JP2004052015A - Plating apparatus and plating method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a plating apparatus and a plating method by which, in a plating apparatus and a plating method where the peripheral part of the object to be plated is held by a retaining claw of a retaining fixture, and plating is performed, the defects of the plating caused by the remaining of bubbles in the vicinity of the inside of the retaining claw can be eliminated, and the effective range of the plating can be increased. <P>SOLUTION: The plating apparatus is provided with a plating tank 51 to be stored with a plating liquid 20, a retaining fixture 53 holding the peripheral part of the object 30 to be plated by a retaining claw 53a, and loading and retaining the object 30 to be plated so as to dip the same into the plating liquid 20 in a state where the plating face 30a is exposed to the inside of the plating liquid 20, an anode plate 54 arranged at the inside of the plating liquid 20, and a first nozzle 11 jetting the plating liquid from the front of the object 30 to be plated toward the plating face in the vicinity of the inside of the retaining claw 53a. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a plating apparatus and a plating method.
[0002]
[Prior art]
Conventionally, a plating apparatus 50 as shown in FIG. 5 is known.
This is done by immersing the plating object 30 in the plating solution 20 of the plating tank 61 so as to face the anode 54 with the plating object 30 as a cathode, applying a voltage to both electrodes by a power source 62, and plating the plating surface 30a of the plating object 30. Is applied.
At this time, the object to be plated 30 is connected to the cathode while being detachably held by a plate-like holding jig 53 as shown in FIG. When mounting the plating object 30 on the holding jig 53, the back surface 30 c of the plating object 30 is brought into close contact with the plate-like portion of the holding jig 53, and a predetermined width 30 b of the entire peripheral portion of the plating object 30 is held. It is sandwiched and held by claws 53a. The reason why the holding jig 53 holds the object 30 to be plated in such a configuration is to prevent the predetermined width 30b and the back surface 30c of the entire peripheral portion of the object 30 from being plated.
[0003]
[Problems to be solved by the invention]
By the way, according to the structure in which the holding claw 53a sandwiches the entire periphery of the object 30 to be plated, since the holding claw 53a has a thickness 53d, the holding jig 53 on which the object to be plated 30 is mounted is immersed in the plating solution. In addition, the bubbles 60 are taken in the vicinity of the inside of the holding claw 53a on the plating surface side. In particular, when the holding jig 53 is quickly immersed in the plating solution in consideration of the efficiency, the bubbles 60 do not escape and tend to remain at the position.
Further, at the upper peripheral portion of the plating object (the upper peripheral portion when the plating object is arranged perpendicularly to the plating solution level), the holding claws 53a become like eaves covering the plating surface 30a. . For this reason, the air bubbles 60 are taken in beneath and tend to remain. In addition, the gas 60 generated during plating is caught.
[0004]
As described above, the air bubbles remaining near the inside of the holding claw 53a prevent the contact between the plating surface and the plating solution, and cause the plating to be chipped.
As a result, a portion where plating is insufficient is formed in the vicinity of a predetermined width 30b or more that is held by the holding claws 53a so as not to be plated, and a range where plating can be performed well, that is, a plating effective range is reduced. .
[0005]
Therefore, the present invention has been made to solve these problems, and an object of the present invention is to provide a plating apparatus and a plating method for performing plating by sandwiching a peripheral portion of an object to be plated by holding claws of a holding jig. It is an object of the present invention to provide a plating apparatus and a plating method that can eliminate plating defects due to bubbles remaining near the inside of a holding claw and can increase a plating effective range.
[0006]
[Means for Solving the Problems]
In order to solve the above problem, the present inventor removes bubbles from the position by ejecting and agitating a plating solution toward a portion of the plating surface where bubbles are likely to remain near the inside of the holding claw, and stirring. The present invention has been completed.
[0007]
That is, the plating apparatus of the present invention includes a plating tank in which a plating solution is stored, and a peripheral portion of the plating object sandwiched by holding claws, and the plating object is placed in the plating solution by plating the plating surface of the plating object. A holding jig that is mounted and held immersed in the plating solution of the plating tank in an exposed state, an anode plate arranged in the plating solution, and plating near the inside of the holding claw from the front of the object to be plated. A first nozzle for injecting a plating solution toward the surface.
[0008]
In the plating apparatus having such a configuration, the first nozzle can spray the plating solution toward the plating surface near the inside of the holding claw where bubbles easily remain, and can stir the plating solution in the vicinity. Bubbles can be efficiently released from the vicinity of the inside of the holding claws by stirring the plating solution, and plating can be satisfactorily applied to a portion where the formation of a plating film has been conventionally prevented by the bubbles.
[0009]
Further, the first nozzle is formed by providing a plurality of ejection holes along an annular shape of the nozzle flow passage in a nozzle flow passage provided in an annular shape. One nozzle can be formed.
The term "annular" includes not only a circular shape but also an elliptical shape, a square shape, and a polygonal shape, and the design is appropriately changed depending on the arrangement shape of the holding claws for sandwiching the plating surface. Further, the position where the holding claw is nipped may be partial instead of the entire peripheral edge of the object to be plated.
[0010]
In addition, the plating solution may be sprayed only toward the plating surface in a portion where bubbles easily remain.However, when the plating solution is sprayed in a ring shape, the bubbles can escape and the plating solution flows. Since it becomes uniform in the vertical direction of the plating surface, it is possible to apply plating having a uniform thickness, which is advantageous.
Therefore, the plating solution is sprayed in a ring shape including not only the plating surface near the inside of the holding claw where air bubbles are likely to remain but also the peripheral portion of the plating surface not held by the holding claw.
[0011]
Further, a second nozzle for spraying a plating solution onto a plating surface is provided from a nozzle portion at a front end disposed in front of the object to be plated. Thereby, the plating solution is agitated, and a uniform plating film can be formed more efficiently.
[0012]
In addition, a shielding cylinder made of an insulator, which is arranged in front of the plating surface of the object to be plated to be mounted on the holding jig, with a slight gap from the plating surface, and arranged so that the axis is substantially perpendicular to the plating surface. Wherein the nozzle portion at the tip of the second nozzle is located in the shielding cylinder.
By providing the shielding cylinder, the flow rate of the plating solution becomes almost the same in the central part and the peripheral part of the plating surface, and a plating film having a uniform thickness can be formed even in the fine holes provided over the entire plating surface. it can.
[0013]
Further, the nozzle flow path may be formed in an annular cavity along the through hole inside a plate-shaped nozzle body provided with a through hole slightly smaller than the opening of the shielding cylinder. Features. By providing the nozzle body in a plate shape, it is easy to stabilize the position of the first nozzle, and the plating solution can be reliably jetted to the target position on the plating surface.
[0014]
Further, the holding jig is provided in the plating tank so that the plating surface of the plating object to be mounted is fixed in a state substantially perpendicular to the plating solution level, or in a state in which the plating surface is inclined obliquely upward. It is characterized by being immersed in a plating solution. This makes it more difficult for bubbles to remain on the plating surface.
[0015]
Further, the present invention is characterized in that the first nozzle is provided with an ejection hole such that a plating solution is ejected toward an upper half of a plating surface near the inside of the holding claw. Since the holding claws that sandwich the upper half of the plating surface cover the plating surface in an eaves-like manner, air bubbles are particularly likely to remain. Therefore, by injecting the plating solution intensively into this portion, bubbles can be efficiently removed.
[0016]
Further, a shielding plate formed between the first nozzle and the shielding cylinder so as to allow a plating solution to pass therethrough is disposed substantially parallel to a plating surface of the object to be plated. . By arranging the shielding plate, it is possible to easily form a plating having a uniform thickness, and since the first nozzle is disposed on the plating surface side of the shielding plate, the injection of the plating solution by the first nozzle is prevented by the shielding plate. It is not hindered by.
[0017]
In the plating method of the present invention, the object to be plated is mounted on the holding jig in a state where the plating surface is exposed by clamping the periphery of the object to be plated with the holding claws of the holding jig, and the cathode After fixing the holding jig in a plating tank in which a plating solution is stored, the object to be plated is immersed in the plating solution, and then an anode plate disposed in the plating solution, A plating solution is sprayed from the front of the object to be plated toward the plating surface near the inside of the holding claw using the first nozzle while applying power to the plating surface, thereby plating the plating surface.
As a result, bubbles remaining in the vicinity of the inside of the holding claws can be removed, and the effective plating area can be increased.
[0018]
In addition, the object to be plated is mounted on the holding jig with the plating surface exposed by holding the peripheral edge of the object to be held by the holding claws of the holding jig, and is connected to the cathode. By fixing the tool in a plating bath in which a plating solution is stored, the object to be plated is immersed in the plating solution, and then the anode plate placed in the plating solution and the holding while energizing the cathode are conducted. In front of the plating surface of the object to be plated to be mounted on the jig, it is located in a shielding cylinder made of an insulator, which is disposed so as to have a slight distance from the plating surface and to have an axis substantially perpendicular to the plating surface. A plating solution is sprayed from the nozzle portion at the tip of the second nozzle onto the plating surface, and the plating solution is sprayed from the front of the workpiece using the first nozzle toward the plating surface near the inside of the holding claw. To the plating surface And characterized by applying the can.
This makes it possible to increase the effective plating area while forming a uniform plating film in the fine holes.
[0019]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings. FIG. 1 is a sectional view showing a configuration of a plating apparatus 10 according to the present invention, and FIG. 2 is a sectional view of a first nozzle 11. The plating apparatus 10 performs plating by immersing a disk-shaped object 30 to be plated in a plating solution 20 stored in a plating tank 51. In particular, the plating apparatus 10 has a fine resist layer formed on a plating surface of a semiconductor wafer. This is an advantageous device when depositing plating in a hole to form a bump.
[0020]
As shown in FIG. 6, the object 30 to be plated is connected to a cathode while being detachably held by a plate-like holding jig 53. When mounting the plating object 30 on the holding jig 53, the back surface 30 c of the plating object is brought into close contact with the plate-like portion of the holding jig 53, and the predetermined width 30 b of the entire peripheral portion of the plating object 30 is held by the holding claw. It is sandwiched and held by 53a. The reason why the holding jig 53 holds the object 30 to be plated in such a configuration is to prevent the predetermined width 30b and the back surface 30c of the entire peripheral portion of the object 30 from being plated.
Further, the holding jig 53 can be immersed and fixed in the plating solution 20 so that the plating surface 30a of the mounted workpiece 30 is perpendicular to the plating solution surface 20a. It has become.
[0021]
The shielding cylinder 56 made of an insulating material such as plastic is disposed in front of the plating surface 30a of the workpiece 30 at a slight distance from the plating surface 30a and with the axis substantially perpendicular to the plating surface 30a.
The anode plate 54 is disposed in the shielding cylinder 56 so as to face the plating surface 30a of the object 30 to be plated, and an insulator 55 made of a plastic plate or the like is fixedly disposed on the back side thereof. At this time, it is preferable that a slight gap is formed between the peripheral edge of the anode plate 54 and the inner wall surface of the shielding cylinder 56.
[0022]
The second nozzle 58 is arranged such that a nozzle portion 58a at the tip end provided with a large number of small holes penetrates through the insulator 55 and the anode plate 54 and faces the plating surface 30a. The rear end side of the second nozzle 58 is connected to a plating solution tank via a plating solution pipe, and the plating solution in the plating solution tank is sprayed from the nozzle portion 58a toward the plating surface 30a by a spray pump. (Not shown).
[0023]
Further, the plating bath 20 is configured so that the plating solution 20 is stored up to the plating solution level 20 a and overflows from the discharge pipe 52 beyond that. The plating solution from the discharge pipe 52 is returned to the plating solution tank and can be circulated.
Further, a shield plate 57 provided with a large number of small holes is arranged substantially parallel to the plating surface 30a between the nozzle portion 58a and the plating surface 30a.
Further, a plating power supply (not shown) is provided so that the anode plate 54 and the cathode can be energized.
[0024]
As shown in FIG. 2, the first nozzle 11 has a through hole 13 a that is slightly smaller than the opening of the shielding cylinder 56 near the center of the plate-shaped nozzle body 13. As shown in FIG. 1, the first nozzle 11 has a through hole 13a communicating with the opening of the shielding cylinder 56, and the nozzle body 13 is in a state substantially perpendicular to the plating solution level 20a. And between the shielding plate 57 and the holding jig 53.
Thus, the plating solution sprayed from the second nozzle 58 can reach the plating surface 30a through the through hole 13a.
[0025]
Further, an annular cavity is provided inside the nozzle body 13 along the through hole 13a, and a nozzle flow path 14 is formed. A plurality of ejection holes 12 are formed in the nozzle flow path 14 along the annular shape so that the plating solution is ejected toward the plating surface near the inner side of the holding claw 53a that sandwiches the entire periphery of the object 30 to be plated in a circular shape. Is provided. The ejection holes 12 are, for example, holes having a diameter of 1.2 mm, and are provided at intervals of about 6 mm.
[0026]
Two plating solution channels 15, 15 are linearly extended from two locations of the nozzle channel 14, and the plating solution channels 15, 15 are provided with openings on the same side surface of the nozzle body 13, respectively. I have.
The plating solution pipe connected to the rear end side of the second nozzle 58 described above is branched, and its tip is further divided into two branches, which are connected to the two openings of the plating solution flow paths 15 and 15, respectively. I have. Thereby, the plating solution in the plating solution tank is sent to both the second nozzle 58 and the first nozzle 11 by the injection pump. In the plating solution pipe, valves 17 and 18 are provided at two branches of the first nozzle side and the second nozzle side, and plating is performed from only one of the second nozzle 58 and the first nozzle 11. It is configured so that the liquid can be ejected.
[0027]
In order to perform plating on the plating object 30 using the plating apparatus 10 having such a configuration, the holding jig 53 on which the plating object 30 is mounted is immersed in a plating solution in the plating tank 51, and the second nozzle The plating is performed by spraying a plating solution sprayed from both the nozzle 58 and the first nozzle 11 onto the plating surface 30a, and energizing the cathode and anode plates 54.
According to this, since the entire plating surface 30a is buried in the plating solution 20, the plating solution ejected from the nozzle portion 58a flows outward from the gap between the peripheral portion of the plating surface 30a and the shield cylinder end surface. Out into the plating solution. When flowing out into the solution in this manner, the flow resistance from the solution is large, and therefore, there is no large difference in the flow rate of the plating solution between the central portion and the peripheral portion of the plating surface 30a. Thus, a plating film having a uniform thickness can be formed even with fine holes formed in the plating surface 30a.
Further, since a slight gap is formed between the peripheral portion of the anode plate 54 and the inner wall surface of the shielding cylinder 56, the plating solution ejected from the nozzle portion 58a also allows the plating solution to be ejected from the rear side of the anode plate 54. The plating solution flows into the shielding cylinder 56, whereby a smooth plating solution flow can be obtained in the shielding cylinder 56.
Furthermore, since the shielding cylinder 56 is formed of an insulator and the insulator 55 is fixed to the back surface of the anode plate 54, it is possible to prevent the lines of electric force from leaking out of the shielding cylinder 56, and to improve plating efficiency. be able to.
Further, since the shielding plate 57 is provided, it is possible to adjust the lines of electric force acting on the plating surface 30a, and it is possible to suppress variations in the thickness of the plating film.
[0028]
Then, as shown in FIG. 4, the plating solution is ejected from the plurality of ejection holes 12 of the first nozzle 11 toward the plating surface near the entire inner periphery of the holding claw 53a. Let it escape. As a result, the plating can be satisfactorily applied even to the portion where the formation of the plating film is conventionally prevented by the bubbles, and the effective plating range can be increased. That is, a product can be efficiently manufactured without waste.
[0029]
As described above, the present invention has been described variously with reference to the preferred embodiments. However, the present invention is not limited to this embodiment, and a plating apparatus and a plating apparatus for holding a peripheral portion of an object to be plated by holding claws are provided. Can be adopted in a wide range of methods.
For example, the object to be plated is immersed in the plating solution such that the plating surface is perpendicular to the plating solution surface, but may be immersed so that the plating surface faces obliquely upward.
Further, in the above embodiment, the first nozzle 11 is provided with the ejection hole 12 in a ring shape. (See FIG. 3) Alternatively, the nozzle flow path 14 may be formed in a fan shape, and the ejection holes 12 may be provided.
Further, the first nozzle 11 may have a nozzle flow path 14 provided in a pipe shape.
[0030]
The shielding plate 57 may be formed with a number of small holes, besides, may have a mesh shape, or may have an opening corresponding to a plating surface of a wafer to be plated. An opening having a diameter slightly smaller than the diameter of the surface may be formed. In any case, by adjusting the number and diameter of the small holes of the shielding plate 57, the fineness of the mesh, and the diameter of the opening, the lines of electric force acting on the plating surface can be adjusted.
In the above-described embodiment, the shielding plate is provided so as to eliminate the variation in the plating thickness. However, the shielding plate may not be provided. In this case, too, the first nozzle 11 has the shielding cylinder 56 and the cover held by the holding jig 53. It is arranged between plating objects.
[0031]
【The invention's effect】
ADVANTAGE OF THE INVENTION According to this invention, in the plating apparatus and plating method which clamp and hold the peripheral part of a to-be-plated object by the holding nail of a holding jig, the plating defect by the bubble near the inside of a holding nail is eliminated, and the plating effective area And the product can be manufactured efficiently.
[Brief description of the drawings]
FIG. 1 is an explanatory sectional view showing an embodiment of a plating apparatus according to the present invention.
FIG. 2 is an explanatory sectional view showing a configuration of a first nozzle.
FIG. 3 is an explanatory sectional view showing another configuration of the first nozzle.
FIG. 4 is an explanatory diagram illustrating a state in which a plating solution is jetted from an ejection hole of a first nozzle toward a plating surface.
FIG. 5 is an explanatory sectional view of a conventional plating apparatus.
FIG. 6 is an explanatory cross-sectional view illustrating bubbles remaining near holding claws of a conventional plating apparatus.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 10 Plating apparatus 11 1st nozzle 12 Injection hole 13 Nozzle body 14 Nozzle flow path 20 Plating solution 30 Plated object 51 Plating tank 53 Holding jig 53a Holding claw 54 Anode plate 56 Shielding cylinder 57 Shielding plate 58 Second nozzle

Claims (10)

A plating tank in which a plating solution is stored;
The periphery of the object to be plated is sandwiched by the holding claws, and the object to be plated is mounted and held so that the plating surface of the object to be plated can be immersed in the plating solution of the plating tank with the plating surface of the object exposed to the plating solution. Holding jig,
An anode plate arranged in a plating solution,
A plating apparatus, comprising: a first nozzle that sprays a plating solution from a front side of an object to be plated toward a plating surface near an inside of the holding claw. 2. The plating apparatus according to claim 1, wherein the first nozzle is formed by providing a plurality of ejection holes along an annular shape of the nozzle flow path in an annular nozzle flow path. 3. . The plating apparatus according to claim 1, further comprising a second nozzle that sprays a plating solution onto a plating surface from a nozzle portion at a front end disposed in front of the workpiece. In front of the plating surface of the object to be plated to be mounted on the holding jig, a shielding cylinder made of an insulator having a slight gap with the plating surface and arranged so that the axis is substantially perpendicular to the plating surface is provided. And
The plating apparatus according to claim 3, wherein a nozzle portion at a tip of the second nozzle is located inside the shielding cylinder. The nozzle flow path is formed in a ring-shaped cavity along the through hole inside a plate-shaped nozzle body provided with a through hole that is slightly smaller than the opening of the shielding cylinder. The plating apparatus according to claim 4, wherein the plating is performed. The holding jig is provided so that a plating surface of a plating object to be mounted is substantially perpendicular to a plating solution surface, or a plating solution of the plating tank is fixed in an oblique state in which a plating surface faces upward. The plating apparatus according to claim 12, wherein the plating apparatus is immersed in the plating apparatus. 4. The first nozzle according to claim 1, wherein an ejection hole is provided so that a plating solution is ejected toward an upper half of a plating surface near an inside of the holding claw. The plating apparatus according to 4, 5, or 6. A shielding plate formed between the first nozzle and the shielding cylinder so as to allow a plating solution to pass therethrough is disposed substantially in parallel with a plating surface of the object to be plated. The plating apparatus according to 1, 2, 3, 4, 5, 6, or 7. By sandwiching the periphery of the object to be plated by the holding claws of the holding jig, the object to be plated is mounted on the holding jig with the plating surface exposed, and connected to the cathode,
By fixing the holding jig in the plating tank in which the plating solution is stored, the object to be plated is immersed in the plating solution,
An anode plate arranged in the plating solution, while energizing the cathode,
A plating method, wherein a plating solution is sprayed from a front side of an object to be plated toward a plating surface near the inside of the holding claw using a first nozzle, and plating is performed on the plating surface. By sandwiching the periphery of the object to be plated by the holding claws of the holding jig, the object to be plated is mounted on the holding jig with the plating surface exposed, and connected to the cathode,
By fixing the holding jig in the plating tank in which the plating solution is stored, the object to be plated is immersed in the plating solution,
An anode plate arranged in the plating solution, while energizing the cathode,
In front of the plating surface of the object to be plated to be mounted on the holding jig, with a slight gap from the plating surface, and disposed such that the axis is substantially perpendicular to the plating surface, in a shielding cylinder made of an insulator. From the nozzle portion located at the tip of the second nozzle, the plating solution is sprayed onto the plating surface,
A plating method, wherein a plating solution is sprayed from a front side of an object to be plated toward a plating surface near the inside of the holding claw using a first nozzle, and plating is performed on the plating surface.

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