JP2003344640A - Optical element and method for manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To manufacture an optical element having the high reliability without the color mixing or the white void by a simple process using an ink jet system. <P>SOLUTION: In the method for manufacturing the optical element and in the method for manufacturing a substrate for a color filter, in which a colored part is formed by providing ink liquid droplets to the region encompassed by a pattern having a shielding property, using an ink jet recording device, a water- repellent treatment for a partition wall or a hydrophilic treatment for the surface of a support substrate is performed, in a plasma treatment device in which a plasma generation part and a treatment part for treating the substrate with a prescribed treatment using a neutral active species generated by the plasma generation part are disposed in the downstream of a reactive gas, in which the substrate is not directly exposed to the plasma generated by the plasma generation part. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a color filter which is a constituent member of a color liquid crystal element used in a color television, a personal computer and a pachinko game table, and a full color display electroluminescence provided with a plurality of light emitting layers. A manufacturing method for manufacturing an optical element such as an element using an inkjet method, and further,
The present invention relates to an optical element manufactured by the manufacturing method and a liquid crystal element using a color filter which is one of the optical elements.

[0002]

2. Description of the Related Art In recent years, the development of personal computers,
In particular, with the development of portable personal computers, the demand for liquid crystal displays, especially color liquid crystal displays, tends to increase. However, cost reduction is necessary for further widespread use, and in particular, there is an increasing demand for cost reduction of a color filter, which has a heavy weight in terms of cost.

Conventionally, various methods have been tried in order to meet the above requirements while satisfying the required characteristics of the color filter, but a method satisfying all the required characteristics has not yet been established. Each method will be described below.

The first method is a dyeing method. The dyeing method involves first forming a water-soluble polymer material layer, which is a material for dyeing, on a transparent substrate, patterning this into a desired shape by a photolithography process, and then immersing the obtained pattern in a dyeing bath. To obtain a colored pattern. By repeating this process three times, R (red), G (green), B
A colored layer including three colored portions of (blue) is formed.

The second method is a pigment dispersion method, which has been most actively used in recent years. In this method, a photosensitive resin layer in which a pigment is dispersed is first formed on a transparent substrate, and this is patterned to obtain a monochromatic pattern. By repeating this process three times, a colored layer including colored portions of three colors of R, G, and B is formed.

A third method is an electrodeposition method. In this method, first, a transparent electrode is patterned on a transparent substrate, and the first color is electrodeposited by immersing it in an electrodeposition coating solution containing a pigment, a resin, an electrolytic solution and the like. This process is repeated 3 times to obtain R, G,
A colored layer consisting of colored portions of three colors of B is formed and finally baked.

As a fourth method, a pigment is dispersed in a thermosetting resin and printing is repeated three times to obtain R, G, and
After coating B separately, the resin is heat-cured to form a colored layer. Either way,
It is common to form a protective layer on the colored layer.

The common points of these methods are R,
It is necessary to repeat the same process three times in order to color the three colors of G and B, which is costly. There is also a problem that the yield decreases as the number of processes increases. Further, in the electrodeposition method, since the pattern shape that can be formed is limited, in the current technology, a TFT type (TF
It is difficult to apply it to the structure of a liquid crystal element of T, that is, an active matrix driving method using a thin film transistor as a switching element.

Further, the printing method is not suitable for forming a fine pitch pattern because of its poor resolution.

In order to make up for the above-mentioned drawbacks, in recent years, a method of manufacturing a color filter using an ink jet method has been actively studied. The method using the inkjet method has advantages that the manufacturing process is simple and the cost is low.

On the other hand, the ink jet method can be applied not only to the manufacture of color filters but also to the manufacture of electroluminescent elements.

The electroluminescence device has a structure in which a thin film containing a fluorescent inorganic and organic compound is sandwiched between a cathode and an anode, and electrons and holes are injected into the thin film to recombine. Is an element that emits light by utilizing the emission of fluorescence or phosphorescence when this exciton is deactivated. A fluorescent material used in such an electroluminescence device is used, for example, in a TFT.
It is possible to form an element by forming the light emitting layer by applying the same by an ink jet method on a substrate on which an element is formed.

[0013]

As described above, the ink jet method can be applied to the manufacture of optical elements such as color filters and electroluminescent elements because the manufacturing process can be simplified and the cost can be reduced. However, in the production of such an optical element, there are problems called "color mixture" and "white spots" as problems peculiar to the inkjet method. Hereinafter, a case of manufacturing a color filter will be described as an example.

"Mixed color" is an obstacle that occurs when ink is mixed between adjacent pixels (colored portions) of different colors. In a method for manufacturing a color filter in which a black matrix is used as a partition and ink is applied to the openings of the black matrix to form colored portions, a volume that is several times to several tens of times the volume of the openings of the black matrix is used. It is necessary to apply an ink having When the solid content concentration of the colorant or curing component contained in the ink is high,
That is, when the volume of the applied ink is relatively small, the black matrix sufficiently functions as a partition wall and can hold the ink in the opening of the black matrix, so that the applied ink can pass over the black matrix. , The adjacent colored parts of different colors are never reached. However, when the solid content concentration in the ink is low, that is, when it is necessary to apply a large amount of ink, the ink overflows beyond the black matrix serving as the partition wall, so that color mixing occurs between adjacent colored portions. Resulting in. In particular, there is a limit to the viscosity of the ink that can be stably ejected from the nozzle of the inkjet head, and there is also a limit to the concentration of the solid content contained in the ink, so a technique for avoiding color mixing is required. .

Therefore, there has been proposed a method of preventing color mixing by utilizing the difference in ink wettability between the colored portion and the partition wall. For example, in JP-A-59-75205, in order to prevent the ink from spreading outside the target area,
A method of forming a diffusion prevention pattern with a substance having poor wettability has been proposed, but no specific technique is disclosed.
On the other hand, Japanese Patent Application Laid-Open No. 4-123005 proposes a specific method of patterning a silicone rubber layer having a large water and oil repellency to form a partition wall for preventing color mixing. Further, in JP-A-5-241011 and JP-A-5-241012, similarly, a silicone rubber layer is formed on a black matrix serving as a light-shielding layer,
A method used as a partition wall for color mixing prevention is disclosed.

According to these methods, even when an amount of ink far exceeding the height of the partition wall is applied, the ink is repelled because the surface layer of the partition wall exhibits ink repellency,
It is possible to effectively prevent color mixing without reaching the adjacent colored portions beyond the partition walls.

FIG. 3 shows a conceptual diagram thereof. In the figure, 31 is a transparent substrate, 33 is a black matrix which also serves as a partition wall, 36
Is ink. When the upper surface of the black matrix 33 has ink repellency, the applied ink 36 is retained in the opening of the black matrix 33 and reaches the adjacent colored portion as shown in FIG. 3B. There is no. However, when the ink repellency of the upper surface of the black matrix 33 is low, the applied ink 36 wets and spreads on the black matrix 33 and is applied to the adjacent openings, as shown in FIG. It mixes with the ink. In general, it is possible to obtain more excellent ink repellency by using a fluorine compound than by using a silicon compound. For example, JP 2000-3
Japanese Patent No. 5511 discloses a method of forming a positive resist pattern on a light-shielding portion and further applying an ink repellent treatment agent on the pattern. It is disclosed that a fluorine compound is used as the ink repellent treatment agent. Has been done. However, in the case of this method, it is necessary to remove the positive resist pattern provided on the light-shielding portion after forming the colored portion, but when removing the resist pattern, problems such as dissolution, peeling, and swelling of pixels may occur. is there.

The method of fluorinating the surface of the resin layer is described in the Chemical Society of Japan, 1985 (10) p. 1916
〜 1923, a method of treating a reaction gas of a fluorine compound by converting it into plasma is proposed. Further, as an example in which this technique is applied to a color filter, there is Japanese Patent Laid-Open No.
No. 1-271753, the partition wall has a multi-layer structure of a lower layer having affinity for ink and an upper layer having non-affinity, and as a method for making the upper layer non-affinity for ink, a gas containing a fluorine compound is used. A method of plasma treatment is disclosed.

However, in all of the above-mentioned methods, the partition walls are formed in multiple layers, and it is necessary to perform the photolithography process a plurality of times, so that the process is complicated, the cost is increased, and the yield is reduced. is there.

On the other hand, "white spots" are obstacles mainly caused by the inability of the applied ink to diffuse sufficiently and uniformly in the region surrounded by the partition walls, and color unevenness and contrast are caused. This may cause display failure such as deterioration of display quality.

FIG. 4 shows a conceptual diagram of blank areas. In the figure, the same members as those in FIG. 3 are designated by the same reference numerals. Further, 38 is a blank portion.

In recent years, in the color filter for the TFT type liquid crystal element, the opening shape of the black matrix 33 is complicated in order to protect the TFT from outside light or to obtain a bright display by increasing the aperture ratio. Has become
Since those having a plurality of corners are generally used, there arises a problem that the ink 36 does not sufficiently diffuse into the corners, as shown in FIG. When forming the black matrix 33,
Generally, a photolithography process using a resist is used, and various components contained in the resist may cause contaminants to adhere to the surface of the transparent substrate 31 and hinder the diffusion of the ink 36. Further, when the ink repellency of the side surface of the black matrix 33 is extremely higher than that of the surface of the transparent substrate 31, the ink 36 is repelled by the side surface of the black matrix 33, as shown in FIG. 4B. In some cases, the problem may occur that the color becomes light at the portion where the ink 36 and the black matrix 33 are in contact with each other.

As a method for solving such problems of color mixture and white spots, in Japanese Patent Laid-Open No. 9-203803, an area (concave portion) surrounded by a black matrix (convex portion) is
It has been proposed to use a substrate that has been treated to be ink-philic so as to have a contact angle with water of 20 ° or less. A water-soluble leveling agent or a water-soluble surfactant is exemplified as a method for imparting ink affinity. Further, in order to solve the above-mentioned problem of color mixture at the same time, a method of imparting ink repellency by previously treating the surface of the convex portion with an ink repellent treatment agent is disclosed, and a fluorine-containing silane cup is used as the ink repellent treatment agent. A method of coating with a fluorine-based solvent using a ring agent is exemplified. Further, at this time, as a method for selectively making only the surface layer of the convex portion ink-repellent and not making the side surface of the convex portion ink-repellent, two kinds of materials are laminated so that the convex portion itself has such a property. Cover the areas other than the protrusions with resist and treat only the top surface of the protrusions with ink repellent. Form a resist layer on the transparent substrate, treat the entire surface with ink repellent, and then pattern the resist layer by a photolithography process. A method of forming a convex portion by the method is exemplified.

Further, Japanese Patent Laid-Open No. 9-230129 discloses a method of irradiating an energy ray as a method of treating the concave portion with the ink. Also in this case, as a method of performing the ink repellent treatment only on the surface layer of the convex portion,
A method is exemplified in which a photosensitive material for forming convex portions is applied on a glass substrate, the entire surface is treated with an ink repellent treatment agent, and then the photosensitive material is patterned by a photolithography process. After that, the convex portion and the concave portion are simultaneously or selectively subjected to ink-philic treatment by irradiation with energy rays.

However, in all of these methods, the surface of the convex portion is subjected to the ink repellent treatment and then the concave portion is subjected to the ink repellent treatment. Therefore, when the ink repellent treatment is performed, the surface of the convex portion subjected to the ink repellent treatment is treated. There is a problem that the ink repellency is reduced. Therefore, sufficient ink affinity on the transparent substrate surface and the side surface of the black matrix,
It is difficult to obtain sufficient ink repellency on the upper surface of the black matrix.

The above problem similarly occurs when an electroluminescent element is manufactured by an ink jet method. That is, in an electroluminescent element, for example, when an organic semiconductor material that emits light of each of R, G, and B is used as ink, and the ink is applied to a region surrounded by partition walls to form a pixel (light emitting layer). When the ink is mixed between the adjacent light emitting layers, there is a problem in that the light emitting layer cannot emit light of a desired color and brightness. Further, even in the case of a single-color light emitting layer, since the amount of ink filled in the partition walls is made uniform, when the ink flows into the adjacent pixels, non-uniformity in the amount of ink occurs, which is recognized as uneven brightness. Becomes Further, if the ink is not sufficiently diffused in the region surrounded by the partition walls, there arises a problem that sufficient emission brightness cannot be obtained at the boundary portion between the light emitting layer and the partition walls. In the following description, for the sake of convenience, even in the case of manufacturing an electroluminescence element, the mixture of ink between adjacent light emitting layers is “mixed color”, and the light emission luminance due to the repulsion of ink at the boundary between the light emitting layer and the partition wall. The occurrence of unevenness is described as “white spot”.

An object of the present invention is to solve the above problems and to produce a highly reliable optical element in the case of manufacturing an optical element such as a color filter or an electroluminescence element at a low cost by a simple process using an ink jet system. To provide well. Specifically, when ink is applied to the area surrounded by the partition walls, color mixing between adjacent pixels is prevented, and the ink is sufficiently diffused in the area to form a pixel having a flat surface. To form. Another object of the present invention is to provide a liquid crystal element having excellent color display characteristics at a lower cost by using the optical element obtained by the manufacturing method.

[0028]

A first aspect of the present invention is a method for manufacturing an optical element having at least a plurality of pixels on a supporting substrate and partition walls located between adjacent pixels, and a resin on the supporting substrate. The step of forming partition walls made of the composition, and the plasma generation unit and the processing unit that performs a predetermined process on the substrate using the neutral active species generated in the plasma generation unit are generated in the plasma generation unit. Plasma treatment apparatus that is arranged downstream of the reaction gas without exposing the plasma directly to the substrate, or using a plasma generation unit and neutral active species generated in the plasma generation unit. A plasma processing apparatus in which a processing unit that performs a predetermined process on a substrate is adjacently disposed via a conductive intermediate electrode having a through hole,
2. A method for manufacturing an optical element, comprising: a plasma treatment step of performing a predetermined treatment in 1); and a step of applying ink to a region surrounded by partition walls by an inkjet method to form pixels.

According to the present invention, when ink is applied to the area surrounded by the partition wall by the ink jet method, even if the landing deviation of ink droplets is small, color mixing and ink residue on the partition wall do not occur and excellent quality is achieved. The optical element can be provided.

In the present invention, the "ink" means
After being dried and cured, for example, it is a generic term for liquids having optical and electrical functions, and is not limited to the coloring materials that have been conventionally used.

In the present invention, the predetermined treatment is a water repellent treatment or a hydrophilic treatment, more preferably a treatment for making only the surface of the partition wall water repellent so that the exposed area of the supporting substrate is made hydrophilic or a hydrophilic treatment and a partition wall. The surface is made water repellent and the exposed area of the supporting substrate is made hydrophilic, and the partition wall is formed of a resin composition containing carbon black. The average roughness (Ra) of the surface of the partition wall after the treatment is 30 nm or less, and the contact angle of the surface of the partition wall after the plasma treatment with pure water is 80 ° or more, and the contact with the pure water on the surface of the supporting substrate is performed. The preferred embodiment includes that the angle is 20 ° or less.

Further, in the present invention, the gas introduced in the hydrophilic treatment step is one kind of gas selected from oxygen, argon and helium, and CF ₄ is used as at least the gas introduced in the water repellent treatment step. , SF ₆ , CHF ₃ , C ₂ F ₆ ,
At least one halogen gas selected from C ₃ F ₈ and C ₅ F ₈ , or CF ₄ , SF ₆ , CHF ₃ , C ₂ F ₆ and C ₃
It is a mixed gas of at least one halogen gas selected from F ₈ and C ₅ F ₈ and O ₂ gas, and the mixing ratio of O ₂ is 3
A gas containing 0% or less is preferably used.

Further, the present invention provides the above-mentioned ink containing at least a curing component, water and an organic solvent, producing a color filter in which the supporting substrate is a transparent substrate and the partition walls are a black matrix, or It is included as a preferable aspect that the pixel is a light emitting layer and an electroluminescent element having electrodes on the upper and lower sides of the light emitting layer is manufactured.

A second aspect of the present invention is characterized in that it has at least a plurality of pixels on a support substrate and partition walls located between adjacent pixels, and is manufactured by the above-described method for manufacturing an optical element of the present invention. Is an optical element.

In the second aspect of the present invention described above, the partition wall is preferably a light-shielding layer, the supporting substrate is a transparent substrate, and the pixels are formed of an ink containing a colorant. A preferred embodiment includes a colored portion, which is a color filter having a plurality of colored portions, and in particular, a protective layer on the colored portion and a transparent conductive film on the surface. Further, a second aspect of the present invention includes, as a preferred embodiment, the above-mentioned pixel is a light emitting layer and is an electroluminescence element having electrodes above and below the light emitting layer.

Further, a third aspect of the present invention is a liquid crystal element characterized in that a liquid crystal is sandwiched between a pair of substrates, and one of the substrates is constituted by using the optical element of the present invention.

[0037]

BEST MODE FOR CARRYING OUT THE INVENTION
A plasma generating unit on a supporting substrate having a partition wall and a processing unit for performing a predetermined process on the substrate by using the neutral active species generated by the plasma generating unit, generate the plasma generated by the plasma generating unit. A plasma processing apparatus that is not directly exposed to the substrate and that is arranged on the downstream side of the reaction gas, or a plasma generation unit and a neutral active species generated by the plasma generation unit In a plasma processing apparatus in which a processing unit for performing a predetermined process is adjacently disposed via a conductive intermediate electrode having a through hole, an inkjet is applied to a region surrounded by the partition wall after performing a predetermined plasma process. The method is characterized in that ink is applied by a method to form pixels. Examples of the optical element of the present invention manufactured by the manufacturing method of the present invention include a color filter and an electroluminescence element. First, the optical element of the present invention will be described with reference to embodiments.

FIG. 10 schematically shows a cross section of an example of a color filter which is an embodiment of the optical element of the present invention. In the figure, 101 is a transparent substrate as a supporting substrate, 102 is a black matrix that also serves as partition walls, 103 is a colored portion which is a pixel, and 104 is a protective layer formed as necessary. When a color filter of the present invention is used to form a liquid crystal element, a protective layer 104 is formed on the colored portion 103 or on the colored portion 103, and further ITO (indium tin oxide) for driving liquid crystal is formed on the protective layer 104. -A transparent conductive film made of a transparent conductive material such as oxide may be formed and provided.

FIG. 11 is a schematic sectional view of an embodiment of the liquid crystal element of the present invention, which is constructed by using the color filter shown in FIG. In the figure, 107 is a common electrode (transparent conductive film),
108 is an alignment film, 109 is a liquid crystal, 111 is a counter substrate, 1
Reference numeral 12 is a pixel electrode, and 113 is an alignment film. The same members as those in FIG.

The color liquid crystal element is generally formed by putting together the substrate 101 on the color filter side and the counter substrate 111 and enclosing the liquid crystal 109. TFTs (not shown) and pixel electrodes 112 are formed in a matrix on the inside of one substrate 111 of the liquid crystal element. In addition, the pixel electrode 112 is provided inside the substrate 101 on the color filter side.
The colored portion 103 of the color filter is formed so that R, G, and B are arrayed at a position facing to, and a transparent common electrode 107 is formed thereon. Further, alignment films 108 and 113 are formed on the surfaces of both substrates, and liquid crystal molecules are arranged in a fixed direction. These substrates are arranged to face each other with a spacer (not shown) in between, and are bonded together by a sealing material (not shown), and the liquid crystal 109 is filled in the gap. When the liquid crystal element is a transmissive type, the substrate 1
11 and the pixel electrode 112 are formed of a transparent material, a polarizing plate is adhered to the outside of each substrate, and generally a backlight in which a fluorescent lamp and a scattering plate are combined is used, and a liquid crystal compound is used to transmit light of the backlight. Display is performed by functioning as an optical shutter that changes the. In the case of a reflective type, the substrate 111 or the pixel electrode 112 is formed of a material having a reflection function, or a reflective layer is provided on the substrate 111, and a polarizing plate is provided outside the transparent substrate 101 to The display is performed by reflecting the light incident from the filter side.

Further, FIG. 9 shows a schematic cross-sectional view of an example of an organic electroluminescence device (hereinafter referred to as “EL device”) which is another embodiment of the optical device of the present invention.
In the figure, 91 is a drive substrate which is a support substrate, 92 is a partition wall, 9
3 is a light emitting layer which is a pixel, 94 is a transparent electrode, and 96 is a metal layer. In this figure, only one pixel region is shown for simplification.

A TFT (not shown), a wiring film, an insulating film, and the like are laminated in multiple layers on the driving substrate 91, and a metal layer 96 is provided.
And a voltage can be applied between the transparent electrodes 94 arranged for each light emitting layer 93 in units of light emitting layers. The drive substrate 91 is manufactured by a known thin film process.

Regarding the structure of the organic EL device of the present invention,
There is no particular limitation as long as it is a structure in which at least one light-emitting material is filled in a partition wall made of a resin composition between electrodes composed of a pair of an anode and a cathode, at least one of which is transparent or semi-transparent, and the structure is known. The above can be adopted, and various modifications can be made without departing from the gist of the present invention.

The laminated structure is, for example, (1) electrode (cathode) / light emitting layer / hole injection layer / electrode (anode) (2) electrode (anode) / light emitting layer / electron injection layer / electrode (cathode) ( 3) Electrode (anode) / hole injection layer / light emitting layer / electron injection layer / electrode (cathode) (4) Electrode (anode or cathode) / light emitting layer / electrode (cathode or anode) The present invention can be applied to an EL element having a laminated structure provided with an organic compound layer having any of the above configurations.

The above (1) is called a two-layer structure, (3) is called a three-layer structure, and (4) is called a single-layer structure. Although the organic EL device of the present invention is basically based on these laminated structures, it may have a structure in which (1) to (4) other than these are combined, or a plurality of respective layers. Further, full color display may be realized by combining with a color filter. The shape, size, material, manufacturing method and the like of the organic EL element of the present invention having these laminated structures are appropriately selected according to the application of the organic EL element, etc., and there is no particular limitation.

The light emitting material used in the light emitting layer of the organic EL device of the present invention is not particularly limited, and various materials can be applied. Specifically, a low molecular weight fluorescent substance and a polymeric fluorescent substance are preferable, and a polymeric fluorescent substance is more preferable.

For example, the low molecular weight organic compound is not particularly limited, but naphthalene and its derivative, anthracene and its derivative, perylene and its derivative, polymethine type, xanthene type, coumarin type and cyanine type dyes, 8 -A metal complex of hydroxyquinoline and its derivative, aromatic amine, tetraphenylcyclopentadiene and its derivative, tetraphenylbutadiene and its derivative, etc. can be used. Specifically, known ones such as those described in JP-A-57-51781 and JP-A-59-194393 can be used.

The high molecular weight organic compound which can be used as the light emitting material is not particularly limited, but polyphenylene vinylene, polyarylene, polyalkylthiophene, polyalkylfluorene and the like can be mentioned.

The polymeric fluorescent substance used in the organic EL device of the present invention may be a random, block or graft copolymer, or a polymer having an intermediate structure between them, for example, having a block property. It may be a random copolymer. From the viewpoint of obtaining a polymeric fluorescent substance having a high fluorescence quantum yield, a random copolymer having a block property or a block or graft copolymer is preferable to a completely random copolymer. Further, since the organic EL element of the present invention utilizes light emission from a thin film, the polymeric fluorescent substance used is one having fluorescence in a solid state.

As a good solvent for the polymeric fluorescent substance,
Examples include chloroform, methylene chloride, dichloroethane, tetrahydrofuran, toluene, xylene and the like.
Although it depends on the structure and molecular weight of the polymeric fluorescent substance, usually 0.1% by weight or more can be dissolved in these solvents.

In the organic EL device of the present invention, it is used in an electron transporting layer when an electron transporting layer is further provided between a layer containing a light emitting material and a cathode, or is used as a mixture with a hole transporting material and a light emitting material. The electron transporting material has a function of transmitting the electrons injected from the cathode to the light emitting material. There is no particular limitation on such an electron-transporting material, and any one of conventionally known compounds can be selected and used.

Preferred examples of the electron transporting material include:
Examples thereof include nitro-substituted fluorenone derivatives, anthraquinodimethane derivatives, diphenylquinone derivatives, thiopyran dioxide derivatives, heterocyclic tetracarboxylic acid anhydrides, and carbodiimides.

Furthermore, a fluorenylidene methane derivative,
Examples thereof include anthraquinodimethane derivative, anthrone derivative, and oxadiazole derivative. Also,
Although disclosed as a material for forming the light emitting layer, a metal complex of 8-hydroxyquinoline and its derivative or the like can also be used as an electron transport material.

Next, a typical method for producing an organic EL element having a laminated structure, which is an example of the present invention, will be described. As the transparent or semitransparent electrode, which is a pair of electrodes composed of an anode and a cathode, for example, a transparent substrate such as transparent glass or transparent plastic on which a transparent or semitransparent electrode is formed is used.

In the light emitting device of the present invention, the light emitting layer is generally combined with a suitable binder resin to form a thin film.
The binder can be selected from a wide range of binder resins,
For example, polyvinyl carbazole resin, polycarbonate resin, polyester resin, polyarylate resin, butyral resin, polystyrene resin, polyvinyl acetal resin, diallyl phthalate resin, acrylic resin, methacrylic resin, phenol resin, epoxy resin, silicone resin, polysulfone resin, urea resin, etc. However, the present invention is not limited to these. You may use these individually or in mixture of 2 or more types as a homopolymer or a copolymer polymer. As the anode material, a material having a work function as large as possible is preferable, and for example, nickel, gold, platinum, palladium, selenium, rhenium, iridium and alloys thereof, tin oxide, indium tin oxide (ITO), and copper iodide are preferable. Further, a conductive polymer such as poly (3-methylthiophene), polyphenylene sulfide or polypyrrole can also be used.

On the other hand, as the cathode material, silver, lead, tin, magnesium, aluminum, calcium, manganese, indium, chromium or an alloy thereof having a small work function is used.

The method for manufacturing the optical element of the present invention will be described below with reference to the drawings.

1 and 2 are process diagrams schematically showing the method for manufacturing an optical element of the present invention. Each step will be described below. The following steps (a) to (h) correspond to FIGS. 1 and 2 (a) to (h). Further, in each step of FIGS. 1 and 2, (a-1) to (h-1) on the left side of the paper are schematic plan views seen from above, and (a-2) to (h-2) on the right side of the paper are ( It is an AB sectional schematic diagram of a-1)-(h-1). In the figure, 1 is a support substrate, 2 is a resin composition layer, 3 is a partition wall, 4 is an opening of the partition wall 3, 5 is an inkjet head, 6 is ink, and 7 is a pixel.

Step (a) The supporting substrate 1 is prepared. The supporting substrate 1 is the transparent substrate 101 when the color filter illustrated in FIG. 10 is manufactured, and a glass substrate is generally used. However, for the purpose of forming a liquid crystal element, the supporting substrate 1 has desired transparency and mechanical strength. A plastic substrate or the like can also be used as long as it has the necessary properties such as.

Further, in the case of manufacturing the EL element illustrated in FIG. 9, the supporting substrate 1 is the driving substrate 91 on which the transparent electrode 94 is formed, and when irradiating light from the substrate side as shown in FIG. A transparent substrate such as a glass substrate is used as the driving substrate 91. The surface of the substrate is treated with plasma or UV so that the material of the light emitting layer 93 is easily attached to the substrate in a later step.
Surface treatment such as treatment or coupling treatment is preferably performed.

Step (b) The resin composition layer 2 for forming the partition walls 3 is formed on the supporting substrate 1. The partition wall 3 according to the present invention is the black matrix 102 in the case of the color filter of FIG. 10, and the partition wall 92 in the case of the electroluminescence element of FIG.
Equivalent to. Particularly in the case of manufacturing a color filter, the partition wall 3 is preferably a light-shielding layer that shields light between adjacent pixels as shown by 102 in FIG. 10, and in that case, the black matrix 102 as shown in FIG. Or
Alternatively, it may be a black stripe. In addition, the light-shielding layer can also be used when manufacturing an EL element.

In the present invention, the resin composition used to form the partition walls 3 is an epoxy resin, an acrylic resin, a polyimide resin containing polyamideimide, a urethane resin, a polyester resin, a polyvinyl resin, or the like. Although it is possible to use the photosensitive or non-photosensitive resin material, it is preferable that the resin material has a heat resistance of 250 ° C. or higher. From that point, an epoxy resin, an acrylic resin, or a polyimide resin is preferably used.

When the partition 3 is used as a light shielding layer, the resin composition layer 2 is formed by using a black resin composition in which a light shielding agent is dispersed in the resin composition. As described below, it is desirable to use carbon black as the light-shielding agent in order to obtain high ink repellency and appropriate surface roughness of the partition walls 3. The carbon black may be channel black, roller black or disc black. Manufactured by the contact method called so-called contact gas method, gas furnace nest black, manufactured by the furnace method called oil furnace nest black, thermal black, manufactured by the thermal method called acetylene black Although those described above can be used, channel black, gas furnace nest black, and oil furnace nest black are particularly preferable. If necessary,
A mixture of R, G and B pigments may be added. Also,
It is also possible to use a commercially available black resist. A high-resistance light-shielding layer may be used if necessary.

The resin composition layer 2 can be formed by a method such as spin coating, roll coating, bar coating, spray coating, dip coating, or a printing method.

Step (c) When a photosensitive material is used as the resin composition layer 2, the partition walls 3 having a plurality of openings 4 are formed by patterning by photolithography or the like. When a non-photosensitive material is used, it may be formed by patterning by wet or dry etching or lift-off using a photoresist as a mask.

Step (d) The supporting substrate 1 on which the partition walls 3 are formed is subjected to hydrophilic plasma treatment. That is, a gas containing at least one selected from oxygen, argon, and helium is introduced, and low-pressure plasma treatment or atmospheric-pressure plasma treatment is performed in which the supporting substrate 1 is irradiated with plasma under a reduced-pressure atmosphere or an atmospheric pressure atmosphere. .

At this time, the plasma generation unit and the processing unit that performs a predetermined process on the substrate by using the neutral active species generated by the plasma generation unit directly generate the plasma generated by the plasma generation unit on the substrate. Of a predetermined amount on the substrate by using a plasma processing apparatus which is arranged on the downstream side of the reaction gas without being exposed to the atmosphere, or a plasma generation unit and a neutral active species generated by the plasma generation unit. A plasma processing apparatus is used in which a processing section for performing processing is disposed adjacent to each other via a conductive intermediate electrode having a through hole.

By performing the hydrophilic plasma treatment, contaminants adhering to the surface of the supporting substrate 1 in the step of forming the partition wall 3 are removed, and the surface is cleaned to wet the ink 6 in the subsequent step (ink affinity). ) Is improved, and the ink 6 can be well diffused in the opening 4. Further, since the substrate is not directly exposed to the plasma in the plasma processing, the surface layer of the partition wall 3 is kept in a smooth state.

Step (e) The supporting substrate 1 which has been subjected to the hydrophilic plasma treatment is subjected to the water-repellent plasma treatment in the same apparatus as used in the step (d) in a gas atmosphere containing at least fluorine atoms. By the plasma treatment, fluorine or a fluorine compound in the introduced gas enters the partition 3 surface layer, and the water repellency of the partition 3 surface increases.

At least the foot introduced in this step
As the gas containing elementary atoms, CF_Four, CHF₃, C₂
F₆, SF₆, C₃F₈, C_FiveF₈Halogen gas selected from
It is preferable to use one or more of these. In particular, C_FiveF₈(O
Cutafluorocyclopentene) has zero ozone depletion potential
At the same time, it has an atmospheric lifetime (C
F _Four: 50,000 years, C_FourF₈: 3200) 0.98 and very
To be short. Therefore, the global warming potential is 90 (CO₂= 2
(100 years accumulated value) and compared with conventional gas (C
F_Four: 6500, C_FourF₈: 8700) Very small,
It is extremely effective in protecting the environment and the global environment and is used in the present invention.
Recommended for use.

Further, as the introduction gas, a gas such as oxygen, argon, helium or nitrogen may be used in combination, if necessary. In the present invention, the above CF ₄ , CHF ₃ , C
By using a mixed gas of O ₂ and at least one halogen gas selected from ₂ F ₆ , SF ₆ , C ₃ F ₈ and C ₅ F ₈ , the degree of ink repellency in this step can be controlled. It will be possible.
However, in the mixed gas, the O ₂ mixing ratio is 30%.
When it exceeds the above range, the oxidation reaction by O ₂ becomes dominant and the effect of improving the ink repellency is hindered, and when the O ₂ mixture ratio exceeds 30%, the resin is markedly damaged. In this case, the mixture ratio of O ₂ is 3
It is necessary to use it within the range of 0% or less.

As a method of generating plasma in this step and the previous dry etching processing step, a method such as high frequency discharge or microwave discharge can be used, and pressure, gas flow rate, discharge frequency, processing time at the time of plasma irradiation are used. The conditions such as can be set arbitrarily.

FIG. 5 and FIG. 6 are schematic views of a plasma generator which can be used in the hydrophilic treatment plasma treatment step and the water repellent plasma treatment step of the present invention. In FIG. 5, 51 is an upper electrode, 52 is a lower electrode, 53 is a substrate to be processed, and 54 is a high frequency power source. The device has a parallel plate top electrode 1
A high frequency voltage of 3.56 MHz is applied to generate plasma. The substrate to be processed is placed on the lower electrode connected to the ground. There is a conductive 55 intermediate electrode arranged in a through hole between the upper electrode and the lower electrode, and is connected to the ground. Therefore, plasma is generated between the upper electrode and the intermediate electrode, and the substrate is not directly exposed to the plasma.
FIG. 6 shows an example of a plasma processing apparatus using 2.45 GHz microwave. 56 is a plasma generation part, 57 is a microwave power source, 58 is a waveguide, and 59 is a gas transport pipe. In the case of the device, the substrate is not directly exposed to the plasma because the plasma generation unit and the processing unit are far from each other, and the ions and electrons generated by the plasma do not reach the substrate because they have a short life. . Only neutral and radically reactive particles are transported to the substrate and react. Although the intermediate electrode is shown in FIG. 6, it may not be necessary. In either method, the ink repellency and surface roughness of the partition wall 3 and the ink affinity of the surface of the supporting substrate 1 can be set to desired levels depending on conditions such as pressure, gas flow rate, discharge frequency, and treatment time. .

The degree of ink repellency of the surfaces of the partition walls 3 according to the present invention after the plasma treatment is preferably such that the contact angle measured with the ink used for the optical element to be prepared is 80 ° or more. When the contact angle is less than 80 °, the contrast of the water repellency between the supporting substrate and the partition wall is small, so that color mixing is likely to occur and a large amount of ink cannot be applied. In particular, when manufacturing a color filter, it becomes difficult to manufacture a color filter having high color purity.

The ink affinity of the surface of the supporting substrate 1 is preferably such that the contact angle measured with the ink used for the optical element to be prepared is 25 ° or less. By setting the contact angle to the ink to be 25 ° or less, the ink is satisfactorily wet and spread on the surface of the supporting substrate 1, and even if the surface of the partition wall 3 has high ink repellency, white spots do not occur. Further, when the landing position of the ink is displaced, the force of drawing the ink into the pixel becomes strong. In particular, it is desirable that the angle be 20 ° or less.

Further, the present inventor has found that the color mixture due to the landing deviation in the ink jet system is not only due to the contrast between the hydrophilicity of the supporting substrate and the water repellency of the partition wall, but the white spots are the ink repellency of the surface of the partition wall 3 and the supporting substrate 1. It was found that it depends not only on the ink affinity of the surface but also on the surface roughness of the surface of the partition wall 6.

That is, in the hydrophilic plasma treatment of the supporting substrate and the water repellent plasma treatment of the partition walls, when the surface roughness of the partition walls is increased and the surface roughness is increased, the ink tends to stay on the partition surface by the pinning effect. Therefore, it takes a long time until the ink is drawn into the pixel. When the ink ejected from the inkjet head is displaced in the landing position due to the deviation or the accuracy of the apparatus, the ink is ejected to the adjacent pixels while the ink remains on the partition wall surface, and thus the colors are easily mixed. Further, if the ink is cured while remaining on the surface of the partition wall, the amount of ink in the pixel is reduced, which may cause unevenness.

For this reason, in the present invention,
The surface of the partition wall 3 preferably has an average roughness (Ra) of 10 nm or less. More preferably, the thickness is 5 nm or less, and the landing margin at the time of pixel formation is further improved. The present invention controls the surface roughness of the partition wall 3 by using the plasma processing apparatus as described above as a means for making the support substrate hydrophilic and making the partition wall water-repellent without roughening the surface of the partition wall. be able to. That is, the plasma generating unit and the processing unit that performs plasma processing on the substrate are arranged at positions where the plasma generated by the plasma generating unit is not directly exposed to the substrate, and on the downstream side of the reaction gas. In a plasma processing apparatus or a plasma processing apparatus in which the plasma generating unit and the processing unit are arranged adjacent to each other via a conductive intermediate electrode having a through hole, the substrate is not directly exposed to plasma. In addition, it is realized by devising such that ions and electrons generated by plasma do not reach the substrate.

Step (f) Using the ink jet recording apparatus, the inks 6 of R, G and B are applied from the ink jet head 5 to the region (opening 4) surrounded by the partition walls 3. As an inkjet,
A bubble jet (registered trademark) type using an electrothermal converter as an energy generating element, a piezo jet type using a piezoelectric element, or the like can be used. Further, as the ink 6, in the case of a color filter, R after curing,
A material containing colorants of respective colors so as to form G and B colored portions, and in the case of an EL element, a material for forming a light emitting layer which emits light by voltage application after curing is used. In any case, the ink 6 preferably contains at least a curing component, water, and a solvent. Hereinafter, the composition of the ink used when the color filter is manufactured by the manufacturing method of the present invention will be described in more detail.

[1] Colorant As the colorant to be contained in the ink according to the present invention, both a dye type and a pigment type can be used. However, in the case of using a pigment, in order to uniformly disperse the pigment in the ink. A dye-based colorant is preferably used because a dispersant needs to be added separately and the ratio of the colorant in the total solid content becomes low. Further, the addition amount of the colorant is preferably equal to or less than that of the curing component described later.

[2] Curing component In consideration of process resistance, reliability, etc. in the post-process, a component that is cured by heat treatment or light irradiation to fix the colorant, that is, a crosslinkable monomer or polymer is used. It is preferable to contain components. In particular, it is preferable to use a curable resin composition in consideration of heat resistance in the subsequent step. Specifically, for example, as the base resin, an acrylic resin having a functional group such as a hydroxyl group, a carboxyl group, an alkoxy group, an amide group, or a silicone resin;
Or cellulose derivatives such as hydroxypropyl cellulose, hydroxyethyl cellulose, methyl cellulose, carboxymethyl cellulose or modified products thereof;
Or polyvinylpyrrolidone, polyvinyl alcohol,
Examples thereof include vinyl polymers such as polyvinyl acetal. Further, it is possible to use a crosslinking agent or a photoinitiator for curing these base resins by light irradiation or heat treatment. Specifically, a melamine derivative such as methylolated melamine is used as the cross-linking agent, and a dichromate, a bisazide compound, a radical initiator, a cationic initiator, an anionic initiator or the like is used as the photoinitiator. It is possible. Further, a plurality of these photoinitiators can be mixed or used in combination with other sensitizers.

[3] Solvent As a medium for the ink used in the present invention, a mixed solvent of water and an organic solvent is preferably used. As water, it is preferable to use ion-exchanged water (deionized water) instead of general water containing various ions.

Examples of the organic solvent include methyl alcohol, ethyl alcohol, n-propyl alcohol, isopropyl alcohol, n-butyl alcohol, sec-butyl alcohol, tert-butyl alcohol and the like having 1 carbon atom.
~ 4 alkyl alcohols; dimethylformamide,
Amides such as dimethylacetamide; ketones such as acetone and diacetone alcohol or keto alcohols;
Ethers such as tetrahydrofuran and dioxane; polyalkylene glycols such as polyethylene glycol and polypropylene glycol; alkylene groups such as ethylene glycol, propylene glycol, butylene glycol, triethylene glycol, thiodiglycol, hexylene glycol and diethylene glycol having 2 to 4 Alkylene glycols containing 1 carbon; glycerins; lower alkyl ethers of polyhydric alcohols such as ethylene glycol monomethyl ether, diethylene glycol methyl ether, triethylene glycol monomethyl ether; N-methyl-2-pyrrolidone, 2-pyrrolidone, etc. It is preferable to select from among these.

In addition to the above components, two or more kinds of organic solvents having different boiling points are mixed and used in order to prepare an ink having desired physical properties, if necessary, and a surfactant or a defoaming agent is used. A preservative or the like may be added.

Steps (g) to (h) Pixels 7 are formed by applying necessary treatments such as heat treatment and light irradiation to remove the solvent component in the ink 6 and cure it.

Further, in the case of a color filter, as described above, a protective layer or a transparent conductive film is formed if necessary. In this case, as the protective layer, a photocurable type, a thermosetting type, or a photothermal combined curing type resin material, or an inorganic film formed by vapor deposition, sputtering, or the like can be used. Any material can be used as long as it has transparency and can withstand the subsequent transparent conductive film forming process, alignment film forming process and the like. Further, the transparent conductive film may be directly formed on the colored portion without the protective layer.

[0087]

Examples (Example 1) [Formation of Black Matrix] A black resist containing carbon black ("CK-S171" manufactured by Fuji Film Orin Co., Ltd.) was formed on a glass substrate ("1737" manufactured by Corning).
X resist ") is applied, and predetermined exposure, development and post-baking treatments are performed to obtain a film thickness of 2 μm, 75 μm × 225 μm.
A black matrix pattern (partition wall) having a rectangular opening was prepared.

[Preparation of Ink] Each of R, G and B inks was prepared with the following composition using an acrylic copolymer having the composition shown below as a thermosetting component.

Curing component Methyl methacrylate 50 parts by weight Hydroxyethyl methacrylate 30 parts by weight N-methylol acrylamide 20 parts by weight R ink C.I. I. Acid Orange 148 3.5 parts by weight C.I. I. Acid Red 289 0.5 parts by weight Diethylene glycol 30 parts by weight Ethylene glycol 20 parts by weight Ion-exchanged water 40 parts by weight The above curing component 6 parts by weight G Ink C.I. I. Acid Yellow 23 2 parts by weight Zinc phthalocyanine sulfamide 2 parts by weight Diethylene glycol 30 parts by weight Ethylene glycol 20 parts by weight Ion-exchanged water 40 parts by weight Curing component 6 parts by weight B Ink C.I. I. Direct Blue 199 4 parts by weight Diethylene glycol 30 parts by weight Ethylene glycol 20 parts by weight Ion-exchanged water 40 parts by weight Curing component 6 parts by weight [Hydrophilic plasma treatment] FIG. 5 is prepared on the glass substrate (black matrix substrate) on which a black matrix is formed. Plasma treatment was performed using the plasma treatment apparatus (apparatus A) under the following conditions.

Gas used: O ₂ gas flow rate: 900 sccm Pressure: 44 Pa RF power: 1200 W Treatment time: 90 sec [Evaluation of ink repellency] Using an automatic liquid crystal glass cleaning / treatment inspection device “LCD-400S” manufactured by Kyowa Interface Co., Ltd. The contact angle with respect to pure water of the black matrix substrate after the plasma treatment was measured. The surface of the black matrix was measured on a frame having a width of 5 mm provided around the fine pattern, and the surface of the glass substrate was measured at a position further outside the frame where the black matrix pattern was not provided. . The contact angle of each B ink was as follows: glass substrate surface: 15 °, partition wall surface: 63 °.

[Evaluation of Surface Roughness] The surface roughness of the black matrix surface was evaluated by using a stylus type surface roughness meter “FP-20” manufactured by Tecnor Co., Ltd. The average roughness (Ra) was measured at. As a result, the average roughness (Ra) of the black matrix surface was 2.3 nm.

[Preparation of colored portion] Using an inkjet recording apparatus equipped with an inkjet head with a discharge rate of 25 pl, the above R, G, and B inks were used for 250 openings per opening on a black matrix substrate subjected to plasma treatment.
pl was given. At this time, as shown in FIG. 13, the ink was intentionally slid so that only the G ink landed at a position deviated from the center of the pixel opening, and drawing was performed. Drawing was performed by shifting the displacement amount x of the G head from the center of the pixel opening portion from 0 to 40 μm. Next, heat treatment was performed at 90 ° C. for 10 minutes and subsequently at 230 ° C. for 30 minutes to cure the ink to form colored portions (pixels), and nine types of color filters having different G ink landing positions were produced.

[Evaluation of Landing Margin, White Area, and Flatness of Colored Part Surface] The landing margin and white area of the obtained color filter were evaluated by observation with an optical microscope. The landing margin is the maximum landing position misalignment amount of the color filter of the color filters drawn with the deviation amount x from the center of the pixel opening of the G head shifted from 0 to 40 μm and in which no color mixture or ink residue on the partition wall surface is observed. Evaluated as. In addition, the flatness is evaluated by using the surface roughness meter used in the above-described evaluation of the surface roughness when 250 pl of ink per opening is applied with a displacement amount x = 0 from the center of the pixel opening of the G head. using the difference (d _t -d _b) of height d _b from the glass substrate surface of the black matrix portion that contacts the end of the colored portion and the height d _t from the glass surface of the colored portion the central portion of each color Measured, -0.5 μm
≦ (d _t -d _b) flat if ≦ 0.5μm, (d _t -
If d _b ) <− 0.5 μm, concave shape, (d _t −d _b )>
If it was 0.5 μm, it was evaluated as a convex shape.

As a result, in the color filter of this example, the landing margin was 30 μm, no white spot was observed, and the surface of the colored portion was flat.

(Example 2) A color filter was produced in the same manner as in (Example 1) except that the following hydrophobizing plasma treatment was carried out instead of the hydrophilic plasma treatment of (Example 1).

[Water-Repellent Plasma Treatment] Plasma treatment was performed on the glass substrate (black matrix substrate) on which the black matrix was formed, using the plasma treatment apparatus (apparatus A) shown in FIG. 5 under the following conditions.

Gas used: CF ₄ gas flow rate: 330 sccm Pressure: 44 Pa RF power: 1200 W Treatment time: 120 sec The contact angle of the black matrix substrate with B ink after the plasma treatment was as follows: glass substrate surface: 23 °; partition wall surface: 87 °. there were. The average roughness (Ra) of the partition wall surface is 3.
It was 1 nm. In the color filter of this example, the landing margin was 35 μm, white spots were not observed, and the colored portion surface was also flat.

Example 3 A color filter was produced in the same manner as in Example 1 except that after the formation of the black matrix, the following hydrophilic treatment plasma treatment and water repellent plasma treatment were successively performed.

[Hydrophilic Plasma Treatment] Using the plasma treatment apparatus (apparatus A) shown in FIG. 5, plasma treatment was performed under the following conditions.

Gas used: O ₂ gas flow rate: 900 sccm Pressure: 44 Pa RF power: 1200 W Treatment time: 90 sec [Water repellent plasma treatment] Fig. 5 Plasma treatment under the following conditions using a plasma treatment apparatus (apparatus A) I went.

Gas used: CF ₄ Gas flow rate: 330 sccm Pressure: 44 Pa RF power: 1200 W Treatment time: 120 sec The contact angle of the black matrix substrate with B ink after the plasma treatment was as follows: glass substrate surface: 15 °, partition wall surface: 86 ° there were. The average roughness (Ra) of the partition wall surface is 3.
It was 8 nm. In the color filter of this example, the landing margin was 35 μm, white spots were not observed, and the colored portion surface was also flat.

(Example 4) A color filter was produced in the same manner as in Example 2 except that the treatment time for the water repellent plasma treatment in Example 2 was increased from 120 sec to 180 sec.

The contact angle of the black matrix substrate with the B ink after the plasma treatment was 21 ° on the glass substrate surface and 105 ° on the partition wall surface. The average roughness (Ra) of the partition wall surface is 4.
It was 7 nm. In the color filter of this example, the landing margin was 35 μm, and since the water repellency of the partition wall surface was high, minute white spots were observed at the four corners of the opening, and the colored portion surface was convex.

(Example 5) A color filter was prepared in the same manner as in Example 2 except that the water-repellent plasma treatment of (Example 2) was performed using CF ₄ and O ₂ under the following conditions.

[Water Repellent Plasma Treatment] Using the plasma treatment apparatus (apparatus A) shown in FIG. 5, plasma treatment was performed under the following conditions.

Gas used: CF ₄ / O ₂ gas flow rate: 330/30 sccm Pressure: 44 Pa RF power: 1200 W Treatment time: 180 sec The contact angle of the black matrix substrate with B ink after the plasma treatment was as follows: glass substrate surface: 18 ° partition wall Surface: 89 °. The average roughness (Ra) of the partition wall surface is 6.
It was 1 nm. In the color filter of this example, the landing margin was 25 μm, white spots were not observed, and the colored portion surface was also flat.

(Example 6) A color filter was prepared in the same manner as in Example 2 except that the water-repellent plasma treatment of Example 2 was performed under the following conditions using the apparatus B shown in FIG. did.

[Water-Repellent Plasma Treatment] Using the plasma treatment apparatus (apparatus B) shown in FIG. 6, plasma treatment was performed under the following conditions.

Gas used: CF ₄ Gas flow rate: 900 sccm Pressure: 50 Pa RF power: 800 W Treatment time: 90 sec The contact angle of the black matrix substrate with B ink after the plasma treatment was as follows: glass substrate surface: 16 °; partition wall surface: 88 °. there were. The average roughness (Ra) of the partition wall surface is 2.
It was 7 nm. In the color filter of this example, the landing margin was 35 μm, white spots were not observed, and the colored portion surface was also flat.

(Comparative Example 1) A color filter was produced in the same manner as in Example 1 except that plasma treatment was not performed.
The contact angle of the black matrix substrate with the B ink was: glass substrate surface: 64 °, partition wall surface: 68 °. The average roughness (Ra) of the partition wall surface is 2.
It was 0 nm. White spots were observed in all colored portions in all the color filters obtained in this example. In addition, color mixing was observed with all color filters. The flatness of the colored portion surface could not be evaluated because white spots occurred.

(Comparative Example 2) Same as (Example 3) except that the hydrophilic plasma treatment and the water repellent plasma treatment of (Example 3) were performed under the following conditions using the apparatus C shown in FIG. To produce a color filter.

[Hydrophilic Plasma Treatment] Using the plasma treatment apparatus (apparatus C) shown in FIG. 12, plasma treatment was performed under the following conditions.

Gas used: O ₂ gas flow rate: 100 sccm Pressure: 11 Pa RF power: 1200 W Treatment time: 60 sec [Water repellent plasma treatment] FIG. 12 Plasma treatment under the following conditions using a plasma treatment apparatus (apparatus C) I went.

Gas used: CF ₄ gas flow rate: 330 sccm Pressure: 44 Pa RF power: 1200 W Treatment time: 30 sec The contact angle of the black matrix substrate with B ink after the plasma treatment was as follows: glass substrate surface: 14 °; partition wall surface: 123 °. there were. The average roughness (Ra) of the partition wall surface is 1
It was 2.3 nm. In the color filter of this example, the landing margin was 15 μm, white spots were not observed, and the colored portion surface was also flat.

The above results are shown in Table 1.

[0116]

[Table 1]

(Embodiment 8) TF formed by a thin film process, in which wiring films, insulating films, etc. are laminated in multiple layers.
ITO is formed as a transparent electrode in a thickness of 40 nm on a T drive substrate in a pixel (light emitting layer) unit by sputtering, and patterning is performed according to a pixel shape by a photolithography method.

Next, partition walls for filling the light emitting layer are formed. Transparent photosensitive resin ("CT-200" made by Fujifilm Olin)
0 L "), and subjecting it to predetermined exposure, development and post-baking treatment to form a film thickness of 0.4 μm on the ITO transparent electrode.
A transparent matrix pattern having rectangular openings of 75 μm × 225 μm was prepared. The substrate was plasma-treated under the same conditions as in (Example 2). The contact angle of each ink on the ITO transparent electrode and the transparent matrix pattern was 23 ° on the ITO transparent electrode and 78 ° on the transparent matrix pattern.

Next, a light emitting layer was filled in the partition walls of the substrate. The light-emitting layer has an electron-transporting property of 2,5-bis (5-t
ert-Butyl-2-benzoxazolyl) -thiophene [an electron-transporting blue light-emitting dye having a fluorescence peak of 450 nm, and one of emission-center-forming compounds. Less than,
30% by weight of poly-N-vinylcarbazole [molecular weight: 150,000, manufactured by Kanto Chemical Co., Inc.,
Hereinafter, both are dissolved in a dichloroethane solution so that they can be molecularly dispersed in a hole transporting host compound composed of "PVK". Another dichloroethane solution of PVK-BBOT containing 0.015 mol% of Nile Red, which is another luminescence center forming compound, was filled in a partition wall surrounded by a transparent resin by an inkjet method and dried to have a thickness of 200 nm. The light emitting layer of was formed.
At this time, each pixel (light emitting layer) was independent, and the solution containing the light emitting material was not mixed in the adjacent pixels between the partition walls.
Further, Mg: Ag (10: 1) was vacuum-deposited on this to form a Mg: Ag cathode having a thickness of 200 nm. When a voltage of 18 V was applied to each pixel of the EL device thus produced, uniform white light emission of 480 cd / m ² was obtained.

[0120]

As described above, according to the present invention,
An optical element with pixels without mixed colors or white spots can be manufactured with a good yield by a simple process using an inkjet method, and a color filter with uniform density in the colored part and an EL element with uniform brightness in the light emitting layer are provided. It can be provided with high yield. Therefore, a liquid crystal element having excellent color display characteristics can be provided at a lower cost by using the color filter.

[Brief description of drawings]

FIG. 1 is a process drawing of an embodiment of a method for manufacturing an optical element of the present invention.

FIG. 2 is a process drawing of an embodiment of a method for manufacturing an optical element of the present invention.

FIG. 3 is a conceptual diagram of color mixing that occurs in a method of manufacturing an optical element by an inkjet method.

FIG. 4 is a conceptual diagram of white spots that occur in a method of manufacturing an optical element by an inkjet method.

FIG. 5 is a schematic diagram showing an example of the configuration of a plasma generator that can be used in the manufacturing method of the present invention.

FIG. 6 is a schematic diagram showing another configuration of a plasma generator that can be used in the manufacturing method of the present invention.

FIG. 7 is a diagram showing a cross-sectional shape of a pixel immediately after application of ink and a pixel in the manufacturing method of the present invention.

FIG. 8 is a diagram showing a cross-sectional shape of a pixel immediately after application of ink and a pixel in a conventional manufacturing method.

FIG. 9 is a schematic cross-sectional view of an example of an electroluminescence element that is an embodiment of the optical element of the present invention.

FIG. 10 is a schematic cross-sectional view of an example of a color filter that is another embodiment of the optical element of the present invention.

FIG. 11 is a schematic sectional view of an embodiment of the liquid crystal element of the present invention.

FIG. 12 is a schematic diagram showing another configuration of a plasma generator that can be used in a conventional manufacturing method.

FIG. 13 is a conceptual diagram showing a landing margin evaluation method in an example.

[Explanation of symbols]

1 Support substrate 2 Resin composition layer 3 partitions 4 openings 5 inkjet head 6 ink 7 pixels 31 Transparent substrate 33 Black Matrix 36 ink 38 White void 51 upper electrode 52 Lower electrode 53 substrate to be processed 54 high frequency electrode 55 Intermediate electrode 56 Plasma generator 57 Microwave power supply 58 Waveguide 59 Transport pipe 91 drive board 92 partition 93 Light-emitting layer 94 Transparent electrode 96 metal layer 101 transparent substrate 102 black matrix 103 Coloring part 104 protective layer 107 common electrode 108 Alignment film 109 LCD 111 Counter substrate 112 pixel electrode 113 Alignment film

   ─────────────────────────────────────────────────── ─── Continued front page    F term (reference) 2C056 FB01                 2H048 BA02 BA11 BA64 BB02 BB24                       BB42                 2H089 HA36 KA17 KA19 TA03 TA05                       TA06 TA07 TA18

Claims (22)

[Claims] 1. A method of manufacturing an optical element having at least a plurality of pixels and a partition wall located between adjacent pixels on a support substrate, the method comprising forming a partition wall made of a resin composition on the support substrate. The plasma generation unit and the processing unit that performs a predetermined process on the substrate by using the neutral active species generated by the plasma generation unit prevent the plasma generated by the plasma generation unit from being directly exposed to the substrate. In the plasma processing apparatus, which is provided on the downstream side of the reaction gas, a plasma processing step in which predetermined processing is performed, and a step of applying ink to a region surrounded by partition walls by an inkjet method to form pixels And a method for manufacturing an optical element. 2. A method of manufacturing an optical element having at least a plurality of pixels and a partition wall located between adjacent pixels on a supporting substrate, the method comprising forming a partition wall made of a resin composition on the supporting substrate. A plasma generating unit and a processing unit that performs a predetermined process on a substrate using the neutral active species generated by the plasma generating unit are arranged adjacent to each other via a conductive intermediate electrode having a through hole. A method of manufacturing an optical element, comprising: a plasma processing step of performing a predetermined process in a plasma processing apparatus; and a step of applying ink to a region surrounded by partition walls by an inkjet method to form pixels. 3. The method for manufacturing an optical element according to claim 1, wherein the predetermined treatment is water repellent treatment. 4. The method for manufacturing an optical element according to claim 1, wherein the predetermined treatment is a hydrophilic treatment. 5. The optical element according to claim 1, wherein the predetermined predetermined treatment is a treatment for making the partition wall surface water-repellent and hydrophilicizing the exposed region of the support substrate. Manufacturing method. 6. The predetermined treatment is a treatment for continuously performing a hydrophilic treatment and a treatment for making the partition wall surface water-repellent and hydrophilicizing an exposed region of the support substrate. Item 3. A method for manufacturing an optical element according to items 1 and 2. 7. The method of manufacturing an optical element according to claim 1, wherein the partition wall is formed of a resin composition containing carbon black. 8. The method for manufacturing an optical element according to claim 1, wherein the average roughness (Ra) of the surface of the partition wall after the predetermined treatment is 10 nm or less. 9. The optical element according to claim 3, wherein the contact angle of the partition wall surface to the ink after the plasma treatment is 80 ° or more, and the contact angle of the support substrate surface to pure water is 25 ° or less. Production method. 10. The method for manufacturing an optical element according to claim 1, wherein the gas introduced in the hydrophilic treatment step is at least one gas selected from oxygen, argon, helium, and nitrogen. . 11. The gas introduced in the water repellent treatment step is CF ₄ , SF ₆ , CHF ₃ , C ₂ F ₆ , C ₃ F ₈ , C ₅ F ₈
The method for manufacturing an optical element according to claim 1, further comprising at least one halogen gas selected from the group consisting of: 12. The gas introduced in the plasma treatment step is CF ₄ , SF ₆ , CHF ₃ , C ₂ F ₆ , C ₃ F ₈ , C ₅ F ₈
The method for producing an optical element according to any one of claims 1 to 11, which is a mixed gas of at least one kind of halogen gas selected from the above and O ₂ gas, and the mixing ratio of O ₂ is 30% or less. 13. The ink comprises at least a curing component,
The method for producing an optical element according to claim 1, which contains water and an organic solvent. 14. The method of manufacturing an optical element according to claim 1, wherein the supporting substrate is a transparent substrate, and the partition walls are a black matrix. 15. The method for manufacturing an optical element according to claim 1, wherein the pixel is a light emitting layer, and an electroluminescent element having electrodes above and below with the light emitting layer interposed therebetween is manufactured. 16. A support substrate having at least a plurality of pixels and a partition wall located between adjacent pixels.
An optical element manufactured by the method for manufacturing an optical element according to any one of 3 above. 17. The optical element according to claim 16, wherein the partition wall is a light shielding layer. 18. The color filter according to claim 16, wherein the supporting substrate is a transparent substrate, the pixel is a colored portion formed of ink containing a colorant, and the color filter is provided with a plurality of colored portions. The optical element described. 19. The optical element according to claim 18, further comprising a protective layer on the colored portion. 20. The transparent conductive film is provided on the surface.
Or the optical element according to item 19. 21. The optical element according to claim 16, wherein the pixel is a light emitting layer, and the pixel is an electroluminescence element having electrodes on the upper and lower sides of the light emitting layer. 22. A liquid crystal is sandwiched between a pair of substrates,
A liquid crystal element, characterized in that one of the substrates is constituted by using the optical element according to any one of claims 18 to 20.