JP2003502495A - 銅の精密メッキシステムのために銅を補充する装置及び方法 - Google Patents

銅の精密メッキシステムのために銅を補充する装置及び方法

Info

Publication number
JP2003502495A
JP2003502495A JP2000617236A JP2000617236A JP2003502495A JP 2003502495 A JP2003502495 A JP 2003502495A JP 2000617236 A JP2000617236 A JP 2000617236A JP 2000617236 A JP2000617236 A JP 2000617236A JP 2003502495 A JP2003502495 A JP 2003502495A
Authority
JP
Japan
Prior art keywords
solution
plating
copper
cartridge
container
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000617236A
Other languages
English (en)
Japanese (ja)
Inventor
エイチ ティン シウ
チョー ピーター
リン フランク
アンドリューシュチェンコ ターニャ
Original Assignee
ステアーグ キューテック インコーポレイテッド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ステアーグ キューテック インコーポレイテッド filed Critical ステアーグ キューテック インコーポレイテッド
Priority claimed from PCT/US1999/010193 external-priority patent/WO2000068468A1/en
Publication of JP2003502495A publication Critical patent/JP2003502495A/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C25D21/14—Controlled addition of electrolyte components

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Automation & Control Theory (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
JP2000617236A 1999-05-10 1999-05-10 銅の精密メッキシステムのために銅を補充する装置及び方法 Pending JP2003502495A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US1999/010193 WO2000068468A1 (en) 1998-03-30 1999-05-10 Copper replenishment technique for precision copper plating system

Publications (1)

Publication Number Publication Date
JP2003502495A true JP2003502495A (ja) 2003-01-21

Family

ID=22272716

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000617236A Pending JP2003502495A (ja) 1999-05-10 1999-05-10 銅の精密メッキシステムのために銅を補充する装置及び方法

Country Status (4)

Country Link
EP (1) EP1194616A4 (de)
JP (1) JP2003502495A (de)
KR (1) KR100764272B1 (de)
CN (1) CN1253609C (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20070098134A (ko) * 2006-03-31 2007-10-05 신도플라텍 주식회사 도금액 자동공급장치
JP5293276B2 (ja) * 2008-03-11 2013-09-18 上村工業株式会社 連続電気銅めっき方法
CN105442024A (zh) * 2015-12-30 2016-03-30 桂林斯壮微电子有限责任公司 药液自动添加系统
CN111501074B (zh) * 2020-05-22 2021-07-16 佛山市诺诚科技有限公司 一种电镀方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6021240B2 (ja) * 1980-01-12 1985-05-25 株式会社小糸製作所 堆積される銅をメッキ液に補給する方法及び装置
US4568431A (en) * 1984-11-13 1986-02-04 Olin Corporation Process for producing electroplated and/or treated metal foil
DE69509685T2 (de) * 1994-02-28 1999-09-23 Kawasaki Steel Co Vorrichtung zum kontinuierlichen Lösen von Metallpulver zur Verwendung beim Plattieren und Verfahren zum Lösen von Nickelmetall unter Verwendung dieser Vorrichtung

Also Published As

Publication number Publication date
EP1194616A4 (de) 2002-10-09
CN1371432A (zh) 2002-09-25
CN1253609C (zh) 2006-04-26
KR100764272B1 (ko) 2007-10-05
KR20020001871A (ko) 2002-01-09
EP1194616A1 (de) 2002-04-10

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