JP2004031744A - Electronic part device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic part device in which an interval between a cover member made of metal and a circuit element is substantially eliminated and which is reduced in size and lowered in height. <P>SOLUTION: The electronic part device includes the circuit part elements 2, 3 placed on a wiring board 1 and covered with the cover member 6 made of a metal. An insulating resin layer 8 is disposed on an inner surface of a flat part of a ceiling of the cover member 6 made of the metal. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to an electronic component device such as a high-frequency component or an oscillation component covered with a metal lid member used for a portable communication device or an electronic device.
[0002]
[Prior art]
BACKGROUND ART Conventionally, a metal lid member has been used as a shield case connected to a ground potential in electronic component devices such as high-frequency components and oscillation components used in portable communication devices and network devices.
[0003]
As shown in FIG. 7, the circuit components 12 and 13 are mounted on a wiring board 11 on which a wiring pattern of a ground potential and a surface wiring pattern are formed, and thereafter, the circuit components 12 and 13 are covered. In addition, the metal lid member 16 is joined so as to be joined to the wiring pattern of the ground potential of the wiring board 11.
Terminal electrodes 14 and 15 are provided on the end surface of the wiring board 11, and the joining leg 17, which is a part of the metal lid member 16, is connected to, for example, the terminal electrode 15 of the ground potential among the terminal electrodes 14 and 15. Was. In addition, a part of the metal lid member 16, for example, a part 18 of the side wall surface comes into contact with the surface of the wiring board 11.
The metal cover member 16 has a ground potential as a whole, blocks electromagnetic noise coming from the outside, and prevents superposition of electromagnetic wave noise generated from the electronic component elements 12 and 13 on the wiring board 11. Functions as a shield case.
[0004]
Although not shown in the figure, a wiring pattern for forming a predetermined circuit network and electrode pads on which various individual electronic component elements 12 and 13 are attached are formed on the surface of the wiring board 11.
[0005]
The terminal electrodes on the end face of the wiring board 11 include a terminal electrode 15 having a ground potential and an input / output terminal electrode 14 for inputting and outputting signals. Each of the terminal electrodes 14 and 15 has a recess formed on the end surface of the wiring board 11, and is formed of an electrode conductor film inside the recess.
[0006]
Further, the wiring board 11 is configured by laminating a plurality of insulating layers, for example, and an internal wiring conductor having a ground potential and an internal wiring pattern for forming a predetermined circuit are formed between the respective insulating layers. The input / output terminal electrode 14 is connected to a surface wiring pattern or an internal wiring pattern, and the ground potential terminal electrode 15 is connected to a surface ground potential wiring pattern or an internal ground potential conductor film. .
[0007]
When the metal cover member 16 is joined to the wiring board 11, the lower end of the side wall surface 18 is attached to the metal cover member 16 in order to prevent the metal cover member 16 from tilting. And the joining leg 17 is joined to the terminal electrode 15 at the ground potential using solder.
[0008]
[Problems to be solved by the invention]
In the conventional method, when the metal lid member and circuit component elements such as an active element and a passive element come into contact with each other, a short circuit occurs, the characteristics of the predetermined circuit component element cannot be obtained, and the operation of the predetermined circuit is not performed. Impossible.
[0009]
For this reason, it is necessary to leave a certain distance or more between the circuit component element and the ceiling flat part of the metal lid member so that the metal lid member does not contact the circuit component element. The same applies to the side surface of the metal lid member. As a result, it has been very difficult to reduce the size and height of the entire electronic component device.
[0010]
Further, when joining the metal lid member to the end surface of the wiring board, in order to prevent the metal lid member from tilting, the side wall of the metal lid member is used as a support member for the metal lid member. It was in contact with the surface of the wiring board. For this reason, there are restrictions on the miniaturization of the wiring board and the routing of the surface wiring pattern.
[0011]
The present invention has been devised to solve the above-described problems, and an object thereof is to prevent a short circuit between a circuit component element and a metal lid member, and to further reduce the height and size. Further, the present invention provides an electronic component device with further improved various reliability.
[0012]
[Means for Solving the Problems]
The present invention provides a wiring board on which a wiring pattern of a ground potential and a surface wiring pattern are formed, a circuit component element mounted on the surface wiring pattern of the wiring board, a ground covering the circuit component element, and a ground of the wiring board. An electronic component device comprising a metal lid member joined to a potential wiring pattern,
An electronic component device, wherein an insulating resin layer is interposed between an inner surface of the metal lid member and the circuit component element.
[0013]
The insulating resin layer is preferably formed on the inner surface of the metal lid member. Further, the insulating resin layer is a high heat resistant resin material.
[0014]
In addition, the insulating resin layer is provided with a metal lid member in contact with at least one of the circuit component elements.
[0015]
Preferably, the element in contact with the insulating resin layer is disposed substantially at the center of the wiring board, or the element contacts at least two circuit component elements and the circuit component element is connected to the wiring board. They are arranged symmetrically on the substrate.
[0016]
Further, the metal lid member has a ceiling flat plate portion and a joining leg portion, and further has a side wall portion.
[0017]
Legs for bonding to the metal lid member are bonded to a ground wiring pattern on the surface of the wiring board. Alternatively, a ground potential terminal electrode is formed on an end surface of the wiring board, and the joining leg is joined to the ground potential terminal electrode.
In addition, the metal lid member has at least two joining legs that are targeted from the end of the ceiling flat portion.
[0018]
The joining leg of the metal lid member is formed by a bending method.
Or it is formed by a squeezing method.
[0019]
Further, the wiring board has a ground layer which is spread in a plane inside the wiring board.
[Action]
In the present invention, the insulating resin layer is interposed between the inner surface of the metal lid member and the circuit component element. Accordingly, the circuit component element and the inner surface of the metal lid member are brought into contact with each other without providing a fixed gap so that the metal lid member and the functional circuit component element do not short-circuit as in the conventional electronic component device. Can be done. Therefore, the height and size of the electronic component device can be reduced.
[0020]
Since the insulating resin layer is formed on the inner surface of the metal lid member, the metal lid member and the insulating resin layer can be treated as an integral body. In addition, the work can be easily performed, and the operation can be performed with the assurance that the inner surface of the metal lid member is reliably insulated.
[0021]
In addition, since a high heat-resistant resin material is used for the insulating resin layer, even when heat is applied when the metal lid member is joined to the wiring board by soldering or the like, the insulating resin is deteriorated, and Since the metal part of the lid member does not short-circuit with the circuit component element, insulation reliability can be ensured.
[0022]
The insulating resin layer is in contact with at least one of the circuit component elements. Therefore, the distance between the metal cover member and the wiring board can be minimized, and the positioning in the height direction when the metal cover member is attached becomes easy.
[0023]
Further, since the contacting circuit component element is disposed substantially at the center on the wiring board, the metal lid member can be held relatively stably.
[0024]
Further, by arranging the circuit elements at two locations symmetrically on the wiring board, the stability can be further improved.
[0025]
Further, the metal lid member has a ceiling flat plate portion and a joining leg portion. Furthermore, it has a side wall part. The ceiling flat portion is an essential member for securing insulation properties with circuit component elements and reducing the height. In addition, since the wiring board is joined to the wiring board using the joining legs, the wiring board and the metal lid member are mechanically and firmly fixed. In addition, by joining the joining leg to the wiring pattern or the terminal electrode of the ground potential, an effect as a shielding effect can be achieved, and the characteristics of the entire electronic component device are improved.
[0026]
The joining leg is joined to the ground wiring pattern on the surface of the wiring board, so that the circuit board element can be connected to each wiring board area in a large wiring board state (before division or cutting). It can be mounted, and furthermore, a metal lid can be attached, which simplifies the manufacturing process of the electronic component device. In addition, since the joining leg acts as a leg, the ceiling surface of the metal lid member is It is possible to control the plane part of the ceiling in parallel with the circuit board in a state where the part is in contact with the circuit component element. This facilitates the handling of the electronic component device.
[0027]
A ground potential terminal electrode is formed on the end surface of the wiring board, and the joining leg is joined to the ground potential terminal electrode, so that the surface area of the wiring board can be maximized, The occupied area of the component element increases. Further, since the metal lid member has at least two joining legs which are targeted from an end of the ceiling flat portion, the metal lid member contacts the circuit component element at the ceiling flat portion of the metal lid member. In this state, the ceiling flat portion can be controlled in parallel with the wiring board. This facilitates the handling of the electronic component device.
[0028]
The joining leg of the metal lid member is formed by bending or squeezing the flat surface of the ceiling. In particular, in the case of having a side portion, since it can be easily formed by squeezing and has no folding stress, a highly accurate metal lid member can be achieved.
[0029]
Further, the wiring board is a multilayer board composed of a plurality of insulating layers, and a ground layer extending in a plane is formed inside the wiring board. The body member and the wiring board side can form a shield container by this ground potential layer, thereby reducing the influence of external noise and the noise from this electronic component device, and improving the characteristics of the entire electronic component device. Can be.
[0030]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, an electronic component device of the present invention will be described with reference to the drawings.
FIG. 1 is an exploded perspective view of an electronic component device according to the present invention, and FIG. 2 is a side view thereof.
[0031]
A temperature-compensated crystal oscillator will be described as an example of the electronic component device. In the electronic component device, circuit component elements 2 and 3 such as passive elements such as an inductance, a capacitor, and a resistor, and active elements such as a crystal oscillator, a thermistor, a transistor, and a varicap diode are mounted on a wiring board 1.
[0032]
The wiring board 1 is made of glass epoxy resin, ceramic or the like, and is omitted in FIG. 1. However, a wiring pattern for forming a predetermined circuit on the surface of the wiring board 1 or mounting each of the circuit component elements 2 and 3 is used. Is formed. As a part of this wiring pattern, a wiring pattern of the ground potential is also formed.
[0033]
Further, terminal electrodes 4 and 5 connected to wiring patterns forming a predetermined circuit are formed on the end surface and the back surface of the wiring board 1. Specifically, in order to avoid an increase in the external shape of the circuit board 1 and to form the terminal electrodes 4 and 5 in the state of the large board, a recess is formed on the end surface of the wiring board 1. Terminal electrodes 4 and 5 are formed on the entire inner wall surface or a part of the inner wall surface. In FIG. 1, the terminal electrodes 4 and 5 are formed on the entire surface of the concave portion. However, the terminal electrode also includes a terminal electrode 4 serving as a signal-side input / output terminal and a terminal electrode 5 which is at a ground potential and to which a metal lid member 6 is joined.
[0034]
The metal lid member 6 has a ceiling flat portion 6a that covers the circuit component elements 2 and 3, and a joining leg 7 extending downward from the ceiling flat portion 6a toward the wiring board 1 is formed. . An insulating resin layer 8 is coated on the inner surface side of the ceiling flat portion of the metal lid member 6. For example, the insulating resin layer 8 is made of a high heat-resistant resin such as an epoxy resin or a polyimide resin that does not deteriorate even at 230 to 260 ° C. The thickness of the insulating resin layer 8 can be set to 10 μm or less.
[0035]
Next, the assembly of the wiring board 1, the circuit component elements 2, 3 and the metal lid member 6 and the joining structure of the metal lid member 6 will be described.
[0036]
Further, cream solder is applied on a predetermined wiring pattern of the wiring board 1, that is, a wiring pattern on which the circuit component elements 2 and 3 are mounted.
[0037]
Next, the various circuit component elements 2 and 3 are mounted on the pattern to which the cream solder has been applied, and joined by reflow processing. The reflow temperature at this time is about 230 to 260 ° C.
[0038]
Thereafter, the metal cover member 6 is covered from the upper surface side so as to cover the circuit component elements 2 and 3 from the upper surface of the wiring board 1, and the joining legs 7 of the metal cover member 6 are 1 is disposed on the terminal electrode 5 at the ground potential in the concave portion on the end face. Thereafter, the ceiling flat portion 6a (actually, the insulating resin layer 8) of the metal lid member 6 is the tallest circuit component element among the circuit component elements 2 and 3, for example, the upper surface of the circuit component element 2. Is lowered until it comes into contact with the.
[0039]
The solder between the terminal electrode 5 at the ground potential and the joining leg 7 is supplied in advance by supplying cream solder to the terminal electrode 5 side or the joining leg 7 side, or to the terminal electrode 5 for joining. After the legs 7 are located, solder may be supplied to the gaps. After that, the solder is reflow-processed and soldered. During this reflow, the reflow process may be performed while applying a slight stress from the upper surface side of the metal lid member 6. This reflow temperature is set to a temperature slightly lower than the reflow temperature when mounting the circuit component elements 2 and 3. Therefore, it is important that the heat does not deteriorate the insulating resin layer 8 of the metal lid member 6. Therefore, if there is heat resistance enough to withstand the reflow temperature of 230 to 260 ° C. when the circuit component elements 2 and 3 are mounted, if the metal cover member 6 is joined, Even if the attachment of the body member 6 and the joining of the circuit component elements 2 and 3 are performed simultaneously, there is no deterioration.
[0040]
That is, the upper surface of the tallest circuit component element 2 of the circuit component elements 2 and 3 was brought into contact with the insulating resin layer 8 formed on the inner surface of the ceiling flat portion of the metal lid member 6. Since the bonding is performed in the state, the height of the electronic component device can be reduced.
[0041]
In the conventional method, in order to prevent a short circuit between the circuit component element and the metal lid member, it is necessary to provide a gap of 100 μm or more between the electronic component and the metal lid member. Since the insulating resin layer 8 is disposed on the substrate 6, the thickness of the insulating resin layer is 10 μm or less. From this, it has become possible to reduce the height to at least 90 μm or more.
[0042]
In FIG. 1, the tall circuit component element 3 is positioned substantially at the center of the wiring board 1 to provide stability when the metal lid member 6 is held. As another method, for example, two or more circuit component elements 3 that are in contact with the insulating resin layer 8 are arranged on the wiring board 1, and are aligned with the center line or the diagonal line on the wiring board 1. Alternatively, the metal cover member 6 may be positioned so as to be symmetrical with respect to the point, so that the metal cover member 6 is stably held. Thereby, when performing the soldering of the metal lid member 6, it is possible to reduce the occurrence of such a problem that the metal lid member 6 is inclined.
[0043]
FIG. 3 is another side view of the present invention. In this embodiment, the metal lid 6 has a side wall 9 formed therein. At this time, the side wall 9 does not need to be brought into contact with the surface of the wiring board 1 as in the related art. That is, the dimension of the side wall 9 in the height direction may be the same as or smaller than the mounting height of the tallest circuit component element 2.
[0044]
By providing the side wall 9, external noise from the lateral direction and noise generated from the electronic component device can be cut off.
[0045]
FIG. 4 is another side view of the present invention. In this embodiment, a joining portion 72 bent at the end of the joining leg 71 of the metal lid 6 so as to be in surface contact with the surface of the wiring board 1 is provided. Since the joining surface of the joining portion 72 is flush with the outer surface of the metal lid member 6, even if the insulating resin layer 8 is formed up to the joining leg 7, the joining leg shown in FIG. The part 71 can be easily joined. At this time, a wiring pattern 91 having a ground potential is formed on the surface of the wiring board 1. Then, it is soldered to the wiring pattern 91 having the ground potential.
[0046]
In addition, a plurality of insulating layers (glass epoxy resin layer, ceramic layer) are laminated on the wiring board 1 and a ground potential spread in a plane as shown in FIG. It is important to provide the conductor layer 92. By forming the planar ground potential conductor layer 92 inside the wiring board 1, it is possible to prevent electromagnetic waves by a synergistic effect with the electromagnetic wave preventing effect of the metal lid member 6.
A part of the conductor layer 92 at the ground potential is, for example, directly or indirectly connected to the terminal electrode 5 at the ground potential.
[0047]
By doing so, the metal lid member 6 has a shield structure on the front side, and the ground potential conductor layer 9 has a shield structure on the wiring board 1 side, so that a shield container can be formed from above and below. The operating characteristics of the component device can be improved.
Further, when the side wall portion 9 is formed on the metal lid member 6, a further shielding effect can be achieved.
[0048]
Further, as a method of forming the joining leg portion 7 of the metal lid member 6, there are two methods, a bending method and a squeezing method.
[0049]
The bending process means that after removing the four corners 61 of the metal plate material 60 to be the metal lid member 6 shown in FIG. 6, a portion to be the joining leg 70 is formed, and cut along the solid line in FIG. After that, the metal lid member 6 as shown in FIG. 1 can be formed by bending the dotted line in the figure.
In this case, since the metal plate member 60 serving as the metal lid member 6 can be formed by the hoop member, the metal lid member 6 can be formed very efficiently.
[0050]
In the squeezing process, the metal plate 60 is pressed into a metal flat plate by using a punch and a die, so that the flat plate flows out into the die, and is processed into the container-shaped metal lid member 6.
[0051]
In the above-described embodiment, a temperature-compensated crystal oscillator has been described as an example. However, an electronic component device in which a circuit component element is mounted on a wiring board and further covered with a metal cover member, for example, a high-frequency module, etc. Can be widely used.
[0052]
【The invention's effect】
As described above, according to the present invention, an insulating resin is applied to the inner surface of the ceiling flat portion of the metal lid member, and the metal lid member is brought into contact with the upper surface of the electronic component and the ceiling surface of the metal lid member. The member is soldered to the wiring board. As a result, a problem that the metal lid member is inclined during the joining does not occur. Further, since it becomes possible to approach the electronic component as much as possible, it is possible to further reduce the size and height. Further, the characteristics of the electronic component device can be improved.
[Brief description of the drawings]
FIG. 1 is an exploded perspective view of an electronic component device according to the present invention.
FIG. 2 is a side view of the electronic component device of the present invention.
FIG. 3 is a side view of another electronic component device of the present invention.
FIG. 4 is a side view of still another electronic component device of the present invention.
FIG. 5 is a plan view of a conductor layer formed on an insulating layer constituting a wiring board used in the electronic component device of the present invention.
FIG. 6 is a plan view of a metal member serving as a metal lid member according to the present invention.
FIG. 7 is an exploded perspective view of a conventional electronic component device.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Wiring board 2, 3 Circuit element 4, 5 End electrode 6 Metal lid member 7 17 Joining leg 8 Insulating resin layer

Claims (14)

A wiring board on which a ground potential wiring pattern and a surface wiring pattern are formed,
A circuit component element mounted on a surface wiring pattern of the wiring board,
An electronic component device comprising a metal lid member that covers the circuit component element and is joined to a wiring pattern of a ground potential of the wiring board,
An electronic component device, wherein an insulating resin layer is interposed between the inner surface of the metal lid member and the circuit component element. The electronic component device according to claim 1, wherein the insulating resin layer is formed on the inner surface of the metal lid member. 3. The electronic component device according to claim 1, wherein the insulating resin layer is made of a high heat resistant resin material. 2. The electronic component device according to claim 1, wherein the insulating resin layer is in contact with at least one of the circuit component elements. 5. The electronic component device according to claim 4, wherein an element with which the insulating resin layer is in contact is arranged substantially at the center on the wiring board. 5. The electronic component device according to claim 4, wherein the insulating resin layer contacts at least two circuit component elements, and the circuit component elements are arranged symmetrically on the wiring board. . 2. The electronic component device according to claim 1, wherein the metal lid member has a ceiling flat plate portion and a joining leg portion. The electronic component device according to claim 7, wherein the metal lid member further has a side wall. 8. The electronic component device according to claim 7, wherein a leg portion for bonding to the metal lid member is bonded to a ground wiring pattern on a surface of the wiring board. 8. The electronic component device according to claim 7, wherein a ground potential terminal electrode is formed on an end face of the wiring board, and the joining leg is joined to the ground potential terminal electrode. The electronic component device according to claim 7, wherein the metal lid member has at least two joining legs that are targeted from ends of the ceiling flat portion. 8. The electronic component device according to claim 7, wherein the joining leg of the metal lid member is formed by a bending method. 8. The electronic component device according to claim 7, wherein the joining leg of the metal lid member is formed by squeezing. The electronic component device according to claim 1, wherein the wiring board has a ground layer that is spread in a plane inside the wiring board.

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