JP2004029136A5 - - Google Patents

Claims (4)

(A) A resin containing a repeating unit having a group represented by the general formula (Y), which decomposes by the action of an acid and increases the solubility in an alkali developer;
And (B) at least one compound (B1) selected from the group consisting of (B1) to (B4) below as an acid-generating compound upon irradiation with actinic rays or radiation: A compound that generates an aliphatic or aromatic sulfonic acid substituted with a fluorine atom,
(B2) a compound that generates an aliphatic or aromatic sulfonic acid that does not contain a fluorine atom upon irradiation with actinic rays or radiation,
(B3) a compound that generates an aliphatic or aromatic carboxylic acid substituted with at least one fluorine atom by irradiation with actinic rays or radiation,
(B4) A photosensitive resin composition comprising a compound that generates an aliphatic or aromatic carboxylic acid that does not contain a fluorine atom when irradiated with actinic rays or radiation.

In the formula (Y), R _{50 to} R ₅₅ may be the same or different and each represents a hydrogen atom, a fluorine atom, or an alkyl group which may have a substituent. However, at least one of R _{50 to} R ₅₅ represents a fluorine atom or an alkyl group in which at least one hydrogen atom is substituted with a fluorine atom.
R _{60 to} R ₆₂ may be the same or different and each represents an optionally substituted alkyl group, cycloalkyl group, alkenyl group, aralkyl group or aryl group. The photosensitive resin composition according to claim 1, wherein the repeating unit having a group represented by the general formula (Y) is represented by the following general formula (1) or (2).

Q ₁ represents an alicyclic hydrocarbon group. L ₁ and L ₂ represent a linking group, and Y represents a group represented by the general formula (Y). R _x1 and R _y1 each independently represent a hydrogen atom, a halogen atom, a cyano group or an alkyl group which may have a substituent. The photosensitive resin composition according to claim 1, wherein the component (A) is a resin having at least one repeating unit represented by the following general formulas (II) and (II ′).

In general formulas (II) and (II ′),
R ₅ may be the same or different and each represents a hydrogen atom, a halogen atom, a cyano group or an alkyl group which may have a substituent.
R ₆ and R ₇ may be the same or different, and may be a hydrogen atom, a halogen atom, a cyano group, a hydroxyl group, or an optionally substituted alkyl group, cycloalkyl group, alkoxy group, acyl group. Represents an acyloxy group, an alkenyl group, an aryl group or an aralkyl group.
R _{50 to} R ₅₅ may be the same or different and each represents a hydrogen atom, a fluorine atom, or an alkyl group that may have a substituent. However, at least one of R _{50 to} R ₅₅ represents a fluorine atom or an alkyl group in which at least one hydrogen atom is substituted with a fluorine atom.
R _{60 to} R ₆₂ may be the same or different and each represents an optionally substituted alkyl group, cycloalkyl group, alkenyl group, aralkyl group or aryl group.   A pattern forming method, comprising: forming a resist film from the photosensitive resin composition according to claim 1; and exposing and developing the resist film.