JP2625542B2 - Wafer and its mold - Google Patents

Description

Description: BACKGROUND OF THE INVENTION The present invention relates to a wafer and a molding die thereof, and more particularly, to a wafer suitable for closing a hole of a holding pin for positioning a hoop material in a cavity during molding. And a molding die thereof.

[Conventional technology]

FIG. 7 shows a conventional wafer. In FIG. 7, reference numeral 1 denotes a terminal, and the terminal 1 is formed in a hoop shape.
Is provided.

Next, a method of manufacturing the wafer having the above-described configuration will be described. The hoop material having the terminal 1 is conveyed into the injection mold, the movable mold plate and the fixed mold plate are closed, molten resin is poured into the cavity, and after solidification, the mold is released. A wafer as shown in FIG.

[Problems to be solved by the invention]

By the way, in the conventional technique, it is necessary to position the terminal 1 in the cavity at the time of injection molding.
The holding pin 3 is in contact with the terminal 1. Accordingly, when the wafer is released from the mold, the holes 4 of the holding pins 3 are formed. For example, when cleaning is performed to remove the flux adhering to the wafer mounted on the printed circuit board, the cleaning liquid is removed as shown in FIG. As shown by the arrow A in FIG.
Into the inside, causing contact failure and deterioration of the contact. In order to prevent this, a post-process of coating a synthetic resin or applying an adhesive to cover the hole 4 of the holding pin 3 is required, which increases the number of processes and increases the cost. There is a possibility that the sealing is not complete and the sealing degree is not sufficient.

The present invention has been made in view of the problems of the prior art, and has been made in order to solve the problem. The object of the present invention is to provide a wafer that can eliminate a post-process, greatly improve the degree of sealing, and reduce the total cost. An object of the present invention is to provide a molding die.

[Means for solving the problem]

In order to achieve the above object, a wafer according to the present invention has a terminal and a first wafer portion having a hole formed integrally with the terminal and formed by removing a holding member that supports the terminal during molding. And a second wafer portion integrally formed with the first wafer portion to close the hole, and a mold for forming a wafer according to the present invention comprises a fixed side plate and a fixed side plate. A movable mold plate which can be freely attached to and detached from the side mold plate; a cavity provided on a joint surface between the movable mold plate and the fixed mold plate, for injecting molten resin; and the fixed mold plate when closing the mold. A holding member that abuts on a hoop material interposed between the hoop material and the movable side mold plate to position the hoop material in the cavity, and injects and solidifies a molten resin into the cavity to form a resin on the hoop material. To take out A molding die, wherein a plurality of cavity upper surface portions of the fixed side mold plate that define the upper surface of the cavity are provided with respect to the cavity lower surface portion of the movable side mold plate that defines the lower surface of the cavity; A first wafer portion is formed with a first cavity defined by a lower surface portion and a first cavity upper surface portion, and a second cavity upper surface portion is formed on the cavity lower surface portion instead of the first cavity upper surface portion. The second defined opposing
The second wafer portion is formed with the above-mentioned cavities, and the holes formed in the pressing member at the time of forming the first wafer portion are closed by the second wafer portion.

[Action]

By the means, the second wafer is integrally formed with the first wafer portion in which the punched hole of the pressing member for positioning the terminal at the time of molding is formed.
Since the second wafer portion is formed, the second wafer portion is filled in the hole of the first wafer portion and closed. Therefore, post-processing for closing the hole is not required, the total cost is reduced, and the degree of sealing is greatly improved.

Further, the cavities of the movable mold plate are common between the first wafer portion molding and the second wafer portion molding, and only the cavities are exchanged on the fixed mold plate, so that the mold cost and the processing cost can be reduced. .

〔Example〕

 Hereinafter, embodiments of the present invention will be described with reference to the drawings.

1 (a) and 1 (b) are cross-sectional views showing a primary molding and a secondary molding of a wafer according to the present invention, FIG. 2 is a front view showing an outline of the overall structure, and FIG. FIGS. 4 (a) to 4 (f) are schematic sectional views showing each step of molding.
5 (a) and 5 (b) are plan views schematically showing FIGS. 4 (a) and 4 (d), and FIG. 6 is a process diagram showing a forming process.

In FIG. 1B, reference numeral 10 denotes a terminal formed in a hoop shape, and a first wafer portion 11 is integrally formed with the terminal 10. The first wafer portion 11 is formed in a box shape with an open lower surface, and a terminal 10 is embedded in a top portion 12 thereof. The lower surface of the terminal 10 is formed so as to be exposed on the inner top surface of the first wafer portion 11. Further, when the terminal 10 is integrally formed with the first wafer portion 11, it is necessary to position the terminal 10 in the cavity of the molding die.
The upper and lower surfaces have concave portions 13 formed by removing the positioning member. A second wafer portion 14 is formed on the upper surface of the first wafer portion 11 so as to cover the concave portion 13 on the upper surface side (in FIG. 1B) of the terminal 10 and integrated with the first wafer 11. Have been.

Next, a molding die for producing the above-mentioned wafer will be described.

In FIGS. 2 and 3 diagram, were generically indicated by reference numeral 15 and 16 is a fixed mold and a movable mold, L ₁ is a mold opening surface of the products X is taken out, L ₂ is The mold opening surface for taking out the unnecessary resin Y is shown.

The fixed mold 15 is fixed to the fixed mounting plate 17, the runner forming member 18 integrally fixed to the fixed mounting plate 17, the fixed mounting plate 17 and the runner forming plate member 18 by a predetermined distance. And a fixed-side mold plate 19 slidable in a direction perpendicular to the separating and approaching direction. The fixed mold 15 is provided with an injection port 21 to which a nozzle 20 of the injection machine is mounted, and a tip of the nozzle 20 communicates with a runner 22 provided on a lower surface of the runner forming plate member 18. . In addition, the fixed side template 19
Is composed of a guide plate 23 and a slide cavity 24 supported by the guide plate 23 to perform the above-described slide. The guide plate 23 and the slide cavity 24 are formed with a spool 25 that communicates with the runner 22 when the mold is closed in FIG. 3, and the spool 25 communicates with the cavity 26 via a pin gate. . That is, on the lower surface side of the slide cavity 24,
The first cavity upper surface 2 that defines one surface of the product X
7, and the second cavity upper surface portions 28 are formed alternately.

Reference numeral 29 denotes an undercut notch provided in the runner forming plate member 18, which communicates with the runner 22 when the mold is closed, and as shown in FIG. Is also filled. Then, when the mold opening of the unnecessary resin Y mold opening plane L ₂ for taking out, which will be described later, the notch
The unnecessary resin Y is brought into close contact with and held by the runner forming plate member 18 due to the biting force of the resin in 29. The notch 29 can be made considerably large with respect to the runner 22 and does not affect the holding force even if the resin is stretched. Therefore, it is possible to have a large holding force with respect to the unnecessary resin Y.

Reference numeral 30 denotes an air cylinder.
a penetrates the guide plate 23 and is fixed to the slide cavity 24. By operating the air cylinder 30, the slide cavity 24 is slid along the guide groove 23a of the guide plate 23. The air cylinder 30 is attached to the guide plate 23, and moves with the movement of the guide plate 23.

Reference numeral 31 denotes an eject mechanism for extruding and separating the unnecessary resin Y provided on the fixed-side mounting plate 17, a reciprocating plate 32 operated by an appropriate drive source such as an air cylinder, and an eject pin 33 fixed to the reciprocating plate 32. , And a support pin 34. The distal end of the eject pin 33 is flush with the upper bottom surface of the notch 29 in the mold closed state.

Reference numeral 35 denotes a cavity positioning pin provided in the movable mold 16, and the tip of the cavity positioning pin 35 is inserted into a positioning hole 36 formed in the slide cavity 24. Therefore, when the mold is closed, the slide cavity 24 is accurately positioned with respect to the movable mold plate 37 of the movable mold 16.

The movable mold 16 includes a movable mounting plate 38, a spacer block 39 integrally fixed to the movable mounting plate 38, a movable mold plate 37 and an edge plate 40 integrally fixed to the spacer block 39. , An edge plate plate 41 and the like. A lower surface portion 42 for defining the other surface of the product X is formed on the upper surface of the movable mold plate 37. In the mold closed state shown in FIG.
And the fixed side mold plate 19 are in close contact with each other to form a cavity 26.

The cavity 26 has two types of shapes in this embodiment. That is, as described above, the first and second cavity upper surfaces 27 and 28 are provided as the cavity upper surface of the fixed mold plate 19 corresponding to one cavity lower surface 42 of the movable mold plate 37. The primary molding is performed by the cavity defined by the first cavity upper surface portion 27 and the cavity lower surface portion 42. Then, the slide cavity 24 is slid with respect to the cavity lower surface portion 42 so that the second cavity upper surface portion 28 is substituted for the first cavity upper surface portion 27.
Face each other. Secondary molding is performed by the cavity defined by the second cavity upper surface portion 28 and the upper surface of the first wafer portion 11 formed by the primary molding.
The secondary molding is to bury the traces of the positioning member remaining after the primary molding and to improve the hermeticity.

Reference numeral 43 denotes a pilot pin. The pilot pin 43 is inserted into a positioning hole of a hoop material conveyed between the movable mold plate 37 and the fixed mold plate 19, and positions the hoop material with respect to the cavity. is there. This hoop material is
The hoop material is sent out by a feeder 44 shown in FIG. This hoop material is 3rd
In the drawing, the paper is transported in a direction perpendicular to the paper surface, and the slide cavity 26 is set so as to be slidable in the same direction as the transport direction. Further, both side edges of the hoop material are positioned by the hoop material guide plate 45. This hoop material guide plate 45 is attached to the movable mold plate 37.

Although not shown, the product X
An ejector pin for projection is fixed, and the ejector pin is slidable relative to the member 24 penetrating the movable mold plate 37. When the mold is closed, the distal end face of the ejector pin has a cavity. Lower part 42
Are positioned flush with the upper main surface of the movable mold plate 37. Needless to say, the number of aegetapine pins is provided corresponding to each product X.

46 is a guide plate support pin, and 47 is a positioning pin provided on the movable mold plate 37. The positioning pin 47 is elastically provided with respect to the guide plate support pin 46 and is engaged with the positioning groove of the guide plate support pin 46. It has become so.

Next, a molding method using the thus-configured molding die will be described with reference to FIGS.

First, primary molding is performed. At the time of this primary molding, the fourth
As shown in FIGS. 5 (a) and 5 (a), the first cavity upper surface 27 of the slide cavity 24 is located opposite the cavity lower surfaces 42, 42 of the movable mold plate 37. It is necessary to position the hoop material terminal 10 in the first cavity upper surface portion 27, and for example, a holding pin is provided. When the mold is closed as shown in FIG. 4 (a), the molten resin is filled into the cavity from the nozzle 20 of the injection machine via the runner 22, the spool 25 and the pin gate. As shown in FIG. 5 (a), the runner 22 is divided into two branches and communicates with two cavities, and accordingly, two runners are formed. The injected resin is integrally molded with the terminal 10 in the cavity in the cavity, and the first wafer portion 11 shown in FIG. 1A is molded. A trace of a positioning member for positioning the terminal 10 in the cavity remains on the wafer in the primary molding. The remaining resin in the mold among the injected resins becomes the unnecessary resin Y.

From this state, the movable mold 16 starts moving downward in the figure by a drive source (not shown). This movement of the movable die 16, begins to open the mold opening plane L ₁ for the product X fetch, the resin in the mold is cut with fragile the pin gate portion is separated into a product X and unwanted resin Y . And the movable mold
16 is further moved downward, also moves the fixed side mold plate 19, mold opening L ₂ for the unnecessary resin Y extraction also begin to open. Upon the opening operation the mold opening plane L _2, the unnecessary resin Y runner part, because it is by connexion held considerably stronger holding force by the resin of the notch 29 of the runner forming plate member 18, unnecessary resin The Y is always separated from the fixed-side mold plate 19 in a state of being in close contact with the runner forming plate member 18 side. Subsequently, further continuing the movable mold 16 is a downward movement, when the mold opening plane L ₂ is opened a predetermined amount, the Ejiekuto mechanism 31 is actuated to move the Ejiekutopin 33 downward. Thereby, the resin in the notch 29 of the unnecessary resin Y is extruded from the runner forming plate member 18, the unnecessary resin Y is separated from the member 18, and taken out by an appropriate means (FIG. 4 (b)). . As a means for removing the unnecessary resin Y, a bucket is inserted in the middle of the mold opening while the mold opening is stopped at an intermediate position, and the unnecessary resin Y is dropped into the bucket. In this way, a series of mold opening processes is completed, and primary molding is performed.

Next, secondary molding is performed. In this secondary molding, the slide cavity 24 is moved from the state shown in FIG.
Operate 30 and slide it to the left. Due to this sliding movement, as shown in FIG. 4 (c), the upper surface of the cavity of the slide cavity 24 facing each cavity 42 of the movable mold plate 37 becomes the upper surface of the first cavity during the primary molding. 27 is replaced by a second cavity upper surface portion 28.
Therefore, at the time of the secondary molding, the second cavity upper surface portion
The cavities are defined by the cavities 28 and the lower surface portions 42 of the cavities.

The movable mold 16 is moved upward from the state shown in FIG. 4 (c) to bring the mold closed as shown in FIG. 4 (d). In the state shown in FIG. 4D, the runner 22 and the spool 25 communicating with the second cavity upper surface portion 28 are communicated, but not with the spool 25 of the first cavity upper surface portion 27 (fifth embodiment). Figure (b). In the state of FIG. 4 (d), the wafer formed by the primary molding is left as it is in the cavity.
In this state, the molten resin of the same type as that of the primary molding is again filled into the cavity for the secondary molding from the nozzle 20 via the runner 22, the spool 25, and the pin gate. By this filling, the second wafer portion 14 is closed by closing the trace of the first wafer portion 11.
Are integrally molded, and the sealing performance is improved.

From the state shown in FIG. 4 (d), the mold is opened in the same manner as the mold opening in the primary molding described above, and as shown in FIG. 4 (e), the unnecessary resin Y is separated from the runner molding plate member 18, and the bucket is separated. Remove by

On the other hand, before and after the separation and removal of the unnecessary resin Y from the mold in the secondary molding, the eject plate 40 is pushed out by an ejection device (not shown).
Protrudes from the movable side mold plate 37 with an eject pin.
The product X is separated and taken out by an appropriate means (FIG. 4 (f)). In this way, a series of mold opening processes is completed, the secondary molding is completed, and a wafer as shown in FIG. 1 (b) is obtained.

〔The invention's effect〕

As described above, according to the present invention, a post-process such as application of an adhesive is required, the degree of sealing is greatly improved, and the total cost can be reduced.

[Brief description of the drawings]

FIGS. 1 to 6 show an embodiment of the present invention. FIGS. 1 (a) and 1 (b) are cross-sectional views showing a primary molding and a secondary molding of a wafer according to the present invention. FIG. 2 is a front view showing an outline of the entire structure, FIG. 3 is a longitudinal sectional view, FIGS. 4 (a) to (f) are schematic sectional views showing each step of molding, and FIGS. 4B is a schematic plan view corresponding to FIGS. 4A and 4D, FIG. 6 is a process diagram showing a molding process, and FIG. 7 is a longitudinal sectional view of a conventional wafer. 10 ... terminal, 11 ... first wafer part, 14 ... second wafer part, 15 ... fixed mold, 16 ... movable mold, 24 ...
.., Slide cavity, 27... First cavity upper surface, 28... Second cavity upper surface, 42... Cavity lower surface.

Claims (2)

(57) [Claims] A terminal, a first wafer portion integrally formed with the terminal, a first wafer portion having a hole formed by removing a holding member for supporting the terminal at the time of molding, and a first wafer portion; A second wafer portion formed to close the hole. 2. A fixed-side mold plate, a movable-side mold plate which can be freely attached to and detached from the fixed-side mold plate; A cavity to be injected, and a holding member for positioning a hoop material in the cavity by contacting a hoop material interposed between the fixed side mold plate and the movable side mold plate when the mold is closed. In a molding die for a wafer in which a molten resin is injected and solidified to integrally mold the resin into the hoop material, the cavity is formed with respect to the lower surface of the cavity of the movable mold plate that defines the lower surface of the cavity. A plurality of cavities upper surface portions of the fixed side mold plate that define the upper surface of the first die portion are formed, and a first wafer portion is formed by a first cavity defined by the lower surface portions of the cavities and the first upper surface portions of cavities; The first A second wafer portion is formed with a second cavity defined by opposing a second lower surface of the cavity to a lower surface of the cavity in place of the upper surface of the cavity, and the second wafer portion is formed at the time of forming the first wafer portion. 3. A molding die for a wafer, wherein a hole of a holding member is closed by the second wafer portion.