JP2003347265A - 半導体集積回路装置の製造方法 - Google Patents

半導体集積回路装置の製造方法

Info

Publication number
JP2003347265A
JP2003347265A JP2003114112A JP2003114112A JP2003347265A JP 2003347265 A JP2003347265 A JP 2003347265A JP 2003114112 A JP2003114112 A JP 2003114112A JP 2003114112 A JP2003114112 A JP 2003114112A JP 2003347265 A JP2003347265 A JP 2003347265A
Authority
JP
Japan
Prior art keywords
wafer
oxide film
cleaning
manufacturing
integrated circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2003114112A
Other languages
English (en)
Japanese (ja)
Other versions
JP2003347265A5 (enExample
Inventor
Tomomasa Funahashi
倫正 舟橋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP2003114112A priority Critical patent/JP2003347265A/ja
Publication of JP2003347265A publication Critical patent/JP2003347265A/ja
Publication of JP2003347265A5 publication Critical patent/JP2003347265A5/ja
Pending legal-status Critical Current

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Landscapes

  • Weting (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP2003114112A 2003-04-18 2003-04-18 半導体集積回路装置の製造方法 Pending JP2003347265A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003114112A JP2003347265A (ja) 2003-04-18 2003-04-18 半導体集積回路装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003114112A JP2003347265A (ja) 2003-04-18 2003-04-18 半導体集積回路装置の製造方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP10257267A Division JP2000091289A (ja) 1998-09-10 1998-09-10 半導体集積回路装置の製造方法

Publications (2)

Publication Number Publication Date
JP2003347265A true JP2003347265A (ja) 2003-12-05
JP2003347265A5 JP2003347265A5 (enExample) 2005-11-17

Family

ID=29774758

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003114112A Pending JP2003347265A (ja) 2003-04-18 2003-04-18 半導体集積回路装置の製造方法

Country Status (1)

Country Link
JP (1) JP2003347265A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002202618A (ja) * 2000-12-27 2002-07-19 Tosoh Corp レジスト剥離剤
JP2006278678A (ja) * 2005-03-29 2006-10-12 Tokyo Electron Ltd 基板処理方法
JP2006319282A (ja) * 2005-05-16 2006-11-24 Fuji Electric Device Technology Co Ltd 半導体装置の製造方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002202618A (ja) * 2000-12-27 2002-07-19 Tosoh Corp レジスト剥離剤
JP2006278678A (ja) * 2005-03-29 2006-10-12 Tokyo Electron Ltd 基板処理方法
JP2006319282A (ja) * 2005-05-16 2006-11-24 Fuji Electric Device Technology Co Ltd 半導体装置の製造方法

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