JP2003508933A - 超音波変換スラリー分配器 - Google Patents
超音波変換スラリー分配器Info
- Publication number
- JP2003508933A JP2003508933A JP2001521501A JP2001521501A JP2003508933A JP 2003508933 A JP2003508933 A JP 2003508933A JP 2001521501 A JP2001521501 A JP 2001521501A JP 2001521501 A JP2001521501 A JP 2001521501A JP 2003508933 A JP2003508933 A JP 2003508933A
- Authority
- JP
- Japan
- Prior art keywords
- slurry
- ultrasonic
- polishing pad
- cmp
- wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000002002 slurry Substances 0.000 title claims abstract description 370
- 238000006243 chemical reaction Methods 0.000 title claims abstract description 78
- 238000005498 polishing Methods 0.000 claims abstract description 235
- 238000009826 distribution Methods 0.000 claims abstract description 116
- 238000000034 method Methods 0.000 claims abstract description 63
- 239000002245 particle Substances 0.000 claims abstract description 35
- 239000000126 substance Substances 0.000 claims abstract description 27
- 230000003750 conditioning effect Effects 0.000 claims abstract description 10
- 235000012431 wafers Nutrition 0.000 claims description 171
- 230000002463 transducing effect Effects 0.000 claims description 37
- 230000008569 process Effects 0.000 claims description 24
- 239000002699 waste material Substances 0.000 claims description 13
- 239000006185 dispersion Substances 0.000 claims description 10
- 230000008878 coupling Effects 0.000 claims description 9
- 238000010168 coupling process Methods 0.000 claims description 9
- 238000005859 coupling reaction Methods 0.000 claims description 9
- 238000005054 agglomeration Methods 0.000 claims description 5
- 230000002776 aggregation Effects 0.000 claims description 5
- 230000007246 mechanism Effects 0.000 claims description 4
- 238000003825 pressing Methods 0.000 claims description 3
- 238000003860 storage Methods 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 19
- 239000004065 semiconductor Substances 0.000 abstract description 5
- 238000009827 uniform distribution Methods 0.000 abstract description 4
- 239000000463 material Substances 0.000 description 6
- 238000007517 polishing process Methods 0.000 description 6
- CETPSERCERDGAM-UHFFFAOYSA-N ceric oxide Chemical compound O=[Ce]=O CETPSERCERDGAM-UHFFFAOYSA-N 0.000 description 4
- 229910000422 cerium(IV) oxide Inorganic materials 0.000 description 4
- 239000012636 effector Substances 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000001459 lithography Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 239000006227 byproduct Substances 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 239000008367 deionised water Substances 0.000 description 2
- 229910021641 deionized water Inorganic materials 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 230000032258 transport Effects 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000001015 X-ray lithography Methods 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 235000008429 bread Nutrition 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000005315 distribution function Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 230000008685 targeting Effects 0.000 description 1
- 238000012876 topography Methods 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000002604 ultrasonography Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
- B24B1/04—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes subjecting the grinding or polishing tools, the abrading or polishing medium or work to vibration, e.g. grinding with ultrasonic frequency
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
- B24B41/061—Work supports, e.g. adjustable steadies axially supporting turning workpieces, e.g. magnetically, pneumatically
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/390,455 | 1999-09-07 | ||
| US09/390,455 US6196900B1 (en) | 1999-09-07 | 1999-09-07 | Ultrasonic transducer slurry dispenser |
| PCT/US2000/023861 WO2001017724A2 (en) | 1999-09-07 | 2000-08-30 | Ultrasonic transducer slurry dispenser |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2003508933A true JP2003508933A (ja) | 2003-03-04 |
| JP2003508933A5 JP2003508933A5 (enExample) | 2007-10-18 |
Family
ID=23542524
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001521501A Withdrawn JP2003508933A (ja) | 1999-09-07 | 2000-08-30 | 超音波変換スラリー分配器 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US6196900B1 (enExample) |
| EP (1) | EP1144155B1 (enExample) |
| JP (1) | JP2003508933A (enExample) |
| DE (1) | DE60036858T2 (enExample) |
| WO (1) | WO2001017724A2 (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20170073292A (ko) * | 2015-12-18 | 2017-06-28 | 주식회사 케이씨텍 | 화학 기계적 연마장치 및 그 제어방법 |
| JP2024531239A (ja) * | 2021-08-18 | 2024-08-29 | アプライド マテリアルズ インコーポレイテッド | Ｃｍｐスラリ凝集低減のためのユースポイント超音波ホモジナイザ |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6766813B1 (en) * | 2000-08-01 | 2004-07-27 | Board Of Regents, The University Of Texas System | Apparatus and method for cleaning a wafer |
| US8801496B2 (en) * | 2006-04-28 | 2014-08-12 | HGST Netherlands B.V. | Reducing agglomeration of particles while manufacturing a lapping plate using oil-based slurry |
| US7267600B1 (en) | 2006-06-12 | 2007-09-11 | Taiwan Semiconductor Manufacturing Company | Polishing apparatus |
| US8439723B2 (en) | 2008-08-11 | 2013-05-14 | Applied Materials, Inc. | Chemical mechanical polisher with heater and method |
| US8414357B2 (en) | 2008-08-22 | 2013-04-09 | Applied Materials, Inc. | Chemical mechanical polisher having movable slurry dispensers and method |
| US20100041316A1 (en) * | 2008-08-14 | 2010-02-18 | Yulin Wang | Method for an improved chemical mechanical polishing system |
| US8133097B2 (en) * | 2009-05-07 | 2012-03-13 | Taiwan Semiconductor Manufacturing Company, Ltd. | Polishing apparatus |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5522965A (en) * | 1994-12-12 | 1996-06-04 | Texas Instruments Incorporated | Compact system and method for chemical-mechanical polishing utilizing energy coupled to the polishing pad/water interface |
| JP2647050B2 (ja) * | 1995-03-31 | 1997-08-27 | 日本電気株式会社 | ウェハ研磨装置 |
| US5683289A (en) * | 1996-06-26 | 1997-11-04 | Texas Instruments Incorporated | CMP polishing pad conditioning apparatus |
| US5868608A (en) * | 1996-08-13 | 1999-02-09 | Lsi Logic Corporation | Subsonic to supersonic and ultrasonic conditioning of a polishing pad in a chemical mechanical polishing apparatus |
| US5895550A (en) * | 1996-12-16 | 1999-04-20 | Micron Technology, Inc. | Ultrasonic processing of chemical mechanical polishing slurries |
| US5738573A (en) * | 1997-01-29 | 1998-04-14 | Yueh; William | Semiconductor wafer polishing apparatus |
| US6030487A (en) * | 1997-06-19 | 2000-02-29 | International Business Machines Corporation | Wafer carrier assembly |
| JPH1110526A (ja) * | 1997-06-23 | 1999-01-19 | Super Silicon Kenkyusho:Kk | 基板研磨装置及び基板研磨の方法 |
| KR100567982B1 (ko) * | 1997-12-08 | 2006-04-05 | 가부시키가이샤 에바라 세이사꾸쇼 | 연마액 공급장치 |
| JPH11204468A (ja) * | 1998-01-09 | 1999-07-30 | Speedfam Co Ltd | 半導体ウエハの表面平坦化装置 |
-
1999
- 1999-09-07 US US09/390,455 patent/US6196900B1/en not_active Expired - Lifetime
-
2000
- 2000-08-30 JP JP2001521501A patent/JP2003508933A/ja not_active Withdrawn
- 2000-08-30 EP EP00959642A patent/EP1144155B1/en not_active Expired - Lifetime
- 2000-08-30 DE DE60036858T patent/DE60036858T2/de not_active Expired - Lifetime
- 2000-08-30 WO PCT/US2000/023861 patent/WO2001017724A2/en not_active Ceased
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20170073292A (ko) * | 2015-12-18 | 2017-06-28 | 주식회사 케이씨텍 | 화학 기계적 연마장치 및 그 제어방법 |
| KR102569631B1 (ko) * | 2015-12-18 | 2023-08-24 | 주식회사 케이씨텍 | 화학 기계적 연마장치 및 그 제어방법 |
| JP2024531239A (ja) * | 2021-08-18 | 2024-08-29 | アプライド マテリアルズ インコーポレイテッド | Ｃｍｐスラリ凝集低減のためのユースポイント超音波ホモジナイザ |
Also Published As
| Publication number | Publication date |
|---|---|
| EP1144155B1 (en) | 2007-10-24 |
| US6196900B1 (en) | 2001-03-06 |
| WO2001017724A3 (en) | 2001-09-27 |
| WO2001017724A2 (en) | 2001-03-15 |
| DE60036858T2 (de) | 2008-02-21 |
| EP1144155A2 (en) | 2001-10-17 |
| DE60036858D1 (de) | 2007-12-06 |
| EP1144155A3 (en) | 2002-09-11 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20070827 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20070827 |
|
| A711 | Notification of change in applicant |
Free format text: JAPANESE INTERMEDIATE CODE: A711 Effective date: 20080515 |
|
| A761 | Written withdrawal of application |
Free format text: JAPANESE INTERMEDIATE CODE: A761 Effective date: 20090903 |