JP2003507199A5 - - Google Patents

Download PDF

Info

Publication number
JP2003507199A5
JP2003507199A5 JP2001516715A JP2001516715A JP2003507199A5 JP 2003507199 A5 JP2003507199 A5 JP 2003507199A5 JP 2001516715 A JP2001516715 A JP 2001516715A JP 2001516715 A JP2001516715 A JP 2001516715A JP 2003507199 A5 JP2003507199 A5 JP 2003507199A5
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2001516715A
Other versions
JP4519385B2 (ja
JP2003507199A (ja
Filing date
Publication date
Priority claimed from US09/375,962 external-priority patent/US6171181B1/en
Application filed filed Critical
Publication of JP2003507199A publication Critical patent/JP2003507199A/ja
Publication of JP2003507199A5 publication Critical patent/JP2003507199A5/ja
Application granted granted Critical
Publication of JP4519385B2 publication Critical patent/JP4519385B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

JP2001516715A 1999-08-17 2000-08-10 一体化した窓を有する成形された研磨パッド Expired - Lifetime JP4519385B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/375,962 US6171181B1 (en) 1999-08-17 1999-08-17 Molded polishing pad having integral window
US09/375,962 1999-08-17
PCT/US2000/021776 WO2001012387A1 (en) 1999-08-17 2000-08-10 Molded polishing pad having integral window

Publications (3)

Publication Number Publication Date
JP2003507199A JP2003507199A (ja) 2003-02-25
JP2003507199A5 true JP2003507199A5 (ja) 2007-09-06
JP4519385B2 JP4519385B2 (ja) 2010-08-04

Family

ID=23483104

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001516715A Expired - Lifetime JP4519385B2 (ja) 1999-08-17 2000-08-10 一体化した窓を有する成形された研磨パッド

Country Status (6)

Country Link
US (2) US6171181B1 (ja)
EP (1) EP1210209A4 (ja)
JP (1) JP4519385B2 (ja)
KR (1) KR100646887B1 (ja)
TW (1) TW470688B (ja)
WO (1) WO2001012387A1 (ja)

Families Citing this family (95)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3431115B2 (ja) 1995-03-28 2003-07-28 アプライド マテリアルズ インコーポレイテッド ケミカルメカニカルポリシングの操作をインシチュウでモニタするための装置及び方法
US5893796A (en) * 1995-03-28 1999-04-13 Applied Materials, Inc. Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus
US6876454B1 (en) 1995-03-28 2005-04-05 Applied Materials, Inc. Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations
US6716085B2 (en) 2001-12-28 2004-04-06 Applied Materials Inc. Polishing pad with transparent window
US6179709B1 (en) * 1999-02-04 2001-01-30 Applied Materials, Inc. In-situ monitoring of linear substrate polishing operations
US6524164B1 (en) * 1999-09-14 2003-02-25 Applied Materials, Inc. Polishing pad with transparent window having reduced window leakage for a chemical mechanical polishing apparatus
JP2003524300A (ja) 2000-02-25 2003-08-12 ロデール ホールディングス インコーポレイテッド 透明部分のある研磨パッド
WO2001068322A1 (en) * 2000-03-15 2001-09-20 Rodel Holdings, Inc. Window portion with an adjusted rate of wear
US8485862B2 (en) * 2000-05-19 2013-07-16 Applied Materials, Inc. Polishing pad for endpoint detection and related methods
JP2004511108A (ja) 2000-10-06 2004-04-08 キャボット　マイクロエレクトロニクス　コーポレイション 充填材入り透光性領域を含む研磨パッド
US6688956B1 (en) * 2000-11-29 2004-02-10 Psiloquest Inc. Substrate polishing device and method
US6840843B2 (en) 2001-03-01 2005-01-11 Cabot Microelectronics Corporation Method for manufacturing a polishing pad having a compressed translucent region
WO2002102547A1 (en) * 2001-06-15 2002-12-27 Rodel Holdings, Inc. Polishing apparatus that provides a window
JP4570286B2 (ja) * 2001-07-03 2010-10-27 ニッタ・ハース株式会社 研磨パッド
JP2003048151A (ja) * 2001-08-08 2003-02-18 Rodel Nitta Co 研磨パッド
JP2003062748A (ja) * 2001-08-24 2003-03-05 Inoac Corp 研磨用パッド
US7030018B2 (en) 2002-02-04 2006-04-18 Kla-Tencor Technologies Corp. Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or tool
US7001242B2 (en) * 2002-02-06 2006-02-21 Applied Materials, Inc. Method and apparatus of eddy current monitoring for chemical mechanical polishing
US6875077B2 (en) * 2002-03-18 2005-04-05 Raytech Innovative Solutions, Inc. Polishing pad for use in chemical/mechanical planarization of semiconductor wafers having a transparent window for end-point determination and method of making
US20030194959A1 (en) * 2002-04-15 2003-10-16 Cabot Microelectronics Corporation Sintered polishing pad with regions of contrasting density
US20050276967A1 (en) * 2002-05-23 2005-12-15 Cabot Microelectronics Corporation Surface textured microporous polishing pads
US6913517B2 (en) * 2002-05-23 2005-07-05 Cabot Microelectronics Corporation Microporous polishing pads
US20040171339A1 (en) * 2002-10-28 2004-09-02 Cabot Microelectronics Corporation Microporous polishing pads
US7579071B2 (en) * 2002-09-17 2009-08-25 Korea Polyol Co., Ltd. Polishing pad containing embedded liquid microelements and method of manufacturing the same
KR100465649B1 (ko) * 2002-09-17 2005-01-13 한국포리올 주식회사 일체형 연마 패드 및 그 제조 방법
US7267607B2 (en) * 2002-10-28 2007-09-11 Cabot Microelectronics Corporation Transparent microporous materials for CMP
US7311862B2 (en) * 2002-10-28 2007-12-25 Cabot Microelectronics Corporation Method for manufacturing microporous CMP materials having controlled pore size
US7435165B2 (en) 2002-10-28 2008-10-14 Cabot Microelectronics Corporation Transparent microporous materials for CMP
US8845852B2 (en) * 2002-11-27 2014-09-30 Toyo Tire & Rubber Co., Ltd. Polishing pad and method of producing semiconductor device
US6676483B1 (en) 2003-02-03 2004-01-13 Rodel Holdings, Inc. Anti-scattering layer for polishing pad windows
US6832947B2 (en) * 2003-02-10 2004-12-21 Cabot Microelectronics Corporation CMP pad with composite transparent window
US6960120B2 (en) 2003-02-10 2005-11-01 Cabot Microelectronics Corporation CMP pad with composite transparent window
EP1594656B1 (en) * 2003-02-18 2007-09-12 Parker-Hannifin Corporation Polishing article for electro-chemical mechanical polishing
US6991514B1 (en) 2003-02-21 2006-01-31 Verity Instruments, Inc. Optical closed-loop control system for a CMP apparatus and method of manufacture thereof
US7704125B2 (en) 2003-03-24 2010-04-27 Nexplanar Corporation Customized polishing pads for CMP and methods of fabrication and use thereof
TWI286964B (en) 2003-03-25 2007-09-21 Neopad Technologies Corp Customized polish pads for chemical mechanical planarization
US8864859B2 (en) 2003-03-25 2014-10-21 Nexplanar Corporation Customized polishing pads for CMP and methods of fabrication and use thereof
US9278424B2 (en) 2003-03-25 2016-03-08 Nexplanar Corporation Customized polishing pads for CMP and methods of fabrication and use thereof
EP1466699A1 (en) * 2003-04-09 2004-10-13 JSR Corporation Abrasive pad, method and metal mold for manufacturing the same, and semiconductor wafer polishing method
US20040209066A1 (en) * 2003-04-17 2004-10-21 Swisher Robert G. Polishing pad with window for planarization
US6884156B2 (en) * 2003-06-17 2005-04-26 Cabot Microelectronics Corporation Multi-layer polishing pad material for CMP
US6997777B2 (en) * 2003-06-17 2006-02-14 Cabot Microelectronics Corporation Ultrasonic welding method for the manufacture of a polishing pad comprising an optically transmissive region
US7435161B2 (en) * 2003-06-17 2008-10-14 Cabot Microelectronics Corporation Multi-layer polishing pad material for CMP
US7086932B2 (en) * 2004-05-11 2006-08-08 Freudenberg Nonwovens Polishing pad
JP2005051237A (ja) * 2003-07-17 2005-02-24 Jsr Corp 化学機械研磨用パッドおよび化学機械研磨方法
JP4721016B2 (ja) * 2003-07-17 2011-07-13 Ｊｓｒ株式会社 化学機械研磨用パッドの製造方法
US7183213B2 (en) * 2003-07-17 2007-02-27 Jsr Corporation Chemical mechanical polishing pad and chemical mechanical polishing method
US7195539B2 (en) * 2003-09-19 2007-03-27 Cabot Microelectronics Coporation Polishing pad with recessed window
US7258602B2 (en) * 2003-10-22 2007-08-21 Iv Technologies Co., Ltd. Polishing pad having grooved window therein and method of forming the same
US7442116B2 (en) * 2003-11-04 2008-10-28 Jsr Corporation Chemical mechanical polishing pad
US6984163B2 (en) * 2003-11-25 2006-01-10 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad with high optical transmission window
US7132033B2 (en) * 2004-02-27 2006-11-07 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of forming a layered polishing pad
US7204742B2 (en) * 2004-03-25 2007-04-17 Cabot Microelectronics Corporation Polishing pad comprising hydrophobic region and endpoint detection port
DE602005000252T2 (de) * 2004-04-28 2007-06-06 Jsr Corp. Kissen zum chemisch-mechanischen Polieren, Herstellungsverfahren dafür und chemisch-mechanisches Polierverfahren für Halbleiterwafer
US8075372B2 (en) * 2004-09-01 2011-12-13 Cabot Microelectronics Corporation Polishing pad with microporous regions
US20060089094A1 (en) * 2004-10-27 2006-04-27 Swisher Robert G Polyurethane urea polishing pad
US20060089093A1 (en) * 2004-10-27 2006-04-27 Swisher Robert G Polyurethane urea polishing pad
US20060089095A1 (en) * 2004-10-27 2006-04-27 Swisher Robert G Polyurethane urea polishing pad
TWI385050B (zh) * 2005-02-18 2013-02-11 Nexplanar Corp 用於ｃｍｐ之特製拋光墊及其製造方法及其用途
KR101593927B1 (ko) * 2005-08-22 2016-02-15 어플라이드 머티어리얼스, 인코포레이티드 화학적 기계적 폴리싱의 스펙트럼 기반 모니터링을 위한 장치 및 방법
US7226339B2 (en) 2005-08-22 2007-06-05 Applied Materials, Inc. Spectrum based endpointing for chemical mechanical polishing
JP2007118106A (ja) * 2005-10-26 2007-05-17 Toyo Tire & Rubber Co Ltd 研磨パッド及びその製造方法
US20070197132A1 (en) * 2006-02-15 2007-08-23 Applied Materials, Inc. Dechuck using subpad with recess
US20070212979A1 (en) * 2006-03-09 2007-09-13 Rimpad Tech Ltd. Composite polishing pad
JP4971028B2 (ja) * 2007-05-16 2012-07-11 東洋ゴム工業株式会社 研磨パッドの製造方法
US8562389B2 (en) * 2007-06-08 2013-10-22 Applied Materials, Inc. Thin polishing pad with window and molding process
TWI411495B (zh) * 2007-08-16 2013-10-11 Cabot Microelectronics Corp 拋光墊
JP2009148891A (ja) * 2009-04-02 2009-07-09 Nitta Haas Inc 研磨パッド
US8257544B2 (en) * 2009-06-10 2012-09-04 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad having a low defect integral window
US8506355B1 (en) * 2010-01-04 2013-08-13 Applied Micro Circuits Corporation System and method for in-situ inspection during metallurgical cross-sectioning
US9017140B2 (en) 2010-01-13 2015-04-28 Nexplanar Corporation CMP pad with local area transparency
JP5715770B2 (ja) * 2010-06-17 2015-05-13 ローム アンド ハース エレクトロニック マテリアルズ シーエムピー ホウルディングス インコーポレイテッド 低欠陥の一体型窓を有する化学機械研磨パッド及び当該化学機械研磨パッドを用いて基体を化学機械研磨する方法
CN102310366B (zh) * 2010-07-08 2014-03-05 罗门哈斯电子材料Cmp控股股份有限公司 具有低缺陷整体窗的化学机械抛光垫
US9156124B2 (en) * 2010-07-08 2015-10-13 Nexplanar Corporation Soft polishing pad for polishing a semiconductor substrate
US8257545B2 (en) 2010-09-29 2012-09-04 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with light stable polymeric endpoint detection window and method of polishing therewith
WO2012068428A2 (en) * 2010-11-18 2012-05-24 Cabot Microelectronics Corporation Polishing pad comprising transmissive region
US11090778B2 (en) 2012-04-02 2021-08-17 Thomas West, Inc. Methods and systems for centrifugal casting of polymer polish pads and polishing pads made by the methods
US10722997B2 (en) 2012-04-02 2020-07-28 Thomas West, Inc. Multilayer polishing pads made by the methods for centrifugal casting of polymer polish pads
US10022842B2 (en) 2012-04-02 2018-07-17 Thomas West, Inc. Method and systems to control optical transmissivity of a polish pad material
US9156125B2 (en) * 2012-04-11 2015-10-13 Cabot Microelectronics Corporation Polishing pad with light-stable light-transmitting region
US20140256226A1 (en) * 2013-03-07 2014-09-11 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Broad spectrum, endpoint detection window chemical mechanical polishing pad and polishing method
US9186772B2 (en) 2013-03-07 2015-11-17 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with broad spectrum, endpoint detection window and method of polishing therewith
US9064806B1 (en) 2014-03-28 2015-06-23 Rohm and Haas Electronics Materials CMP Holdings, Inc. Soft and conditionable chemical mechanical polishing pad with window
US9216489B2 (en) 2014-03-28 2015-12-22 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with endpoint detection window
US9259820B2 (en) 2014-03-28 2016-02-16 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with polishing layer and window
US9333620B2 (en) 2014-04-29 2016-05-10 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with clear endpoint detection window
US9314897B2 (en) 2014-04-29 2016-04-19 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with endpoint detection window
US10213894B2 (en) 2016-02-26 2019-02-26 Applied Materials, Inc. Method of placing window in thin polishing pad
KR101904322B1 (ko) * 2017-01-23 2018-10-04 에스케이씨 주식회사 연마패드 및 이의 제조방법
KR101945878B1 (ko) 2017-07-11 2019-02-11 에스케이씨 주식회사 연마층과 유사 경도를 갖는 윈도우를 포함하는 연마패드
KR20190006703A (ko) 2017-07-11 2019-01-21 에스케이씨 주식회사 연마패드의 비파괴 누수 검사 방법
KR101945869B1 (ko) 2017-08-07 2019-02-11 에스케이씨 주식회사 우수한 기밀성을 갖는 연마패드
CN109202693B (zh) 2017-10-16 2021-10-12 Skc索密思株式会社 防泄漏抛光垫及其制造方法
KR101890331B1 (ko) 2017-10-16 2018-08-21 에스케이씨 주식회사 누수 방지된 연마패드 및 이의 제조방법
KR102080840B1 (ko) 2018-03-29 2020-02-24 에스케이씨 주식회사 누수 방지된 연마패드 및 이의 제조방법

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4179488A (en) * 1976-03-31 1979-12-18 Yoshino Kogyosho Co., Ltd. Method of making a frosted bottle of saturated polyester
US4564497A (en) * 1982-07-28 1986-01-14 Yoshino Kogyosho Co., Ltd. Method of producing bottles of saturated polyester
US4728559A (en) * 1987-07-16 1988-03-01 Eastman Kodak Company Thermoformed plastic containers with transparent windows and method of making same
US5182070A (en) * 1991-04-08 1993-01-26 The Torrington Company Process for molding polymer bearing cage with amorphous case
US5413941A (en) 1994-01-06 1995-05-09 Micron Technology, Inc. Optical end point detection methods in semiconductor planarizing polishing processes
US5893796A (en) 1995-03-28 1999-04-13 Applied Materials, Inc. Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus
JP2796077B2 (ja) * 1995-06-08 1998-09-10 松下電器産業株式会社 基板の研磨装置及び基板の研磨方法
US5605760A (en) 1995-08-21 1997-02-25 Rodel, Inc. Polishing pads
JPH09277162A (ja) * 1996-04-12 1997-10-28 Nikon Corp 半導体研磨装置
US6074287A (en) * 1996-04-12 2000-06-13 Nikon Corporation Semiconductor wafer polishing apparatus
EP1825988B1 (en) * 1997-04-16 2011-09-07 Husky Injection Molding Systems Ltd. Injection molding apparatus with cooled core

Similar Documents

Publication Publication Date Title
BE2011C032I2 (ja)
BE2010C018I2 (ja)
BE2010C019I2 (ja)
BE2009C057I2 (ja)
JP2003507199A5 (ja)
JP2000280359A5 (ja)
JP2003533754A5 (ja)
AR028236A3 (ja)
BE2010C040I2 (ja)
JP2001120572A5 (ja)
JP2001291870A5 (ja)
JP2001262502A5 (ja)
JP2002135177A5 (ja)
JP2000293365A5 (ja)
JP2001255661A5 (ja)
JP2001209718A5 (ja)
JP2002019146A5 (ja)
JP2002065986A5 (ja)
JP2001341926A5 (ja)
JP2002072770A5 (ja)
JP2002096287A5 (ja)
JP2002151988A5 (ja)
JP2001297337A5 (ja)
JP2001314612A5 (ja)
HU0004268D0 (ja)