DE19959262A1 - Leitfähiges pastöses Material und dessen Verwendung - Google Patents
Leitfähiges pastöses Material und dessen VerwendungInfo
- Publication number
- DE19959262A1 DE19959262A1 DE19959262A DE19959262A DE19959262A1 DE 19959262 A1 DE19959262 A1 DE 19959262A1 DE 19959262 A DE19959262 A DE 19959262A DE 19959262 A DE19959262 A DE 19959262A DE 19959262 A1 DE19959262 A1 DE 19959262A1
- Authority
- DE
- Germany
- Prior art keywords
- material according
- coated
- nickel
- particles
- conductive particles
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000000463 material Substances 0.000 title claims abstract description 57
- 235000011837 pasties Nutrition 0.000 title claims description 10
- 239000002245 particle Substances 0.000 claims abstract description 21
- 238000004519 manufacturing process Methods 0.000 claims abstract description 8
- 229920001971 elastomer Polymers 0.000 claims abstract description 6
- 239000000806 elastomer Substances 0.000 claims abstract description 6
- 229920000098 polyolefin Polymers 0.000 claims abstract description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 16
- 229910052759 nickel Inorganic materials 0.000 claims description 8
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 5
- 229910052709 silver Inorganic materials 0.000 claims description 5
- 239000004332 silver Substances 0.000 claims description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 239000010439 graphite Substances 0.000 claims description 3
- 229910002804 graphite Inorganic materials 0.000 claims description 3
- 239000000843 powder Substances 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims description 2
- 229910000831 Steel Inorganic materials 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- 239000000835 fiber Substances 0.000 claims description 2
- 239000011521 glass Substances 0.000 claims description 2
- 229910052742 iron Inorganic materials 0.000 claims description 2
- 229910052749 magnesium Inorganic materials 0.000 claims description 2
- 239000011777 magnesium Substances 0.000 claims description 2
- 239000010445 mica Substances 0.000 claims description 2
- 229910052618 mica group Inorganic materials 0.000 claims description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 2
- 239000004033 plastic Substances 0.000 claims description 2
- 239000010959 steel Substances 0.000 claims description 2
- 229910000859 α-Fe Inorganic materials 0.000 claims description 2
- 229920001296 polysiloxane Polymers 0.000 abstract description 5
- 238000007789 sealing Methods 0.000 abstract description 4
- 230000007613 environmental effect Effects 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 8
- 230000000694 effects Effects 0.000 description 3
- 125000000217 alkyl group Chemical group 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000013016 damping Methods 0.000 description 2
- 230000005670 electromagnetic radiation Effects 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 238000001556 precipitation Methods 0.000 description 2
- 229920002545 silicone oil Polymers 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 208000036829 Device dislocation Diseases 0.000 description 1
- 101100400378 Mus musculus Marveld2 gene Proteins 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 230000000994 depressogenic effect Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 231100000252 nontoxic Toxicity 0.000 description 1
- 230000003000 nontoxic effect Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- -1 polyoxypropylene Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
- H01R13/2414—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means conductive elastomers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
- H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
- H01R13/6598—Shield material
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0806—Silver
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0831—Gold
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0862—Nickel
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S277/00—Seal for a joint or juncture
- Y10S277/92—Seal including electromagnetic shielding feature
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12014—All metal or with adjacent metals having metal particles
- Y10T428/12028—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, etc.]
- Y10T428/12063—Nonparticulate metal component
- Y10T428/12104—Particles discontinuous
- Y10T428/12111—Separated by nonmetal matrix or binder [e.g., welding electrode, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24008—Structurally defined web or sheet [e.g., overall dimension, etc.] including fastener for attaching to external surface
- Y10T428/24017—Hook or barb
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
- Y10T428/254—Polymeric or resinous material
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
- Y10T428/256—Heavy metal or aluminum or compound thereof
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
- Y10T428/256—Heavy metal or aluminum or compound thereof
- Y10T428/257—Iron oxide or aluminum oxide
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
- Y10T428/259—Silicic material
Landscapes
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Medicinal Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Conductive Materials (AREA)
- Paints Or Removers (AREA)
Priority Applications (14)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19959262A DE19959262A1 (de) | 1999-12-09 | 1999-12-09 | Leitfähiges pastöses Material und dessen Verwendung |
| US09/669,083 US6518496B1 (en) | 1999-12-09 | 2000-09-25 | Non-silicone conductive paste for the electrical industry, and its use |
| CA002394050A CA2394050A1 (en) | 1999-12-09 | 2000-11-16 | Non-silicone conductive paste for the electrical industry, and its use |
| KR1020027007233A KR100743732B1 (ko) | 1999-12-09 | 2000-11-16 | 전기 산업용 비-실리콘 전도성 페이스트 및 이의 용도 |
| PCT/EP2000/011371 WO2001043146A1 (en) | 1999-12-09 | 2000-11-16 | Non-silicone conductive paste for the electrical industry, and its use |
| DE60010515T DE60010515T2 (de) | 1999-12-09 | 2000-11-16 | Leitfähige, nichtsilikonische paste für die elektrische industrie und ihre verwendung |
| AU21594/01A AU2159401A (en) | 1999-12-09 | 2000-11-16 | Non-silicone conductive paste for the electrical industry, and its use |
| AT00985043T ATE266241T1 (de) | 1999-12-09 | 2000-11-16 | Leitfähige, nichtsilikonische paste für die elektrische industrie und ihre verwendung |
| JP2001543744A JP4436993B2 (ja) | 1999-12-09 | 2000-11-16 | 電気工業用の非シリコーン伝導性ペースト及びその使用方法 |
| ES00985043T ES2220577T3 (es) | 1999-12-09 | 2000-11-16 | Pista conductiva sin silicona para la industria electrica, y su utilizacion. |
| EP00985043A EP1240648B8 (en) | 1999-12-09 | 2000-11-16 | Non-silicone conductive paste for the electrical industry, and its use |
| US10/010,475 US6780927B2 (en) | 1999-12-09 | 2001-11-08 | Non-silicone conductive paste for the electrical industry, and its use |
| US10/006,755 US6563044B2 (en) | 1999-12-09 | 2001-11-08 | Non-silicone conductive paste for the electrical industry, and its use |
| US10/008,752 US6921780B2 (en) | 1999-12-09 | 2001-11-08 | Non-silicone conductive paste for the electrical industry, and its use |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19959262A DE19959262A1 (de) | 1999-12-09 | 1999-12-09 | Leitfähiges pastöses Material und dessen Verwendung |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE19959262A1 true DE19959262A1 (de) | 2001-06-21 |
Family
ID=7931917
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19959262A Withdrawn DE19959262A1 (de) | 1999-12-09 | 1999-12-09 | Leitfähiges pastöses Material und dessen Verwendung |
| DE60010515T Expired - Lifetime DE60010515T2 (de) | 1999-12-09 | 2000-11-16 | Leitfähige, nichtsilikonische paste für die elektrische industrie und ihre verwendung |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE60010515T Expired - Lifetime DE60010515T2 (de) | 1999-12-09 | 2000-11-16 | Leitfähige, nichtsilikonische paste für die elektrische industrie und ihre verwendung |
Country Status (10)
| Country | Link |
|---|---|
| US (4) | US6518496B1 (enExample) |
| EP (1) | EP1240648B8 (enExample) |
| JP (1) | JP4436993B2 (enExample) |
| KR (1) | KR100743732B1 (enExample) |
| AT (1) | ATE266241T1 (enExample) |
| AU (1) | AU2159401A (enExample) |
| CA (1) | CA2394050A1 (enExample) |
| DE (2) | DE19959262A1 (enExample) |
| ES (1) | ES2220577T3 (enExample) |
| WO (1) | WO2001043146A1 (enExample) |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19959262A1 (de) * | 1999-12-09 | 2001-06-21 | Altoflex S A | Leitfähiges pastöses Material und dessen Verwendung |
| DE10310604A1 (de) * | 2002-03-11 | 2003-10-09 | Helmut Kahl | Gerätegehäuse mit einem elektromagnetisch abgeschirmten Raumbereich |
| US7018701B2 (en) * | 2002-06-06 | 2006-03-28 | Fuji Polymer Industries Co., Ltd. | Thermally conductive sheet and method for manufacturing the same |
| US7346549B2 (en) * | 2002-06-27 | 2008-03-18 | At&T Knowledge Ventures, L.P. | System and method for wirelessly transacting access to a set of events and associated digital content/products |
| US6864573B2 (en) * | 2003-05-06 | 2005-03-08 | Daimlerchrysler Corporation | Two piece heat sink and device package |
| ATE357476T1 (de) | 2003-11-05 | 2007-04-15 | Dow Corning | Wärmeleitfähiges schmierfett und verfahren und vorrichtungen, bei denen das schmierfett verwendet wird |
| SE0302985D0 (sv) * | 2003-11-13 | 2003-11-13 | Mydata Automation Ab | A method for generating a jetting program |
| JP2005187793A (ja) * | 2003-12-24 | 2005-07-14 | Rohm & Haas Electronic Materials Llc | 改良された接着剤 |
| US20090169724A1 (en) * | 2007-12-27 | 2009-07-02 | Toshiaki Ogiwara | Conductive paste for use in membrane touch switch applications |
| FR2939441B1 (fr) | 2008-12-08 | 2010-12-24 | Solvay | Procede de preparation d'un materiau polymere transparent comprenant des nanoparticules minerales ayant un facteur de forme strictement superieur a 1,0 |
| US7816785B2 (en) * | 2009-01-22 | 2010-10-19 | International Business Machines Corporation | Low compressive force, non-silicone, high thermal conducting formulation for thermal interface material and package |
| US8618211B2 (en) | 2009-03-16 | 2013-12-31 | Dow Corning Corporation | Thermally conductive grease and methods and devices in which said grease is used |
| CA2759785A1 (en) * | 2010-08-27 | 2012-02-27 | Pchem Associates, Inc. | Low-temperature sintered silver nanoparticle composition and electronic articles formed using the same |
| KR101048083B1 (ko) * | 2010-10-14 | 2011-07-11 | 주식회사 이노칩테크놀로지 | 전자파 차폐 가스켓 |
| US9999158B2 (en) | 2013-01-03 | 2018-06-12 | Henkel IP & Holding GmbH | Thermally conductive EMI suppression compositions |
| WO2015120773A1 (en) | 2014-02-13 | 2015-08-20 | Honeywell International Inc. | Compressible thermal interface materials |
| MX393621B (es) | 2016-03-08 | 2025-03-24 | Honeywell Int Inc | Material de camibo de fase. |
| US11041103B2 (en) | 2017-09-08 | 2021-06-22 | Honeywell International Inc. | Silicone-free thermal gel |
| US11072706B2 (en) | 2018-02-15 | 2021-07-27 | Honeywell International Inc. | Gel-type thermal interface material |
| US11373921B2 (en) | 2019-04-23 | 2022-06-28 | Honeywell International Inc. | Gel-type thermal interface material with low pre-curing viscosity and elastic properties post-curing |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4011360A (en) * | 1974-04-10 | 1977-03-08 | Chomerics, Inc. | Electrically conductive silicone rubber stock |
| JPH0812870A (ja) * | 1994-06-28 | 1996-01-16 | Kanegafuchi Chem Ind Co Ltd | 硬化性導電性組成物 |
| DE4319965C2 (de) * | 1993-06-14 | 1996-11-21 | Emi Tec Elektronische Material | Verfahren zur Herstellung eines Gehäuses |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3653959A (en) * | 1970-04-14 | 1972-04-04 | Grace W R & Co | Encapsulating and potting composition and process |
| EP0103695A1 (en) * | 1982-07-16 | 1984-03-28 | Showa Denko Kabushiki Kaisha | Vulcanized olefin-based rubber composition |
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| DE59303215D1 (de) * | 1992-02-07 | 1996-08-22 | Ciba Geigy Ag | Füllstoff für wärmeleitende Kunststoffe |
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-
1999
- 1999-12-09 DE DE19959262A patent/DE19959262A1/de not_active Withdrawn
-
2000
- 2000-09-25 US US09/669,083 patent/US6518496B1/en not_active Expired - Fee Related
- 2000-11-16 EP EP00985043A patent/EP1240648B8/en not_active Expired - Lifetime
- 2000-11-16 JP JP2001543744A patent/JP4436993B2/ja not_active Expired - Fee Related
- 2000-11-16 AT AT00985043T patent/ATE266241T1/de not_active IP Right Cessation
- 2000-11-16 ES ES00985043T patent/ES2220577T3/es not_active Expired - Lifetime
- 2000-11-16 CA CA002394050A patent/CA2394050A1/en not_active Abandoned
- 2000-11-16 KR KR1020027007233A patent/KR100743732B1/ko not_active Expired - Fee Related
- 2000-11-16 AU AU21594/01A patent/AU2159401A/en not_active Abandoned
- 2000-11-16 DE DE60010515T patent/DE60010515T2/de not_active Expired - Lifetime
- 2000-11-16 WO PCT/EP2000/011371 patent/WO2001043146A1/en not_active Ceased
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2001
- 2001-11-08 US US10/010,475 patent/US6780927B2/en not_active Expired - Fee Related
- 2001-11-08 US US10/006,755 patent/US6563044B2/en not_active Expired - Fee Related
- 2001-11-08 US US10/008,752 patent/US6921780B2/en not_active Expired - Fee Related
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Also Published As
| Publication number | Publication date |
|---|---|
| US20020039662A1 (en) | 2002-04-04 |
| AU2159401A (en) | 2001-06-18 |
| WO2001043146A1 (en) | 2001-06-14 |
| JP4436993B2 (ja) | 2010-03-24 |
| US6921780B2 (en) | 2005-07-26 |
| KR20030076920A (ko) | 2003-09-29 |
| DE60010515T2 (de) | 2005-05-12 |
| JP2003516610A (ja) | 2003-05-13 |
| US20020051862A1 (en) | 2002-05-02 |
| US6518496B1 (en) | 2003-02-11 |
| ATE266241T1 (de) | 2004-05-15 |
| KR100743732B1 (ko) | 2007-07-27 |
| US6563044B2 (en) | 2003-05-13 |
| CA2394050A1 (en) | 2001-06-14 |
| EP1240648B8 (en) | 2005-01-19 |
| US6780927B2 (en) | 2004-08-24 |
| EP1240648B1 (en) | 2004-05-06 |
| US20020068145A1 (en) | 2002-06-06 |
| ES2220577T3 (es) | 2004-12-16 |
| EP1240648A1 (en) | 2002-09-18 |
| DE60010515D1 (de) | 2004-06-09 |
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Owner name: LAIRD TECHNOLOGIES S.A.S., CROSNE, FR |
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| 8130 | Withdrawal |