JP2004050497A - Molding fixture, molding equipment and molding method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a molding fixture which prevents the generation of burrs and the leakage of a sealing compound from occurring, molding equipment and a molding method. <P>SOLUTION: The molding fixture 100 is a ring-like member and constituted of an inner peripheral member 101 and an outer peripheral member 102. The inner peripheral member 101 has a circumference long enough to encircle the periphery of a semiconductor wafer. The outer peripheral member 102 has a height equal to or less than the height or below of the inner peripheral member 101 and is formed so as to encircle the periphery of the inner peripheral member 101. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a molding jig and a mold which are arranged inside a mold having a concave portion and which can produce a molded product having a predetermined size in which a molded product, in particular, a semiconductor wafer is sealed with a sealing material. The present invention relates to a molding method using a molding jig.
[0002]
[Prior art]
In the manufacture of a semiconductor device, a large number of metal pillars electrically connected to electrodes of a semiconductor chip are formed on one surface of a semiconductor wafer, and the surface on which these metal pillars are formed is attached to the surface of the metal pillar. Seal with resin so that the upper surface is exposed. The exposed upper surface of the metal column serves as a joint portion of the solder ball, and the solder ball is joined.
[0003]
The resin sealing device used in such a method covers the upper surface of a lower mold having a concave portion with a sealing film for preventing the resin from adhering to the lower mold. Next, the resin sealing device arranges the semiconductor wafer in the space formed by the concave portion such that the surface on which the metal columnar body is formed faces upward. Further, the resin sealing device arranges a tablet-shaped resin material on the upper surface of the metal columnar body, and then, moves the upper mold and the lower mold having a flat lower surface and covered with a sealing film into an upper mold. By disposing so that the lower surface of the lower mold and the upper surface of the lower mold face each other, heating the lower mold and the upper mold to melt the resin material, and pressing the lower mold and the upper mold together, The space surrounded by the concave portion of the lower mold and the lower surface of the upper mold is filled with resin. Thereby, the semiconductor wafer is sealed with the resin.
[0004]
The shape of the resin-sealed semiconductor wafer (molded product) manufactured by the above-described method depends on the shape of the concave portion of the lower mold. For this reason, when manufacturing a molded product using semiconductor wafers of different sizes, it is necessary to use a lower mold corresponding to the size of each semiconductor wafer.
[0005]
However, since the mold is expensive, preparing a lower mold for each semiconductor wafer having a different size increases the cost. For this reason, a method has been proposed in which a molding jig is prepared according to the size of a semiconductor wafer, and the molding jig is arranged in a concave portion of a lower mold.
[0006]
FIG. 1 is a perspective view of a conventional molding jig. The mold forming jig 200 shown in the figure is a ring-shaped member capable of surrounding the periphery of a semiconductor wafer. The material of the molding jig 200 is, for example, SUS, 42 alloy (an alloy of iron and nickel). The height of the molding jig 200 is slightly lower than the thickness required for the molded product.
[0007]
FIG. 2 is a cross-sectional view showing a resin sealing step using the molding jig shown in FIG. In the first step shown in FIG. 2A, the resin sealing device is configured to adjust the height of the inner frame mold 201 constituting the lower mold and the outer frame mold 202 arranged so as to surround the inner frame mold 201. After disposing the mold jig 200 in the recess 204 formed by the difference, the surfaces of the inner frame mold 201, the outer frame mold 202, and the mold jig 200 are covered with the sealing film 206. Next, the resin sealing device arranges the semiconductor wafer 250 having the metal column 251 formed on one surface in a space surrounded by the molding jig 200 such that the metal column 251 faces the upper surface. I do. Further, the resin sealing device arranges a tablet-shaped resin material 260 on the upper surface of the semiconductor wafer 250.
[0008]
Thereafter, in a second step shown in FIG. 2B, the resin sealing device includes an upper mold 208 having a flat lower surface and covered with a sealing film 210, an inner frame mold 201, and an outer frame mold. The upper mold 208, the inner frame mold 201, and the outer frame mold 202 are disposed so that the lower surface of the upper mold 208 and the upper surfaces of the inner frame mold 201 and the outer frame mold 202 face each other. 202 is heated to melt the resin material 260, and the inner frame mold 201 is moved upward.
[0009]
Then, in the third step shown in FIG. 2C, the resin sealing device sets the distance between the sealing film 210 covering the upper mold 208 and the sealing film 206 covering the inner frame mold 201 to the mold. When the height required for the molded product is reached, the inner frame mold 201 is stopped. Thus, the space surrounded by the upper surface of the inner frame mold 201, the lower surface of the upper mold 208, and the molding jig 200 is filled with the melted resin material 260. At this time, since the height of the molding jig 200 is slightly lower than the depth of the concave portion 204, a gap 270 is generated between the upper surface of the molding jig 200 and the lower surface of the upper mold 208, and Excess resin material 260 that does not constitute a product flows into gap 270. After that, the resin material 260 is cured, and the semiconductor wafer 250 is sealed by the resin material 260.
[0010]
[Problems to be solved by the invention]
However, in the method using the molding jig 200 described above, when the resin material 260 flowing into the gap 270 is cured, the resin material 260 causes burrs on the outer periphery of the molded product. For this reason, a step of removing burrs is required. Further, since the volume of the gap 270 is not sufficient, when the upper mold 208 and the inner frame mold 201 and the outer frame mold 202 are pressed against each other, the sealing film is lost due to the pressure of the resin material 260 that has lost the escape space. The bent portion of 206 may be broken and resin leakage may occur. In this case, it is necessary to remove the resin material 260 attached to the mold. On the other hand, in order to prevent such resin leakage, the amount of the resin material 260 may be strictly adjusted, but this is not always appropriate because the process becomes complicated.
[0011]
An object of the present invention is to solve the above problems, and an object of the present invention is to provide a molding jig, a molding apparatus, and a molding method capable of preventing generation of burrs and leakage of a sealing material. It is in.
[0012]
[Means for Solving the Problems]
In order to achieve the above object, according to the present invention, a mold having a predetermined size is disposed inside a mold having a concave portion and a molded product is sealed with a sealing material. In a molding jig capable of producing a product, it is possible to surround the periphery of the molded product, the inner periphery has a height substantially equal to the thickness required for the molded product, and the height of the outer periphery Is a frame material lower than the height of the inner circumference.
[0013]
According to a second aspect of the present invention, in the molding jig, the frame member has an inner peripheral member having a height substantially equal to a thickness required for the molded article; An outer peripheral member having a height less than the height of the peripheral member and surrounding the inner peripheral member.
[0014]
According to a third aspect of the present invention, in the molding jig, an inner periphery of the frame member has a shape along an outer periphery of the molded article.
[0015]
According to a fourth aspect of the present invention, in the molding jig, an outer periphery of the frame member has a shape along a side surface of a concave portion of the mold.
[0016]
According to a fifth aspect of the present invention, there is provided a molding apparatus for sealing a molded article with a sealing material to produce a molded article having a predetermined size. And the mold, it is possible to surround the periphery of the molded article, the inner circumference has a height substantially equal to the thickness required for the molded article, the height of the outer circumference is the height of the inner circumference A film member is coated on a mold jig, which is a lower frame material, the upper surfaces of the first mold and the mold jig, and the lower surface of the second mold, and is surrounded by the mold jig. After the molded article is placed in the space provided, the lower surface of the second mold is opposed to the upper surface of the first mold, and at least one of the first and second molds is set to the other. While pressing, the space surrounded by the molding jig is filled with a sealing material. Characterized in that it comprises a to the sealing means.
[0017]
According to a sixth aspect of the present invention, there is provided a molding method for producing a molded product having a predetermined size by sealing the molded product with a sealing material. In the concave portion of the mold, it is possible to surround the periphery of the molded article, the inner periphery has a height substantially equal to the thickness required for the molded article, and the outer periphery has the inner height. Disposing a molding jig, which is a frame member having a height lower than the circumference, and forming a film member on the upper surface of the first mold and the molding jig and the lower surface of the second mold having a flat lower surface. Covering, and arranging an article to be molded in a space surrounded by the mold jig; and causing the lower surface of the second mold to face the upper surface of the first mold; While pressing at least one of the second molds to the other, the mold molding The enclosed space in characterized by comprising a step of filling with a sealing material.
[0018]
According to the present invention, since the inner circumference of the molding jig has a height substantially equal to the thickness required for the molded product, when at least one of the first and second molds is pressed against the other, The film material covering the upper surface of the inner peripheral portion of the molding jig and the film material covering the lower surface of the second mold can be brought into close contact with each other. Therefore, it is possible to prevent burrs from being generated on the outer periphery of the molded product.
[0019]
In addition, by setting the height of the outer periphery of the molding jig to be less than the height of the inner periphery, the outer periphery of the molding jig is surrounded by the first mold, the second mold, and the molding jig. In addition, a sufficient space can be formed, and it can be secured as an escape for extra resin that does not constitute a molded product. For this reason, it is possible to prevent resin leakage.
[0020]
BEST MODE FOR CARRYING OUT THE INVENTION
According to the present invention, the concave portion of the first mold having the concave portion on the upper surface can surround the periphery of the molded product, and the inner periphery has a height substantially equal to the thickness required for the molded product. Then, a mold forming jig which is a frame material whose outer periphery is lower than the inner periphery is arranged, and the upper surface of the first mold and the mold forming jig and the second mold of which the lower surface is flat are arranged. The lower surface is covered with a film member, and a molded object is arranged in a space surrounded by a molding jig. The lower surface of the second mold is opposed to the upper surface of the first mold. A molded product is produced by pressing at least one of the second dies against the other and filling a space surrounded by the molding jig with a sealing material.
[0021]
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
[0022]
FIG. 3 is a perspective view of a molding jig in the present embodiment, and FIG. 4 is a sectional view. The mold forming jig 100 shown in these figures is a ring-shaped member, and includes an inner peripheral member 101 and an outer peripheral member 102. The mold jig 100 is disposed inside a mold having a concave portion (lower mold), and is capable of producing a molded article of a predetermined size in which a semiconductor wafer to be molded is sealed with a resin. Things.
[0023]
The inner peripheral member 101 has a circumferential length capable of surrounding the periphery of the semiconductor wafer. The inner peripheral member 101 has a height substantially equal to the thickness required for a molded product. The inner periphery of the inner peripheral member 101 has a shape along the outer periphery of the semiconductor wafer.
[0024]
On the other hand, the outer peripheral member 102 has a height less than the height of the inner peripheral member 101 and is formed so as to surround the inner peripheral member 101. The outer periphery of the outer peripheral member 102 has a shape along the side surface of the concave portion of the mold.
[0025]
Hereinafter, a resin sealing step using the molding jig 100 will be described. FIG. 4 is a cross-sectional view illustrating a resin sealing step using the molding jig of the present embodiment.
[0026]
In the first step shown in FIG. 5A, the lower mold is formed by the inner frame mold 111 and the outer frame mold 112 which is arranged so as to surround the inner frame mold 111 and constitutes the lower mold. . The resin sealing device forms the recess 114 by making a difference in height between the inner frame mold 111 and the outer frame mold 112.
[0027]
Next, the resin sealing device arranges the molding jig 100 in the recess 114. As described above, the outer periphery of the outer peripheral member 102 constituting the molding jig 100 has a shape along the side surface of the concave portion 114. Therefore, the outer edge of the molding jig 100 is supported and fixed by the outer frame mold 112 constituting the side surface of the concave portion 114.
[0028]
Next, the resin sealing device covers the surfaces of the inner frame mold 111, the outer frame mold 112, and the mold jig 100 with the sealing film 113. The sealing film 113 is capable of withstanding the heating temperature of the mold, and has a constant shape so that the top of a metal column 151 formed on the semiconductor wafer 150 described later is exposed after resin sealing. A material having flexibility is used. The material of the sealing film 113 is, for example, PTFE, ETFE, PET, FEP, fluorine-impregnated glass cloth, polypropylene, polyvinylidene chloride, or the like.
[0029]
Further, the resin sealing device arranges the semiconductor wafer 150 in a space surrounded by the molding jig 100. At this time, the semiconductor wafer 150 is arranged such that the surface on which the metal pillars 151 are formed is the upper surface.
[0030]
After that, the resin sealing device places a tablet-shaped resin material 160 as a sealing material on the upper surface of the semiconductor wafer 150. Note that, instead of the tablet-shaped resin 160, a granular or liquid resin material may be used.
[0031]
Thereafter, in a second step shown in FIG. 5B, the resin sealing device includes an upper mold 118 whose lower surface is flat and whose lower surface is covered with a sealing film 119, an inner frame mold 111, and an outer mold. The frame mold 112 is arranged such that the lower surface of the upper mold 118 and the upper surfaces of the inner frame mold 111 and the outer frame mold 112 face each other and come into contact with each other.
[0032]
Next, the resin sealing device heats the upper mold 118, the inner frame mold 111, and the outer frame mold 112 to melt the resin material 160, and incorporates a drive motor and the like as sealing means. The inner frame mold 111 is moved upward by the drive mechanism 114. As a result, the lower mold and the upper mold 118 composed of the inner frame mold 111 and the outer frame mold 112 press each other. At this time, the resin material 160 is pressed vertically by the upper mold 118 and the inner frame mold 111 as the inner frame mold 111 moves upward. For this reason, the resin material 160 spreads outward while gradually melting, and when the space inside the inner peripheral member 101 of the mold jig 100 becomes narrower than a predetermined value, a part of the resin material 160 is removed from the mold jig. It flows out beyond the inner peripheral member 101 of 100.
[0033]
Then, in a third step shown in FIG. 5C, the resin sealing device sets the distance between the sealing film 119 covering the upper mold 118 and the sealing film 113 covering the inner frame mold 111 to the mold. When the height required for the molded product is reached, the upward movement of the inner frame mold 111 by the drive mechanism 114 is stopped.
[0034]
As described above, the inner peripheral member 101 of the molding jig 100 has a height substantially equal to the thickness required for the molded product. For this reason, when the distance between the sealing film 119 covering the upper mold 118 and the sealing film 113 covering the inner frame mold 111 becomes the height required for the molded product, the inner peripheral member The sealing film 113 covering the upper surface of the substrate 101 and the sealing film 119 covering the lower surface of the upper mold 118 are in close contact with each other.
[0035]
At this time, the space surrounded by the upper surface of the inner frame mold 111, the lower surface of the upper mold 118, and the inner surface of the inner peripheral member 101 is filled with the resin material 160, and the upper surface of the semiconductor wafer 150 is filled with the resin material 160. A sealed mold is produced.
[0036]
At this time, a space 170 surrounded by the outer surface of the inner peripheral member 101, the upper surface of the outer peripheral member 102, the inner surface of the outer frame mold 112, and the lower surface of the upper mold 118 is formed. In this space 170, the resin material 162 that has flowed out beyond the inner peripheral member 101 stays.
[0037]
However, since the space 170 has a sufficient volume, the entire space is not filled with the resin material 162. Therefore, it is possible to prevent the sealing films 113 and 119 from being torn by the pressure of the resin material 162, thereby preventing resin leakage. Since the sealing film 113 covering the upper surface of the inner peripheral member 101 and the sealing film 119 covering the lower surface of the upper mold 118 are in close contact with each other, the resin material 160 and the resin material 162 are separated. State. Therefore, it is possible to prevent burrs from being generated on the outer periphery of the molded product.
[0038]
The resin encapsulating device moves the upper mold 118 upward after curing the resin material 150 following the above-described process, and removes the molded product in which the upper surface of the semiconductor wafer 150 is sealed with the resin material 160. Take out.
[0039]
In the embodiment described above, the mold jig 100 has the inner peripheral member 101 and a height less than the height of the inner peripheral member 101, and is formed so as to surround the periphery of the inner peripheral member 101. As shown in the sectional view of FIG. 6, the inner peripheral member and the outer peripheral member are integrally formed, and the inclination gradually decreases from the inner peripheral side to the outer peripheral side as shown in the cross-sectional view of FIG. May be used.
[0040]
【The invention's effect】
As described above, according to the present invention, since the inner circumference of the molding jig has a height substantially equal to the thickness required for the molded product, at least one of the first and second dies is pressed against the other. When this is done, the film material covering the upper surface of the inner peripheral portion of the molding jig and the film material covering the lower surface of the second mold can be brought into close contact. Therefore, it is possible to prevent burrs from being generated on the outer periphery of the molded product.
[0041]
In addition, by setting the height of the outer periphery of the molding jig to be less than the height of the inner periphery, the outer periphery of the molding jig is surrounded by the first mold, the second mold, and the molding jig. In addition, a sufficient space can be formed, and it can be secured as an escape for extra resin that does not constitute a molded product. For this reason, it is possible to prevent resin leakage.
[Brief description of the drawings]
FIG. 1 is a perspective view of a conventional molding jig.
FIG. 2 is a sectional view showing a resin sealing step using a conventional molding jig.
FIG. 3 is a perspective view of a molding jig of the present embodiment.
FIG. 4 is a sectional view of a molding jig of the present embodiment.
FIG. 5 is a cross-sectional view showing a resin sealing step using the molding jig of the present embodiment.
FIG. 6 is a cross-sectional view of a modification of the molding jig.
[Explanation of symbols]
100, 100a Molding jig 101 Inner peripheral member 102 Outer peripheral member 111 Inner frame mold 112 Outer frame mold 113, 119 Sealing film 114 Drive mechanism 118 Upper mold 150 Semiconductor wafer 151 Metal columnar body 160, 162 Resin material

Claims (6)

In a molding jig which is arranged inside a mold having a concave portion and which can produce a molded product having a predetermined size in which a molded product is sealed with a sealing material,
It is possible to surround the periphery of the molded article, the inner periphery has a height substantially equal to the thickness required for the molded article, the outer periphery of the frame material is lower than the height of the inner periphery A mold forming jig characterized by the following. The mold forming jig according to claim 1,
The frame material is
An inner peripheral member having a height substantially equal to the thickness required for the molded product,
An outer peripheral member having a height less than the height of the inner peripheral member and surrounding the inner peripheral member;
A molding jig characterized by comprising: The mold jig according to claim 1,
A molding jig, wherein an inner periphery of the frame material has a shape along an outer periphery of the molded article. The molding jig according to any one of claims 1 to 3,
A molding jig, wherein an outer periphery of the frame material has a shape along a side surface of a concave portion of the mold. In a molding device that seals a molded product with a sealing material and generates a molded product of a predetermined size,
A first mold having a concave portion on the upper surface,
It is possible to surround the periphery of the molded article, the inner periphery has a height substantially equal to the thickness required for the molded article, the outer periphery of the frame material is lower than the height of the inner periphery With a certain mold molding jig,
A second mold having a flat lower surface;
After the upper surface of the first mold and the upper surface of the molding jig and the lower surface of the second mold are covered with a film member, and after the article to be molded is arranged in a space surrounded by the molding jig, The lower surface of the second mold is opposed to the upper surface of the first mold, and at least one of the first and second molds is pressed against the other, and is surrounded by the molding jig. Sealing means for filling the filled space with a sealing material,
A molding apparatus comprising: In a molding method for sealing a molded article with a sealing material and generating a molded article of a predetermined size,
In the concave portion of the first mold having a concave portion on the upper surface, it is possible to surround the periphery of the molded product, the inner periphery has a height substantially equal to the thickness required for the molded product, A step of arranging a molding jig that is a frame material whose outer peripheral height is lower than the inner peripheral height,
Covering the upper surface of the first mold and the molding jig and the lower surface of the second mold having a flat lower surface with a film member;
A step of arranging a molded article in a space surrounded by the mold jig,
A space surrounded by the molding jig, with the lower surface of the second mold facing the upper surface of the first mold and at least one of the first and second molds pressed against the other. Filling with a sealing material,
A molding method characterized by comprising:

Images