JP2003500526A5 - - Google Patents

Download PDF

Info

Publication number
JP2003500526A5
JP2003500526A5 JP2000620638A JP2000620638A JP2003500526A5 JP 2003500526 A5 JP2003500526 A5 JP 2003500526A5 JP 2000620638 A JP2000620638 A JP 2000620638A JP 2000620638 A JP2000620638 A JP 2000620638A JP 2003500526 A5 JP2003500526 A5 JP 2003500526A5
Authority
JP
Japan
Prior art keywords
compound
producing
conjugated polymer
cyclodextrin
complex
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2000620638A
Other languages
English (en)
Japanese (ja)
Other versions
JP4422918B2 (ja
JP2003500526A (ja
Filing date
Publication date
Priority claimed from DE19931114A external-priority patent/DE19931114A1/de
Application filed filed Critical
Priority claimed from PCT/EP2000/004107 external-priority patent/WO2000072331A1/de
Publication of JP2003500526A publication Critical patent/JP2003500526A/ja
Publication of JP2003500526A5 publication Critical patent/JP2003500526A5/ja
Application granted granted Critical
Publication of JP4422918B2 publication Critical patent/JP4422918B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2000620638A 1999-05-20 2000-05-08 π−共役ポリマーの製造方法 Expired - Fee Related JP4422918B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
DE19923140 1999-05-20
DE19923140.0 1999-05-20
DE19931114A DE19931114A1 (de) 1999-05-20 1999-07-06 Verfahren zur Herstellung von n-konjugierten Polymeren
DE19931114.5 1999-07-06
PCT/EP2000/004107 WO2000072331A1 (de) 1999-05-20 2000-05-08 VERFAHREN ZUR HERSTELLUNG VON π-KONJUGIERTEN POLYMEREN

Publications (3)

Publication Number Publication Date
JP2003500526A JP2003500526A (ja) 2003-01-07
JP2003500526A5 true JP2003500526A5 (https=) 2007-06-28
JP4422918B2 JP4422918B2 (ja) 2010-03-03

Family

ID=26053438

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000620638A Expired - Fee Related JP4422918B2 (ja) 1999-05-20 2000-05-08 π−共役ポリマーの製造方法

Country Status (6)

Country Link
US (1) US6805816B1 (https=)
EP (1) EP1198799B1 (https=)
JP (1) JP4422918B2 (https=)
AT (1) ATE289703T1 (https=)
AU (1) AU4562900A (https=)
WO (1) WO2000072331A1 (https=)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100395280C (zh) * 2006-05-26 2008-06-18 华东理工大学 自分散型纳米级导电聚苯胺的制备方法
FR2938096B1 (fr) * 2008-11-03 2010-11-26 Oberthur Technologies Dispositif electronique autorisant des communications sans contact en champ proche.
CA2822995C (en) * 2010-12-31 2021-05-11 Eastpond Laboratories Limited Cellular hydration compositions containing cyclodextrins
US20120171184A1 (en) 2010-12-31 2012-07-05 Lajos Szente Cellular hydration compositions
US9382490B2 (en) 2012-12-27 2016-07-05 Shell Oil Company Compositions
BR112015014028A2 (pt) 2012-12-27 2017-07-11 Shell Int Research composição de aditivo para uso em um combustível diesel, formulação de combustível diesel, e, uso de uma ciclodextrina modificada
CN103242524B (zh) * 2013-05-16 2015-06-03 东华大学 以环糊精为模板制备聚苯胺纳米管的方法
WO2020033820A1 (en) 2018-08-10 2020-02-13 Avx Corporation Solid electrolytic capacitor formed from conductive polymer particles
EP3834217A4 (en) 2018-08-10 2022-05-11 KYOCERA AVX Components Corporation SOLID ELECTROLYTE CAPACITOR WITH INTRINSICALLY CONDUCTIVE POLYMER
CN118280737A (zh) 2018-08-10 2024-07-02 京瓷Avx元器件公司 包含聚苯胺的固体电解电容器
US11955294B2 (en) 2018-12-11 2024-04-09 KYOCERA AVX Components Corporation Solid electrolytic capacitor containing an intrinsically conductive polymer
DE112020002426T5 (de) 2019-05-17 2022-01-27 Avx Corporation Festelektrolytkondensator
WO2021055707A1 (en) 2019-09-18 2021-03-25 Avx Corporation Solid electroltyic capacitor for use at high voltages
DE112020006028T5 (de) 2019-12-10 2022-10-06 KYOCERA AVX Components Corporation Festelektrolytkondensator, der eine Vorbeschichtung und ein intrinsisch leitfähiges Polymer enthält
WO2021119088A1 (en) 2019-12-10 2021-06-17 Avx Corporation Tantalum capacitor with increased stability
US11631548B2 (en) 2020-06-08 2023-04-18 KYOCERA AVX Components Corporation Solid electrolytic capacitor containing a moisture barrier

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ATE111294T1 (de) * 1988-03-03 1994-09-15 Blasberg Oberflaechentech Gedruckte schaltplatte mit metallisierten löchern und deren herstellung.
DE4202337A1 (de) * 1992-01-29 1993-08-05 Bayer Ag Verfahren zur durchkontaktierung von zweilagigen leiterplatten und multilayern
US6593399B1 (en) * 1999-06-04 2003-07-15 Rohm And Haas Company Preparing conductive polymers in the presence of emulsion latexes
DE10004725A1 (de) * 2000-02-03 2001-08-09 Bayer Ag Verfahren zur Herstellung von wasserlöslichen pi-konjugierten Polymeren

Similar Documents

Publication Publication Date Title
JP2003500526A5 (https=)
US6212769B1 (en) Process for manufacturing a printed wiring board
TWI231316B (en) Micro-etch solution for producing metal surface topography
KR960016662A (ko) 2층 및 다층 인쇄 회로 기판의 쓰루-홀 도금 방법
JP2002515657A5 (https=)
MY114849A (en) Surface treatment process of metallic material and metallic obtained thereby
EP0457180A3 (en) Process for metallising a through-hole board
JP2004265927A5 (https=)
EP1482771A3 (en) Metal/ceramic circuit board and method for producing same
KR950024971A (ko) 산화구리용 화학적 환원액
TW200403290A (en) Method for electroless metalisation of polymer substrate
TWI517772B (zh) 沉積導電聚合物層進入印刷電路板之貫穿孔與導通孔之方法
JPH07202432A (ja) プリント配線板の製造方法
Ohnishi et al. Metal pattern formation by selective electroless metallization on polypyrrole films patterned by photochemical degradation of iron (III) chloride as oxidizing agent
KR960030756A (ko) 인쇄 배선 보드와 그 형성 방법
EP1471167A3 (en) Electroless plating method
JP2002266087A5 (https=)
JPH01264290A (ja) プリント配線板の製造方法
IE51721B1 (en) Process for the manufacture of printed circuits
US20040166438A1 (en) Promoting adhesion between a polymer and a metallic substrate
JPH10303550A (ja) 導電性高分子膜を用いるめっきの前処理液
JP2587597B2 (ja) プリント配線板の製造方法
JP2002371370A5 (https=)
JPH0710028B2 (ja) プリント板の製造法
JPS6467995A (en) Manufacture of printed circuit board with side face electrode