JP2003516610A5 - - Google Patents

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Publication number
JP2003516610A5
JP2003516610A5 JP2001543744A JP2001543744A JP2003516610A5 JP 2003516610 A5 JP2003516610 A5 JP 2003516610A5 JP 2001543744 A JP2001543744 A JP 2001543744A JP 2001543744 A JP2001543744 A JP 2001543744A JP 2003516610 A5 JP2003516610 A5 JP 2003516610A5
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2001543744A
Other languages
Japanese (ja)
Other versions
JP4436993B2 (ja
JP2003516610A (ja
Filing date
Publication date
Priority claimed from DE19959262A external-priority patent/DE19959262A1/de
Application filed filed Critical
Publication of JP2003516610A publication Critical patent/JP2003516610A/ja
Publication of JP2003516610A5 publication Critical patent/JP2003516610A5/ja
Application granted granted Critical
Publication of JP4436993B2 publication Critical patent/JP4436993B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2001543744A 1999-12-09 2000-11-16 電気工業用の非シリコーン伝導性ペースト及びその使用方法 Expired - Fee Related JP4436993B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19959262A DE19959262A1 (de) 1999-12-09 1999-12-09 Leitfähiges pastöses Material und dessen Verwendung
DE19959262.4 1999-12-09
PCT/EP2000/011371 WO2001043146A1 (en) 1999-12-09 2000-11-16 Non-silicone conductive paste for the electrical industry, and its use

Publications (3)

Publication Number Publication Date
JP2003516610A JP2003516610A (ja) 2003-05-13
JP2003516610A5 true JP2003516610A5 (enExample) 2007-03-29
JP4436993B2 JP4436993B2 (ja) 2010-03-24

Family

ID=7931917

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001543744A Expired - Fee Related JP4436993B2 (ja) 1999-12-09 2000-11-16 電気工業用の非シリコーン伝導性ペースト及びその使用方法

Country Status (10)

Country Link
US (4) US6518496B1 (enExample)
EP (1) EP1240648B8 (enExample)
JP (1) JP4436993B2 (enExample)
KR (1) KR100743732B1 (enExample)
AT (1) ATE266241T1 (enExample)
AU (1) AU2159401A (enExample)
CA (1) CA2394050A1 (enExample)
DE (2) DE19959262A1 (enExample)
ES (1) ES2220577T3 (enExample)
WO (1) WO2001043146A1 (enExample)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19959262A1 (de) * 1999-12-09 2001-06-21 Altoflex S A Leitfähiges pastöses Material und dessen Verwendung
DE10310604A1 (de) * 2002-03-11 2003-10-09 Helmut Kahl Gerätegehäuse mit einem elektromagnetisch abgeschirmten Raumbereich
US7018701B2 (en) * 2002-06-06 2006-03-28 Fuji Polymer Industries Co., Ltd. Thermally conductive sheet and method for manufacturing the same
US7346549B2 (en) * 2002-06-27 2008-03-18 At&T Knowledge Ventures, L.P. System and method for wirelessly transacting access to a set of events and associated digital content/products
US6864573B2 (en) * 2003-05-06 2005-03-08 Daimlerchrysler Corporation Two piece heat sink and device package
ATE357476T1 (de) 2003-11-05 2007-04-15 Dow Corning Wärmeleitfähiges schmierfett und verfahren und vorrichtungen, bei denen das schmierfett verwendet wird
SE0302985D0 (sv) * 2003-11-13 2003-11-13 Mydata Automation Ab A method for generating a jetting program
JP2005187793A (ja) * 2003-12-24 2005-07-14 Rohm & Haas Electronic Materials Llc 改良された接着剤
US20090169724A1 (en) * 2007-12-27 2009-07-02 Toshiaki Ogiwara Conductive paste for use in membrane touch switch applications
FR2939441B1 (fr) 2008-12-08 2010-12-24 Solvay Procede de preparation d'un materiau polymere transparent comprenant des nanoparticules minerales ayant un facteur de forme strictement superieur a 1,0
US7816785B2 (en) * 2009-01-22 2010-10-19 International Business Machines Corporation Low compressive force, non-silicone, high thermal conducting formulation for thermal interface material and package
US8618211B2 (en) 2009-03-16 2013-12-31 Dow Corning Corporation Thermally conductive grease and methods and devices in which said grease is used
CA2759785A1 (en) * 2010-08-27 2012-02-27 Pchem Associates, Inc. Low-temperature sintered silver nanoparticle composition and electronic articles formed using the same
KR101048083B1 (ko) * 2010-10-14 2011-07-11 주식회사 이노칩테크놀로지 전자파 차폐 가스켓
US9999158B2 (en) 2013-01-03 2018-06-12 Henkel IP & Holding GmbH Thermally conductive EMI suppression compositions
WO2015120773A1 (en) 2014-02-13 2015-08-20 Honeywell International Inc. Compressible thermal interface materials
MX393621B (es) 2016-03-08 2025-03-24 Honeywell Int Inc Material de camibo de fase.
US11041103B2 (en) 2017-09-08 2021-06-22 Honeywell International Inc. Silicone-free thermal gel
US11072706B2 (en) 2018-02-15 2021-07-27 Honeywell International Inc. Gel-type thermal interface material
US11373921B2 (en) 2019-04-23 2022-06-28 Honeywell International Inc. Gel-type thermal interface material with low pre-curing viscosity and elastic properties post-curing

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3653959A (en) * 1970-04-14 1972-04-04 Grace W R & Co Encapsulating and potting composition and process
US4011360A (en) * 1974-04-10 1977-03-08 Chomerics, Inc. Electrically conductive silicone rubber stock
EP0103695A1 (en) * 1982-07-16 1984-03-28 Showa Denko Kabushiki Kaisha Vulcanized olefin-based rubber composition
JPS61123665A (ja) * 1984-11-19 1986-06-11 Matsushita Electric Ind Co Ltd 導電性樹脂組成物の製造方法
JPS6333443A (ja) * 1986-07-28 1988-02-13 Sumitomo Bakelite Co Ltd 導電性樹脂組成物
US4994903A (en) * 1989-12-18 1991-02-19 Texas Instruments Incorporated Circuit substrate and circuit using the substrate
KR950000014B1 (ko) * 1989-12-21 1995-01-07 몬산토 캄파니 금속피복을 위한 수용성 촉매 폴리머 필름
DE59303215D1 (de) * 1992-02-07 1996-08-22 Ciba Geigy Ag Füllstoff für wärmeleitende Kunststoffe
EP0562179A1 (en) * 1992-03-26 1993-09-29 Sumitomo Chemical Company, Limited Electroconductive resin composition
JPH06136211A (ja) * 1992-10-22 1994-05-17 Asahi Chem Ind Co Ltd スチレン系樹脂組成物
DE4319965C3 (de) * 1993-06-14 2000-09-14 Emi Tec Elektronische Material Verfahren zur Herstellung eines Gehäuses mit elektromagnetischer Abschirmung
JP3490500B2 (ja) * 1994-06-28 2004-01-26 鐘淵化学工業株式会社 硬化性導電性組成物
WO1996001480A1 (en) * 1994-07-01 1996-01-18 Neste Oy Electrically conducting polymer compositions
JPH11505070A (ja) * 1995-05-10 1999-05-11 リッテルフューズ，インコーポレイティド Ｐｔｃ回路保護装置およびその製造方法
WO1998040435A1 (en) * 1997-03-11 1998-09-17 Nippon Zeon Co., Ltd. Conductive elastomer film, method for production thereof, and conductive elastomer composition
AU6461998A (en) * 1997-03-14 1998-09-29 Minnesota Mining And Manufacturing Company Cure-on-demand, moisture-curable compositions having reactive silane functionality
JP3913859B2 (ja) * 1997-09-10 2007-05-09 株式会社カネカ 硬化性組成物
US6281433B1 (en) * 1999-08-03 2001-08-28 Lucent Technologies Inc. Faceplate for network switching apparatus
DE19959262A1 (de) * 1999-12-09 2001-06-21 Altoflex S A Leitfähiges pastöses Material und dessen Verwendung

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