JP2003327666A - Epoxy resin composition and semiconductor sealed device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To obtain an epoxy resin composition which particularly excels in storage stability, and to provide a semiconductor sealed device sealed by using the same. <P>SOLUTION: The epoxy resin composition comprises (A) an epoxy resin, (B) a phenol resin as the curing agent, (C) an inorganic filler, and (D) a urea compound represented by the formula as the curing accelerator, and the semiconductor sealed device is provided by sealing a semiconductor chip with the cured product of the composition. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an epoxy resin composition having excellent storage stability at room temperature and a semiconductor encapsulation device which is encapsulated with the epoxy resin composition.

[0002]

2. Description of the Related Art An epoxy resin composition generally contains a curing accelerator in order to enhance the reactivity between the epoxy resin and the curing agent. Generally, phosphorus-based catalysts such as triphenylphosphine, 1,8-diazabicyclo [5,4,0] undecene-7 (abbreviation: DBU), and imidazoles have been used as the curing accelerator. Triphenylphosphine has a low catalytic activity and needs to be mixed in a large amount in the epoxy resin composition in order to improve the curability, the reaction proceeds even at room temperature, the viscosity of the resin composition increases, and the storage stability becomes poor. Become. In addition, imidazoles and DBU have better storage stability than phosphorus-based catalysts, but since the reaction proceeds at room temperature, they need to be stored under an environment of 10 ° C or lower.

[0003]

DISCLOSURE OF THE INVENTION The present invention has been made to solve the above-mentioned drawbacks, and an epoxy resin composition having good curability, moldability and storage stability, and the same. An object of the present invention is to provide a semiconductor encapsulation device that is encapsulated by using.

[0004]

Means for Solving the Problems As a result of intensive studies aimed at achieving the above-mentioned objects, the present inventors have found that by using a catalyst of a specific urea compound as a curing accelerator, good curability is obtained. It was found that an epoxy resin composition having the above-mentioned properties and excellent in moldability and storage stability can be obtained, and the present invention has been completed.

That is, the present invention relates to (A) epoxy resin,
(B) Phenolic resin as a curing agent, (C) an inorganic filler, and (D) a urea compound represented by the following formula as a curing accelerator:

[Chemical 2] An epoxy resin composition characterized by containing, and by a cured product of this epoxy resin composition,
A semiconductor encapsulation device characterized in that a semiconductor is encapsulated.

The present invention will be described in detail below.

The (A) epoxy resin used in the present invention is a monomer having two or more epoxy groups in one molecule,
Refers to all oligomers and polymers. For example, orthocresol novolac type epoxy resin, phenol novolac type epoxy resin, triphenol methane type epoxy resin, alkyl modified triphenol methane type epoxy resin, triazine nucleus-containing epoxy resin, dicyclopentadiene modified epoxy resin, stilbene type epoxy resin, bisphenol Type epoxy compounds and the like, and these may be used alone or in combination of two or more. There are no particular restrictions on the softening point, melting point, or epoxy equivalent of the epoxy resin.

As the (B) phenol resin curing agent used in the present invention, a monomer having two or more phenolic hydroxyl groups capable of reacting with the (A) epoxy resin in one molecule,
Refers to all oligomers and polymers. For example, phenol novolac resin, cresol novolac resin, dicyclopentadiene modified phenol resin, xylylene modified phenol resin, triphenol methane type phenol resin, etc. may be mentioned. Further, these phenolic resins are not particularly limited in terms of softening point, melting point and hydroxyl group equivalent, and may be used alone or in combination of two or more kinds.

As the inorganic filler (C) used in the present invention, those generally used as a sealing material can be widely used. Examples thereof include fused silica powder and crystalline silica powder, which can be used alone or in combination of two or more. Further, the shape of the inorganic filler may be crushed or spherical, and there is no particular problem.

As the (D) curing accelerator used in the present invention, toluenebisdimethylurea represented by the above formula 2 is used. It is desirable that the curing accelerator be contained in an amount of 0.1 to 5.0% by weight based on the total resin composition. If the proportion is less than 0.1% by weight, it will not function as a curing agent, and if it exceeds 5.0% by weight, the curing rate will be too fast, which is not suitable for practical use and is not preferable. In addition, 1,8-diazabicyclo [5,4,0] undecene-7 (DBU), triphenylphosphine, dimethylbenzylamine, 2-which are generally used to accelerate the reaction between an epoxy group and a phenolic hydroxyl group,
You may use it, mixing with hardening accelerators, such as methyl imidazole. These curing accelerators may be dry blended in the resin composition, melt blended, or a combination of both.

The resin composition of the present invention comprises the above-mentioned (A) to (A).
Although the component (D) is an essential component, a silane coupling agent, a brominated epoxy resin, a flame retardant such as antimony oxide, and a colorant such as carbon black are used as long as they do not deviate from the object of the present invention. Release agents such as natural waxes, synthetic waxes and esters, and components for reducing stress such as silicone oil and silicone rubber can be appropriately added and blended.

As a general method for preparing the epoxy resin composition of the present invention as a molding material, the above-mentioned epoxy resin, phenol resin curing agent, inorganic filler, urea curing accelerator, and other components are blended. After sufficiently uniform mixing with a mixer or the like, melt mixing treatment with a hot roll or mixing treatment with a kneader or the like is further performed, followed by cooling and solidification, and pulverization into an appropriate size to obtain a molding material. The molding material thus obtained is used for sealing and covering semiconductors such as semiconductor devices or electrical parts.
When applied to insulation or the like, excellent characteristics and reliability can be imparted.

The semiconductor encapsulation device of the present invention can be easily manufactured by encapsulating a semiconductor chip using the encapsulating resin obtained as described above. The most general method of sealing is a low-pressure transfer molding method, but sealing by injection molding, compression molding, casting or the like is also possible. The encapsulating resin composition is heated and cured during encapsulation, and finally a semiconductor encapsulating device encapsulated with the cured product of the composition is obtained. Curing by heating is 150
It is desirable to heat it to ℃ or above to cure it. As the semiconductor for sealing, for example, an integrated circuit, a large-scale integrated circuit, a transistor, a thyristor, which is given as a semiconductor element,
The diode, the capacitor, the optical semiconductor, etc. are not particularly limited.

[0014]

The epoxy resin composition and the semiconductor encapsulation device of the present invention have desired characteristics by using a specific urea compound as a curing accelerator for the epoxy resin component. That is, depending on the use of the urea compound, the curability is good, and the moldability and storage stability can be excellent.

[0015]

BEST MODE FOR CARRYING OUT THE INVENTION Next, the present invention will be specifically described with reference to Examples, but the present invention is not limited to these Examples. In the following examples and comparative examples, “%” means “% by weight”.

Example 1 ESCN-19 of cresol novolac type epoxy resin
5XL (Sumitomo Chemical Co., Ltd., trade name) 16%, tetrabromobisphenol A type epoxy resin AER-8029
(Asahi Ciba, product name) 2%, phenol novolac resin BRG-556 (Showa Polymer Co., Ltd., product name) 9%, fused crushed silica powder (maximum particle size 105 μm, average particle size 2
5 μm) 70%, toluenebisdimethylurea 0.2% shown in the above formula 2, antimony trioxide 2%, carbon black 0.2%, carnauba wax 0.2%, coupling agent 0.4% Blend, mix at room temperature, then 9
Kneading was performed at 0 to 100 ° C., and the mixture was cooled and ground to produce a sealing resin composition.

The resin composition thus produced was tested for spiral flow, elevated flow viscosity, glass transition point, molding hardness, storage stability and moisture resistance. The results are shown in Table 2.

Example 2, Comparative Examples 1 to 3 By using the respective compositions shown in Table 1, a sealing resin composition was produced in the same manner as in Example 1. Further, using this resin composition, a spiral flow test, a Koka type flow viscosity test, a glass transition point test, a molding hardness test, a storage stability test and a moisture resistance test were conducted. The results are shown in Table 2.

[0019]

[Table 1]

[Table 2] * 1: 175 ° C, * 2: 175 ° C, load 10kg (Shimadzu Flow Tester C
FT-500 type), * 3: 175 ° C, on a hot plate, * 4: 175 ° C, 14spin-DIP was molded at 90s for 90s, and the hot hardness of the cal portion was measured with a Barcol hardness tester. * 5: 30 ° C Spiral flow after 168 h storage in a constant temperature bath. 175 ° C., * 6: A silicon chip (test element) having two or more aluminum wirings made of a molding material is used for 14 pins.
-DIP frame 175 ° C, transfer molding was performed for 2 minutes, and post-curing was performed at 175 ° C for 8 hours. This package was subjected to PCT in saturated steam at 127 ° C./2.5 atm, and the number of packages broken due to aluminum corrosion was examined.

[0020]

As is clear from the above description and Table 2, the epoxy resin composition and the semiconductor encapsulation device of the present invention use a curing catalyst having a specific structure, and thus have good curability, moldability, It can be excellent in storage stability and productivity.

   ─────────────────────────────────────────────────── ─── Continued front page    F term (reference) 4J036 AA01 DC03 DC10 DC25 DC41                       DC46 DD07 FA05 FB06 FB07                       FB08 JA07                 4M109 AA01 BA01 CA21 EA02 EB03                       EB04 EB12 EC14 EC20

Claims (2)

[Claims] 1. A urea compound represented by the following formula as (A) epoxy resin, (B) curing agent as phenol resin, (C) inorganic filler and (D) curing accelerator: An epoxy resin composition comprising: 2. A semiconductor encapsulation device, wherein a semiconductor chip is encapsulated with the cured product of the epoxy resin composition according to claim 1.