DE19959262A1 - Leitfähiges pastöses Material und dessen Verwendung - Google Patents

Leitfähiges pastöses Material und dessen Verwendung

Info

Publication number
DE19959262A1
DE19959262A1 DE19959262A DE19959262A DE19959262A1 DE 19959262 A1 DE19959262 A1 DE 19959262A1 DE 19959262 A DE19959262 A DE 19959262A DE 19959262 A DE19959262 A DE 19959262A DE 19959262 A1 DE19959262 A1 DE 19959262A1
Authority
DE
Germany
Prior art keywords
material according
coated
nickel
particles
conductive particles
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19959262A
Other languages
German (de)
English (en)
Inventor
El Cadi Mohamed Ait
Jean-Alec Ducros
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Laird Technologies SAS
Original Assignee
Altoflex S A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Altoflex S A filed Critical Altoflex S A
Priority to DE19959262A priority Critical patent/DE19959262A1/de
Priority to US09/669,083 priority patent/US6518496B1/en
Priority to DE60010515T priority patent/DE60010515T2/de
Priority to ES00985043T priority patent/ES2220577T3/es
Priority to PCT/EP2000/011371 priority patent/WO2001043146A1/en
Priority to EP00985043A priority patent/EP1240648B8/en
Priority to CA002394050A priority patent/CA2394050A1/en
Priority to AT00985043T priority patent/ATE266241T1/de
Priority to KR1020027007233A priority patent/KR100743732B1/ko
Priority to AU21594/01A priority patent/AU2159401A/en
Priority to JP2001543744A priority patent/JP4436993B2/ja
Publication of DE19959262A1 publication Critical patent/DE19959262A1/de
Priority to US10/006,755 priority patent/US6563044B2/en
Priority to US10/010,475 priority patent/US6780927B2/en
Priority to US10/008,752 priority patent/US6921780B2/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2414—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means conductive elastomers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6598—Shield material
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0806—Silver
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0831—Gold
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0862—Nickel
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S277/00—Seal for a joint or juncture
    • Y10S277/92—Seal including electromagnetic shielding feature
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12014—All metal or with adjacent metals having metal particles
    • Y10T428/12028—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, etc.]
    • Y10T428/12063—Nonparticulate metal component
    • Y10T428/12104—Particles discontinuous
    • Y10T428/12111—Separated by nonmetal matrix or binder [e.g., welding electrode, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24008—Structurally defined web or sheet [e.g., overall dimension, etc.] including fastener for attaching to external surface
    • Y10T428/24017—Hook or barb
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/254—Polymeric or resinous material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/256—Heavy metal or aluminum or compound thereof
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/256—Heavy metal or aluminum or compound thereof
    • Y10T428/257—Iron oxide or aluminum oxide
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/259—Silicic material

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Conductive Materials (AREA)
  • Paints Or Removers (AREA)
DE19959262A 1999-12-09 1999-12-09 Leitfähiges pastöses Material und dessen Verwendung Withdrawn DE19959262A1 (de)

Priority Applications (14)

Application Number Priority Date Filing Date Title
DE19959262A DE19959262A1 (de) 1999-12-09 1999-12-09 Leitfähiges pastöses Material und dessen Verwendung
US09/669,083 US6518496B1 (en) 1999-12-09 2000-09-25 Non-silicone conductive paste for the electrical industry, and its use
AT00985043T ATE266241T1 (de) 1999-12-09 2000-11-16 Leitfähige, nichtsilikonische paste für die elektrische industrie und ihre verwendung
AU21594/01A AU2159401A (en) 1999-12-09 2000-11-16 Non-silicone conductive paste for the electrical industry, and its use
PCT/EP2000/011371 WO2001043146A1 (en) 1999-12-09 2000-11-16 Non-silicone conductive paste for the electrical industry, and its use
EP00985043A EP1240648B8 (en) 1999-12-09 2000-11-16 Non-silicone conductive paste for the electrical industry, and its use
CA002394050A CA2394050A1 (en) 1999-12-09 2000-11-16 Non-silicone conductive paste for the electrical industry, and its use
DE60010515T DE60010515T2 (de) 1999-12-09 2000-11-16 Leitfähige, nichtsilikonische paste für die elektrische industrie und ihre verwendung
KR1020027007233A KR100743732B1 (ko) 1999-12-09 2000-11-16 전기 산업용 비-실리콘 전도성 페이스트 및 이의 용도
ES00985043T ES2220577T3 (es) 1999-12-09 2000-11-16 Pista conductiva sin silicona para la industria electrica, y su utilizacion.
JP2001543744A JP4436993B2 (ja) 1999-12-09 2000-11-16 電気工業用の非シリコーン伝導性ペースト及びその使用方法
US10/006,755 US6563044B2 (en) 1999-12-09 2001-11-08 Non-silicone conductive paste for the electrical industry, and its use
US10/010,475 US6780927B2 (en) 1999-12-09 2001-11-08 Non-silicone conductive paste for the electrical industry, and its use
US10/008,752 US6921780B2 (en) 1999-12-09 2001-11-08 Non-silicone conductive paste for the electrical industry, and its use

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19959262A DE19959262A1 (de) 1999-12-09 1999-12-09 Leitfähiges pastöses Material und dessen Verwendung

Publications (1)

Publication Number Publication Date
DE19959262A1 true DE19959262A1 (de) 2001-06-21

Family

ID=7931917

Family Applications (2)

Application Number Title Priority Date Filing Date
DE19959262A Withdrawn DE19959262A1 (de) 1999-12-09 1999-12-09 Leitfähiges pastöses Material und dessen Verwendung
DE60010515T Expired - Lifetime DE60010515T2 (de) 1999-12-09 2000-11-16 Leitfähige, nichtsilikonische paste für die elektrische industrie und ihre verwendung

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE60010515T Expired - Lifetime DE60010515T2 (de) 1999-12-09 2000-11-16 Leitfähige, nichtsilikonische paste für die elektrische industrie und ihre verwendung

Country Status (10)

Country Link
US (4) US6518496B1 (enExample)
EP (1) EP1240648B8 (enExample)
JP (1) JP4436993B2 (enExample)
KR (1) KR100743732B1 (enExample)
AT (1) ATE266241T1 (enExample)
AU (1) AU2159401A (enExample)
CA (1) CA2394050A1 (enExample)
DE (2) DE19959262A1 (enExample)
ES (1) ES2220577T3 (enExample)
WO (1) WO2001043146A1 (enExample)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19959262A1 (de) * 1999-12-09 2001-06-21 Altoflex S A Leitfähiges pastöses Material und dessen Verwendung
EP1345485A3 (de) * 2002-03-11 2006-04-19 Helmut Kahl Gerätegehäuse mit einem elektromagnetisch abgeschirmten Raumbereich
CN100375276C (zh) * 2002-06-06 2008-03-12 富士高分子工业株式会社 导热片材及其制造方法
US7346549B2 (en) * 2002-06-27 2008-03-18 At&T Knowledge Ventures, L.P. System and method for wirelessly transacting access to a set of events and associated digital content/products
US6864573B2 (en) * 2003-05-06 2005-03-08 Daimlerchrysler Corporation Two piece heat sink and device package
JP4828429B2 (ja) 2003-11-05 2011-11-30 ダウ・コーニング・コーポレイション 熱伝導性グリース、並びに前記グリースを用いる方法及びデバイス
SE0302985D0 (sv) * 2003-11-13 2003-11-13 Mydata Automation Ab A method for generating a jetting program
JP2005187793A (ja) * 2003-12-24 2005-07-14 Rohm & Haas Electronic Materials Llc 改良された接着剤
US20090169724A1 (en) * 2007-12-27 2009-07-02 Toshiaki Ogiwara Conductive paste for use in membrane touch switch applications
FR2939441B1 (fr) 2008-12-08 2010-12-24 Solvay Procede de preparation d'un materiau polymere transparent comprenant des nanoparticules minerales ayant un facteur de forme strictement superieur a 1,0
US7816785B2 (en) * 2009-01-22 2010-10-19 International Business Machines Corporation Low compressive force, non-silicone, high thermal conducting formulation for thermal interface material and package
WO2010107516A1 (en) 2009-03-16 2010-09-23 Dow Corning Corporation Thermally conductive grease and methods and devices in which said grease is used
CA2759785A1 (en) * 2010-08-27 2012-02-27 Pchem Associates, Inc. Low-temperature sintered silver nanoparticle composition and electronic articles formed using the same
KR101048083B1 (ko) * 2010-10-14 2011-07-11 주식회사 이노칩테크놀로지 전자파 차폐 가스켓
US9999158B2 (en) 2013-01-03 2018-06-12 Henkel IP & Holding GmbH Thermally conductive EMI suppression compositions
EP3105300B1 (en) 2014-02-13 2019-08-21 Honeywell International Inc. Compressible thermal interface materials
CN109072051B (zh) 2016-03-08 2023-12-26 霍尼韦尔国际公司 相变材料
US11041103B2 (en) 2017-09-08 2021-06-22 Honeywell International Inc. Silicone-free thermal gel
US11072706B2 (en) 2018-02-15 2021-07-27 Honeywell International Inc. Gel-type thermal interface material
US11373921B2 (en) 2019-04-23 2022-06-28 Honeywell International Inc. Gel-type thermal interface material with low pre-curing viscosity and elastic properties post-curing

Citations (3)

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Publication number Priority date Publication date Assignee Title
US4011360A (en) * 1974-04-10 1977-03-08 Chomerics, Inc. Electrically conductive silicone rubber stock
JPH0812870A (ja) * 1994-06-28 1996-01-16 Kanegafuchi Chem Ind Co Ltd 硬化性導電性組成物
DE4319965C2 (de) * 1993-06-14 1996-11-21 Emi Tec Elektronische Material Verfahren zur Herstellung eines Gehäuses

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JPS61123665A (ja) * 1984-11-19 1986-06-11 Matsushita Electric Ind Co Ltd 導電性樹脂組成物の製造方法
JPS6333443A (ja) * 1986-07-28 1988-02-13 Sumitomo Bakelite Co Ltd 導電性樹脂組成物
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Publication number Priority date Publication date Assignee Title
US4011360A (en) * 1974-04-10 1977-03-08 Chomerics, Inc. Electrically conductive silicone rubber stock
DE4319965C2 (de) * 1993-06-14 1996-11-21 Emi Tec Elektronische Material Verfahren zur Herstellung eines Gehäuses
JPH0812870A (ja) * 1994-06-28 1996-01-16 Kanegafuchi Chem Ind Co Ltd 硬化性導電性組成物

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* Cited by examiner, † Cited by third party
Title
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Römpp Lexikon Chemie, Georg Thieme Verlag, 10. Aufl., Stuttgart 1999, S. 3500 *

Also Published As

Publication number Publication date
EP1240648B8 (en) 2005-01-19
WO2001043146A1 (en) 2001-06-14
US6921780B2 (en) 2005-07-26
CA2394050A1 (en) 2001-06-14
KR100743732B1 (ko) 2007-07-27
KR20030076920A (ko) 2003-09-29
ES2220577T3 (es) 2004-12-16
EP1240648B1 (en) 2004-05-06
US6780927B2 (en) 2004-08-24
US6518496B1 (en) 2003-02-11
US20020039662A1 (en) 2002-04-04
US20020051862A1 (en) 2002-05-02
AU2159401A (en) 2001-06-18
EP1240648A1 (en) 2002-09-18
DE60010515D1 (de) 2004-06-09
ATE266241T1 (de) 2004-05-15
DE60010515T2 (de) 2005-05-12
JP4436993B2 (ja) 2010-03-24
JP2003516610A (ja) 2003-05-13
US6563044B2 (en) 2003-05-13
US20020068145A1 (en) 2002-06-06

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