JP2004047855A - Semiconductor laser equipment, optical pickup, and optical disk drive - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To precisely define the position of a luminous point of a semiconductor laser chip to a supporter. <P>SOLUTION: A latch (projection part) 4 whose relative position to the position of a luminous point 5 of laser beam is defined is formed parallel to an optical axis of a laser beam on the mount surface 3a of the semiconductor laser chip 3 to the supporter 1, and a positioning part (recess) 2 which defines the position of the luminous point 5 of the semiconductor laser chip 3 to the supporter 1 engaged with the latch 4 is formed on the mount surface 1a of the supporter 1. Therefore, it is possible to define the position of the luminous point 5 of the semiconductor laser chip 3 precisely by mounting the semiconductor laser chip 3 on the supporter 1 with the latch 4 and the positioning part 2 engaged with each other. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a semiconductor laser device used for a laser light source for recording and reproducing data on and from an optical disk, a laser light source for a data writing system in a laser printer and a digital copying machine, and more particularly to an improvement in a mount for a semiconductor laser chip. About.
[0002]
[Prior art]
In mounting a semiconductor laser chip on a support such as a silicon substrate, if an error occurs in the mounting position of the semiconductor laser chip with respect to the support, the spot position of the laser beam will not be constant. In particular, in a semiconductor laser device in which a plurality of semiconductor laser chips are mounted on a support, it is necessary to control the relative positions of light emitting points between the plurality of semiconductor laser chips with high accuracy.
[0003]
As a semiconductor laser device requiring a plurality of semiconductor laser chips, for example, in order to be able to read data written on an optical disc such as a CD (Compact Disc) and a DVD (Digital Versatile Disc), emission wavelengths are different. Some types of semiconductor laser chips are mounted on one support. In an optical disk device such as a DVD player on which such a semiconductor laser device is mounted, compatibility between the DVD and the CD when reproducing them is desired. For that purpose, an optical pickup mounted with a red semiconductor laser of 660 nm having a short wavelength for reproducing a DVD and a near-infrared semiconductor laser of 780 nm for reproducing a CD is required. The realization of an integrated optical pickup in which a semiconductor laser chip is incorporated in one package is expected. As a method of mounting such two semiconductor laser chips having different emission wavelengths close to each other, a structure of a semiconductor laser device disclosed in Japanese Patent Application Laid-Open No. H11-112089 shown in FIG. 7 is disclosed. FIG. 7 shows a state in which a first semiconductor laser chip 100 for CD and a second semiconductor laser 101 for DVD having different emission wavelengths are mounted on a submount (substrate) in a junction-down manner. Note that the shape of the emission end face of the second semiconductor laser chip 101 for DVD is a parallelogram due to crystal growth. According to the present invention, the distance L (see FIG. 7) between the light emitting points 102 and 103 can be reduced to about 100 μm by biasing the positions of the light emitting points 102 and 103 of the semiconductor laser chips 100 and 101 toward the ends. I have to.
[0004]
However, in such a two-wavelength light source, the specifications of the distance L between the light emitting points 102 and 103 of the two semiconductor laser chips 100 and 101 and the parallelism of light emitted from the two semiconductor laser chips 100 and 101 are strict. For example, the error of the interval L between the light emitting points 102 and 103 is required to be ± 10 μm, and the difference between the emission angles of the two semiconductor laser chips 102 and 103 is required to be ± 0.5 ° or less.
[0005]
The necessity of accurately determining the position of the light emitting point of the semiconductor laser chip with respect to the submount is required even when one semiconductor laser chip is mounted. To perform such high-precision mounting, an expensive die bonding apparatus capable of high-precision positioning is required, and such a high-precision die bonding apparatus requires about 20 seconds for one positioning. There was a disadvantage that the tact was slow.
[0006]
[Problems to be solved by the invention]
As a method of accurately positioning the semiconductor laser chip, a method utilizing the surface tension of a solder material (AuSn) for die-bonding the semiconductor laser chip is disclosed in, for example, Japanese Patent Application Laid-Open No. 6-181367. It is difficult and impractical to correct the position of the semiconductor laser chip with the surface tension of the solder.
[0007]
As shown in FIG. 8, as a method of more positively positioning the semiconductor laser chip 104, a groove 106 is formed on the surface of the heat sink 105, and the semiconductor laser chip 104 is abutted against one side surface 107 of the groove 106. Japanese Patent Application Laid-Open No. 2001-274499 discloses the mounting.
[0008]
However, in the semiconductor laser chip 104, although the emission end face on the near side or the back side with respect to the paper surface in FIG. 8 has extremely accurate parallelism, the side face perpendicular to the parallel face (in FIG. The abutment surface) is prone to chipping when the cleft is opened, and is not very accurate. Therefore, when the outer shape is used as a reference, the position of the light emitting point can be mounted only with an accuracy of about ± 20 μm.
[0009]
SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and has a light emitting point in a structure of a semiconductor laser device capable of improving the mounting accuracy of a semiconductor laser chip in a semiconductor laser device, particularly, in a semiconductor laser device having a plurality of semiconductor laser chips. The purpose is to be able to accurately define the position of.
[0010]
[Means for Solving the Problems]
The invention according to claim 1 is a semiconductor laser device in which a semiconductor laser chip that emits laser light is mounted on a support, wherein a mounting surface of the semiconductor laser chip with respect to the support has a light emitting point position of the laser light. A locking portion whose relative position is defined is formed in parallel with the optical axis of the laser beam, and the mounting surface of the support with respect to the semiconductor laser chip is locked with the locking portion to form the support. And a positioning portion for defining the light emitting point position of the semiconductor laser chip with respect to.
[0011]
Therefore, by mounting the semiconductor laser chip on the support in a state where the locking portion formed on the semiconductor laser chip and the positioning portion formed on the support are locked, the light emitting point position of the semiconductor laser chip can be changed. It is possible to specify with high precision.
[0012]
The invention according to claim 2 is a semiconductor laser device in which a plurality of semiconductor laser chips that emit laser light are mounted on a support, wherein each mounting surface of the semiconductor laser chip with respect to the support has the laser light. A locking part whose position relative to the light emitting point position is defined is formed in parallel with the optical axis of the laser beam, and the mounting surface of the support for the semiconductor laser chip is locked with the locking part. And a plurality of positioning portions for defining the light emitting point position of the semiconductor laser chip with respect to the support.
[0013]
Therefore, by mounting the semiconductor laser chip on the support with the locking portions formed on the plurality of semiconductor laser chips and the positioning portions formed on the support locked together, the plurality of semiconductor laser chips can be mounted. The light emitting point position can be defined with high accuracy.
[0014]
According to a third aspect of the present invention, in the semiconductor laser device according to the first or second aspect, the locking portion is a convex portion having a polygonal outline shape, and the positioning portion corresponds to the outline shape of the locking portion. It is a polygonal concave portion.
[0015]
Therefore, the same effect as the semiconductor laser device according to claim 1 or 2 can be obtained, and furthermore, the rotation of the semiconductor laser chip with respect to the support body by the locking of the locking portion and the positioning portion each having a polygonal contour shape. Direction displacement can be prevented.
[0016]
According to a fourth aspect of the present invention, in the semiconductor laser device according to the third aspect, at least one of the opposite sides of the concave portion and the convex portion has a contact force between the side of the concave portion and the side of the convex portion. An inclined surface is formed which slides the center of the convex portion toward the center of the concave portion by the component force generated by the above.
[0017]
Therefore, the same effect as that of the semiconductor laser device according to the third aspect can be obtained, and furthermore, the semiconductor with respect to the supporting member can be obtained simply by bringing the side of the projection as the locking portion into contact with the side of the recess as the positioning portion. The light emitting point position of the laser chip can be automatically determined with high accuracy.
[0018]
According to a fifth aspect of the present invention, in the semiconductor laser device according to the first or second aspect, the projection formed on the mounting surface of the semiconductor laser chip also serves as a metal electrode.
[0019]
Therefore, by using the convex portion of the semiconductor laser chip also as the metal electrode, the convex portion can be formed by gold plating using the photolithography technique as in the related art, so that a convex portion with high positional accuracy can be obtained. Gold, which is a material for the metal electrode, is well compatible with AuSn, a solder material for die bonding, and thus good adhesion can be secured.
[0020]
According to a sixth aspect of the present invention, in the semiconductor laser device according to the fourth aspect, a plurality of convex portions are formed on the mounting surface of the one semiconductor laser chip, and the number of the convex portions corresponds to the number of these convex portions. A recess is also formed in the mounting surface of the support.
[0021]
Therefore, the same effect as that of the semiconductor laser device according to the fourth aspect can be obtained, the position of the semiconductor laser chip can be more reliably specified, and the adhesion of the semiconductor laser chip to the support can be improved. Can also be expected.
[0022]
According to a seventh aspect of the present invention, in the semiconductor laser device according to the fourth aspect, the width of the protrusion formed on the mounting surface of the semiconductor laser chip is W. ₂ , The height of the protrusion is t, and the opening width of the recess in the support is W ₁ When the depth of the concave portion is d and the angle of inclination of the inclined surface with respect to the surface of the support is θ, under the condition of d> t,
W ₂ > W ₁ -2t / tan θ
Is established.
[0023]
Therefore, the projecting portion of the semiconductor laser chip can automatically determine the light emitting point position of the semiconductor laser chip with respect to the support with high precision by the component force generated by contact with the inclined surfaces on both sides of the concave portion of the support. .
[0024]
According to an eighth aspect of the present invention, in the semiconductor laser device according to the fourth aspect, a silicon (100) substrate is used as the support, and the silicon (100) substrate is anisotropically etched in the recess. Is formed by
[0025]
Therefore, by etching the surface of the silicon (100) substrate with a potassium hydroxide-based aqueous solution, the inclination angle of the inclined surface with respect to the surface of the silicon (100) substrate as the support is accurately defined to a desired angle. And the productivity of the support having the concave portions can be increased.
[0026]
According to a ninth aspect of the present invention, in the semiconductor laser device of the second aspect, the plurality of semiconductor laser chips mounted on the support have different emission wavelengths.
[0027]
Therefore, it is possible to emit light having different emission wavelengths from one semiconductor laser device in the same package. For example, for an optical pickup, a semiconductor laser chip for CD and a semiconductor laser for DVD are mounted on one support. By mounting the chip, reproduction, recording, or erasing of a CD and a DVD can be performed using a semiconductor laser device of one package, which can contribute to miniaturization and cost reduction of an optical pickup.
[0028]
According to a tenth aspect of the present invention, there is provided the semiconductor laser device according to any one of the first to ninth aspects, a converging optical system for converging a beam emitted from the semiconductor laser device on an optical disk, and a beam reflected from the optical disk. An optical pickup comprising: a light receiving element that receives a detection light and outputs a detection signal corresponding to a convergence position of the detection light with respect to the optical disk; and an optical element that is disposed in a detection optical path from the optical disk to the light receiving element. It is.
[0029]
Therefore, it is possible to provide an optical pickup capable of defining the light emitting point position of the semiconductor laser chip with high accuracy.
[0030]
According to an eleventh aspect of the present invention, there is provided an optical disk rotation driving unit for driving the optical disk to rotate, an optical pickup according to the tenth aspect, and an optical pickup scanning unit for scanning the optical pickup in a radial direction of the optical disk. It is an optical disk drive.
[0031]
Therefore, it is possible to provide an optical disk drive capable of defining the light emitting point position of the semiconductor laser chip with high accuracy.
[0032]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the semiconductor laser device of the present invention will be described with reference to the drawings. FIG. 1 is an explanatory view showing a first embodiment of a semiconductor laser device of the present invention, which is an explanatory view seen from a light emitting point side (an emission end face side). In the semiconductor laser device A according to the present embodiment, a shallow concave portion 2 as a positioning portion is formed on a surface of a submount 1 as a support, and a recess formed on a mounting surface 3a of a semiconductor laser chip 3 in the concave portion 2. It is mounted with solder 6 so that the convex part 4 as a stop part is embedded. The convex portion 4 on the surface of the semiconductor laser chip 3 is formed of gold so that the center of the convex portion 4 coincides with the center of the light emitting point 5 so that the relative position with respect to the light emitting point 5 is defined. The concave portion 2 and the convex portion 4 have a polygonal (quadrangle in this example) contour shape having sides parallel to the optical axis (perpendicular to the paper surface in FIG. 1) of the laser beam emitted from the light emitting point 5. Have. Further, the concave portion 2 has a trapezoidal cross-sectional shape. Thereby, the inclined surfaces 2a having the same inclination angle θ are formed on the four sides of the concave portion 2. In FIG. 1, reference numeral 7 denotes a gold base electrode 7 mainly formed by vapor deposition on the mounting surface 3a of the semiconductor laser chip 3, reference numeral 8 denotes a bonding pad formed by gold plating, and reference numeral 9 denotes a mounting surface 1a of the submount 1. Bonding pads 10 formed by gold vapor deposition are bonding wires for taking out leads.
[0033]
Here, the width of the protrusion 4 formed on the mounting surface 3a of the semiconductor laser chip 3 is represented by W ₂ , The height of the convex portion 4 is t, and the opening width of the concave portion 2 of the submount 1 is W ₁ When the depth of the concave portion 2 is d and the inclination angle of the inclined surface 2a with respect to the surface of the submount 1 is θ, under the condition of d> t,
W ₂ > W ₁ -2t / tan θ
Is established.
[0034]
As described above, in the semiconductor laser device A, when the convex portion 4 of the semiconductor laser chip 3 is fitted into the concave portion 2 of the submount 1, the convex portion 4 is formed between the sides on both sides thereof and the inclined surfaces 2a on both sides of the concave portion 2. Sliding toward the center of the recess 2 due to the component force generated by the contact. In addition, when the inclined surfaces 2a are not formed on both sides of the concave portion 2 and the inclined surfaces (not shown) are formed on both sides of the convex portion 4, or each of the concave portions 2 and the convex portions 4 Similar effects can be obtained even if an inclined surface is formed on the side. Since the position of the projection 4 relative to the light emitting point 5 is defined, the position of the light emitting point 5 of the semiconductor laser chip 3 with respect to the submount 1 can be automatically determined with high accuracy.
[0035]
Further, the convex portion 4 of the semiconductor laser chip 3 is formed of gold also serving as a metal electrode, and can be formed by using a semiconductor fine processing technique, so that the positional accuracy of the convex portion 4 is high.
[0036]
Further, the concave portion 2 on the surface of the submount 1 can be easily formed by using anisotropic etching of silicon. For example, a silicon (100) substrate is used as a material of the submount 1, and the substrate 2 is etched with a potassium hydroxide-based aqueous solution to form the concave portion 2 having an inclination angle θ of 54 °. Since this method is also realized by using the semiconductor fine processing technology, there is an advantage that the positional accuracy is extremely high. Also, as a method other than the anisotropic etching of silicon, it can be easily formed by cutting with a diamond blade.
[0037]
Next, a second embodiment of the semiconductor laser device of the present invention will be described with reference to FIG. The same parts as those in the above-described embodiment are denoted by the same reference numerals, and description thereof is omitted. FIG. 2 is an explanatory diagram showing a second embodiment of the semiconductor laser device of the present invention, which is an explanatory diagram viewed from a light emitting point side (an emission end face side). The semiconductor laser device B according to the second embodiment has the same configuration as the semiconductor laser device A according to the above embodiment, except that the cross-sectional shape of the concave portion 2 on the surface of the submount 1 is triangular. In this case, since the concave portion 2 has a triangular cross-sectional shape, inclined surfaces 2a are formed on both sides.
[0038]
Therefore, in the semiconductor laser device B, when the convex portion 4 of the semiconductor laser chip 3 is fitted into the concave portion 2 of the submount 1 as described above, the convex portion 4 has both sides and the inclined surfaces 2a on both sides of the concave portion 2. As the component slides toward the center of the concave portion 2 due to the component force generated by contact with the submount 1, the position of the light emitting point 5 of the semiconductor laser chip 3 with respect to the submount 1 is automatically determined with high precision. be able to.
[0039]
Next, a third embodiment of the semiconductor laser device of the present invention will be described with reference to FIG. The same parts as those in the above-described embodiment are denoted by the same reference numerals, and description thereof is omitted. FIG. 3 is an explanatory diagram showing a third embodiment of the semiconductor laser device of the present invention, which is an explanatory diagram viewed from a light emitting point side (an emission end face side). In the semiconductor laser device C according to the third embodiment, two projections 4 are formed on the surface of a semiconductor laser chip 3, and a depression 2 having a triangular cross section is formed on the surface of the submount 1. . Therefore, there is an effect that the more accurate alignment becomes possible and the adhesion strength is improved.
[0040]
Next, a fourth embodiment of the semiconductor laser device of the present invention will be described with reference to FIG. The same parts as those in the above-described embodiment are denoted by the same reference numerals, and description thereof is omitted. FIG. 4 is an explanatory view showing a fourth embodiment of the semiconductor laser device of the present invention, which is an explanatory view seen from a light emitting point side (an emission end face side). The semiconductor laser device D according to the fourth embodiment is proposed as a light source for an optical pickup for both CD and DVD. Two semiconductor laser chips 11 and 12 are mounted on one submount 1. In the figure, the left semiconductor laser chip 11 has a light emission wavelength of 780 nm for a CD, and the right semiconductor laser chip 12 has a light emission wavelength of 660 nm for a DVD made using an inclined substrate. In the light source for both CD and DVD, the interval L between the light emitting points 5 of the two semiconductor laser chips 11 and 12 needs to be reduced to about 100 μm. Therefore, special semiconductor laser chips 11 and 12 in which the light emitting point 5 is biased toward the end as shown are used. Further, in such a light source, mounting precision is required to be extremely strict with respect to the interval L between the light emitting points 5 and the parallelism of the light beam.
[0041]
In the semiconductor laser device D shown in FIG. 4, when the two semiconductor laser chips 11 and 12 are mounted on the submount 1, the light emitting points 5 of the two semiconductor laser chips 11 and 12 are arranged at a desired interval. The convex portion 4 is formed on the submount 1 and the concave portion 2 is formed on the submount 1.
[0042]
As described above, the convex portions 4 are formed on each of the semiconductor laser chips 11 and 12, the concave portions 2 are formed on the submount 1, and the two are combined. A light source semiconductor laser device D can be provided.
[0043]
Next, an embodiment of the optical pickup of the present invention will be described with reference to FIG. FIG. 5 is an explanatory diagram showing a schematic configuration of the optical pickup. This optical pickup 20 uses the semiconductor laser device D of the two-wavelength light source described in FIG. 4 in the present embodiment, but the semiconductor laser device A of FIG. 1, the semiconductor laser device B of FIG. 2, and the semiconductor laser device of FIG. The laser device C may be used.
[0044]
The schematic configuration of the optical pickup 20 will be described together with the operation. The laser light emitted from the semiconductor laser device D is converted into substantially parallel light by the collimator lens 21, passes through the beam splitter 22, is deflected by 90 degrees in the optical path by the deflecting prism 23, and is incident on the objective lens 24 which is a converging optical system. Then, the light passes through the transparent substrate of the optical disk 25 and is converged as a minute spot on the recording surface. The reproduction, recording, or erasing of information is performed by the minute spot.
[0045]
The light reflected on the recording surface of the optical disk 25 is converted into substantially parallel light again by the objective lens 24, deflected by 90 degrees by the deflecting prism 23, reflected by the beam splitter 22, converged by the condenser lens 26, and received The device (PD) 27 is reached. From the light receiving element 27, an information signal and a servo signal are detected.
[0046]
Next, an embodiment of the optical disk drive of the present invention will be described with reference to FIG. FIG. 6 is a plan view showing a schematic configuration of the optical disk drive. The optical disc drive 30 according to the present embodiment includes an optical disc rotation driving unit 31 for driving the optical disc 25 to rotate, the optical pickup 20 described above, and an optical pickup scanning unit 32 for scanning the optical pickup 20 in the radial direction of the optical disc 25. And
[0047]
The optical disk rotation driving means 31 includes a turntable 33 for detachably holding the optical disk 25, a spindle motor (not shown) for rotating the turntable 33, and a rotation control circuit (not shown) for controlling the operation of the spindle motor. Z).
[0048]
The optical pickup scanning means 32 includes two guide rails 34 for slidably holding the outer casing of the optical pickup 20 in the radial direction of the optical disk 25 and a feed screw 35 arranged along one of the guide rails 34. A rack 36 fixed to the outer casing of the optical pickup 20 and meshed with the feed screw 35; a scanning motor 37; a gear train 38 for transmitting the rotation of the scanning motor 37 to the feed screw 35; A scanning control circuit (not shown) for controlling the operation.
[0049]
Accordingly, when the spindle motor is driven, the turntable 33 is driven to rotate together with the optical disk 25, and when the scanning motor 37 is driven, the optical pickup 20 is scanned in the radial direction of the optical disk 25. In this process, by driving the optical pickup 20, the reproduction of data written on the optical disk 25 and the recording or erasing of data on the optical disk 25 are performed.
[0050]
【The invention's effect】
According to the first aspect of the present invention, the semiconductor laser chip is mounted on the support in a state where the locking portion formed on the semiconductor laser chip and the positioning portion formed on the support are locked. It is possible to provide a semiconductor laser device capable of defining a light emitting point position of a semiconductor laser chip with high accuracy.
[0051]
According to the second aspect of the present invention, the semiconductor laser chip is mounted on the support with the locking portions formed on the plurality of semiconductor laser chips and the positioning portions formed on the support locked together. Accordingly, it is possible to provide a semiconductor laser device capable of defining the light emitting point positions of a plurality of semiconductor laser chips with high accuracy.
[0052]
According to the third aspect of the present invention, in the semiconductor laser device according to the first or second aspect, the locking portion is a convex portion having a polygonal outline shape, and the positioning portion has multiple shapes corresponding to the outline shape of the locking portion. Since it is a rectangular concave portion, the same effect as the semiconductor laser device according to claim 1 or 2 can be obtained, and furthermore, the contour of the support member is determined by locking the polygonal locking portion and the positioning portion. The displacement of the semiconductor laser chip in the rotational direction can be prevented.
[0053]
According to the fourth aspect of the present invention, in the semiconductor laser device according to the third aspect, at least one of the opposing sides of the concave portion and the convex portion is generated by a contact force between the side of the concave portion and the side of the convex portion. Since the inclined surface that slides the center of the convex portion toward the center of the concave portion by the component force is formed, the same effect as the semiconductor laser device according to claim 3 can be obtained, and furthermore, the locking portion It is possible to automatically and precisely determine the position of the light emitting point of the semiconductor laser chip with respect to the support simply by bringing the side of the convex portion, which is described above, into contact with the side of the concave portion, which is the positioning portion.
[0054]
According to the fifth aspect of the present invention, in the semiconductor laser device according to the first or second aspect, the convex portion formed on the mounting surface of the semiconductor laser chip also serves as a metal electrode. By also using the electrodes, they can be formed by gold plating using a photolithography technique as in the past, so that it is possible to obtain projections with high positional accuracy, and the gold used as the material of the metal electrodes is made of a die. Good adhesion to AuSn, a solder material for bonding, can be ensured.
[0055]
According to a sixth aspect of the present invention, in the semiconductor laser device according to the fourth aspect, a plurality of convex portions are formed on a mounting surface of one semiconductor laser chip, and the number of concave portions corresponds to the number of these convex portions. Is also formed on the mounting surface of the support, so that the same effect as that of the semiconductor laser device according to claim 4 can be obtained, and furthermore, the position of the semiconductor laser chip can be defined more reliably. In addition, an improvement in the adhesion of the semiconductor laser chip to the support can be expected.
[0056]
According to the seventh aspect of the present invention, in the semiconductor laser device according to the fourth aspect, the width of the protrusion formed on the mounting surface of the semiconductor laser chip is W. ₂ , The height of the convex portion is t, and the opening width of the concave portion of the support is W ₁ When the depth of the concave portion is d and the angle of inclination of the inclined surface with respect to the surface of the support is θ, W ₂ > W ₁ Since the relationship of -2t / tan θ is established, the convex portion of the semiconductor laser chip automatically adjusts the light emitting point position of the semiconductor laser chip with respect to the support by the component force generated by contact with the inclined surfaces on both sides of the concave portion of the support. Can be determined with high precision.
[0057]
According to an eighth aspect of the present invention, in the semiconductor laser device according to the fourth aspect, a silicon (100) substrate is used as the support, and the concave portion is formed by performing anisotropic etching on the silicon (100) substrate. Since the silicon (100) substrate is formed, the surface of the silicon (100) substrate is subjected to an etching treatment with a potassium hydroxide-based aqueous solution so that the inclination angle of the inclined surface with respect to the surface of the silicon (100) substrate as a support is set to a desired angle. And the productivity of the support having the concave portion can be increased.
[0058]
According to the ninth aspect of the present invention, in the semiconductor laser device according to the second aspect, since the plurality of semiconductor laser chips mounted on the support have different emission wavelengths, the plurality of semiconductor laser chips are separated from one semiconductor laser device in the same package. It is possible to emit light having different emission wavelengths. For example, by mounting a semiconductor laser chip for CD and a semiconductor laser chip for DVD on one support for an optical pickup, Reproduction, recording, or erasing of CDs and DVDs can be performed using a semiconductor laser device, which can contribute to miniaturization and cost reduction of an optical pickup.
[0059]
According to a tenth aspect of the present invention, there is provided the semiconductor laser device according to any one of the first to ninth aspects, a converging optical system for converging a beam emitted from the semiconductor laser device on an optical disk, and a converging optical system for reflecting the beam emitted from the optical disk. A light receiving element for receiving the detected light and outputting a detection signal corresponding to the convergence position of the detected light with respect to the optical disk; and an optical element arranged in a detection optical path from the optical disk to the light receiving element. It is possible to provide an optical pickup capable of defining a light emitting point position of a chip with high accuracy.
[0060]
According to an eleventh aspect of the present invention, there is provided an optical disk rotation driving means for driving the optical disk to rotate, an optical pickup according to the tenth aspect, and an optical pickup scanning means for scanning the optical pickup in a radial direction of the optical disk. Therefore, it is possible to provide an optical disk drive capable of defining the light emitting point position of the semiconductor laser chip with high accuracy.
[Brief description of the drawings]
FIG. 1 is an explanatory diagram showing a first embodiment of a semiconductor laser device of the present invention.
FIG. 2 is an explanatory view showing a second embodiment of the semiconductor laser device of the present invention.
FIG. 3 is an explanatory view showing a third embodiment of the semiconductor laser device of the present invention.
FIG. 4 is an explanatory view showing a fourth embodiment of the semiconductor laser device of the present invention.
FIG. 5 is an explanatory diagram showing one embodiment of the optical pickup of the present invention.
FIG. 6 is a plan view showing an embodiment of the optical disk drive of the present invention.
FIG. 7 is an explanatory view showing a conventional example of a semiconductor laser device.
FIG. 8 is an explanatory view showing another conventional example of a semiconductor laser device.
[Explanation of symbols]
A, B, C, D semiconductor laser devices
1 Support
1a Mounting surface
2 Positioning part, recess
2a Inclined surface
3 Semiconductor laser chip
3a mounting surface
4 Locking part, recess
5 Emission point
11,12 Semiconductor laser chip
20 Optical pickup
24 focusing optics
25 Optical Disk
27 Light receiving element
31 Optical disk rotation drive means
32 Optical pickup scanning means

Claims (11)

In a semiconductor laser device in which a semiconductor laser chip that emits laser light is mounted on a support,
On the mounting surface of the semiconductor laser chip with respect to the support, a locking portion that defines a position relative to a light emitting point position of the laser light is formed parallel to the optical axis of the laser light, and A semiconductor laser device, wherein a positioning portion that locks with the locking portion and defines the light emitting point position of the semiconductor laser chip with respect to the support is formed on a mount surface of the support. In a semiconductor laser device in which a plurality of semiconductor laser chips that emit laser light are mounted on a support,
On each mounting surface of the semiconductor laser chip with respect to the support, a locking portion is formed in parallel with the optical axis of the laser light, the locking portion defining a position relative to a light emitting point position of the laser light. A semiconductor laser device, wherein a plurality of positioning portions are formed on a mounting surface of the support for the chip, the plurality of positioning portions engaging with the locking portions and defining the light emitting point position of the semiconductor laser chip with respect to the support. The semiconductor laser device according to claim 1, wherein the locking portion is a convex portion having a polygonal contour, and the positioning portion is a polygonal concave portion corresponding to the contour shape of the locking portion. Opposite sides of at least one of the concave portion and the convex portion have the center of the convex portion directed toward the center of the concave portion by a component force generated by the contact force between the side of the concave portion and the side of the convex portion. 4. The semiconductor laser device according to claim 3, wherein an inclined surface to be slid is formed. The semiconductor laser device according to claim 1, wherein the protrusion formed on the mounting surface of the semiconductor laser chip also serves as a metal electrode. 5. The mounting surface of the one semiconductor laser chip is formed with a plurality of projections, and the number of depressions corresponding to the number of these projections is also formed on the mounting surface of the support. 13. The semiconductor laser device according to claim 1. Said semiconductor laser chip W ₂ the widths of said convex portion formed on the mounting _surface, the height of the convex portion t, W ₁ the opening width of the recess of the _support, the depth of the concave portion d, When the inclination angle of the inclined surface with respect to the surface of the support is θ, under the condition of d> t,
W ₂ > W ₁ -2t / tan θ
5. The semiconductor laser device according to claim 4, wherein the following relationship is satisfied. 5. The semiconductor laser device according to claim 4, wherein a silicon (100) substrate is used as the support, and the recess is formed by performing an anisotropic etching process on the silicon (100) substrate. 3. The semiconductor laser device according to claim 2, wherein the plurality of semiconductor laser chips mounted on the support have different emission wavelengths. A semiconductor laser device according to any one of claims 1 to 9,
A converging optical system for converging a beam emitted from the semiconductor laser device onto an optical disc;
A light receiving element that receives detection light reflected from the optical disk and outputs a detection signal according to a convergence position of the detection light with respect to the optical disk;
An optical element disposed in a detection optical path from the optical disk to the light receiving element. Optical disk rotation driving means for driving the optical disk to rotate,
An optical pickup according to claim 10,
Optical pickup scanning means for scanning the optical pickup in a radial direction of the optical disc,
An optical disk drive comprising:

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