JP2004031358A - Manufacturing method of semiconductor device and foreign matter removing sheet - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To efficiently manufacture a semiconductor device by easily removing contamination deposited on a semiconductor manufacturing tool. <P>SOLUTION: The contamination removing method removes the contamination deposited on the semiconductor device manufacturing tool to which a semiconductor device having a resin package sealing a semiconductor chip and a plurality of outer leads is assembled, wherein a contamination removing sheet 20 having adherence is prepared, and inserted between a tool body 11 having a connector 18 that is a member to be contacted that is brought into contact with the semiconductor device and a cover member 13 openable/closeable with respect to the tool body 11 so that foreign matter 10 adhering to the tool body 11 adheres to the contamination removing sheet 20. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a semiconductor device manufacturing method and a foreign matter removing sheet used when manufacturing a semiconductor device.
[0002]
[Prior art]
In manufacturing a semiconductor device, after fixing a semiconductor chip to a lead frame, the leads formed on the lead frame and the electrodes of the semiconductor chip are electrically connected by wires, and the semiconductor chip and the wires are further sealed by resin. The manufacture of the semiconductor device is almost completed. After the manufacture is almost completed in this way, it is checked whether or not each semiconductor device has desired characteristics, and the manufacture of the semiconductor device is finally completed by selecting only non-defective products. become.
[0003]
This inspection includes a characteristic test to test whether the semiconductor chip incorporated in the semiconductor device has a predetermined characteristic, and a prediction of various stresses generated when the semiconductor device is transported or used. Environmental tests are being conducted to examine the effects.
[0004]
Such a test is described in, for example, “Industrial Research Institute Co., Ltd., issued on November 20, 1994, 1995 edition“ Ultra LSI Manufacturing / Testing Apparatus ”, P193 to P197.
[0005]
[Problems to be solved by the invention]
Inspection of the semiconductor device to determine pass / fail, and selection of only a good product completes the manufacture of the semiconductor device. When such a test is performed, a connector that contacts the outer lead portion of the semiconductor device is used. Various jigs having a portion and also called a socket are used. In this socket, semiconductor devices are sequentially mounted and used repeatedly for inspection. Therefore, if a foreign substance adheres to the semiconductor device to be mounted, the foreign substance adheres to the connector portion or the like. Sometimes. If foreign matter adheres to the connector part, foreign matter will be interposed between the outer lead part and the connector part in a subsequent test of another semiconductor device, and even if it is a good product, it will be determined as a defective product. In some cases, the manufacturing efficiency of the semiconductor device is reduced. In addition, when a foreign substance is present, the outer lead portion may be deformed or damaged when the semiconductor device is incorporated in the socket, which results in a defective product.
[0006]
Therefore, in the related art, an operator periodically observes the socket and, when foreign matter is found attached, blows compressed air onto the inner surface of the socket to remove the foreign matter by air blowing. However, this operation is a different operation from the inspection process of the semiconductor device, and not only reduces the efficiency of the manufacturing operation of the semiconductor device, but also foreign matter may enter the recess of the socket by air blow. In such a case, the connector part that comes into contact with the lead may be damaged, and the socket must be replaced periodically.
[0007]
SUMMARY OF THE INVENTION An object of the present invention is to efficiently manufacture a semiconductor device so that foreign matter attached to a jig for manufacturing a semiconductor can be easily removed.
[0008]
The above and other objects and novel features of the present invention will become apparent from the description of the present specification and the accompanying drawings.
[0009]
[Means for Solving the Problems]
The following is a brief description of an outline of typical inventions disclosed in the present application.
[0010]
That is, in the foreign matter inspection method of the present invention, a semiconductor device is mounted, an external terminal of the semiconductor device is electrically connected to a connector portion, and a socket used for testing the semiconductor device includes: Mounting a sheet having a planar shape including the planar area of the package portion and the external terminal of the semiconductor device and capable of being accommodated inside the socket into the socket; and mounting and testing the semiconductor device. Pressing the upper surface of the sheet by a lid member that presses the upper surface when performing the process, and bringing the adhesive layer on the sheet surface into close contact with the semiconductor device mounting surface inside the socket and the lid member; The foreign material adhering to the device mounting surface and the lid member is adsorbed to the adhesive layer on the surface, and the sheet is released by releasing the pressing force. Retrieving from socket, and a semiconductor device to be tested and mounted in the socket, characterized by having a determining the quality of the semiconductor device. The material of the sheet is silicone rubber, paper, nonwoven fabric, or resin, and has an adhesive layer on one surface. Further, instead of the lid member, the upper surface of the sheet is pressed by a sheet pressing jig for cleaning the socket.
[0011]
The foreign matter removing sheet of the present invention is provided with a semiconductor device mounted thereon, electrically connecting an external terminal of the semiconductor device and a connector portion, and in a socket used for testing the semiconductor device, a package portion of the semiconductor device. A sheet having a planar shape that includes a mounting area and an arrangement plane area of a plurality of connector portions, and that can be housed inside the socket, having an adhesive layer on both upper and lower surfaces, having the adhesive layer The semiconductor device is mounted in the socket with one surface facing downward, and the upper surface is pressed by a lid member at a predetermined pressure to be in close contact with the semiconductor device mounting surface inside the socket, and the lid member. The sheet has a function of adhering foreign matter adhering to the sheet and discharging the foreign matter together with the sheet. The material of the sheet is silicone rubber, paper, nonwoven fabric, or resin. The size of each side of the sheet is larger than that of each side of the semiconductor device to be tested by being mounted on the socket. Further, instead of the lid member, the upper surface of the sheet is pressed by a sheet pressing jig for cleaning the socket.
[0012]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
[0013]
FIG. 1A is a front view showing an example of the semiconductor device 1, and a plan view thereof is shown in FIG. The semiconductor device 1 has a resin package 2 as a sealing portion in which a semiconductor chip, that is, a semiconductor pellet is sealed, and an outer lead portion 3 protruding outward from the outer periphery. The semiconductor device 1 is of a QFP (Quad Flat Package) type, and outer lead portions 3 are provided on each of four outer peripherals.
[0014]
FIG. 2 is a view showing a socket which is an example of a jig for manufacturing a semiconductor device. This socket has a jig main body 11 and a lid member 13 which can be opened and closed by a hinge 12 with respect to the jig main body. . A clamp member 15 that engages with an engaging portion 14 formed on the jig body 11 is rotatably mounted on the lid member 13.
[0015]
The hinge portion 12 is provided with a spring member (not shown) for urging the lid member 13 in the opening direction, and the clamp member 15 is provided with a spring member (not shown) for urging the lid member 13 in the closing direction. An operating portion 16 is provided on the clamp member 15. When the operating portion 16 is pressed in a state where the lid member 13 is closed and the clamp member 15 is engaged with the engaging portion 14, the operating portion 16 is engaged with the clamp member 15. The engagement with the joint 14 is released.
[0016]
An accommodation space 17 for accommodating the semiconductor device 1 is formed in the jig main body 11, and connector portions 18 that contact the outer lead portions 3 are provided corresponding to the number of the outer lead portions 3 of the semiconductor device 1. Have been.
[0017]
FIGS. 3 and 4 show a state in which the semiconductor device 1 is housed in a socket and the lid member 13 is closed to the jig main body 11 in order to inspect characteristics and the like of the semiconductor device 1 using the socket. The portion 18 a protruding from the lower surface of the jig main body 11 is connected to the inspection apparatus main body 19. Therefore, characteristic tests and the like of the semiconductor device are sequentially performed using this socket.
[0018]
FIG. 5 is a view showing the foreign substance removing sheet 20, which is slightly larger than the semiconductor device 1 accommodated in the accommodation space 17, the length E is slightly longer than the dimension C in FIG. 1 is slightly longer than the dimension B in FIG. 1 and the thickness F of the rectangular sheet material is slightly larger than the dimension A in FIG. Various materials such as rubber such as silicone rubber, paper, nonwoven fabric, and resin can be used as the material of the foreign matter removing sheet 20. The material has elasticity, at least the surface has adhesiveness, and the contact is cleaned. A cleaning agent having a cleaning action to perform the cleaning is impregnated.
[0019]
When the test of the semiconductor device 1 is sequentially performed using one socket, foreign matters such as metal chips and resin chips attached to the semiconductor device 1 may adhere to the socket, and a predetermined number of inspections are completed. After that, the foreign matter removing sheet 20 shown in FIG. 5 is inserted into the housing space 17 of the socket, and the foreign matter removing sheet 20 is sandwiched between the jig main body 11 and the cover member 13. FIG. 6 shows a state in which the foreign matter removing sheet 20 is sandwiched between them, and the foreign matter 10 is adhered to the sandwiched foreign matter removing sheet 20.
[0020]
At this time, the cleaning agent impregnated in the foreign matter removing sheet 20 oozes out to the surfaces of the jig body 11 and the cover member 13 including the connector portion 18 to clean these surfaces. It is cleaned by contact cleaning chemicals.
Then, when foreign matter is attached to these surfaces, the foreign matter removing sheet 20 has adhesiveness, so that the foreign matter removing sheet 20 is adhered to the foreign matter removing sheet 20.
[0021]
After the surfaces of the jig main body 11 and the lid member 13 constituting the socket are thus cleaned, the inspection, ie, the test, of the semiconductor device 1 is performed again using the socket. Thereby, a test can be performed with high accuracy in a state where the foreign matter is removed and the connector section 18 is cleaned.
[0022]
As the jig for manufacturing a semiconductor device, various types can be cited in addition to the sockets of the type shown in FIGS. 2 and 3, and a type in which the jig body 11 and the lid member 13 can be separated. The present invention can also be applied to a device that can incorporate and test a large number of semiconductor devices 1 at the same time.
[0023]
FIG. 7 is a view showing another type of foreign matter removing sheet 20. The foreign matter removing sheet 20 is continuous in a belt shape and has a length corresponding to a plurality of semiconductor devices 1.
By using such a foreign matter removing sheet 20, it can be used for a socket for inspecting a large number of semiconductor devices at the same time, and corresponds to one of the semiconductor devices 1 with respect to the socket shown in FIGS. The foreign matter removing operation can be performed by using only the portions sequentially. The foreign matter removing sheet 20 has a hole into which the protrusion formed on the jig main body 11 enters.
[0024]
FIG. 8 is a view showing a foreign matter removing method according to another embodiment of the present invention. In this case, a relatively thick foreign matter removing sheet 20 as shown in FIGS. 5 and 7 is not used. The thin foreign matter removing sheet 20 is used. In this case, since the foreign substance removing sheet 20 is thin, the pressing member 21 is sandwiched in the socket together with the foreign substance removing sheet corresponding to the accommodation space 17 in the socket. As the pressing member 21, a material similar to the foreign matter removing sheet 20 may be used other than the sponge or the like, and the semiconductor device 1 itself may be used as the dummy as the pressing member 21.
[0025]
9 and 10 are views showing a jig for manufacturing a semiconductor device according to another embodiment of the present invention. The jig main body 11 has a quadrangular frame portion 22 in which a grid is provided. A partition 23 is provided in the shape, and a housing space 17 for housing the semiconductor device 1 is formed in the partition 23. The jig body 11 is provided with a clamp member 15 which is swingable about a hinge 12. As shown in FIG. 10, a lid member 13 separated from the jig body 11 is attached to the jig body 11. The main body 11 is fixed to the main body 11 by a clamp member 15.
[0026]
Such a jig for manufacturing a semiconductor device is preferably used when an aging test of the semiconductor device 1 is performed. Removal can be performed.
[0027]
As described above, the invention made by the inventor has been specifically described based on the embodiment. However, the present invention is not limited to the embodiment, and various modifications can be made without departing from the gist of the invention. Needless to say.
[0028]
For example, in the above-described embodiment, a case where the present invention is applied to a jig for performing a performance test of the semiconductor device 1 or performing an aging test is shown. The invention can be applied. Further, the semiconductor device to be used is not limited to the surface mount type as shown in the figure, but may be a pin mount type. Also, when conducting a test for manufacturing a semiconductor device, a jig having only a jig body and not having a lid member is used, and a lid member is used only for removing foreign matter. The present invention can also be applied to
[0029]
【The invention's effect】
The effects obtained by typical aspects of the invention disclosed in the present application will be briefly described as follows.
(1). After the process for manufacturing a predetermined semiconductor device has been completed a predetermined number of times, the foreign matter adhering to the jig is adhered to the foreign matter removing sheet by sandwiching the foreign matter removing sheet between the jig body and the lid member. This can be easily removed.
(2). When the foreign matter removing sheet is sandwiched, the cleaning agent impregnated therein oozes out on the inner surface of the jig, and the foreign matter can be easily removed.
(3). Since the foreign matter is removed, the outer lead portions of the semiconductor device are not bridged by the metal dust, so that a short-circuit failure at the time of inspection can be prevented.
(4). Resin waste does not enter between the outer lead portion and the connector portion, and the occurrence of test failure can be prevented.
(5). It is possible to prevent the connector portion provided on the semiconductor manufacturing jig from being deformed, and to prolong its life.
[Brief description of the drawings]
FIG. 1A is a front view illustrating an example of a semiconductor device, and FIG. 1B is a plan view thereof.
FIG. 2 is a perspective view showing an example of a jig for manufacturing a semiconductor device.
FIG. 3 is a perspective view showing a state where a lid member of the jig shown in FIG. 2 is closed.
FIG. 4 is a cross-sectional view taken along line 4-4 in FIG. 3 in a state where the semiconductor device is accommodated.
FIG. 5 is a perspective view showing an example of a foreign matter removing sheet.
FIG. 6 is a cross-sectional view showing a state in which foreign matter attached to the jig is being removed by a foreign matter removing sheet, and showing a portion similar to FIG. 4;
FIG. 7 is a perspective view showing another example of the foreign matter removing sheet.
FIG. 8 is a cross-sectional view showing a state where foreign matter is removed using a thin foreign matter removing sheet, and showing a portion similar to FIG. 4;
FIG. 9 is a plan view showing a jig for manufacturing a semiconductor according to another embodiment of the present invention.
FIG. 10 is a partially omitted front view in a state where a lid member is attached to the jig main body shown in FIG. 9;
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Semiconductor device 2 Resin package 3 Outer lead part 10 Foreign material 11 Jig body 12 Hinge part 13 Cover member 14 Engagement part 15 Clamp member 16 Operating part 17 Housing space 18 Connector part 19 Inspection apparatus main body 20 Foreign matter removal sheet 21 Pressing member 22 Frame part 23 Partition wall

Claims (7)

A semiconductor device is mounted, an electrical connection is made between an external terminal of the semiconductor device and a connector portion, and in a socket used for testing the semiconductor device,
Mounting a sheet having a planar shape that includes a planar area of the package portion and the external terminal of the semiconductor device in the socket, and that can be accommodated in the socket;
The upper surface of the sheet is pressed by a lid member that presses the upper surface when the semiconductor device is mounted and a test is performed, and the adhesive layer on the sheet surface is brought into close contact with the semiconductor device mounting surface inside the socket and the lid member. Steps and
Releasing the pressing force from the sheet, in which the foreign material adhering to the semiconductor device mounting surface inside the socket and the lid member to the surface adhesive layer is released from the socket, and testing the socket. Mounting the target semiconductor device and determining the quality of the semiconductor device. 2. The method according to claim 1, wherein the sheet is made of silicone rubber, paper, nonwoven fabric, or resin, and has an adhesive layer on one surface. 2. The method according to claim 1, wherein an upper surface of the sheet is pressed by a sheet pressing jig for socket cleaning instead of the lid member. A semiconductor device is mounted, an electrical connection is made between an external terminal of the semiconductor device and a connector portion, and in a socket used for testing the semiconductor device, a package mounting region of the semiconductor device, and a plurality of connector portions. A sheet having a plane shape that includes the arrangement plane area and can be accommodated inside the socket,
Has adhesive layers on both upper and lower sides,
It is mounted in the socket with one surface having the adhesive layer facing downward, the upper surface is pressed by a cover member at a predetermined pressure, and the semiconductor device mounting surface inside the socket is in close contact with the cover member,
A foreign matter removing sheet having a function of adhering foreign matter attached to the inside of the socket and the lid member and discharging the foreign matter together with the sheet. The foreign matter removal sheet according to claim 4, wherein the material of the sheet is silicone rubber, paper, nonwoven fabric, or resin. 5. The foreign matter removal sheet according to claim 4, wherein a dimension of each side of the plane of the sheet is larger than a dimension of each side of the plane of the semiconductor device to be tested by being mounted on the socket. The foreign matter removal sheet according to claim 4, wherein an upper surface of the sheet is pressed by a sheet pressing jig for socket cleaning instead of the lid member.

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