JP2003502495A - 銅の精密メッキシステムのために銅を補充する装置及び方法 - Google Patents
銅の精密メッキシステムのために銅を補充する装置及び方法Info
- Publication number
- JP2003502495A JP2003502495A JP2000617236A JP2000617236A JP2003502495A JP 2003502495 A JP2003502495 A JP 2003502495A JP 2000617236 A JP2000617236 A JP 2000617236A JP 2000617236 A JP2000617236 A JP 2000617236A JP 2003502495 A JP2003502495 A JP 2003502495A
- Authority
- JP
- Japan
- Prior art keywords
- solution
- plating
- copper
- cartridge
- container
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
- C25D21/14—Controlled addition of electrolyte components
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Automation & Control Theory (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
- Electroplating Methods And Accessories (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/US1999/010193 WO2000068468A1 (en) | 1998-03-30 | 1999-05-10 | Copper replenishment technique for precision copper plating system |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2003502495A true JP2003502495A (ja) | 2003-01-21 |
Family
ID=22272716
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2000617236A Pending JP2003502495A (ja) | 1999-05-10 | 1999-05-10 | 銅の精密メッキシステムのために銅を補充する装置及び方法 |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP1194616A4 (de) |
JP (1) | JP2003502495A (de) |
KR (1) | KR100764272B1 (de) |
CN (1) | CN1253609C (de) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20070098134A (ko) * | 2006-03-31 | 2007-10-05 | 신도플라텍 주식회사 | 도금액 자동공급장치 |
JP5293276B2 (ja) * | 2008-03-11 | 2013-09-18 | 上村工業株式会社 | 連続電気銅めっき方法 |
CN105442024A (zh) * | 2015-12-30 | 2016-03-30 | 桂林斯壮微电子有限责任公司 | 药液自动添加系统 |
CN111501074B (zh) * | 2020-05-22 | 2021-07-16 | 佛山市诺诚科技有限公司 | 一种电镀方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6021240B2 (ja) * | 1980-01-12 | 1985-05-25 | 株式会社小糸製作所 | 堆積される銅をメッキ液に補給する方法及び装置 |
US4568431A (en) * | 1984-11-13 | 1986-02-04 | Olin Corporation | Process for producing electroplated and/or treated metal foil |
US5573652A (en) * | 1994-02-28 | 1996-11-12 | Kawasaki Steel Corporation | Apparatus for continuously dissolving metal powder for use in plating and method of dissolving nickel metal using same |
-
1999
- 1999-05-10 CN CNB998167851A patent/CN1253609C/zh not_active Expired - Fee Related
- 1999-05-10 EP EP99921825A patent/EP1194616A4/de not_active Withdrawn
- 1999-05-10 JP JP2000617236A patent/JP2003502495A/ja active Pending
- 1999-05-10 KR KR1020017014316A patent/KR100764272B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR100764272B1 (ko) | 2007-10-05 |
EP1194616A1 (de) | 2002-04-10 |
CN1371432A (zh) | 2002-09-25 |
EP1194616A4 (de) | 2002-10-09 |
CN1253609C (zh) | 2006-04-26 |
KR20020001871A (ko) | 2002-01-09 |
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Legal Events
Date | Code | Title | Description |
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