JP2003506873A5 - - Google Patents
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- Publication number
- JP2003506873A5 JP2003506873A5 JP2001514483A JP2001514483A JP2003506873A5 JP 2003506873 A5 JP2003506873 A5 JP 2003506873A5 JP 2001514483 A JP2001514483 A JP 2001514483A JP 2001514483 A JP2001514483 A JP 2001514483A JP 2003506873 A5 JP2003506873 A5 JP 2003506873A5
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US36485599A | 1999-07-30 | 1999-07-30 | |
| US09/364,788 | 1999-07-30 | ||
| US09/364,788 US7435108B1 (en) | 1999-07-30 | 1999-07-30 | Variable width resilient conductive contact structures |
| US09/364,855 | 1999-07-30 | ||
| PCT/US2000/020530 WO2001009952A2 (en) | 1999-07-30 | 2000-07-28 | Interconnect assemblies and methods |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2003506873A JP2003506873A (en) | 2003-02-18 |
| JP2003506873A5 true JP2003506873A5 (en) | 2007-09-13 |
Family
ID=27002648
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001514483A Pending JP2003506873A (en) | 1999-07-30 | 2000-07-28 | Interconnect assembly and method |
Country Status (6)
| Country | Link |
|---|---|
| EP (1) | EP1208595A2 (en) |
| JP (1) | JP2003506873A (en) |
| KR (2) | KR100807426B1 (en) |
| AU (1) | AU6385600A (en) |
| TW (1) | TW518916B (en) |
| WO (1) | WO2001009952A2 (en) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6939474B2 (en) * | 1999-07-30 | 2005-09-06 | Formfactor, Inc. | Method for forming microelectronic spring structures on a substrate |
| US6888362B2 (en) * | 2000-11-09 | 2005-05-03 | Formfactor, Inc. | Test head assembly for electronic components with plurality of contoured microelectronic spring contacts |
| US6780001B2 (en) | 1999-07-30 | 2004-08-24 | Formfactor, Inc. | Forming tool for forming a contoured microelectronic spring mold |
| US7189077B1 (en) | 1999-07-30 | 2007-03-13 | Formfactor, Inc. | Lithographic type microelectronic spring structures with improved contours |
| US6627980B2 (en) | 2001-04-12 | 2003-09-30 | Formfactor, Inc. | Stacked semiconductor device assembly with microelectronic spring contacts |
| DE10143790B4 (en) * | 2001-09-06 | 2007-08-02 | Infineon Technologies Ag | Electronic component with at least one semiconductor chip |
| TWI288958B (en) | 2002-03-18 | 2007-10-21 | Nanonexus Inc | A miniaturized contact spring |
| US7010854B2 (en) | 2002-04-10 | 2006-03-14 | Formfactor, Inc. | Re-assembly process for MEMS structures |
| DE102008001038B4 (en) * | 2008-04-08 | 2016-08-11 | Robert Bosch Gmbh | Micromechanical component with a slanted structure and corresponding manufacturing method |
| US10281648B2 (en) * | 2013-07-30 | 2019-05-07 | President And Fellows Of Harvard College | Device support structures from bulk substrates |
| KR102655504B1 (en) | 2022-06-10 | 2024-04-11 | 영진전자산업 주식회사 | The pcb chamfering device with spindle fine adjustment device |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4423401A (en) * | 1982-07-21 | 1983-12-27 | Tektronix, Inc. | Thin-film electrothermal device |
| US5152695A (en) | 1991-10-10 | 1992-10-06 | Amp Incorporated | Surface mount electrical connector |
| JPH05259584A (en) * | 1992-01-14 | 1993-10-08 | Internatl Business Mach Corp <Ibm> | Integrated light defector and manufacture therefor |
| JPH06213929A (en) * | 1993-01-19 | 1994-08-05 | Sharp Corp | Manufacture of probe head of inspecting apparatus and the probe head |
| JPH06260383A (en) * | 1993-03-03 | 1994-09-16 | Nikon Corp | Exposure method |
| US5915170A (en) * | 1994-09-20 | 1999-06-22 | Tessera, Inc. | Multiple part compliant interface for packaging of a semiconductor chip and method therefor |
| JPH08306708A (en) * | 1995-05-09 | 1996-11-22 | Sanyo Electric Co Ltd | Semiconductor device and its fabrication |
| DE69635083T2 (en) * | 1995-05-26 | 2006-05-18 | Formfactor, Inc., Livermore | PREPARATION OF COMPOUNDS AND APPARATUSES USING A SURGERY SUBSTRATE |
| US5613861A (en) | 1995-06-07 | 1997-03-25 | Xerox Corporation | Photolithographically patterned spring contact |
| JP3611637B2 (en) * | 1995-07-07 | 2005-01-19 | ヒューレット・パッカード・カンパニー | Electrical connection structure of circuit members |
| JP3294084B2 (en) * | 1995-10-31 | 2002-06-17 | 沖電気工業株式会社 | Device mounting structure and mounting method |
| JP3022312B2 (en) | 1996-04-15 | 2000-03-21 | 日本電気株式会社 | Method of manufacturing probe card |
| DE69733928T2 (en) * | 1996-05-17 | 2006-06-14 | Formfactor Inc | MICROELECTRONIC CONTACT STRUCTURE AND MANUFACTURING METHOD THEREFOR |
| JPH10303345A (en) * | 1997-04-28 | 1998-11-13 | Shinko Electric Ind Co Ltd | Packaging structure to substrate of semiconductor chip |
| JP3378259B2 (en) * | 1997-05-15 | 2003-02-17 | フォームファクター，インコーポレイテッド | How to create a contact structure |
| US5944537A (en) * | 1997-12-15 | 1999-08-31 | Xerox Corporation | Photolithographically patterned spring contact and apparatus and methods for electrically contacting devices |
-
2000
- 2000-07-28 KR KR1020077003992A patent/KR100807426B1/en not_active IP Right Cessation
- 2000-07-28 AU AU63856/00A patent/AU6385600A/en not_active Abandoned
- 2000-07-28 KR KR1020027001207A patent/KR100733525B1/en not_active IP Right Cessation
- 2000-07-28 EP EP00950811A patent/EP1208595A2/en not_active Withdrawn
- 2000-07-28 WO PCT/US2000/020530 patent/WO2001009952A2/en active Application Filing
- 2000-07-28 JP JP2001514483A patent/JP2003506873A/en active Pending
- 2000-08-18 TW TW089115236A patent/TW518916B/en not_active IP Right Cessation