CN1253609C - 补充镀覆溶液所损失的镀覆材料的装置和方法、补铜装置以及筒 - Google Patents

补充镀覆溶液所损失的镀覆材料的装置和方法、补铜装置以及筒 Download PDF

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Publication number
CN1253609C
CN1253609C CNB998167851A CN99816785A CN1253609C CN 1253609 C CN1253609 C CN 1253609C CN B998167851 A CNB998167851 A CN B998167851A CN 99816785 A CN99816785 A CN 99816785A CN 1253609 C CN1253609 C CN 1253609C
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CN
China
Prior art keywords
solution
copper
plating
plating solution
cartridge
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB998167851A
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English (en)
Chinese (zh)
Other versions
CN1371432A (zh
Inventor
C·H·廷
P·曹
F·林
T·安德里乌施陈科
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SCHITEGEKATEK CO
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SCHITEGEKATEK CO
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Filing date
Publication date
Application filed by SCHITEGEKATEK CO filed Critical SCHITEGEKATEK CO
Priority claimed from PCT/US1999/010193 external-priority patent/WO2000068468A1/en
Publication of CN1371432A publication Critical patent/CN1371432A/zh
Application granted granted Critical
Publication of CN1253609C publication Critical patent/CN1253609C/zh
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Expired - Fee Related legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C25D21/14—Controlled addition of electrolyte components

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Automation & Control Theory (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
CNB998167851A 1999-05-10 1999-05-10 补充镀覆溶液所损失的镀覆材料的装置和方法、补铜装置以及筒 Expired - Fee Related CN1253609C (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US1999/010193 WO2000068468A1 (en) 1998-03-30 1999-05-10 Copper replenishment technique for precision copper plating system

Publications (2)

Publication Number Publication Date
CN1371432A CN1371432A (zh) 2002-09-25
CN1253609C true CN1253609C (zh) 2006-04-26

Family

ID=22272716

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB998167851A Expired - Fee Related CN1253609C (zh) 1999-05-10 1999-05-10 补充镀覆溶液所损失的镀覆材料的装置和方法、补铜装置以及筒

Country Status (4)

Country Link
EP (1) EP1194616A4 (de)
JP (1) JP2003502495A (de)
KR (1) KR100764272B1 (de)
CN (1) CN1253609C (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20070098134A (ko) * 2006-03-31 2007-10-05 신도플라텍 주식회사 도금액 자동공급장치
JP5293276B2 (ja) * 2008-03-11 2013-09-18 上村工業株式会社 連続電気銅めっき方法
CN105442024A (zh) * 2015-12-30 2016-03-30 桂林斯壮微电子有限责任公司 药液自动添加系统
CN111501074B (zh) * 2020-05-22 2021-07-16 佛山市诺诚科技有限公司 一种电镀方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6021240B2 (ja) * 1980-01-12 1985-05-25 株式会社小糸製作所 堆積される銅をメッキ液に補給する方法及び装置
US4568431A (en) * 1984-11-13 1986-02-04 Olin Corporation Process for producing electroplated and/or treated metal foil
DE69509685T2 (de) * 1994-02-28 1999-09-23 Kawasaki Steel Co Vorrichtung zum kontinuierlichen Lösen von Metallpulver zur Verwendung beim Plattieren und Verfahren zum Lösen von Nickelmetall unter Verwendung dieser Vorrichtung

Also Published As

Publication number Publication date
EP1194616A4 (de) 2002-10-09
CN1371432A (zh) 2002-09-25
JP2003502495A (ja) 2003-01-21
KR100764272B1 (ko) 2007-10-05
KR20020001871A (ko) 2002-01-09
EP1194616A1 (de) 2002-04-10

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Granted publication date: 20060426