JP4521949B2 - Optical element manufacturing method and liquid crystal element manufacturing method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention uses an ink jet system for an optical element such as a color filter, which is a constituent member of a color liquid crystal element used in a color television, a personal computer, or a pachinko game machine, and an electroluminescence element having a plurality of light emitting layers. In addition, the present invention relates to an optical element manufactured by the manufacturing method and a liquid crystal element using a color filter which is one of the optical elements.
[0002]
[Prior art]
In recent years, with the development of personal computers, especially portable personal computers, the demand for liquid crystal displays, particularly color liquid crystal displays, has been increasing. However, cost reduction is necessary for further dissemination, and there is an increasing demand for cost reduction of color filters that are particularly heavy in terms of cost.
[0003]
Conventionally, various methods have been tried to meet the above-described requirements while satisfying the required characteristics of the color filter, but a method that satisfies all the required characteristics has not yet been established. Each method will be described below.
[0004]
The first method is a staining method. In the dyeing method, first, a water-soluble polymer material layer, which is a dyeing material, is formed on a transparent substrate, patterned into a desired shape by a photolithography process, and then the obtained pattern is immersed in a dyeing bath. To obtain a colored pattern. By repeating this step three times, a colored layer composed of three colored portions of R (red), G (green), and B (blue) is formed.
[0005]
The second method is a pigment dispersion method, which has been most actively performed in recent years. In this method, first, a photosensitive resin layer in which a pigment is dispersed is formed on a transparent substrate, and this is patterned to obtain a monochromatic pattern. By repeating this process three times, a colored layer composed of colored portions of R, G, and B is formed.
[0006]
There is an electrodeposition method as a third method. In this method, first, a transparent electrode is patterned on a transparent substrate, and immersed in an electrodeposition coating solution containing a pigment, a resin, an electrolytic solution, etc., and the first color is electrodeposited. This process is repeated three times to form a colored layer composed of three colored portions of R, G, and B, and finally fired.
[0007]
As a fourth method, a pigment is dispersed in a thermosetting resin, and printing is repeated three times to separate R, G, and B, and then the resin is thermally cured to form a colored layer. Is. In any method, a protective layer is generally formed on the colored layer.
[0008]
The point common to these methods is that it is necessary to repeat the same process three times in order to color the three colors of R, G, and B, resulting in high costs. Further, there is a problem that the yield decreases as the number of steps increases. Furthermore, in the electrodeposition method, the shape of the pattern that can be formed is limited, so that it is difficult to apply to the structure of a TFT type (active matrix driving method using a TFT, ie, a thin film transistor as a switching element) with the current technology. It is.
[0009]
Also, since the printing method has poor resolution, it is not suitable for forming a fine pitch pattern.
[0010]
In order to compensate for the above drawbacks, in recent years, a method for producing a color filter using an inkjet method has been actively studied. The method using the ink jet method has an advantage that the manufacturing process is simple and the cost is low.
[0011]
On the other hand, the ink jet method is not limited to the manufacture of color filters, but can also be applied to the manufacture of electroluminescent elements.
[0012]
An electroluminescence element has a structure in which a thin film containing a fluorescent inorganic and organic compound is sandwiched between a cathode and an anode, and excitons are obtained by injecting electrons and holes into the thin film and recombining them. Is generated by utilizing the emission of fluorescence when the exciton is deactivated. A fluorescent material used for such an electroluminescent element can be applied to a substrate on which an element such as a TFT is formed by an ink jet method to form a light emitting layer, whereby the element can be configured.
[0013]
[Problems to be solved by the invention]
As described above, since the ink jet system can simplify the manufacturing process and reduce the cost, it is applied to the manufacture of optical elements such as color filters and electroluminescent elements. However, in the manufacture of such an optical element, there are problems such as “color mixing” and “white spot” as problems peculiar to the ink jet system. Hereinafter, a case where a color filter is manufactured will be described as an example.
[0014]
“Mixed color” is a failure that occurs when ink is mixed between adjacent pixels (colored portions) of different colors. In the manufacturing method of the color filter in which the black matrix is used as a partition and ink is applied to the opening of the black matrix to form a colored portion, the volume is several to several tens of times the volume of the opening of the black matrix. It is necessary to apply an ink having When the solid content concentration of the colorant or the curing component contained in the ink is high, that is, when the volume of the applied ink is relatively small, the black matrix functions sufficiently as a partition wall, and the inside of the opening of the black matrix Since the ink can be held, the applied ink does not go over the black matrix and reach the colored portions of different colors adjacent to each other. However, when the solid concentration in the ink is low, that is, when it is necessary to apply a large amount of ink, the ink overflows beyond the black matrix serving as the partition wall, and color mixing occurs between adjacent colored portions. Resulting in. In particular, there is a limit to the viscosity of ink that can be stably ejected from the nozzles of an inkjet head, and there is also a limit to the concentration of solids contained in the ink, so a technique for avoiding color mixing is necessary. .
[0015]
In view of this, a method for preventing color mixing by utilizing a difference in wettability of ink between the colored portion and the partition wall has been proposed. For example, Japanese Patent Application Laid-Open No. 59-75205 proposes a method of forming a diffusion prevention pattern with a substance having poor wettability in order to prevent the ink from spreading outside the target area. Not disclosed. On the other hand, JP-A-4-123005 proposes a method of patterning a silicone rubber layer having a large water and oil repellency to form a partition wall for preventing color mixing. Further, JP-A-5-241011 and JP-A-5-241012 similarly disclose a method in which a silicone rubber layer is formed on a black matrix serving as a light shielding layer and used as a partition for preventing color mixing.
[0016]
According to these methods, even when an amount of ink far exceeding the height of the partition is applied, the surface layer of the partition shows ink repellency so that the ink is repelled, and the adjacent colored portion beyond the partition. Therefore, it is possible to effectively prevent color mixing.
[0017]
The conceptual diagram is shown in FIG. In the figure, 31 is a transparent substrate, 33 is a black matrix that also serves as a partition, and 36 is ink. When the upper surface of the black matrix 33 has ink repellency, as shown in FIG. 3B, the applied ink 36 is held in the opening of the black matrix 33 and reaches the adjacent colored portion. There is no. However, when the ink repellency on the upper surface of the black matrix 33 is low, as shown in FIG. 3A, the applied ink 36 spreads over the black matrix 33 and is applied to the adjacent openings. It mixes with ink.
[0018]
In general, it is possible to obtain better ink repellency by using a fluorine compound than by using a silicon compound. For example, Japanese Patent Laid-Open No. 2000-35511 discloses a method of forming a positive resist pattern on a light shielding portion and further applying an ink repellent treatment agent on the pattern. The use of fluorine compounds is disclosed. However, in this method, it is necessary to remove the positive resist pattern provided on the light-shielding portion after forming the colored portion. However, when the resist pattern is removed, problems such as dissolution, peeling, and swelling of pixels may occur. is there.
[0019]
As a method for fluorinating the surface of the resin layer, Japanese Patent Application Laid-Open No. 6-65408 proposes a method in which a reaction gas of a fluorine compound is converted into plasma. Further, as an example in which this technique is applied to a color filter, in Japanese Patent Laid-Open No. 11-271753, the partition wall has a multilayer structure of a lower layer having affinity for ink and an upper layer having non-affinity, and the upper layer is used for ink. As a technique for making it non-affinity, a plasma treatment method using a gas containing a fluorine compound is disclosed.
[0020]
However, any of the above-described methods is to multi-layer the partition walls, and it is necessary to carry out the photolithography process a plurality of times. Therefore, there is a problem that the process is complicated, the cost is increased, and the yield is lowered.
[0021]
On the other hand, “blank” is a failure that occurs mainly because the applied ink cannot be sufficiently and uniformly diffused in the area surrounded by the partition walls, such as color unevenness and a decrease in contrast. It causes display failure.
[0022]
FIG. 4 shows a conceptual diagram of white spots. In the figure, the same members as those in FIG. Reference numeral 38 denotes a white portion.
[0023]
In recent years, in the color filter for TFT type liquid crystal elements, the shape of the opening of the black matrix 33 has become complicated for the purpose of protecting the TFT from external light or obtaining a bright display by increasing the aperture ratio. In addition, since those having a plurality of corner portions are generally used, as shown in FIG. 4A, there is a problem that the ink 36 does not sufficiently diffuse to the corner portions. Further, when forming the black matrix 33, a photolithography process using a resist is generally used, and contaminants adhere to the surface of the transparent substrate 31 due to various components contained in the resist. This may hinder the diffusion of 36. Furthermore, when the ink repellency on the side surface of the black matrix 33 is extremely high compared to the surface of the transparent substrate 31, the ink 36 is repelled on the side surface of the black matrix 33 as shown in FIG. There may be a problem that the color becomes light at the portion where the ink 36 and the black matrix 33 are in contact with each other.
[0024]
As a technique for solving such problems of color mixture and white spots, in Japanese Patent Application Laid-Open No. 9-203803, a region (concave portion) surrounded by a black matrix (convex portion) has a contact angle of 20 ° or less with respect to water. It has been proposed to use a substrate that has been subjected to ink-philic treatment so that Examples of methods for imparting ink affinity include water-soluble leveling agents and water-soluble surfactants. Furthermore, in order to solve the above-mentioned problem of color mixing at the same time, a technique for imparting ink repellency by treating the surface of the convex portion with an ink repellent treatment agent in advance has been disclosed. A method of coating with a fluorinated solvent using a silane coupling agent is exemplified. At this time, as a method for selectively repelling only the surface layer of the convex portion and not repelling the side surface of the convex portion,
(1) Two kinds of materials are laminated so that the convex part itself has such a property.
(2) Cover portions other than the convex portion with a resist, and apply an ink repellency treatment only to the upper surface of the convex portion. (3) Form a resist layer on the transparent substrate, and perform an ink repellency treatment on the entire surface, followed by a photolithography process. The method of patterning a resist layer by, for example, forming a convex part is illustrated.
[0025]
Similarly, Japanese Patent Application Laid-Open No. 9-230129 discloses a method of irradiating energy rays as a method of making a concave portion an ink-philic process. Also in this case, as a method of performing the ink repellent treatment only on the surface layer of the convex portion, a photosensitive material for forming the convex portion is applied on a glass substrate, and the entire surface is treated with an ink repellent treatment agent, and then photo A technique for patterning a photosensitive material by a lithography process is illustrated. Thereafter, the convex portion and the concave portion are simultaneously or selectively subjected to ink-inking treatment by irradiation with energy rays.
[0026]
However, since all of these methods perform the ink repellent treatment on the concave surface after the surface of the convex portion is subjected to the ink repellent treatment, the surface of the convex portion subjected to the ink repellent treatment when performing the ink remediation treatment. There is a problem that the ink repellency is lowered. Therefore, it is difficult to obtain sufficient ink affinity on the transparent substrate surface and the side surface of the black matrix, and sufficient ink repellency on the upper surface of the black matrix.
[0027]
The above problem also occurs when an electroluminescent element is manufactured by an ink jet method. That is, in an electroluminescence element, for example, when an organic semiconductor material that emits R, G, and B light is used as an ink, and the ink is applied to a region surrounded by a partition wall to form a pixel (light emitting layer). When ink is mixed between adjacent light emitting layers, there arises a problem that the light emitting layer cannot emit light having a desired color and luminance. Even in the case of a single color light emitting layer, the amount of ink filled in the partition is made uniform, so when ink flows into adjacent pixels, the amount of ink becomes non-uniform, which is recognized as luminance unevenness, which is a problem. It becomes. Further, when the ink is not sufficiently diffused in the region surrounded by the partition walls, there is a problem that sufficient light emission luminance cannot be obtained at the boundary portion between the light emitting layer and the partition walls. In the following description, for the sake of convenience, even when an electroluminescent element is manufactured, the mixing of ink between adjacent light emitting layers is “mixed color”, and the light emission luminance due to the repulsion of ink at the boundary between the light emitting layer and the partition wall. The occurrence of unevenness is referred to as “white spots”.
[0028]
An object of the present invention is to solve the above problems and provide a highly reliable optical element with a high yield when an optical element such as a color filter or an electroluminescence element is manufactured at low cost by a simple process using an inkjet method. There is. Specifically, when ink is applied to the area surrounded by the partition walls, color mixing between adjacent pixels is prevented, and the ink is sufficiently diffused in the area so that pixels without white spots are formed. It is to form. A further object of the present invention is to provide a liquid crystal element excellent in color display characteristics at a lower cost by using the optical element obtained by the production method.
[0029]
[Means for Solving the Problems]
A first aspect of the present invention is a method for producing an optical element having at least a partition made of a resin composition located between a plurality of pixels and adjacent pixels on a support substrate,
Forming a resist pattern with an alkali-soluble positive resist in a region surrounded by a partition wall on a support substrate;
A step of subjecting the formed resist pattern to a fluorination treatment,
A step of forming a partition wall by applying a resin composition to the gap between the resist patterns subjected to the fluorination treatment by an inkjet method;
Applying a fluorination treatment to the upper surface of the partition wall while leaving the resist pattern;
Dissolving and removing the resist pattern with an alkaline aqueous solution ;
Forming a pixel by applying ink to a region surrounded by the partition wall by an inkjet method;
It is a manufacturing method of the optical element characterized by having.
[0030]
In the present invention, the fluorination treatment is a plasma treatment in which plasma irradiation is performed by introducing a gas containing at least fluorine atoms, the partition is formed of a resin composition containing a light shielding agent, it shielding agent is carbon black, at least the curing component is above Symbol ink, water, it contains an organic solvent, the resin composition is applied by an inkjet method in a gap between a resist pattern which has been subjected to the fluorination treatment, the photosensitive A preferable embodiment is that it contains a conductive resin, the ink contains a colorant, and a color filter in which the pixel is a colored portion is produced, and an electroluminescent element in which the pixel is a light emitting layer is produced. Is included.
[0033]
Further the second aspect of the present invention is a method of manufacturing a liquid crystal device ing by sandwiching a liquid crystal between a pair of substrates, as one substrate, an optical element manufactured by the manufacturing method of an optical element of the present invention It is a manufacturing method of the liquid crystal element characterized by using .
[0034]
DETAILED DESCRIPTION OF THE INVENTION
In the method for producing an optical element of the present invention, in the step of forming the partition wall on the support substrate, a resist pattern is formed on the support substrate, a resin composition is applied to the gap to form the partition wall, and fluorination treatment is performed. The resist pattern is removed after increasing the ink repellency of the upper surface of the partition wall, and ink is applied by an ink jet method to form a pixel. Therefore, in the present invention, when ink is applied, the ink repellency on the upper surface of the partition wall sufficiently retains even a large amount of ink to prevent color mixing, while the side walls of the partition wall and the surface of the support substrate have high ink affinity and promptly. Ink spreads and prevents white spots.
[0035]
In the present invention, the above “ink” is a generic term for, for example, optically and electrically functional liquids after being dried and cured, and is not limited to conventionally used coloring materials.
[0036]
Examples of the optical element of the present invention manufactured by the manufacturing method of the present invention include a color filter and an electroluminescence element. First, embodiments of the optical element of the present invention will be described.
[0037]
FIG. 8 schematically shows a cross section of an example of a color filter which is an embodiment of the optical element of the present invention. In the figure, 101 is a transparent substrate as a support substrate, 102 is a black matrix that also serves as a partition, 103 is a colored portion that is a pixel, and 104 is a protective layer that is formed as necessary. When a liquid crystal element is formed using the color filter of the present invention, ITO (indium tin oxide) for driving the liquid crystal is formed on the colored portion 103 or on the protective layer 104 formed on the colored portion 103. A transparent conductive film made of a transparent conductive material such as oxide) may be formed and provided.
[0038]
FIG. 9 is a schematic cross-sectional view of an embodiment of the liquid crystal element of the present invention, which is configured using the color filter of FIG. In the figure, 107 is a common electrode (transparent conductive film), 108 is an alignment film, 109 is a liquid crystal, 111 is a counter substrate, 112 is a pixel electrode, and 113 is an alignment film. Therefore, the description is omitted.
[0039]
A color liquid crystal element is generally formed by combining a substrate 101 on the color filter side and a counter substrate 111 and enclosing a liquid crystal 109. TFTs (not shown) and pixel electrodes 112 are formed in a matrix inside one substrate 111 of the liquid crystal element. Further, a color filter coloring portion 103 is formed inside the substrate 101 on the color filter side so that R, G, and B are arranged at a position facing the pixel electrode 112, and a transparent common electrode is formed thereon. 107 is formed. Further, alignment films 108 and 113 are formed in the planes of both substrates, and liquid crystal molecules are arranged in a certain direction. These substrates are arranged to face each other via a spacer (not shown), are bonded together by a sealing material (not shown), and the gap is filled with liquid crystal 109.
[0040]
When the liquid crystal element is a transmissive type, the substrate 111 and the pixel electrode 112 are formed of a transparent material, a polarizing plate is bonded to the outside of each substrate, and a backlight that generally combines a fluorescent lamp and a scattering plate. Is used to make the liquid crystal compound function as an optical shutter that changes the light transmittance of the backlight. In the case of a reflective type, the substrate 111 or the pixel electrode 112 is formed of a material having a reflection function, or a reflective layer is provided on the substrate 111, and a polarizing plate is provided outside the transparent substrate 101. Display is performed by reflecting light incident from the filter side.
[0041]
FIG. 7 shows a schematic cross-sectional view of an example of an organic electroluminescence element (hereinafter referred to as “EL element”), which is another embodiment of the optical element of the present invention. In the figure, 91 is a drive substrate as a support substrate, 92 is a partition, 93 is a light emitting layer as a pixel, 94 is a transparent electrode, and 96 is a metal layer. In this figure, only one pixel region is shown for simplification.
[0042]
The driving substrate 91 has a multi-layered structure of TFTs (not shown), wiring films, insulating films, and the like, and a voltage can be applied in units of light emitting layers between the transparent electrodes 94 arranged for each of the metal layers 96 and the light emitting layers 93. It is configured. The drive substrate 91 is manufactured by a known thin film process.
[0043]
The structure of the organic EL device of the present invention is such that at least one of a pair of anode and cathode that is transparent or translucent is filled with at least a light emitting material in a partition made of a resin composition. For example, there is no particular limitation, and a known structure can be adopted, and various modifications can be made without departing from the gist of the present invention.
[0044]
The laminated structure is, for example,
(1) Electrode (cathode) / light emitting layer / hole injection layer / electrode (anode)
(2) Electrode (anode) / light emitting layer / electron injection layer / electrode (cathode)
(3) Electrode (anode) / hole injection layer / light emitting layer / electron injection layer / electrode (cathode)
(4) Electrode (anode or cathode) / light emitting layer / electrode (cathode or anode)
However, the present invention can also be applied to an EL element having a stacked structure in which an organic compound layer having any one of the above structures is provided.
[0045]
(1) a two-layer structure, (3) is a three-layer structure, (4) is what is referred to as Tanso構granulation. The organic EL element of the present invention is based on these laminated structures, but may have a structure in which (1) to (4) other than these are combined, or a plurality of each layer. Further, a full color display may be realized by combining with a color filter. The shape, size, material, manufacturing method and the like of the organic EL element of the present invention having such a laminated structure are appropriately selected according to the use of the organic EL element, and there are no particular restrictions on these.
[0046]
The light emitting material used for the light emitting layer of the organic EL device of the present invention is not particularly limited, and various materials can be applied. Specifically, low molecular phosphors and polymer phosphors are preferable, and polymer phosphors are more preferable.
[0047]
For example, the low molecular organic compound is not particularly limited, but naphthalene and derivatives thereof, anthracene and derivatives thereof, perylene and derivatives thereof, polymethine-based, xanthene-based, coumarin-based, cyanine-based pigments, 8-hydroxyquinoline, and the like. And metal complexes of the derivatives thereof, aromatic amines, tetraphenylcyclopentadiene and derivatives thereof, tetraphenylbutadiene and derivatives thereof, and the like can be used. Specifically, for example, known ones such as those described in JP-A-57-51781 and JP-A-59-194393 can be used.
[0048]
In addition, the high molecular organic compound that can be used as the light emitting material is not particularly limited, and examples thereof include polyphenylene vinylene, polyarylene, polyalkylthiophene, and polyalkylfluorene.
[0049]
The polymeric fluorescent substance used in the organic EL device of the present invention may be a random, block or graft copolymer, or a polymer having an intermediate structure thereof, for example, a random copolymer having a block property. It may be a polymer. From the viewpoint of obtaining a polymeric fluorescent substance having a high fluorescence quantum yield, a random copolymer having a block property and a block or graft copolymer are preferable to a complete random copolymer. In addition, since the organic EL element of the present invention utilizes light emission from a thin film, the polymer fluorescent substance having fluorescence in a solid state is used.
[0050]
Examples of the good solvent for the polymeric fluorescent substance include chloroform, methylene chloride, dichloroethane, tetrahydrofuran, toluene, xylene and the like. Although depending on the structure and molecular weight of the polymeric fluorescent substance, it can usually be dissolved in these solvents in an amount of 0.1% by weight or more.
[0051]
In the organic EL device of the present invention, an electron transport property used in an electron transport layer when an electron transport layer is further provided between a layer containing a light emitting material and a cathode, or mixed with a hole transport material and a light emitting material. The material has a function of transmitting electrons injected from the cathode to the light emitting material. There is no restriction | limiting in particular about such an electron transport material, Arbitrary things can be selected and used from a conventionally well-known compound.
[0052]
Preferable examples of the electron transporting material include nitro-substituted fluorenone derivatives, anthraquinodimethane derivatives, diphenylquinone derivatives, thiopyran dioxide derivatives, heterocyclic tetracarboxylic acid anhydrides, and carbodiimides.
[0053]
Further examples include fluorenylidenemethane derivatives, anthraquinodimethane derivatives and anthrone derivatives, oxadiazole derivatives, and the like. Further, although disclosed as a material for forming a light-emitting layer, 8-hydroxyquinoline and metal complexes of derivatives thereof can also be used as an electron transporting material.
[0054]
Next, a typical method for manufacturing an organic EL element having a laminated structure as an example of the present invention will be described. As a pair of electrodes composed of an anode and a cathode, as a transparent or translucent electrode, for example, a transparent substrate such as transparent glass or transparent plastic on which a transparent or translucent electrode is formed is used.
[0055]
In the EL device of the present invention, the light emitting layer is generally combined with an appropriate binder resin to form a thin film. The binder can be selected from a wide range of binder resins such as polyvinyl carbazole resin, polycarbonate resin, polyester resin, polyarylate resin, butyral resin, polystyrene resin, polyvinyl acetal resin, diallyl phthalate resin, acrylic resin, methacrylic resin. , Phenol resin, epoxy resin, silicone resin, polysulfone resin, urea resin and the like, but are not limited thereto. These may be used alone or in combination as a copolymer polymer. As the anode material, a material having a work function as large as possible is preferable. For example, nickel, gold, platinum, palladium, selenium, rhenium, iridium and alloys thereof, or tin oxide, indium tin oxide (ITO), and copper iodide are preferable. In addition, conductive polymers such as poly (3-methylthiophene), polyphenylene sulfide, and polypyrrole can also be used.
[0056]
On the other hand, silver, lead, tin, magnesium, aluminum, calcium, manganese, indium, chromium, or alloys thereof having a small work function are used as the cathode material.
[0057]
Hereinafter, a method for producing an optical element of the present invention will be described with reference to the drawings.
[0058]
1 and 2 are process diagrams schematically showing a method for producing an optical element of the present invention. Each step will be described below. The following steps (a) to (h) correspond to (a) to (h) in FIGS. 1 and 2, (a-1) to (h-1) on the left side of the drawing are schematic plan views viewed from above, and (a-2) to (h-2) on the right side of the drawing are ( It is an AB cross-sectional schematic diagram of a-1)-(h-1). In the figure, 1 is a support substrate, 3 is a partition, 4 is an opening of the partition 3, 5 is a resist pattern, 6 is an inkjet head, 7 is ink, 8 is a pixel, and 9 is a resin composition that forms the partition 3. .
[0059]
Step (a)
A support substrate 1 is prepared. The support substrate 1 is a transparent substrate 101 in the case of manufacturing the color filter illustrated in FIG. 8, and a glass substrate is generally used. However, for the purpose of constituting a liquid crystal element, desired transparency and mechanical strength are used. A plastic substrate or the like can be used as long as it has the necessary characteristics.
[0060]
When the EL element illustrated in FIG. 7 is manufactured, the support substrate 1 is the drive substrate 91 on which the transparent electrode 94 is formed. When light emission is observed from the substrate side as shown in FIG. A transparent substrate such as a glass substrate is used for 91.
[0061]
The support substrate 1 is preferably subjected to an ink affinity process in advance. As the lyophilic process, for example, a cleaning process using an alkaline aqueous solution, a UV cleaning process, an excimer cleaning process, a corona discharge process, an oxygen plasma process, or the like is preferably used.
[0062]
Step (b)
A resist pattern 5 is formed on the support substrate 1 for patterning the partition walls 3 and for protecting the side surfaces of the partition walls 3 and the surface of the support substrate 1 in the fluorination treatment of the upper surfaces of the partition walls 3 to be described later. As the resist, it is necessary to use a material that can be removed after the fluorination treatment. As a method for forming the resist pattern 5, a photolithography method in which a photosensitive resist is exposed and developed through a mask having a predetermined pattern, a method in which a photosensitive or non-photosensitive material is directly formed by printing or an inkjet method, The lift-off method of patterning a non-photosensitive material through a photosensitive resist can be applied, but is not limited to these methods. However, in consideration of pattern resolution and ease, a photolithography method and a method using a photolytic positive resist are preferable. In particular, when an alkali-soluble positive resist is used, the surface of the support substrate is made ink-friendly by the alkali cleaning at the time of removing the resist. Increased and preferred.
[0063]
Step (c)
Preferably, the resist pattern 5 is subjected to fluorination treatment. By this treatment, the surface of the resist pattern 5 increases the ink repellency, and when the partition wall 3 is formed by applying the resin composition 9 as an ink to the gap of the resist pattern 5 from the inkjet head in a process described later. Even when the resin composition 9 having droplets larger than the line width is received, the resin composition quickly flows into the gap due to the ink repellency on the surface of the resist pattern 5. be able to.
[0064]
As the fluorination treatment, a method in which the process is simple and the surface of the resist pattern 5 can be favorably fluorinated to increase the ink repellency, and plasma irradiation is performed by introducing a gas containing at least fluorine atoms. Treatment is preferably used.
[0065]
As the gas containing at least a fluorine atom used in the process, one or more halogen gases selected from CF ₄ , CHF ₃ , C ₂ F ₆ , SF ₆ , C ₃ F ₈ , and C ₅ F ₈ are used. It is preferable. In particular, C ₅ F ₈ (octafluorocyclopentene) has an ozone depleting ability of 0, and at the same time, has an atmospheric lifetime (CF ₄ : 50,000 years, C ₄ F ₈ : 3200) as compared with conventional gases. It is very short with 98 years. Therefore, the global warming potential is 90 (100-year integrated value with CO ₂ = 2), which is very small (CF ₄ : 6500, C ₄ F ₈ : 8700) compared to conventional gases, and the ozone layer and the global environment. It is extremely effective for protection and is desirable for use in the present invention.
[0066]
Further, as the introduced gas, a gas such as oxygen, argon, or helium may be used in combination as necessary. In this step, when a mixed gas of at least one halogen gas selected from CF ₄ , CHF ₃ , C ₂ F ₆ , SF ₆ , C ₃ F ₈ , and C ₅ F ₈ and O ₂ is used, In this step, the degree of ink repellency on the surface of the resist pattern 5 to be fluorinated can be controlled. However, in the mixed gas, the oxidation reaction mixture ratio by O ₂ exceeds 30% of O ₂ is dominant, because the ink repellency enhancing effect is prevented, also, O ₂ mixing ratio is more than 30% When the mixed gas is used, it is necessary to use the O ₂ mixing ratio in the range of 30% or less.
[0067]
In addition, plasma generation methods such as low frequency discharge, high frequency discharge, and microwave discharge can be used. Conditions such as pressure, gas flow rate, discharge frequency, and processing time during plasma processing are arbitrarily set. can do.
[0068]
5 and 6 are schematic views of a plasma generator that can be used in the plasma treatment step. In the figure, 51 is an upper electrode, 52 is a lower electrode, 53 is a substrate to be processed, and 54 is a high-frequency electrode. The apparatus generates a plasma by applying a high-frequency voltage to two electrodes on parallel plates. FIG. 5 shows a cathode coupling system, and FIG. 6 shows an anode coupling system. In either system, the ink repellency on the surface of the resist pattern 5 is changed depending on conditions such as pressure, gas flow rate, discharge frequency, and processing time. The desired degree can be obtained.
[0069]
In the plasma generator shown in FIGS. 5 and 6, the cathode coupling method of FIG. 5 can shorten the processing time, which is advantageous for the processing step. Further, the anode coupling method of FIG. 6 is advantageous in that the support substrate 1 is not damaged more than necessary. Therefore, the plasma generator used in this step may be selected according to the material of the support substrate 1 and the resist pattern 5.
[0070]
Step (d)
The partition wall 3 is formed by applying the resin composition 9 to the region (gap) where the resist pattern 5 is not formed from the inkjet head 6. As the ink jet, a bubble jet type using an electrothermal transducer as an energy generating element, a piezo jet type using a piezoelectric element, or the like can be used.
[0071]
In the present invention, since the resin composition 9 is selectively applied to the gap between the resist patterns 5 by using an ink jet method in the step, at least a part of the resist pattern 5 can be exposed, Compared to the case where the entire surface is covered with the resin composition 9 as in a general lift-off method, the removal of the resist pattern 5 in the subsequent process is facilitated. Even when the resin composition 9 is placed on the resist pattern 5, the resin composition 9 is also removed simultaneously with the removal of the resist pattern 5, so that the pattern of the partition wall 3 is not affected.
[0072]
In the present invention, the resin composition used for forming the partition walls 3 is a photosensitive resin such as an epoxy resin, an acrylic resin, a polyimide resin containing polyamideimide, a urethane resin, a polyester resin, or a polyvinyl resin. Alternatively, a non-photosensitive resin material can be used, but it preferably has a heat resistance of 250 ° C. or higher. From this point, an epoxy resin, an acrylic resin, or a polyimide resin is preferably used.
[0073]
Further, when the partition wall 3 is used as a light shielding layer, a black resin composition in which a light shielding agent is dispersed in the resin composition 9 is used. As the light-shielding agent, it is desirable to use carbon black because high repellency can be obtained on the upper surface of the partition wall 3 by fluorination treatment described later. As the carbon black, channel black, roller black, disc black, and the like are used. Manufactured by the contact method called, gas furnace black, manufactured by the furnace method called oil furnace black, manufactured by the thermal method called thermal black, acetylene black In particular, channel black, gas furnace black, and oil furnace black are preferable. If necessary, a mixture of R, G, and B pigments may be added. Moreover, the black resist generally marketed can also be used. If necessary, a light-shielding layer with a high resistance may be used.
[0074]
Step (e)
A fluorination treatment is performed with the resist pattern 5 left on the support substrate 1 to increase the ink repellency of the upper surface of the partition 3. The fluorination treatment is the same as the fluorination treatment in the previous step (c), and plasma treatment in which plasma irradiation is performed by introducing a gas containing at least fluorine atoms is preferably used. The conditions for the plasma treatment and the apparatus used are the same as described in the previous step (c).
[0075]
Step (f)
The resist pattern 5 is removed. Although the resist removal method varies depending on the resist material used, it is necessary to use a method that does not adversely affect the adhesion of the partition walls 3 and the ink repellency of the upper surface of the fluorinated partition walls 3. For example, there are a method of dissolving with an alkaline aqueous solution or an organic solvent, and a method of using ultraviolet energy irradiation in addition to that.
[0076]
Step (g)
The ink 7 is applied from the ink jet head 6 to the region (opening 4) surrounded by the partition walls 3 using an ink jet recording apparatus. As the ink jet, a bubble jet type using an electrothermal transducer as an energy generating element, a piezo jet type using a piezoelectric element, or the like can be used. The ink 7 includes a colorant of each color so as to form a colored portion of R, G, B after curing in the case of a color filter. In the case of an EL element, the ink 7 emits light by application of a voltage after curing. A material for forming the light emitting layer is used. In any case, the ink 7 preferably contains at least a curing component, water, and a solvent. Hereinafter, the composition of the ink used when the color filter is produced by the production method of the present invention will be described in more detail.
[0077]
[1] Colorant As the colorant to be contained in the ink in the present invention, both dye-based and pigment-based can be used. However, when a pigment is used, a separate dispersant is used for uniform dispersion in the ink. Therefore, a dye-based colorant is preferably used because the ratio of the colorant in the total solid content becomes low. Moreover, it is preferable that it is the same amount or less as the addition amount of a coloring agent with the hardening component mentioned later.
[0078]
[2] Curing component In consideration of process resistance, reliability, etc. in the subsequent steps, it contains components that cure by heat treatment or light irradiation and fix the colorant, that is, components such as crosslinkable monomers or polymers It is preferable to do. In particular, it is preferable to use a curable resin composition in consideration of heat resistance in the subsequent process. Specifically, for example, as a base resin, an acrylic resin having a functional group such as a hydroxyl group, a carboxyl group, an alkoxy group, an amide group, a silicone resin; or a cellulose derivative such as hydroxypropyl cellulose, hydroxyethyl cellulose, methyl cellulose, carboxymethyl cellulose, or the like These modified products; or vinyl polymers such as polyvinyl pyrrolidone, polyvinyl alcohol, and polyvinyl acetal. Furthermore, it is possible to use a crosslinking agent and a photoinitiator for curing these base resins by light irradiation or heat treatment. Specifically, melamine derivatives such as methylolated melamine are used as crosslinking agents, and dichromate, bisazide compounds, radical initiators, cationic initiators, anionic initiators, etc. are used as photoinitiators. Is possible. Moreover, these photoinitiators can also be used by mixing multiple types or combining with another sensitizer.
[0079]
[3] Solvent As the ink medium used in the present invention, a mixed solvent of water and an organic solvent is preferably used. As water, it is preferable to use ion-exchanged water (deionized water) instead of general water containing various ions.
[0080]
Examples of the organic solvent include alkyl alcohols having 1 to 4 carbon atoms such as methyl alcohol, ethyl alcohol, n-propyl alcohol, isopropyl alcohol, n-butyl alcohol, sec-butyl alcohol, tert-butyl alcohol; dimethylformamide, dimethylacetamide Amides such as acetone, ketones such as acetone and diacetone alcohol or keto alcohols, ethers such as tetrahydrofuran and dioxane, polyalkylene glycols such as polyethylene glycol and polypropylene glycol, ethylene glycol, propylene glycol, butylene glycol and triethylene Alkylene glycols containing 2 to 4 carbons such as glycol, thiodiglycol, hexylene glycol, diethylene glycol, etc. Glycerins; Lower alkyl ethers of polyhydric alcohols such as ethylene glycol monomethyl ether, diethylene glycol methyl ether, triethylene glycol monomethyl ether; N-methyl-2-pyrrolidone, 2-pyrrolidone, etc. Is preferred.
[0081]
In addition to the above components, two or more kinds of organic solvents having different boiling points may be used in combination to obtain an ink having a desired physical property value, if necessary, or a surfactant, antifoaming agent, preservative. Etc. may be added.
[0082]
Step (h)
The pixel 8 is formed by performing necessary processing such as heat treatment and light irradiation, removing the solvent component in the ink 7 and curing it.
[0083]
Furthermore, in the case of a color filter, as described above, a protective layer and a transparent conductive film are formed as necessary. As the protective layer in this case, a photocuring type, a thermosetting type, or a photothermal combination curing type resin material, or an inorganic film formed by vapor deposition, sputtering, or the like can be used. Any material can be used as long as it has transparency and can withstand a subsequent transparent conductive film formation process, alignment film formation process, and the like. Moreover, you may form a transparent conductive film directly on a coloring part, without passing through a protective layer. In the case of an EL element, a necessary member such as a metal layer is formed on the pixel.
[0084]
【Example】
( Reference Example 1)
[Formation of resist pattern] On a glass substrate (Corning "1737"), a positive resist (Hoechst "AZ-4903") is applied by spin coating, and subjected to predetermined exposure and development processes to obtain a film thickness of 10 [mu] m. A resist pattern was obtained in which a plurality of rectangular resists of 75 μm × 225 μm were arranged vertically and horizontally at intervals of 20 μm.
[0085]
[Formation of black matrix]
A black resist (“V-259BK” manufactured by Nippon Steel Chemical Co., Ltd.) was filled in the gap between the resist patterns so as to have a film thickness of 2 μm when dried using an ink jet recording apparatus equipped with an ink jet head having a discharge amount of 40 pl. Then, the black resist is heated to a dry state by touching it on a hot plate at 90 ° C. for 2 minutes, and then the black resist is photocured by ultraviolet exposure to form a black matrix, and at the same time, the resist pattern is photolyzed. did.
[0086]
[Fluorine treatment of black matrix]
The glass substrate (black matrix substrate) on which the black matrix was formed was subjected to plasma treatment under the following conditions using a parallel plate type plasma treatment apparatus.
[0087]
Gas used: CF ₄
Gas flow rate: 80sccm
Pressure: 8Pa
RF power: 150W
Processing time: 60 sec
[0088]
[Removal of resist pattern]
The black matrix substrate subjected to the plasma treatment was treated with an aqueous sodium hydroxide solution (pH 11) to remove the resist pattern. Next, it was thoroughly washed with water, drained and heated in an oven at 230 ° C. for 30 minutes to completely cure the black matrix.
[0089]
[Evaluation of ink repellency of black matrix substrate]
When the contact angle with respect to pure water of the obtained black matrix substrate was measured,
Black matrix top surface: 118 °
Glass substrate surface: 17 °
Met.
[0090]
[Ink adjustment]
Using an acrylic copolymer having the composition shown below as a thermosetting component, R, G, and B inks were prepared with the following compositions.
[0091]
Curing component Methyl methacrylate 50 parts by weight Hydroxyethyl methacrylate 30 parts by weight N-methylolacrylamide 20 parts by weight
R ink C.I. I. Acid Orange 148 3.5 parts by weight C.I. I. Acid Red 289 0.5 parts by weight Diethylene glycol 30 parts by weight Ethylene glycol 20 parts by weight Deionized water 40 parts by weight The above curing component 6 parts by weight
G ink C.I. I. Acid Yellow 23 2 parts by weight Zinc phthalocyanine sulfoamide 2 parts by weight Diethylene glycol 30 parts by weight Ethylene glycol 20 parts by weight Deionized water 40 parts by weight The above curing component 6 parts by weight
B ink C.I. I. Direct Blue 199 4 parts by weight Diethylene glycol 30 parts by weight Ethylene glycol 20 parts by weight Deionized water 40 parts by weight The above curing component 6 parts by weight
(Preparation of colored part)
Using an ink jet recording apparatus equipped with an ink jet head with a discharge amount of 20 pl, the amount of the R, G, B ink is changed every 100 pl in the range of 200 to 800 pl per opening with respect to the black matrix substrate. Granted. Next, heat treatment was performed at 90 ° C. for 10 minutes and subsequently at 230 ° C. for 30 minutes to cure the ink to form colored portions (pixels), and seven types of color filters with different ink application amounts were produced.
[0096]
[Evaluation of mixed colors and white spots]
When the obtained color filter was observed with an optical microscope, no color mixing or white spot was observed in all the color filters. Moreover, the liquid crystal element comprised by providing this color filter with the protective layer and the transparent conductive film had good display quality.
[0097]
( Reference Example 2)
The resist pattern is formed with a photo-curing negative resist (“PVP-resist” manufactured by Sanyo Chemical Co., Ltd.) to a thickness of 6 μm, and an alkaline aqueous solution (“NMD-3” manufactured by Tokyo Ohka Kogyo Co., Ltd.) is used for removing the resist. A color filter was produced in the same manner as in Reference Example 1 except that. A portion of the resist pattern covered with the resin composition was formed when the resin composition was filled, but was removed when the resist was removed.
[0098]
[Evaluation of ink repellency of black matrix substrate]
When the contact angle with respect to pure water of the obtained black matrix substrate was measured,
Black matrix top surface: 115 °
Glass substrate surface: 11 °
Met.
[0099]
[Evaluation of mixed colors and white spots]
When the obtained color filter was observed with an optical microscope, no color mixing or white spot was observed in all the color filters.
[0100]
( Reference Example 3)
A resist pattern was directly formed by intaglio offset printing using a monomethacrylate resin (“NK Ester SA” manufactured by Parent Nakamura Chemical Co., Ltd.) so as to have a film thickness of 4 μm. A color filter was produced in the same manner as in Reference Example 1 except that was used. A portion where the resin composition was also deposited on the resist pattern was formed when the resin composition was filled, but was removed when the resist was removed.
[0101]
[Evaluation of ink repellency of black matrix substrate]
When the contact angle with respect to pure water of the obtained black matrix substrate was measured,
Black matrix top surface: 128 °
Glass substrate surface: 13 °
Met.
[0102]
[Evaluation of mixed colors and white spots]
When the obtained color filter was observed with an optical microscope, no color mixing or white spot was observed in all the color filters.
[0103]
(Comparative Example 1)
A black matrix pattern was formed directly on the glass substrate without forming a resist pattern. Although the pattern was set to a width of 20 μm and a height of 2 μm, the line width was 60 to 70 μm, and a black matrix as designed was not formed.
[0104]
(Comparative Example 2)
A color filter was produced in the same manner as in Reference Example 1 except that the fluorination treatment of the black matrix was not performed.
[0105]
[Evaluation of ink repellency of black matrix substrate]
When the contact angle with respect to pure water of the obtained black matrix substrate was measured,
Black matrix top surface: 76 °
Glass substrate surface: 65 °
Met.
[0106]
[Evaluation of mixed colors and white spots]
When the obtained color filters were observed with an optical microscope, white spots were observed in all the color filters, and color mixing was confirmed in the color filters having an ink application amount of 300 pl or more.
[0107]
Example 4
A color filter was prepared in the same manner as in Reference Example 1 except that the resist pattern had a thickness of 5 μm and the resist pattern was subjected to plasma treatment under the following conditions.
[0108]
[Resistance pattern fluorination treatment]
Gas used: CF ₄
Gas flow rate: 80sccm
Pressure: 8Pa
RF power: 150W
Processing time: 60 sec
[0109]
[Evaluation of ink repellency of resist pattern substrate]
After measuring the contact angle to the pure water of the resist pattern substrate after fluorination treatment,
Resist pattern top: 105 °
Glass substrate surface: 13 °
Met.
[0110]
[Evaluation of ink repellency of black matrix substrate]
When the contact angle with respect to pure water of the obtained black matrix substrate was measured,
Black matrix top surface: 118 °
Glass substrate surface: 17 °
Met.
[0111]
[Evaluation of mixed colors and white spots]
When the obtained color filter was observed with an optical microscope, no color mixing or white spot was observed in all the color filters.
[0112]
( Reference Example 5)
The resist pattern is formed using a photo-curing negative resist (“PVP-resist” manufactured by Sanyo Chemical Co., Ltd.) to a film thickness of 5 μm, and an alkaline aqueous solution (“NMD-3” manufactured by Tokyo Ohka Kogyo Co., Ltd.) is used for removing the resist. A color filter was produced in the same manner as in Example 4 except that.
[0113]
[Evaluation of ink repellency of resist pattern substrate]
After measuring the contact angle to the pure water of the resist pattern substrate after fluorination treatment,
Resist pattern upper surface: 100 °
Glass substrate surface: 15 °
Met.
[0114]
[Evaluation of ink repellency of black matrix substrate]
When the contact angle with respect to pure water of the obtained black matrix substrate was measured,
Black matrix top: 110 °
Glass substrate surface: 10 °
Met.
[0115]
[Evaluation of mixed colors and white spots]
When the obtained color filter was observed with an optical microscope, no color mixing or white spot was observed in all the color filters.
[0116]
(Comparative Example 3)
A color filter was produced in the same manner as in Example 4 except that the resist pattern fluorination treatment and the black matrix fluorination treatment were not performed.
[0117]
[Evaluation of ink repellency of resist pattern substrate]
After measuring the contact angle to the pure water of the resist pattern substrate,
Resist pattern upper surface: 74 °
Glass substrate surface: 63 °
Met.
[0118]
[Evaluation of ink repellency of black matrix substrate]
When the contact angle with respect to pure water of the obtained black matrix substrate was measured,
Black matrix top surface: 73 °
Glass substrate surface: 62 °
Met.
[0119]
[Evaluation of mixed colors and white spots]
When the obtained color filter was observed with an optical microscope, white spots were observed in all the color filters. Further, color mixing was confirmed in a color filter having an ink application amount of 300 pl or more.
[0120]
( Reference Example 6)
On the TFT driving substrate formed by a thin film process, in which wiring films and insulating films are laminated in multiple layers, ITO (transparent electrode) is formed to a thickness of 40 nm by sputtering as a transparent electrode in units of pixels (light emitting layer), Using the substrate patterned according to the pixel shape by the photolithography method, the resist pattern was removed in the same manner as in Reference Example 1.
[0121]
[Evaluation of ink repellency of black matrix substrate]
When the contact angle with respect to pure water of the obtained black matrix substrate was measured,
Black matrix top surface: 122 °
Glass substrate surface: 15 °
Met.
[0122]
[Ink adjustment]
Electron transporting 2,5-bis (5-tert-butyl-2-benzooxazolyl) -thiophene [electron transporting blue light-emitting dye having a fluorescence peak of 450 nm and one of luminescent center forming compounds. Hereinafter, 30% by weight of “BBOT”] is molecularly dispersed in a hole transporting host compound composed of poly-N-vinylcarbazole (molecular weight: 150,000, manufactured by Kanto Chemical Co., Inc., hereinafter referred to as “PVK”). Both were dissolved in a dichloroethane solution so that they could. Ink was prepared by further dissolving 0.015 mol% of Nile red, another luminescent center forming compound, in the dichloroethane solution of PVK-BBOT.
[0123]
[Creation of pixel (light emitting layer)]
The ink was filled in a partition wall surrounded by a transparent resin by an ink jet method and dried to form a light emitting layer having a thickness of 200 nm.
[0124]
[Evaluation of mixed colors and white spots]
Each pixel (light emitting layer) was independent, and the solution containing the light emitting material was not mixed in adjacent pixels between the partition walls. Further, no (white) omission was confirmed.
[0125]
Furthermore, Mg: Ag (10: 1) was vacuum-deposited thereon to form a Mg: Ag cathode having a thickness of 200 nm. When a voltage of 18 V was applied to each pixel of the EL element thus produced, uniform white light emission of 480 cd / m ² was obtained.
[0126]
【The invention's effect】
As described above, according to the present invention, it is possible to manufacture a highly reliable optical element including pixels with no color mixing or white spots with a simple process using an ink jet method, and density unevenness in a colored portion. There can be provided an EL element having no unevenness of light emission luminance in a light emitting layer with no color filter and a light emitting layer. Therefore, a liquid crystal element having excellent color display characteristics can be provided at a lower cost by using the color filter.
[Brief description of the drawings]
FIG. 1 is a process diagram of an embodiment of a method for producing an optical element of the present invention.
FIG. 2 is a process diagram of an embodiment of a method for producing an optical element of the present invention.
FIG. 3 is a conceptual diagram of color mixing that occurs in an optical element manufacturing method using an inkjet method.
FIG. 4 is a conceptual diagram of white spots that occur in a method of manufacturing an optical element by an ink jet method.
FIG. 5 is a schematic view showing an example of the configuration of a plasma generator that can be used in the manufacturing method of the present invention.
FIG. 6 is a schematic view showing another configuration of a plasma generating apparatus that can be used in the manufacturing method of the present invention.
FIG. 7 is a schematic cross-sectional view of an example of an electroluminescence element which is an embodiment of the optical element of the present invention.
FIG. 8 is a schematic cross-sectional view of an example of a color filter that is another embodiment of the optical element of the present invention.
FIG. 9 is a schematic cross-sectional view of an embodiment of a liquid crystal element of the present invention.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Support substrate 3 Partition 4 Opening 5 Resist pattern 6 Inkjet head 7 Ink 8 Pixel 9 Resin composition 31 Transparent substrate 33 Black matrix 36 Ink 38 White 51 Upper electrode 52 Lower electrode 53 Substrate 54 High frequency electrode 91 Driving substrate 92 Partition wall 93 Light emitting layer 94 Transparent electrode 96 Metal layer 101 Transparent substrate 102 Black matrix 103 Colored portion 104 Protective layer 107 Common electrode 108 Alignment film 109 Liquid crystal 111 Counter substrate 112 Pixel electrode 113 Alignment film

Claims (9)

A manufacturing method of an optical element having at least a partition made of a resin composition located between a plurality of pixels and adjacent pixels on a support substrate,
Forming a resist pattern with an alkali-soluble positive resist in a region surrounded by a partition wall on a support substrate;
A step of subjecting the formed resist pattern to a fluorination treatment,
A step of forming a partition wall by applying a resin composition to the gap between the resist patterns subjected to the fluorination treatment by an inkjet method;
Applying a fluorination treatment to the upper surface of the partition wall while leaving the resist pattern;
Dissolving and removing the resist pattern with an alkaline aqueous solution;
Forming a pixel by applying ink to a region surrounded by the partition wall by an inkjet method;
A method for producing an optical element, comprising:   The method for manufacturing an optical element according to claim 1, wherein the fluorination treatment is a plasma treatment in which a plasma irradiation is performed by introducing a gas containing at least fluorine atoms.   The manufacturing method of the optical element of Claim 1 or 2 which forms the said partition with the resin composition containing a light-shielding agent.   The method for producing an optical element according to claim 3, wherein the light shielding agent is carbon black. The ink of at least the curing component, water, method of manufacturing an optical element according to any one of claims 1 to 4 containing an organic solvent. The resin composition applied by an inkjet method in a gap between a resist pattern which has been subjected to the fluorination treatment, method of manufacturing an optical element according to any one of claims 1 to 5, those containing a photosensitive resin . Method of manufacturing an optical element according to any one of claims 1 to 6, said ink containing a colorant to produce a color filter pixel is colored portion. The manufacturing method of the optical element of any one of Claims 1-6 which manufactures the electroluminescent element whose said pixel is a light emitting layer. A method of manufacturing a liquid crystal element in which a liquid crystal is sandwiched between a pair of substrates,
As one of the substrates, a method of manufacturing a liquid crystal device characterized by using an optical element manufactured by the manufacturing method of an optical element according to any one of claims 1-7.

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