 Resin 370a, 370b, 370c Spring 372 Fixing member 380 Third Block 500: Resin sealing device

Claims (5)

Equipped with a mold consisting of an upper chase and a lower chase, a resin sealing device that seals the resin in the cavity and seals the molded product,
The lower chase,
A first block capable of being closely attached to and separated from the upper chase and capable of accommodating the molded article between the upper chase;
A runner groove which can be brought into close contact with and separated from the first block and guides the resin into the cavity provided in the first block has at least a runner groove formed on the surface of the first block. While consisting of two blocks,
Separating means for separating at least a part of the first block and the second block from each other when opening the mold;
A resin sealing device comprising: a slide unit configured to move at least a part of the first block in a direction perpendicular to the separating direction. In claim 1,
Further, the first block, a cavity block in which the cavity is formed and the molded article can be accommodated,
While dividing the second block into a runner groove and a runner block facing the runner groove,
A resin sealing device, wherein the cavity block is movable by the slide means, and the runner block is mold-openable integrally with the upper chase. In claim 2,
The runner block has a surface covering the runner groove of the second block, and
A resin sealing device comprising a block having an L-shaped cross section in which a space capable of accommodating a part of the cavity block is formed when the mold is closed. In claim 3, further,
A resin sealing device, comprising: a second separating means capable of minutely separating the upper chase and the pair of runner blocks which can be opened integrally with the upper chase. In any one of claims 1 to 4,
The resin sealing device further comprises a break mechanism for allowing the resin accumulated in the runner groove formed in the second block to remain on the side of the second block.

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