JP2003516610A5 - - Google Patents
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- Publication number
- JP2003516610A5 JP2003516610A5 JP2001543744A JP2001543744A JP2003516610A5 JP 2003516610 A5 JP2003516610 A5 JP 2003516610A5 JP 2001543744 A JP2001543744 A JP 2001543744A JP 2001543744 A JP2001543744 A JP 2001543744A JP 2003516610 A5 JP2003516610 A5 JP 2003516610A5
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19959262A DE19959262A1 (de) | 1999-12-09 | 1999-12-09 | Leitfähiges pastöses Material und dessen Verwendung |
| DE19959262.4 | 1999-12-09 | ||
| PCT/EP2000/011371 WO2001043146A1 (en) | 1999-12-09 | 2000-11-16 | Non-silicone conductive paste for the electrical industry, and its use |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2003516610A JP2003516610A (ja) | 2003-05-13 |
| JP2003516610A5 true JP2003516610A5 (enExample) | 2007-03-29 |
| JP4436993B2 JP4436993B2 (ja) | 2010-03-24 |
Family
ID=7931917
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001543744A Expired - Fee Related JP4436993B2 (ja) | 1999-12-09 | 2000-11-16 | 電気工業用の非シリコーン伝導性ペースト及びその使用方法 |
Country Status (10)
| Country | Link |
|---|---|
| US (4) | US6518496B1 (enExample) |
| EP (1) | EP1240648B8 (enExample) |
| JP (1) | JP4436993B2 (enExample) |
| KR (1) | KR100743732B1 (enExample) |
| AT (1) | ATE266241T1 (enExample) |
| AU (1) | AU2159401A (enExample) |
| CA (1) | CA2394050A1 (enExample) |
| DE (2) | DE19959262A1 (enExample) |
| ES (1) | ES2220577T3 (enExample) |
| WO (1) | WO2001043146A1 (enExample) |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19959262A1 (de) * | 1999-12-09 | 2001-06-21 | Altoflex S A | Leitfähiges pastöses Material und dessen Verwendung |
| US20040057198A1 (en) * | 2002-03-11 | 2004-03-25 | Helmut Kahl | Device housing comprising an electromagnetically shielded region |
| CN100375276C (zh) * | 2002-06-06 | 2008-03-12 | 富士高分子工业株式会社 | 导热片材及其制造方法 |
| US7346549B2 (en) * | 2002-06-27 | 2008-03-18 | At&T Knowledge Ventures, L.P. | System and method for wirelessly transacting access to a set of events and associated digital content/products |
| US6864573B2 (en) * | 2003-05-06 | 2005-03-08 | Daimlerchrysler Corporation | Two piece heat sink and device package |
| WO2005047378A2 (en) | 2003-11-05 | 2005-05-26 | Dow Corning Corporation | Thermally conductive grease and methods and devices in which said grease is used |
| SE0302985D0 (sv) * | 2003-11-13 | 2003-11-13 | Mydata Automation Ab | A method for generating a jetting program |
| JP2005187793A (ja) * | 2003-12-24 | 2005-07-14 | Rohm & Haas Electronic Materials Llc | 改良された接着剤 |
| US20090169724A1 (en) * | 2007-12-27 | 2009-07-02 | Toshiaki Ogiwara | Conductive paste for use in membrane touch switch applications |
| FR2939441B1 (fr) | 2008-12-08 | 2010-12-24 | Solvay | Procede de preparation d'un materiau polymere transparent comprenant des nanoparticules minerales ayant un facteur de forme strictement superieur a 1,0 |
| US7816785B2 (en) * | 2009-01-22 | 2010-10-19 | International Business Machines Corporation | Low compressive force, non-silicone, high thermal conducting formulation for thermal interface material and package |
| JP5651676B2 (ja) | 2009-03-16 | 2015-01-14 | ダウ コーニング コーポレーションＤｏｗ Ｃｏｒｎｉｎｇ Ｃｏｒｐｏｒａｔｉｏｎ | 熱伝導性グリース、並びに、該グリースを用いる方法及びデバイス |
| JP5632852B2 (ja) * | 2010-08-27 | 2014-11-26 | Ｄｏｗａエレクトロニクス株式会社 | 低温焼結性銀ナノ粒子組成物および該組成物を用いて形成された電子物品 |
| KR101048083B1 (ko) * | 2010-10-14 | 2011-07-11 | 주식회사 이노칩테크놀로지 | 전자파 차폐 가스켓 |
| US9999158B2 (en) | 2013-01-03 | 2018-06-12 | Henkel IP & Holding GmbH | Thermally conductive EMI suppression compositions |
| EP3105300B1 (en) | 2014-02-13 | 2019-08-21 | Honeywell International Inc. | Compressible thermal interface materials |
| KR102554661B1 (ko) | 2016-03-08 | 2023-07-13 | 허니웰 인터내셔널 인코포레이티드 | 상 변화 물질 |
| US11041103B2 (en) | 2017-09-08 | 2021-06-22 | Honeywell International Inc. | Silicone-free thermal gel |
| US11072706B2 (en) | 2018-02-15 | 2021-07-27 | Honeywell International Inc. | Gel-type thermal interface material |
| US11373921B2 (en) | 2019-04-23 | 2022-06-28 | Honeywell International Inc. | Gel-type thermal interface material with low pre-curing viscosity and elastic properties post-curing |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3653959A (en) * | 1970-04-14 | 1972-04-04 | Grace W R & Co | Encapsulating and potting composition and process |
| US4011360A (en) * | 1974-04-10 | 1977-03-08 | Chomerics, Inc. | Electrically conductive silicone rubber stock |
| DE103695T1 (de) * | 1982-07-16 | 1984-09-27 | Showa Denko K.K., Tokyo | Vulkanisierte olefin-rubber-zusammensetzung. |
| JPS61123665A (ja) * | 1984-11-19 | 1986-06-11 | Matsushita Electric Ind Co Ltd | 導電性樹脂組成物の製造方法 |
| JPS6333443A (ja) * | 1986-07-28 | 1988-02-13 | Sumitomo Bakelite Co Ltd | 導電性樹脂組成物 |
| US4994903A (en) * | 1989-12-18 | 1991-02-19 | Texas Instruments Incorporated | Circuit substrate and circuit using the substrate |
| CA2069495C (en) * | 1989-12-21 | 2006-05-09 | George Douglas Vaughn | Catalytic, water-soluble polymeric films for metal coatings |
| EP0555184B1 (de) * | 1992-02-07 | 1996-07-17 | Ciba-Geigy Ag | Füllstoff für wärmeleitende Kunststoffe |
| EP0562179A1 (en) * | 1992-03-26 | 1993-09-29 | Sumitomo Chemical Company, Limited | Electroconductive resin composition |
| JPH06136211A (ja) * | 1992-10-22 | 1994-05-17 | Asahi Chem Ind Co Ltd | スチレン系樹脂組成物 |
| DE4319965C3 (de) * | 1993-06-14 | 2000-09-14 | Emi Tec Elektronische Material | Verfahren zur Herstellung eines Gehäuses mit elektromagnetischer Abschirmung |
| JP3490500B2 (ja) * | 1994-06-28 | 2004-01-26 | 鐘淵化学工業株式会社 | 硬化性導電性組成物 |
| AU2740695A (en) * | 1994-07-01 | 1996-01-25 | Neste Oy | Electrically conducting polymer compositions |
| KR19990008423A (ko) * | 1995-05-10 | 1999-01-25 | 데이비드 제이. 크루거 | 양의 온도 계수 회로 보호 디바이스 및 그 제조 방법 |
| US6294257B1 (en) * | 1997-03-11 | 2001-09-25 | Zeon Corporation | Conductive elastomer film, method for production thereof, and conductive elastomer composition |
| DE69815073T3 (de) * | 1997-03-14 | 2008-07-03 | Minnesota Mining And Manufacturing Co., St. Paul | Auf-anfrage-härtung von feuchtigkeithärtbaren zusammensetzungen mit reaktiven funktionellen silangruppen |
| JP3913859B2 (ja) * | 1997-09-10 | 2007-05-09 | 株式会社カネカ | 硬化性組成物 |
| US6281433B1 (en) * | 1999-08-03 | 2001-08-28 | Lucent Technologies Inc. | Faceplate for network switching apparatus |
| DE19959262A1 (de) * | 1999-12-09 | 2001-06-21 | Altoflex S A | Leitfähiges pastöses Material und dessen Verwendung |
-
1999
- 1999-12-09 DE DE19959262A patent/DE19959262A1/de not_active Withdrawn
-
2000
- 2000-09-25 US US09/669,083 patent/US6518496B1/en not_active Expired - Fee Related
- 2000-11-16 AU AU21594/01A patent/AU2159401A/en not_active Abandoned
- 2000-11-16 WO PCT/EP2000/011371 patent/WO2001043146A1/en not_active Ceased
- 2000-11-16 AT AT00985043T patent/ATE266241T1/de not_active IP Right Cessation
- 2000-11-16 JP JP2001543744A patent/JP4436993B2/ja not_active Expired - Fee Related
- 2000-11-16 KR KR1020027007233A patent/KR100743732B1/ko not_active Expired - Fee Related
- 2000-11-16 DE DE60010515T patent/DE60010515T2/de not_active Expired - Lifetime
- 2000-11-16 EP EP00985043A patent/EP1240648B8/en not_active Expired - Lifetime
- 2000-11-16 CA CA002394050A patent/CA2394050A1/en not_active Abandoned
- 2000-11-16 ES ES00985043T patent/ES2220577T3/es not_active Expired - Lifetime
-
2001
- 2001-11-08 US US10/010,475 patent/US6780927B2/en not_active Expired - Fee Related
- 2001-11-08 US US10/008,752 patent/US6921780B2/en not_active Expired - Fee Related
- 2001-11-08 US US10/006,755 patent/US6563044B2/en not_active Expired - Fee Related