JP2005311203A - Fixing holder for light-emitting element, optical pickup, and information processing device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a fixing holder for a semiconductor laser that adjusts the direction of light projected from a semiconductor laser and radiates heat efficiently. <P>SOLUTION: The fixing holder 1 comprises a sub-holder 2 and a main holder 3. The sub-holder 2, fitted with a semiconductor laser 101, has a convex spherical surface 2a formed of a portion of a spherical surface having a radius SR1 of curvature. The main holder 3, fitted with the sub-holder 2, has a concave spherical surface 3a formed of a portion of a spherical surface having a radius SR2 of curvature. The sub-holder 2 is fixed to the main holder 3, by fitting the convex spherical surface 2a in the concave spherical surface 3a. Then an adhesive enters the part between the convex spherical surface 2a and concave spherical surface 3a, by setting SR1<SR2, and an adhesive groove is formed of a gap where the entering adhesive can be cured. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a fixed holder for fixing a light emitting element such as a semiconductor laser, an optical pickup incorporating the fixed holder, and an information processing apparatus. Specifically, the mounting angle of the light emitting element can be adjusted while considering heat dissipation by configuring the fixed holder by combining the convex spherical surface and the concave spherical surface.

  In an information processing apparatus that records or reproduces information by irradiating a recording medium with light, the recording medium is an optical disc such as a CD (Compact Disc), a CD-R (CD-Recordable), a DVD (Digital Versatile Disc), or the like. A magneto-optical disk such as (Mini Disc) is used. A semiconductor laser is used as the light emitting element.

  FIG. 7 is a perspective view showing a configuration example of a general semiconductor laser. The semiconductor laser 101 is configured by housing a laser element (not shown) in a cylindrical package 103 having a flange portion 102. A window portion 104 through which light is transmitted is formed in the package 103, and a lead 105 protrudes from the back surface of the flange portion 102. In the semiconductor laser 101 having such a configuration, the front surface of the flange portion 102 is used as the reference surface L.

  The light emitted from the semiconductor laser 101 is emitted from the light emitting point P with a predetermined divergence angle. In the semiconductor laser 101, when an axis perpendicular to the reference plane L passing through the light emitting point P is defined as a Z axis and orthogonal coordinates passing through the light emitting point P and perpendicular to the Z axis are defined as an X axis and a Y axis, the vertical divergence angle θh is Since it is larger than the horizontal divergence angle θv, the emission pattern of the semiconductor laser 101 becomes an ellipse whose radius in the Y-axis direction is longer than that in the X-axis direction. The vertical divergence angle θh is about 21 °, and the horizontal divergence angle θv is about 9 °.

  The semiconductor laser 101 is manufactured so that a light beam is emitted along the Z-axis. However, there are variations in the direction in which the light beam is emitted due to a manufacturing error or the like.

  FIG. 8 is a perspective view showing the deviation of the emitted light of the semiconductor laser. In the semiconductor laser 101, the central axis of the light beam emitted from the semiconductor laser 101 is tilted by Δθv in the X-axis direction and Δθh in the Y-axis direction with respect to the Z-axis due to a chip mounting error (not shown). There are many cases.

  The light emitted from the semiconductor laser 101 is irradiated onto the recording medium through an optical system combined with a lens and the like. For this reason, if the center axis of the light beam emitted from the semiconductor laser 101 is inclined with respect to the Z axis, the center of the light intensity distribution is shifted from the center of the optical axis of the optical system.

  If the center of the light intensity distribution is deviated from the center of the optical axis of the optical system, the light intensity distribution in the central portion will not be maximized in the light spot formed by irradiating the optical beam with the light beam. Therefore, accurate pits cannot be formed especially during recording. Therefore, conventionally, the power of light emitted from the semiconductor laser 101 is increased so that the intensity of light at the center of the light spot is increased.

  However, a semiconductor laser with a short wavelength such as a blue laser cannot sufficiently increase the power of light, so that the center of the light intensity distribution is shifted from the center of the optical system, so that signal recording can be performed normally. As a result, there is a problem that the reproduction cannot be normally performed. For this reason, a technique has been proposed in which the direction of the light beam emitted from the semiconductor laser 101 can be adjusted (see, for example, Patent Document 1).

  In other words, the mounting angle of the semiconductor laser is adjusted by attaching the semiconductor laser to the holder and fixing the holder to the mounting position by using the pressing force of an elastic member such as a leaf spring so that the angle of the holder can be adjusted. Thus, the direction of the light beam emitted from the semiconductor laser 101 can be adjusted.

JP 2001-101695 A

  However, in the configuration in which the holder to which the semiconductor laser is attached is fixed using the pressing force of the elastic member, there is a problem that it is difficult to perform minute angle adjustment. Further, if the predetermined pressing force is obtained after adjusting the angle with the pressing force weakened, there is a problem that the angle of the holder changes due to the change of the pressing force.

  For this reason, if the accuracy requirement for the semiconductor laser is severe, there is a problem that the ratio of the semiconductor laser determined to be defective increases and the yield decreases. In addition, there is a problem that the manufacturing cost increases in order to improve accuracy.

  Furthermore, the conventional structure for fixing a semiconductor laser as described above has a problem that heat dissipation generated by the semiconductor laser is not taken into consideration. In particular, in a semiconductor laser with a short wavelength such as a blue laser, there is a problem that the wavelength varies due to a temperature rise and the desired characteristics cannot be obtained.

  The present invention has been made to solve such a problem, and it is possible to adjust the direction of a light beam emitted from a light emitting element and to efficiently dissipate heat generated by the light emitting element. It is an object of the present invention to provide a fixed holder, an optical pickup using the fixed holder, and an information processing apparatus.

  In order to solve the above-described problems, a light-emitting element fixing holder according to the present invention includes a first holder to which a light-emitting element is attached and a first holder to which the first holder is attached. The first holder has a convex spherical surface formed with an opening through which light emitted from the light emitting element passes, and the second holder has a second opening from the first opening. The concave diameter is gradually reduced from the first opening, and a convex spherical surface is fitted into the concave spherical surface. When the convex spherical surface is fitted into the concave spherical surface, the convex spherical surface and a part of the concave spherical surface come into contact with each other. A convex spherical surface and a concave spherical surface are formed with a curvature in which an open adhesive groove is formed between the portion and the outer peripheral surface of the convex spherical surface.

  In the light-emitting element fixing holder according to the present invention, the light-emitting element is attached to the first holder. The first holder is attached to the second holder by fitting the convex spherical surface to the concave spherical surface. When the convex spherical surface is fitted to the concave spherical surface, the first holder is rotatably supported by the second holder with the center of the convex spherical surface as the center of rotation.

  Thereby, by rotating the first holder, the mounting angle of the light emitting element is adjusted, and the direction of the light beam emitted from the light emitting element can be adjusted in all directions.

  Further, when the convex spherical surface is fitted to the concave spherical surface, an adhesive groove is formed between the convex spherical surface and the concave spherical surface so as to open between the first opening and the outer peripheral surface of the convex spherical surface. By pouring a low-viscosity adhesive from this opening, the adhesive spreads over the entire adhesive groove between the convex spherical surface and the concave spherical surface, and is cured.

  As a result, the adhesive is placed between the convex spherical surface and the concave spherical surface while the first holder whose angle is adjusted with respect to the direction of the light emitted from the light emitting element by rotating with respect to the second holder. Can be fixed by filling.

  Further, since the concave spherical surface is a spherical surface along the convex spherical surface, the concave spherical surface and the convex spherical surface are in contact with each other through the adhesive regardless of the fixing angle of the first holder. Thereby, the heat generated in the light emitting element is efficiently transferred from the first holder to the second holder.

  The optical pickup and the information processing apparatus according to the present invention incorporate the above-described fixing holder. That is, an optical pickup according to the present invention is an optical pickup including a fixed holder to which a light emitting element housed in a package is attached and an optical system that guides light emitted from the light emitting element. Includes a first holder to which the first holder is attached, and a second holder to which the first holder is attached, and the first holder includes a convex spherical surface having an opening through which light emitted from the light emitting element passes. The second holder has a concave spherical surface in which the diameter gradually decreases from the first opening to the second opening, the convex spherical surface fits from the first opening, and the convex spherical surface is fitted into the concave spherical surface. The convex spherical surface and a part of the concave spherical surface are in contact with each other, and the convex spherical surface and the concave spherical surface are configured with a curvature that forms an open adhesive groove between the first opening and the outer peripheral surface of the convex spherical surface. is there.

  In addition, the information processing apparatus according to the present invention guides the light emitted from the light emitting element to the recording medium and the reflected light from the recording medium, to which the light emitting element housed in the package is attached. In an information processing apparatus including an optical pickup having an optical system, a fixed holder includes a first holder to which a light emitting element is attached, and a second holder to which the first holder is attached, and the first holder is The second holder has a convex spherical surface formed with an opening through which light emitted from the light emitting element passes, and the diameter of the second holder gradually decreases from the first opening to the second opening. When the convex spherical surface is fitted to the concave spherical surface, the convex spherical surface and a part of the concave spherical surface are in contact with each other, and an opening is formed between the first opening and the outer peripheral surface of the convex spherical surface. The curvature at which the bonded groove is formed, In which the concave spherical surface is constituted.

  In the optical pickup according to the present invention, in the fixed holder, the first holder is supported so as to be rotatable around the center of the convex spherical surface with respect to the second holder, and by rotating the first holder, The mounting angle is adjusted, and the direction of the light beam emitted from the light emitting element is adjusted in all directions.

  Thereby, the center of the light intensity distribution is adjusted so as to coincide with the optical axis of the optical system, and the concave spherical surface and the convex spherical surface are in contact with each other through the adhesive regardless of the angle of the first holder, Heat generated in the light emitting element is efficiently transferred from the first holder to the second holder.

  Therefore, in the information processing apparatus according to the present invention, the heat generated in the light emitting element is generated from the first holder in a state in which the center of the light intensity distribution is adjusted to coincide with the optical axis of the optical system. The recording medium is irradiated with light while being transmitted to the holder 2.

  With the light-emitting element fixing holder according to the present invention, the direction of the light beam emitted from the light-emitting element can be adjusted in an arbitrary direction by adjusting the mounting angle of the light-emitting element. Therefore, the accuracy required for the light-emitting element can be relaxed, the yield can be improved, and the manufacturing cost can be suppressed.

  Further, since the adhesive groove is formed between the convex spherical surface and the concave spherical surface, the first holder can be fixed to the second holder by filling the adhesive between the convex spherical surface and the concave spherical surface with an easy operation. Thus, after adjusting the direction of the light beam emitted from the light emitting element by rotating the first holder relative to the second holder, the adjustment angle of the first holder with respect to the second holder is maintained, An adhesive can be filled between the convex spherical surface and the concave spherical surface. Therefore, a fine angle adjustment is possible.

  Furthermore, since the first holder and the second holder are in contact with each other through the adhesive, the heat generated in the light emitting element is efficiently transmitted to the second holder through the first holder to dissipate heat. can do.

  In the optical pickup provided with such a fixed holder, the center of the light intensity distribution can be adjusted to coincide with the optical axis of the optical system. Further, since the heat generated in the light emitting element can be efficiently radiated, the influence of temperature change can be suppressed.

  Therefore, in the information processing apparatus provided with such a fixed holder, a signal can be reliably recorded on the recording medium, and a signal on the recording medium can be reliably reproduced.

  Embodiments of a light-emitting element fixing holder, an optical pickup, and an information processing apparatus according to the present invention will be described below with reference to the drawings.

<Outline of fixed holder>
1 to 3 show a configuration example of the fixed holder of the present embodiment, FIG. 1 is a perspective view of the fixed holder in an exploded state, FIG. 2 is a perspective view of the fixed holder assembled, and FIG. 3 is a fixed holder. It is side sectional drawing of the state which assembled.

  The fixed holder 1 of the present embodiment includes a sub holder 2 to which the semiconductor laser 101 described in FIG. 7 is attached, and a main holder 3 to which the sub holder 2 is attached. Then, by fitting the convex spherical surface 2 a formed on the sub-holder 2 to the concave spherical surface 3 a formed on the main holder 3, the direction of the light beam emitted from the semiconductor laser 101 can be easily adjusted depending on the mounting angle of the semiconductor laser 101. Make it possible.

  Further, by forming the radius of curvature of the concave spherical surface 3a slightly larger than the radius of curvature of the convex spherical surface 2a, an adhesive groove can be formed between the convex spherical surface 2a and the concave spherical surface 3a to be hardened by pouring an adhesive. is there.

<Overall configuration of information processing apparatus>
The fixed holder 1 according to the present embodiment is incorporated into an optical pickup constituting an information processing apparatus such as a disk drive device. First, the configuration of the disk drive device and the optical pickup will be described. FIG. 4 is a perspective view showing a configuration example of the disk drive device.

  The disk drive device 21 is an example of an information processing device, and includes an optical pickup 22, and a chassis (not shown) includes a rotation driving mechanism for the disk 23 and a slide driving mechanism for the optical pickup 22.

  The optical pickup 22 has a function of recording information by irradiating the disk 23 with light. Further, it has a function of reproducing information by irradiating the disk 23 with light and receiving reflected light from the disk 23.

  In order to realize the recording / reproducing function described above, the optical pickup 22 includes, for example, a semiconductor laser 101 shown in FIG. 7, a photodetector described later, and various optical components in a housing 24, and drives, for example, a biaxial actuator 26. Is provided. A flexible substrate 27 is connected to the optical pickup 22.

  The biaxial actuator 26 moves the position of the objective lens 25 with a drive mechanism using a coil or the like, adjusts the focus of the light irradiated on the disk 23 to form a light spot, and the light spot irradiated on the disk 23. Has a tracking function for following the track.

  The flexible substrate 27 is mounted with a driver IC 27a for driving the laser, and supplies an electric signal to a coil (not shown) that drives the semiconductor laser 101 and the biaxial actuator 26, and outputs an electric signal from the photodetector.

  The disk 23 is an example of a recording medium on which information is recorded and reproduced by light irradiation. In this example, the disk 23 is an optical disk such as a CD or a DVD, or a magneto-optical disk such as an MD. In order to irradiate the optical spot with the optical pickup 22 over the entire circumference of the disk 23, a spindle motor 28 and a turntable 29 are provided as a rotational drive mechanism for rotating the disk 23.

  The spindle motor 28 is attached to a chassis (not shown), and a turntable 29 is attached to the spindle motor 28 shaft. The disk 23 is detachable from the turntable 29, and the disk 23 mounted on the turntable 29 is driven by a spindle motor 28 to rotate.

  Further, in order to move the irradiation position of the light spot by the optical pickup 22 to an arbitrary position in the entire radial direction of the disk 23, as the slide drive mechanism of the optical pickup 22, a main shaft 30 and a sub shaft 31, a thread motor (not shown), etc. Is provided.

  The main shaft 30 and the sub shaft 31 are attached to a chassis (not shown) so as to be parallel to each other. The housing 24 of the optical pickup 22 is provided with a guide portion 32 supported by the main shaft 30 and a guide portion 33 supported by the sub shaft 31, and the optical pickup 22 is driven by a thread motor (not shown) to be connected to the main shaft 30 and the sub shaft 31. It moves along the axis 31 in the radial direction of the disk 23.

  Next, the configuration of the optical system of the optical pickup 22 will be described. FIG. 5 is a perspective view showing a configuration example of an optical system of the optical pickup.

  The optical system of the optical pickup 22 shown in FIG. 4 includes the semiconductor laser 101 shown in FIG. 7 and the like and the objective lens 25 shown in FIG. Further, as shown in FIG. 5, a photodetector 34, a grating element 35, a collimator lens 36, an anamorphic prism 37, a beam splitter 38, a mirror plate 39, a front PD (photo detector) 40, a condensing lens 41 and a multi lens 42 are provided. .

  With the above configuration, the optical pickup 22 irradiates the disk 23 with the light emitted from the semiconductor laser 101, and the reflected light of the light irradiated on the disk 23 is received by the photodetector 34.

  Specifically, the light emitted from the semiconductor laser 101 is split into three light beams (one main beam and two sub beams) using the diffraction phenomenon in the grating element 35.

  The light beam divided into three is incident on the collimator lens 36, converted from divergent light into parallel light by the collimator lens 36, and shaped in the anamorphic prism 37 by the aspect ratio of each of the three light beams. 38 is incident.

  In the beam splitter 38, the light beam from the semiconductor laser 101 is transmitted and guided to the mirror plate 39, and part of the light is reflected by the boundary surface and guided to the front PD 40. The optical pickup 22 has a function of making the amount of light emitted from the semiconductor laser 101 constant by using the output of the front PD 40.

  The light beam transmitted through the beam splitter 38 is reflected by the mirror plate 39, the optical axis is bent at a right angle, and a light spot is formed on the disk recording surface by the objective lens 25 mounted on the biaxial actuator 26 shown in FIG. Information is recorded on the disk recording surface. Further, the reflected light from the disk recording surface is obtained as an optical signal for information reproduction.

  The light reflected by the disk recording surface travels through the objective lens 25 in the reverse path and enters the beam splitter 38 via the mirror plate 39. The light incident on the beam splitter 38 is reflected at the boundary surface according to the polarization of the light by the dielectric film inside the beam splitter, and the light path is branched.

  In the beam splitter 38, the reflected light of the main beam and the sub beam irradiated on the disk recording surface is divided into light indicating information recorded on the disk, focus information of the objective lens 25, and tracking information of the objective lens 25. Is done.

  The light branched by the beam splitter 38 is incident on the condenser lens 41 and the multi-lens 42, and each light is imaged on each light receiving surface of the photodetector 34. The photodetector 34 converts the optical signal into an electrical signal, and information on the position of the biaxial actuator 26 and the disk recording surface is obtained using this information.

<Specific configuration of fixed holder>
The semiconductor laser 101 described above is attached to the housing 24 of the optical pickup 22 through the fixed holder 1.

  Next, details of the configuration of the fixed holder 1 will be described with reference to FIGS. Here, FIG. 1A is an exploded perspective view showing the entire configuration of the fixed holder 1, and FIG. 1B is a perspective view of the sub-holder 2.

  2A is a perspective view of the assembled fixed holder 1 as viewed from the front, and FIG. 2B is a perspective view of the assembled fixed holder 1 as viewed from the back. FIG. 3 is a cross-sectional view taken along line AA in FIG.

  The sub-holder 2 is a first holder and is made of a metal such as aluminum (Al) or magnesium (Mg) in consideration of heat conduction and heat dissipation. The main holder 3 is a second holder, and is made of a metal such as aluminum or magnesium in consideration of heat conduction and heat dissipation similarly to the sub-holder 2. In this example, the main holder 2 and the sub-holder 3 are made of metal in consideration of heat dissipation, but may be made of resin in consideration of cost.

  The sub-holder 2 includes a convex spherical surface 2 a on the front side facing the main holder 3. The convex spherical surface 2 a is a convex portion that is configured as a part of a spherical surface having the first curvature radius SR <b> 1 and protrudes from the front surface of the sub holder 2.

  The sub holder 2 includes a mounting portion 4 for the semiconductor laser 101. The mounting portion 4 is a space for housing the package 103 of the semiconductor laser 101, and an opening 4a is formed at the apex of the convex spherical surface 2a. Further, the attachment portion 4 is formed with a positioning surface 4 b on the back side of the sub-holder 2, on which the flange portion 102 of the semiconductor laser 101 is abutted.

  The main holder 3 includes a sub-holder mounting part 5 on the back side. The sub-holder mounting portion 5 is configured by cutting out a part on the back side of the main holder 3 into a groove shape. The main holder 3 includes a mounting surface 6 on the front side. The fixed holder 1 is fixed to the housing 24 of the optical pickup 22 shown in FIG.

  The main holder 3 includes a concave spherical surface 3a on the back side. The concave spherical surface 3a is a concave portion constituted by a part of the spherical surface having the second curvature radius SR2, and a circular first opening 7a is formed in the sub-holder mounting portion 5. A second opening 7b penetrating to the mounting surface 6 is formed at the apex of the concave spherical surface 3a, and the concave spherical surface 3a gradually decreases in diameter from the first opening 7a to the second opening 7b. .

  Here, as shown in FIG. 3, when the semiconductor laser 101 is attached to the sub-holder 2, the attachment portion of the sub-holder 2 is such that the center of the convex spherical surface 2 a of the sub-holder 2 coincides with the emission point P of the semiconductor laser 101. The shape 4 and the radius of curvature SR1 of the convex spherical surface 2a are set.

  Further, the radius of curvature SR2 of the concave spherical surface 3a of the main holder 3 is set slightly larger than the radius of curvature SR1 of the convex spherical surface 2a. By setting SR1 <SR2, the convex spherical surface 2a fits into the concave spherical surface 3a.

  Further, when the convex spherical surface 2a is fitted to the concave spherical surface 3a, the convex spherical surface 2a and the concave spherical surface 3a are in contact with each other, and a space necessary for the rotation of the sub holder 2 is formed between the front surface of the sub holder 2 and the sub holder mounting portion 5. Thus, the height etc. which the convex spherical surface 2a protrudes from the front of the subholder 2 are set.

  As a result, the convex spherical surface 2a can be fitted into the concave spherical surface 3a so that the vicinity of the apex of the convex spherical surface 2a is brought into contact with the concave spherical surface 3a. Further, the sub-holder 2 can be freely rotated about the light emission point P of the semiconductor laser 101 with the convex spherical surface 2a in contact with the concave spherical surface 3a.

  Here, when the convex spherical surface 2a is fitted to the concave spherical surface 3a, if the front surface of the sub holder 2 comes into contact with the sub holder mounting portion 5 of the main holder 3, the sub holder 2 cannot be freely rotated.

  Therefore, the convex spherical surface 2a is fitted to the concave spherical surface 3a so that a space is formed between the front surface of the sub holder 2 and the sub holder mounting portion 5 in a state where the concave spherical surface 3a is in contact with the vicinity of the vertex of the convex spherical surface 2a. To do.

  The deviation amount of the central axis of the light beam emitted from the semiconductor laser 101 is normally about 3 ° at the maximum. For this reason, the subholder 2 should just be able to rotate about 5 degrees in all directions. Therefore, a gap is formed between the front surface of the sub-holder 2 and the sub-holder mounting portion 5 so that the sub-holder 2 can be rotated about 5 ° in all directions with respect to the main holder 3.

  Furthermore, by setting SR1 <SR2, an adhesive groove 8 is formed between the convex spherical surface 2a and the concave spherical surface 3a when the convex spherical surface 2a is fitted to the concave spherical surface 3a. The adhesive groove 8 is a gap formed between the convex spherical surface 2a and the concave spherical surface 3a according to the difference between SR1 and SR2, and protrudes from the contact portion of the convex spherical surface 2a and the concave spherical surface 3a toward the first opening 7a. The space between the spherical surface 2a and the concave spherical surface 3a is widened, and a ring shape is opened between the first opening 7a and the outer peripheral surface of the convex spherical surface 2a. Thereby, the cross-sectional shape of the adhesive groove 8 is a curved wedge shape.

  Here, the adhesive groove 8 is formed for pouring an adhesive when the sub-holder 2 is temporarily fixed to the main holder 3. For temporary fixing of the sub-holder 3, an adhesive called a so-called instantaneous adhesive using a polymerization reaction of cyanoacrylate is used. Since the instantaneous adhesive has a low viscosity, if a minute gap is formed between the surfaces to be bonded, the instantaneous adhesive enters between the surfaces to be bonded by capillary action. However, if the distance between the surfaces to be bonded is large, the instantaneous adhesive is not cured.

  For this reason, the curvature radius SR1 of the convex spherical surface 2a and the curvature radius SR2 of the concave spherical surface 3a are set so that a gap is formed as the adhesive groove 8 so that the instantaneous adhesive enters and the instantaneous adhesive can be cured. The A specific example will be described later.

  Further, the main holder 3 includes mounting holes 9 on both sides of the sub-holder mounting portion 5. The fixing holder 1 is fixed to the housing 24 shown in FIG. 4 with a screw (not shown) inserted into the mounting hole 9, but the mounting hole 9 has a diameter of a shaft of a screw (not shown) so that the position of the fixing holder 1 can be adjusted. Has a larger shape.

<Semiconductor laser mounting angle adjustment operation>
Next, an operation for adjusting the direction of the light beam emitted from the semiconductor laser 101 using the above-described fixed holder 1 will be described.

  First, in order to attach the semiconductor laser 101 to the sub holder 2, the package 103 of the semiconductor laser 101 is inserted into the attachment portion 4 of the sub holder 2. Then, the flange portion 102 of the semiconductor laser 101 is abutted against the positioning surface 4b and fixed. The semiconductor laser 101 is fixed to the sub-holder 2 with an adhesive. However, when a thermosetting adhesive is used, considering the influence on the semiconductor laser 101 due to heat, for example, at a low temperature of 80 degrees centigrade or less. The use of a curing adhesive is preferred.

  Next, the convex spherical surface 2 a of the sub-holder 2 to which the semiconductor laser 101 is attached is fitted into the concave spherical surface 3 a of the main holder 3. Then, the semiconductor laser 101 is caused to emit light, light is received by a photodetector or the like attached at a predetermined position, and the angle of the sub-holder 2 is adjusted so that the intensity distribution of the received light is maximized.

  As described above, the convex spherical surface 2a and the concave spherical surface 3a are spherical surfaces having a slightly larger curvature radius than the convex spherical surface 2a, and when the convex spherical surface 2a is fitted to the concave spherical surface 3a, the convex spherical surface 2a is located near the apex. It contacts the concave spherical surface 3a. Further, the center of the convex spherical surface 2 a coincides with the light emitting point P of the semiconductor laser 101.

  As a result, the sub-holder 2 can be freely rotated in all directions around the light emitting point P of the semiconductor laser 101 with a part of the convex spherical surface 2a in contact with the concave spherical surface 3a, and adjusted by rotation. Can be easily maintained.

  Therefore, even if the central axis of the light beam emitted from the semiconductor laser 101 is inclined by Δθv in the X-axis direction and Δθh in the Y-axis direction as shown in FIG. By rotating, the central axis of the light beam emitted from the semiconductor laser 101 can coincide with the Z axis.

  When the adjustment of the angle of the sub-holder 2 is completed, an adhesive is poured into the adhesive groove 8 to temporarily fix the sub-holder 2 to the main holder 3. An instantaneous adhesive is used for temporarily fixing the sub-holder 3.

  As described above, the relationship between the curvature radii of the convex spherical surface 2a and the concave spherical surface 3a is SR1 <SR2, so that the first opening 7a of the main holder 3 and the sub-holder are placed between the convex spherical surface 2a and the concave spherical surface 3a. 2 is formed between the outer peripheral surface of the convex spherical surface 2a and an adhesive groove 8 is formed in contact with the concave spherical surface 3a in the vicinity of the apex of the convex spherical surface 2a.

  When the instantaneous adhesive is poured from the opening, a low-viscosity adhesive such as the instantaneous adhesive spreads over the entire surface of the bonding groove 8 by capillary action and is cured. Thereby, the sub-holder 2 is fixed to the main holder 3 while maintaining the adjusted angle.

  After temporarily fixing the sub-holder 2, the sub-holder 2 is fixed by filling the gap between the sub-holder mounting portion 5 and the sub-holder 2 with a UV curable adhesive or an epoxy adhesive.

  As described above, the fixed holder 1 in which the direction of the light emitted from the semiconductor laser 101 is adjusted by the fixing angle of the sub-holder 2 is attached to the housing 24 of the optical pickup 22 shown in FIG. The

  In the optical pickup 22 to which the fixed holder 1 in which the direction of the light emitted from the semiconductor laser 101 is adjusted is attached, the optical axis of the optical system shown in FIG. 5 and the center of the intensity distribution of the light emitted from the semiconductor laser 101. Match.

  Further, the convex spherical surface 2a of the sub-holder 2 and the concave spherical surface 3a of the main holder 3 are spherical surfaces, and the adhesive is filled in the adhesive groove 8 formed between the convex spherical surface 2a and the concave spherical surface 3a, thereby fixing the sub-holder 2. Regardless of the angle, the convex spherical surface 2a and the concave spherical surface 3a are in surface contact with each other via an adhesive.

  Thereby, the heat generated by driving the semiconductor laser 101 can be efficiently transmitted from the sub-holder 2 to the main holder 3 to be radiated, thereby preventing the temperature of the semiconductor laser 101 from rising.

  Therefore, in the disk drive device provided with the optical pickup 22, signals can be reliably recorded on the disk 23 and signals on the disk 23 can be reliably reproduced.

  Here, the relationship between the curvature radii of the convex spherical surface 2a and the concave spherical surface 3a is SR1 <SR2, so that the space between the first opening 7a of the main holder 3 and the outer peripheral surface of the convex spherical surface 2a of the sub holder 2 is a ring shape. Is open.

  Thereby, the adhesive can be poured into the adhesive groove 8 in a state where the convex spherical surface 2a is fitted to the concave spherical surface 3a. Therefore, after adjusting the angle of the sub-holder 2, the adhesive groove 8 between the convex spherical surface 2a and the concave spherical surface 3a can be filled with an adhesive without removing the sub-holder 2 from the main holder 3. Accurate and easy to do.

  FIG. 6 is a side sectional view showing the relationship between the curvature radii of the convex spherical surface and the concave spherical surface. In FIG. 6, the cross-sectional portion is not hatched to prevent the drawing from being complicated. Further, the Z axis shown in FIG. 6 is the central axis of the main holder 3 passing through the center of the concave spherical surface 3a.

  First, as the semiconductor laser 101, one having a package 103 with a diameter of φ5.6 (mm) is used.

  In order to make the emission point P of the semiconductor laser 101 coincide with the center of the convex spherical surface 2a of the sub-holder 2, if the diameter of the package 103 is φ5.6 (mm), the radius of curvature SR1 of the convex spherical surface 2a is R = 2. The lower limit is 9 (mm).

  This is because if the radius of curvature SR1 of the convex spherical surface 2a is further reduced, the thickness between the convex spherical surface 2a and the mounting portion 4 becomes thin, and the strength cannot be ensured. Thus, the radius of curvature SR1 of the convex spherical surface 2a is defined by the size of the package 103 of the semiconductor laser 101.

  Assume that an instantaneous adhesive is used for fixing the sub-holder 2 and the main holder 3. Here, if the curvature radii of the convex spherical surface 2a and the concave spherical surface 3a coincide, when the concave spherical surface 3a is fitted to the convex spherical surface 2a, the convex spherical surface 2a and the concave spherical surface 3a are in close contact with each other.

  If the surfaces to be bonded are in close contact with each other, an amount of the instantaneous adhesive necessary and sufficient for bonding cannot be poured between the surfaces to be bonded together. On the other hand, if a gap is formed between the surfaces to be bonded, the instantaneous adhesive can be poured using the capillary phenomenon. However, the instantaneous adhesive does not cure unless the gap between the surfaces to be bonded is 0.05 mm or less.

  Therefore, when the curvature radius SR1 of the convex spherical surface 2a is R = 2.9 (mm), as shown in FIG. 6A, the convex spherical surface 2a and the first opening 7a of the main holder 3 serve as the adhesive groove 8. Consider an example in which a gap of, for example, 0.06 (mm) is formed.

  When the gap between the convex spherical surface 2a and the first opening 7a is set to 0.06 (mm), the radius of curvature SR2 of the concave spherical surface 3a of the main holder 3 is R = 3.05 (mm).

  On the other hand, when the curvature radius SR1 of the convex spherical surface 2a is R = 2.9 (mm), as shown in FIG. 6B, the convex spherical surface 2a and the first opening 7a are formed as the adhesive grooves 8. Consider an example in which a gap of 0.1 (mm), for example, is formed between them.

  If the clearance between the convex spherical surface 2a and the first opening 7a is set to 0.1 (mm), the radius of curvature SR2 of the concave spherical surface 3a is R = 3.16 (mm).

  In the adhesive groove 8, the distance between the convex spherical surface 2 a and the concave spherical surface 3 a increases from the contact point between the convex spherical surface 2 a and the concave spherical surface 3 a toward the first opening 7 a. For this reason, when the gap between the first opening 7a and the convex spherical surface 2a is set to about 0.06 to 0.1 (mm), the distance between the convex spherical surface 2a and the concave spherical surface 3a is such that the convex spherical surface 2a and the concave spherical surface 3a. It becomes 0.05 (mm) or less in the range of half or more of the site | part which 3a has opposed.

  Thus, when the instantaneous adhesive is poured into the gap between the first opening 7a and the convex spherical surface 2a, the adhesive groove 8 is filled with a sufficient amount of the instantaneous adhesive necessary for bonding, and the instantaneous adhesive is cured. Thus, the sub-holder 2 is fixed to the main holder 3.

  Further, since the vicinity of the apex portion of the convex spherical surface 2 a is in contact with the concave spherical surface 3 a, the instantaneous adhesive poured into the bonding groove 8 does not wrap around the second opening 7 b of the sub holder 2. Accordingly, the second opening 7b is not blocked by the adhesive.

  Next, the amount of deviation of the emission point of the semiconductor laser 101 when the sub-holder 2 is rotated with respect to the main holder 3 will be examined. In this example, the center of the convex spherical surface 2a and the light emitting point P of the semiconductor laser 101 coincide with each other. However, due to an error in manufacturing the semiconductor laser 101, the position of the light emitting point is shifted within the standard range. Has occurred. Moreover, by setting SR1 <SR2, the center of the concave spherical surface 3a does not coincide with the light emitting point P. For this reason, the rotation center of the sub-holder 2 and the light emission point P of the semiconductor laser 101 do not exactly match.

  When the sub-holder 2 is rotated so that the axis perpendicular to the reference plane L of the flange portion 102 of the semiconductor laser 101 is inclined by 3 degrees with respect to the Z axis, the curvature radius SR2 of the concave spherical surface 3a is set to R = 3.05 (mm ), The amount of deviation of the emission point P of the semiconductor laser 101 from the Z axis was 0.01 (mm).

  On the other hand, when the radius of curvature SR2 of the concave spherical surface 3a is set to R = 3.16 (mm), the deviation amount of the light emitting point P of the semiconductor laser 101 from the Z axis is 0.016 (mm). It was.

  As described above, the amount of deviation of the emission point P of the semiconductor laser 101 when the sub-holder 2 is rotated is very small, and the fixed holder 1 is attached in the XY direction when attached to the housing 24 shown in FIG. Since the position is adjusted, the deviation of the light emission point does not become a problem.

  Thereby, when the curvature radius SR1 of the convex spherical surface 2a of the sub-holder 2 is set to R = 2.9 (mm), the curvature radius SR2 of the concave spherical surface 3a of the main holder 3 is set to R = 3.05 to 3.16 ( mm), the bonding groove 8 is formed between the convex spherical surface 2a and the concave spherical surface 3a with a gap suitable for bonding. Further, the amount of deviation of the light emission point P of the semiconductor laser 101 accompanying the rotation of the sub holder 2 can be suppressed.

  Accordingly, it is appropriate that the radius of curvature SR1 of the convex spherical surface 2a is about R = 2.9 (mm) and the radius of curvature SR2 of the concave spherical surface 3a is about R = 3.1 (mm), and the radius of curvature SR1 of the convex spherical surface 2a is concave. It is considered that the difference of the radius of curvature SR2 of the spherical surface 3a is suitably about 0.15 to 0.25 (mm).

  The present invention can be applied to an apparatus for recording or reproducing information by irradiating a disk-like or other form of recording medium with light.

It is a disassembled perspective view which shows the structural example of the fixed holder of this Embodiment. It is a perspective view of the assembled state which shows the structural example of the fixing holder of this Embodiment. It is a sectional side view which shows the structural example of the fixed holder of this Embodiment. It is a perspective view which shows the structural example of a disk drive apparatus. It is a perspective view which shows the structural example of the optical system of an optical pick-up. It is a sectional side view which shows the relationship between the curvature radius of a convex spherical surface and a concave spherical surface. It is a perspective view which shows the structural example of a general semiconductor laser. It is a perspective view which shows shift | offset | difference of the emitted light of a semiconductor laser.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Fixed holder, 2 ... Sub holder, 2a ... Convex spherical surface, 3 ... Main holder, 3a ... Concave spherical surface, 4 ... Mounting part, 4a ... Opening part, 4b ··· Positioning surface, 5 ··· Sub-holder mounting portion, 6 ··· Mounting surface, 7a ··· 1st opening portion, 7b ··· 2nd opening portion, 8 ··· Adhesive groove, ··· Mounting holes, 21 ... disk drive device, 22 ... optical pickup, 23 ... disk, 24 ... housing, 25 ... objective lens, 101 ... semiconductor laser, 102 ... Flange part

Claims (15)

In the fixing holder of the light emitting element housed in the package,
A first holder to which the light emitting element is attached;
A second holder to which the first holder is attached;
The first holder includes a convex spherical surface formed with an opening through which the light emitted from the light emitting element passes.
The second holder has a concave spherical surface that gradually decreases in diameter from the first opening to the second opening, and into which the convex spherical surface fits from the first opening,
When the convex spherical surface is fitted to the concave spherical surface, the convex spherical surface and a part of the concave spherical surface are in contact with each other, and an open adhesive groove is formed between the first opening and the outer peripheral surface of the convex spherical surface. The convex holder and the concave spherical surface are configured by the curvature. A light-emitting element fixing holder. The convex spherical surface is composed of a part of a spherical surface having a first radius of curvature, and the concave spherical surface is composed of a part of a spherical surface having a second radius of curvature larger than the first radius of curvature. The light-emitting element fixing holder according to claim 1. The light emitting element fixing holder according to claim 1, wherein a center of the convex spherical surface is coincident with a light emitting point of the light emitting element. The difference between the radius of curvature of the convex spherical surface and the radius of curvature of the concave spherical surface is that an adhesive enters between the convex spherical surface and the concave spherical surface, and the adhesive groove is formed by a gap in which the adhesive that has entered can be cured. The light-emitting element fixing holder according to claim 2, characterized in that: The difference between the radius of curvature of the convex spherical surface and the radius of curvature of the concave spherical surface is 0.15 to 0.25 (depending on the radius of curvature of the convex spherical surface defined according to the size of the package of the light emitting element). The fixed holder for a light-emitting element according to claim 4, which is set in a range of mm). A fixing holder to which a light emitting element housed in a package is attached;
In an optical pickup including an optical system that guides light emitted from the light emitting element,
The fixed holder is
A first holder to which the light emitting element is attached;
A second holder to which the first holder is attached;
The first holder includes a convex spherical surface formed with an opening through which the light emitted from the light emitting element passes.
The second holder has a concave spherical surface that gradually decreases in diameter from the first opening to the second opening, and into which the convex spherical surface fits from the first opening,
When the convex spherical surface is fitted to the concave spherical surface, the convex spherical surface and a part of the concave spherical surface are in contact with each other, and an open adhesive groove is formed between the first opening and the outer peripheral surface of the convex spherical surface. An optical pickup comprising the convex spherical surface and the concave spherical surface by curvature. The convex spherical surface is composed of a part of a spherical surface having a first radius of curvature, and the concave spherical surface is composed of a part of a spherical surface having a second radius of curvature larger than the first radius of curvature. The optical pickup according to claim 6. The optical pickup according to claim 6, wherein a center of the convex spherical surface and a light emitting point of the light emitting element are matched. The difference between the radius of curvature of the convex spherical surface and the radius of curvature of the concave spherical surface is that an adhesive enters between the convex spherical surface and the concave spherical surface, and the adhesive groove is formed by a gap in which the adhesive that has entered can be cured. The optical pickup according to claim 7, wherein the optical pickup is defined as follows. The difference between the radius of curvature of the convex spherical surface and the radius of curvature of the concave spherical surface is 0.15 to 0.25 (depending on the radius of curvature of the convex spherical surface defined according to the size of the package of the light emitting element). The optical pickup according to claim 9, wherein the optical pickup is set in a range of mm). A fixing holder to which a light emitting element housed in a package is attached;
In an information processing apparatus comprising an optical pickup having an optical system that guides light emitted from the light emitting element to a recording medium and guides reflected light from the recording medium,
The fixed holder is
A first holder to which the light emitting element is attached;
A second holder to which the first holder is attached;
The first holder includes a convex spherical surface formed with an opening through which light emitted from the light emitting element passes.
The second holder has a concave spherical surface that gradually decreases in diameter from the first opening to the second opening, and into which the convex spherical surface fits from the first opening,
When the convex spherical surface is fitted to the concave spherical surface, the convex spherical surface and a part of the concave spherical surface are in contact with each other, and an open adhesive groove is formed between the first opening and the outer peripheral surface of the convex spherical surface. An information processing apparatus comprising the convex spherical surface and the concave spherical surface by curvature. The convex spherical surface is composed of a part of a spherical surface having a first radius of curvature, and the concave spherical surface is composed of a part of a spherical surface having a second radius of curvature larger than the first radius of curvature. The information processing apparatus according to claim 11, characterized in that: The information processing apparatus according to claim 11, wherein a center of the convex spherical surface is matched with a light emitting point of the light emitting element. The difference between the radius of curvature of the convex spherical surface and the radius of curvature of the concave spherical surface is that an adhesive enters between the convex spherical surface and the concave spherical surface, and the adhesive groove is formed by a gap in which the adhesive that has entered can be cured. The information processing apparatus according to claim 12, wherein the information processing apparatus is defined as follows. The difference between the radius of curvature of the convex spherical surface and the radius of curvature of the concave spherical surface is 0.15 to 0.25 (depending on the radius of curvature of the convex spherical surface defined according to the size of the package of the light emitting element). The information processing apparatus according to claim 14, wherein the information processing apparatus is set within a range of mm).

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