JP2004053564A - Resin flowability evaluation method of adhesive sheet with copper foil - Google Patents
Resin flowability evaluation method of adhesive sheet with copper foil Download PDFInfo
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- JP2004053564A JP2004053564A JP2002215308A JP2002215308A JP2004053564A JP 2004053564 A JP2004053564 A JP 2004053564A JP 2002215308 A JP2002215308 A JP 2002215308A JP 2002215308 A JP2002215308 A JP 2002215308A JP 2004053564 A JP2004053564 A JP 2004053564A
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- Prior art keywords
- resin
- adhesive sheet
- copper foil
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Abstract
Description
【０００１】
【発明の属する技術分野】
本発明は、プリント配線板に使用する銅箔付接着シートの樹脂流れ性を評価する方法に関する。
【０００２】
【従来の技術】
銅箔付接着シートは、銅箔の粗化面にエポキシ系樹脂をコーティングし、加熱しながらコーティングした樹脂を半硬化させたものである。
一般に、接着シートの樹脂流れ性を判定する方法は、プリプレグの試験方法で規定するＪＩＳ Ｃ ６５２１に準拠した重量変化率を測定し判定する方法（以下ＪＩＳ法と呼ぶ）と、ｌＰＣ ＴＭ６５０に準拠した樹脂流れ長さを測定し判定する方法（以下ｌＰＣ法と呼ぶ）がある。
【０００３】
樹脂流れ性を、ＪＩＳ法に準拠して判定する方法は、銅箔付接着シートを１００±０．３ｍｍ角にバイアスカットしたものを試料とし、試料の上下を離型性のフィルムで覆い、それらをプレス機で加圧し、加熱して成形（以下プレス成形と呼ぶ）後、φ８１．１±０．２５ｍｍの円板に打ち抜き、（（成形前の重量−（２×成形後の重量））／成形前の重量）×１００（％）で表される重量変化率で評価する方法である。
【０００４】
樹脂流れ性を、ｌＰＣ法に準拠して判定する方法は、銅箔付接着シートを１０２ｍｍ角にバイアスカットしたものを試料とし、試料を３枚重ねφ２５．４±１．３ｍの打抜き穴を２個２５．４ｍｍ離してあけ、その後離型性のフィルムで覆い、プレス成形後に穴壁からしみ出した樹脂の樹脂流れ長さを測定し評価する方法である。
【０００５】
極端に樹脂流れをおさえた銅箔付接着シートの樹脂流れ性を２水準測定した場合、ＪＩＳ法では、樹脂の流出する量が極端に少ないことと、銅箔付接着シートの重量が銅箔のみの重量と大差ないことから、重量変化率が２水準とも常に０％となり、評価できなかった。
【０００６】
また、ｌＰＣ法では、極端に樹脂流れをおさえた銅箔付接着シートのため、φ２５．４±１．３ｍｍの打抜き穴の穴壁からしみだした樹脂の樹脂流れ長さが２水準とも常に０．０ｍｍとなり評価できなかった。
【０００７】
樹脂流れ性の水準は次のものとした。
水準１：極端に樹脂流れをおさえたものの中で樹脂流れが少ないもの
水準２：極端に樹脂流れをおさえたものの中で樹脂流れが多いもの
【０００８】
【発明が解決しようとする課題】
本発明は、銅箔付接着シートの樹脂流れ性の評価で、極端に樹脂流れをおさえた銅箔付接着シートの樹脂流れ性を定量的に評価することを目的とする。
【０００９】
【課題を解決するための手段】
本発明は次のものに関する。
銅箔付接着シートの樹脂流れ性を評価する方法において、予めドリルを用いた穴あけ加工で穴をあけ、その銅箔付接着シートと銅張積層板をプレス機で加圧し、加熱して接着後に、銅張積層板の表面で、銅箔付接着シートの穴壁から内側にしみだした樹脂に覆われていない部分の距離を測定し評価する方法。
【００１０】
【発明の実施の形態】
本発明は、極端に樹脂流れをおさえた銅箔付接着シートの樹脂流れ性の評価方法において、予め銅箔付接着シートにドリルを用いた穴あけ加工で穴を明け、その銅箔付接着シートと銅張積層板をプレス機で加圧し、加熱して接着後に、銅張積層板の表面で、銅箔付接着シートの穴壁から内側にしみだした樹脂に覆われていない部分（以下樹脂非流出距離と呼ぶ）を測定し評価することを特徴とする。
【００１１】
【作用】
プレス成形する前に予めあける穴の直径を小さくすることにより、樹脂の流動できる面積が小さくなり、流動距離を誇張させることができ、極端に樹脂流れをおさえた銅箔付接着シートでも、樹脂流れ性を定量的に評価することが可能となる。
【００１２】
【実施例】
本発明の実施例について、図を用いて説明する。図２は、予めドリルを用いφ０．３ｍｍ及びφ０．１ｍｍの穴をあけた銅箔付接着シートを銅張積層板とプレス成形する時の構成図であり、図３は、プレス成形後の銅箔付接着シートと、その穴の拡大図である。また表１、２は、樹脂流れ性２水準の銅箔付接着シートを用いて樹脂流れを測定した結果の一例である。
【００１３】
プレス機により、図２に示す構成で銅箔付接着シートをプレス成形する。
図３に示すφ０．３ｍｍ及びφ０．１ｍｍのドリル穴−穴部分を二次元測長機付顕微鏡を用いて樹脂非流出部分９の距離を測定する。
樹脂非流出部分９は円形になるため、その直径を距離とし、少なくとも３点測定し、一番小さな値をデータとする。
【００１４】
【発明の効果】
以上の方法により、極端に樹脂流れをおさえた銅箔付接着シートの樹脂流れ性を定量的に評価することができた。
【００１５】
【表１】
【表２】
【図面の簡単な説明】
【図１】φ０．３及びφ０．１ｍｍのドリル穴をあけた銅箔付接着シート
【図２】プレス成形する試料の構成図
【図３】樹脂非流出部分の測定した一例を示す図
【符号の説明】
１ 銅箔付接着シート
２ φ０．３及びφ０．１ｍｍのドリル穴
３ φ０．３及びφ０．１ｍｍのドリル穴を明けた銅箔付接着シート
４ 銅張積層板
５ 銅張積層板とプレス成形した後のφ０．３及びφ０．１ｍｍのドリル穴を明けた銅箔付接着シート
６ φ０．３及びφ０．１ｍｍのドリル穴の拡大図
７ φ０．３及びφ０．１ｍｍのドリル穴
８ プレス成形後、穴壁から内側に流出した樹脂部分
９ 樹脂非流出部分[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a method for evaluating resin flowability of an adhesive sheet with a copper foil used for a printed wiring board.
[0002]
[Prior art]
The copper foil-attached adhesive sheet is obtained by coating a roughened surface of a copper foil with an epoxy resin, and semi-curing the coated resin while heating.
In general, the method of determining the resin flowability of an adhesive sheet is a method of measuring and determining a weight change rate in accordance with JIS C 6521 specified in the prepreg test method (hereinafter referred to as JIS method), and a method in accordance with lPC TM650. There is a method of measuring and determining the resin flow length (hereinafter referred to as the lPC method).
[0003]
The method of determining resin flowability in accordance with the JIS method is to use a sample obtained by bias-cutting an adhesive sheet with a copper foil into 100 ± 0.3 mm squares, cover the top and bottom of the sample with a release film, Is pressurized by a press machine, heated and molded (hereinafter referred to as press molding), punched out into a disc of φ81.1 ± 0.25 mm, and ((weight before molding− (2 × weight after molding)) / This is a method of evaluating by a weight change rate expressed by (weight before molding) × 100 (%).
[0004]
The method of determining the resin flowability in accordance with the 1PC method is to use a sample obtained by bias-cutting an adhesive sheet with a copper foil into a square of 102 mm, and stacking three samples with two punched holes of φ25.4 ± 1.3 m. In this method, the resin is separated by 25.4 mm, then covered with a releasable film, and the length of resin flowing out of the hole wall after press molding is measured and evaluated.
[0005]
When the resin flowability of the adhesive sheet with copper foil with extremely low resin flow is measured at two levels, the JIS method shows that the amount of resin flowing out is extremely small, and the weight of the adhesive sheet with copper foil is only copper foil. The weight change rate was always 0% at both levels because it was not much different from the weight of the sample, and could not be evaluated.
[0006]
In addition, in the lPC method, since the adhesive sheet with a copper foil extremely suppresses the resin flow, the resin flow length of the resin extruded from the hole wall of the φ25.4 ± 1.3 mm punched hole is always 0 for both levels. 0.0 mm and could not be evaluated.
[0007]
The resin flowability was as follows.
Level 1: Extremely low resin flow and low resin flow Level 2: Extremely low resin flow and high resin flow
[Problems to be solved by the invention]
An object of the present invention is to quantitatively evaluate the resin flowability of an adhesive sheet with a copper foil in which the resin flow is extremely suppressed by evaluating the resin flowability of the adhesive sheet with a copper foil.
[0009]
[Means for Solving the Problems]
The present invention relates to the following.
In the method of evaluating the resin flowability of the copper foil-attached adhesive sheet, a hole is drilled in advance using a drill, and the copper foil-attached adhesive sheet and the copper-clad laminate are pressed with a press, heated, and bonded. A method of measuring and evaluating the distance of a portion of the surface of a copper-clad laminate, which is not covered with resin, which has extruded inward from a hole wall of an adhesive sheet with a copper foil.
[0010]
BEST MODE FOR CARRYING OUT THE INVENTION
The present invention relates to a method for evaluating the resin flowability of an adhesive sheet with a copper foil that extremely suppresses resin flow, in which a hole is formed in advance by a drilling process using a drill in the adhesive sheet with a copper foil, and the adhesive sheet with a copper foil. After the copper-clad laminate is pressed with a press, heated and bonded, a portion of the surface of the copper-clad laminate that is not covered with resin that has extruded inward from the hole wall of the adhesive sheet with copper foil (hereinafter referred to as resin non-spillage) (Referred to as distance) is measured and evaluated.
[0011]
[Action]
By reducing the diameter of the hole that is pre-drilled before press molding, the area where the resin can flow is reduced, the flow distance can be exaggerated, and even if the adhesive sheet with copper foil extremely suppressed the resin flow, the resin flow It is possible to quantitatively evaluate the sex.
[0012]
【Example】
An embodiment of the present invention will be described with reference to the drawings. FIG. 2 is a configuration diagram when a copper-clad laminate is press-formed with an adhesive sheet with copper foil having holes of 0.3 mm and 0.1 mm using a drill in advance, and FIG. It is an adhesive sheet with a foil, and an enlarged view of the hole. Tables 1 and 2 show examples of the results of measuring resin flow using an adhesive sheet with copper foil having two levels of resin flowability.
[0013]
Using a press machine, the adhesive sheet with copper foil is press-formed with the configuration shown in FIG.
Using a microscope equipped with a two-dimensional length measuring machine, the distance between the non-flowing portion 9 of the resin and the holes of φ0.3 mm and φ0.1 mm shown in FIG. 3 is measured.
Since the resin non-flowing portion 9 has a circular shape, its diameter is defined as a distance, at least three points are measured, and the smallest value is used as data.
[0014]
【The invention's effect】
By the above method, the resin flowability of the adhesive sheet with a copper foil which extremely suppressed the resin flow could be quantitatively evaluated.
[0015]
[Table 1]
[Table 2]
[Brief description of the drawings]
FIG. 1 is an adhesive sheet with a copper foil having φ0.3 and φ0.1 mm drill holes. FIG. 2 is a configuration diagram of a sample to be press-formed. FIG. 3 is a diagram showing an example of measurement of a resin non-flowing portion. Description]
1 Adhesive sheet with
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002215308A JP2004053564A (en) | 2002-07-24 | 2002-07-24 | Resin flowability evaluation method of adhesive sheet with copper foil |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002215308A JP2004053564A (en) | 2002-07-24 | 2002-07-24 | Resin flowability evaluation method of adhesive sheet with copper foil |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2004053564A true JP2004053564A (en) | 2004-02-19 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002215308A Pending JP2004053564A (en) | 2002-07-24 | 2002-07-24 | Resin flowability evaluation method of adhesive sheet with copper foil |
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| Country | Link |
|---|---|
| JP (1) | JP2004053564A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105784544A (en) * | 2015-12-29 | 2016-07-20 | 东南大学 | Experimental method for determining viscosity requirements of asphalt pavement crack pouring materials |
| CN108760574A (en) * | 2018-04-18 | 2018-11-06 | 晋能光伏技术有限责任公司 | A kind of photovoltaic module encapsulating material fluidity testing method |
| CN111982747A (en) * | 2020-06-30 | 2020-11-24 | 生益电子股份有限公司 | Method for testing flowability of prepreg of PCB |
-
2002
- 2002-07-24 JP JP2002215308A patent/JP2004053564A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105784544A (en) * | 2015-12-29 | 2016-07-20 | 东南大学 | Experimental method for determining viscosity requirements of asphalt pavement crack pouring materials |
| CN108760574A (en) * | 2018-04-18 | 2018-11-06 | 晋能光伏技术有限责任公司 | A kind of photovoltaic module encapsulating material fluidity testing method |
| CN111982747A (en) * | 2020-06-30 | 2020-11-24 | 生益电子股份有限公司 | Method for testing flowability of prepreg of PCB |
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