JP2003316476A - Information processing device and cooling unit - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a cooling technique usefully applied to a desktop computer having a liquid crystal display device, and to obtain a unique unconventional heat dissipation effect. <P>SOLUTION: An information processing device including a display comprises at least one heat evolving part including a CRT, a cooling liquid circulation means composed of a tubular flow passage filled with a cooling liquid, a cooling liquid pump connected with the cooling liquid circulation means to circulate the cooling liquid in one direction, and a heat absorbing means connected at the midway point of the cooling liquid circulation means to cool the heat evolving part by the cooling liquid. A part of the cooling liquid circulation means is arranged in the vertical direction of the information processing device. The cooling liquid circulating in the cooling liquid circulation means is used as a heat transfer medium to absorb the heat evolved in the heat evolving part by the heat absorbing means and to dissipate the heat from other part. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a desktop computer integrated with a liquid crystal display device, and more particularly to a liquid cooling technology for a heating element in the desktop computer.

[0002]

2. Description of the Related Art A conventional technique for a cooling device for electronic equipment is to heat a heat generating member thermally to a metal housing wall by interposing a metal plate or a heat pipe between the heat generating member in the electronic equipment and the metal housing wall. The heat generated by the heat generating member is dissipated by the wall of the metal casing by connecting to the.

Further, Japanese Patent Application Laid-Open No. 7-142886 discloses a technique for liquid-cooling a heat generating member of an electronic device,
According to this, the heat generated by the semiconductor element heat generating member in the electronic device is received by the heat receiving head, and the refrigerant liquid in the heat receiving head is transported through the flexible tube to the heat radiating head provided in the metal housing of the display device. The heat generated by the semiconductor element heat generating member is efficiently radiated from the metal casing through the heat radiation head through the coolant. Further, the above-mentioned publication discloses an example in which a heat pipe is used as a heat transport device, in which heat generated in a semiconductor element is transferred to a heat pipe through a metal heat receiving plate, and further, a metal which is a heat radiation surface is made of metal. A structure is disclosed in which heat is radiated by being thermally connected to the other end of a heat pipe directly attached to the wall surface of the housing.

Regarding the heat dissipation technology of a desktop computer having a liquid crystal display device, Japanese Patent Laid-Open No. 11-1999
No. 154036. According to this publication, the air that has entered the casing from the air intake holes provided in the lower casing part of the casing part that surrounds the liquid crystal display device, the motherboard, etc. is heated by the heat generated by the motherboard and the power supply part, and the upper surface of the upper casing part It is described that the heat is released to the outside through the heat radiation holes provided on the back surface and the back surface, and on the top surface of the lower casing part.
It is described that a cooling fan is attached to the bottom of the motherboard to improve cooling efficiency.

[0005]

DISCLOSURE OF INVENTION Problems to be Solved by the Invention A desktop computer comprising a main body having a liquid crystal display device and a stand for rotatably supporting the main body has a CPU and an MPU built in the main body. Etc. (hereinafter,
Heat is generated from the CPU), but the generated heat may cause unstable circuit operation or thermal deformation of the mechanisms. In particular, recently, the amount of heat generated has increased as the operating frequency of the CPU has further increased, and it has been desired to efficiently radiate this increased heat to the outside.

The prior art discloses cooling with a liquid coolant for general electronic equipment, cooling using a heat pipe, etc., but the cooling technology for a desktop computer having a liquid crystal display device is disclosed in the above-mentioned JP-A-11-154036. As in the publication, only air cooling and the like have been proposed, and the actual technology is that the cooling structure peculiar to the structure of the desktop computer having the liquid crystal display device is not disclosed.

It is possible to deal with the increase in heat generation of the desktop computer by increasing the air blowing capacity of the fan, but in this case, the wind noise by the fan becomes noise or vibration occurs, and the computer It is conceivable that a problem will occur in use and that the size of the air-cooling heat sink (radiating plate) for radiating heat in the heating element such as the CPU will be increased to maximize the heat radiating capacity. Will be incompatible with the demand for smaller size.

It is an object of the present invention to provide a cooling technique which is useful when applied to a desktop computer having a liquid crystal display device, and to propose a configuration in which a unique heat dissipation effect not obtained by the prior art can be obtained.

[0009]

To solve the above problems, the present invention mainly adopts the following configurations.

In an information processing apparatus including a display, at least one heat generating portion including a CPU, a cooling liquid circulating means including a tubular flow path filled with the cooling liquid, and the cooling liquid circulating in one direction, A cooling liquid pump connected to the cooling liquid circulation means, and a heat absorption means connected to the middle of the cooling liquid circulation means for cooling the heat generating portion with the cooling liquid, and a part of the cooling liquid circulation means is provided as information. The cooling device is arranged in the vertical direction of the processing device, and the cooling liquid circulating in the cooling liquid circulating device is used as a heat transfer medium.

A CPU, a display, and a cooling liquid circulating means, which is arranged in the vertical direction of the device and has a tubular flow path filled with the cooling liquid, and the cooling liquid so as to circulate the cooling liquid in one direction. A CPU cooling unit of an information processing device comprising a cooling liquid pump connected to a cooling liquid circulating means, wherein the CPU cooling unit is connected in the middle of the cooling liquid circulating means, and the heat generated by the CPU is transferred to the cooling liquid. And a heat radiation fin that radiates the heat accumulated in the heat receiving head into the air.

In the CPU cooling unit,
A cooling fan for cooling the radiation fins is provided.

[0013]

BEST MODE FOR CARRYING OUT THE INVENTION A liquid cooling technique for a desktop computer according to an embodiment of the present invention will be described below with reference to the drawings. FIG. 1 shows an overall configuration relating to liquid cooling of a desktop computer according to an embodiment of the present invention, and FIG. 2 is a front view of the overall configuration of FIG. 1 in which a tube and a liquid receiver are fixed to a main chassis. FIG. 3 is a rear view in which (CPU + heat receiving head) and a pump are arranged on the motherboard in the entire configuration of FIG.

Referring to FIGS. 1 to 3, the desktop computer comprises a computer body 1 and a stand 2 for rotatably supporting the computer body 1.
Is equipped with a liquid crystal panel 5 on the front side of the main chassis 3 and a motherboard (control circuit board) on the back side.
4 are arranged.

Various electric / electronic elements, integrated circuits, electronic circuit groups, etc. necessary for operating the computer are mounted on the mother board 4, and a CPU 9 and a power supply circuit which are heat sources when the computer operates are also mounted on the mother board. It is arranged. Further, a large number of connectors are arranged on the back side of the liquid crystal panel 5, that is, on the side facing the main chassis 3, and electrical wiring through the connectors is connected to the terminals of the mother board 4 through the openings of the main chassis 3. Therefore, a space in which electric wirings are arranged is formed between the main chassis 3 and the liquid crystal panel 5.

Referring to FIG. 3, the backside of the mother board 4 (the side opposite to the main chassis side) is a heat source CP.
U9, power supply circuit, HDD (hard disk drive) 1
0 and the like are provided, and a heat receiving head 8 (see FIG. 1) for contacting the heat generating elements and transmitting the heat generation amount to the refrigerant liquid is provided. Here, as the heat source in the desktop computer, specifically, a chip set, a display controller, a power supply unit, an HDD, an FD, in addition to the CPU.
D, CD-ROM section, CD-R / W section, DVD-ROM
There are departments. The heat receiving head 8 is made of a metallic material having a high heat transfer coefficient, and the inside of the heat receiving head is filled with a refrigerant liquid for transporting heat to a heat radiating portion which is located apart from the heat receiving head. Water or ethylene glycol is used as the refrigerant liquid, but is not limited to this. The refrigerant liquid is pressurized by the pump 7 shown in the figure, heat is recovered by the heat receiving head 8, and is circulated by the tube 6.

As the tube 6 for transporting the refrigerant liquid, a Cu tube having a good heat transfer coefficient and corrosion resistance is generally used, but it is not limited to the copper tube as long as it has the above-mentioned attributes. A flexible tube such as a silicon-based tube having the above attributes can also be adopted. As will be described later, in particular, a tube as shown in FIGS. 13 and 14 is laid around similarly to a cable. Therefore, a flexible tube should be used except for a portion fixed to a cover or a chassis (for example, a portion requiring flexibility). It is also possible to use a flexible tube such as a silicon tube instead of the Cu tube for the flow path.

The refrigerant liquid transport tube 6 is brought to the front side of the main chassis through the heat receiving head 8, the pump 7 and the main chassis opening (see FIG. 2), that is, the main chassis 3 and the liquid crystal panel 5. It is brought into the space between them and further fixed to the front side of the main chassis by an appropriate fixing method such as screwing or embedding to form a heat radiating portion. Here, the tube arrangement space on the front side of the main chassis is a space originally secured for the electrical wiring of the liquid crystal panel as described above, and a new tube arrangement for implementing the tube piping on the front side of the main chassis 3 is provided. Since the already secured space is used instead of the space, the overall device can be made thinner,
It does not go against miniaturization.

As shown in FIG. 2, since the tube 6 is fixed on the front side of the main chassis in a spiral shape, a zigzag structure, or a meandering shape, the heat generated by the CPU or the like transferred to the refrigerant liquid is efficiently Cu tube. Through the main chassis 3
Be transmitted to. Since the main chassis originally constitutes the entire frame of the computer connected to the stand 2, its entire area is naturally large, and since it is made of a metal material, the entire chassis The surface area can be used to dissipate heat to the outside, and highly efficient heat dissipation can be achieved.

Further, referring to FIG. 2, the main chassis 3
For example, the tube 6 fixed in a spiral shape on the surface side of the tube 6 may leak the refrigerant liquid due to heat contraction at the joint of the turning portion thereof, so that the leaked refrigerant liquid does not flow down the main chassis and spill onto the stand. A liquid receiver 11 for collecting the refrigerant liquid is provided below the front side of the main chassis. Since the main chassis is normally maintained in the upright state or a state in which the upright state is slightly inclined, the leaked liquid flows down the surface of the main chassis and flows down to the liquid receiver 11
Can be collected at. In FIG. 2, the liquid receiver 11 is the main chassis 3
However, it is also possible to install a liquid receiver on the back side of the main chassis to collect the leaked liquid that has descended along the tube.

Further, although the computer main body 1 is entirely covered with a cover 12, the cover portion corresponding to the lower portion of the space between the liquid crystal panel 5 and the main chassis 3 has a tube for heat transport and a main body. Air inlet 13 for air intake to cool the heat dissipation part consisting of chassis
Is provided. Similarly, an exhaust port 14 for exhausting air is also provided above the cover 12. The air flow path from the air inlet 13 to the air outlet 14 produces an air chimney effect to further cool the air in the heat radiating portion, thereby improving the cooling efficiency.

Next, as another configuration example of the above-described first embodiment of the present invention, a fan for blowing air is provided in the lower portion of the cover, and air is forcibly taken in to dissipate the heat in the heat radiating portion. It is also possible to perform heat exchange and discharge air to further enhance cooling efficiency.

As described above, according to the first embodiment of the present invention, the housing (cover) of the currently used desktop computer can be used as it is without changing the size, and The large surface area of the main chassis can be used to dissipate heat, and heat can be dissipated from both the front and back sides, achieving a further heat dissipation effect. Further, it can be expected that the heat radiation efficiency is further enhanced by the chimney effect of air in the heat radiation portion of the tube.

Next, FIG. 4 shows an example of the configuration relating to liquid cooling of the desktop computer according to the embodiment of the present invention. According to FIG. 4, the present embodiment has a structure in which the tube that has passed through the pump, the heat receiving head, and the main chassis opening is fixedly arranged on the back surface of the liquid crystal panel to form the heat dissipation portion. Since the back surface of the liquid crystal panel is made of a metal material, heat from the refrigerant liquid in the spiral or zigzag structure or the meandering tube can be efficiently transmitted to the back surface of the liquid crystal panel to dissipate the heat.

The space between the liquid crystal panel and the main chassis is a space for arranging electric wirings connected to the connector of the liquid crystal panel, as in the case of the embodiment shown in FIG. No special space is required for arranging the tube on the back surface of the panel to form the heat dissipation portion. Therefore, also in the embodiment shown in FIG. 4, the heat dissipation portion can be installed without changing the external dimensions of the current housing of the desktop computer, which contributes to the thinning and miniaturization of the computer.

Further, since the rear surface of the liquid crystal panel has a large metal surface area, the large surface area can be utilized to efficiently dissipate heat. In addition, by opening an air intake port for air intake in the lower part of the cover that covers between the liquid crystal panel and the main chassis, and providing an air exhaust port in the upper part as well, the air intake port in the lower part is exhausted. An air flow path to the outlet is formed, and the so-called chimney effect can be expected to improve the heat dissipation effect.

Further, as a configuration example of air circulation to the heat radiating portion in the embodiment shown in FIG. 1, a fan for blowing air is provided below and / or above the cover which covers between the liquid crystal panel and the main chassis. The structure is shown in FIG. Figure 10
By adopting the fan shown in (1), it is possible to further promote the transfer of air. Furthermore, since a large amount of cooling air can be conveyed by installing a fan, the lower and upper openings for air intake and exhaust can be narrowed, so the device can be made thinner. In addition to that, there is an effect that the inflow of dust can be reduced.

Next, FIG. 5 shows a configuration relating to prevention of liquid leakage of liquid cooling of the desktop computer according to the embodiment of the present invention. The present embodiment is a countermeasure method in the case where the refrigerant liquid leaks in the heat radiating portion in the structure in which the heat from the heat receiving head is radiated on the front side of the main chassis as shown in the embodiment shown in FIG. . A desktop computer with a liquid crystal display consisting of a computer body and a stand has a computer body that is held upright or slightly tilted from the upright state on the stand both when in use and when not in use. The liquid leaked from the heat radiating portion, which is liable to leak in the cooling device, leaks to the bottom of the main chassis due to the tilted state of the computer body. Therefore, it is a feature of this embodiment that a liquid receiver is provided at the bottom of the main chassis.

As shown in FIG. 5, the liquid leaking in the heat radiating portion travels down the front surface of the main chassis and descends to be collected by the liquid receiver at the bottom of the main chassis. Although the liquid receiver is attached to the lowermost part of the main chassis in FIG. 5, it may be a structure integral with the main chassis. Further, as another configuration example, a liquid receiver integrated with the cover (configuration example shown in FIG. 5) may be used to collect the liquid that has dropped along the surface of the main chassis.

Further, since a connecting portion or a connecting portion of the refrigerant liquid tube can be considered as a place where liquid leakage easily occurs, a liquid receiver may be provided on the back side of the main chassis against liquid leakage from the heat receiving head and the pump. Good (because the liquid leaking from the tube connection portion travels along the outer surface of the tube and descends along the back surface of the main chassis). Further, in order to deal with the leakage liquid that drops from the bottom of the motherboard to which the pump or the heat receiving head is attached, a liquid receiver having an integral structure with the cover may be provided at a position corresponding to the bottom of the motherboard. Further, a liquid receiver may be provided on the stand near the computer main unit.

As described above, according to the embodiments shown in FIG. 1 and FIG. 5, the leaked refrigerant liquid can be collected and damage to the equipment in the stand due to the leakage of the refrigerant liquid can be prevented.

Next, FIG. 6 shows a configuration relating to liquid cooling and air cooling of the desktop computer according to the embodiment of the present invention. In the embodiment shown in FIG. 6, the heat receiving head is fixed on the CPU arranged on the mother board to control the CP.
The heat generated in U is transferred to the heat receiving head, and the heat receiving head transfers the generated heat to the heat radiating portion on the front side of the main chassis or the rear surface of the liquid crystal panel through the refrigerant liquid (water or ethylene glycol) in the tube (see FIGS. 1 and 4). (As in the embodiment shown in FIG. 3), the heat receiving head is provided with a radiation fin.

In other words, the embodiment shown in FIG. 6 is intended to radiate the heat that cannot be completely radiated from the radiating fins provided on the heat receiving head by liquid cooling. In a desktop computer, since there is a space between the rear surface of the motherboard and the back cover, installing the heat radiation fins as in the present embodiment does not change the external size. FIG. 6B shows a structure in which a fan is further provided on the heat radiation fins on the heat receiving head. By providing the blower fan, the heat radiation from the heat radiation fins can be performed efficiently and quickly.

As described above, the embodiment shown in FIG.
Since liquid cooling and air cooling are applied in combination to a heat source such as PU, the maximum heat radiation amount can be increased and the heat radiation efficiency can be improved. In addition, even when an abnormality occurs in the liquid cooling device such as freezing of the coolant liquid such as water, the operation of the computer can be continued by the air cooling effect of the heat radiation fins fixed to the heat receiving head. It is effective.

Next, FIG. 7, FIG. 8 and FIG. 9 are diagrams showing a configuration example regarding the shape and structure of the heat radiating portion in the tube. 7 (1) is a cross-sectional view showing that a spiral tube is arranged between the liquid crystal panel and the main chassis to dissipate heat, and FIG. 7 (2) is a top view of FIG. 7 (1). FIG. 7C is a cross-sectional view showing that a spiral tube is arranged between the liquid crystal panel and the main chassis, and a tube made of aluminum or the like is arranged in the center of the tube to radiate heat. Is. According to the configuration example shown in FIG. 7, the tube coming from the heat-receiving head through the main chassis opening is guided to the back surface of the liquid crystal panel, is arranged along the back surface, and then is guided to the main chassis side to reach the main chassis surface. A structure is adopted in which the heat dissipating portions are formed by arranging the heat dissipating parts (the order of disposing them may be reversed). With this structure, both the liquid crystal panel and the main chassis can be used as the heat dissipation surface, so that further heat dissipation effect can be expected. (3) of FIG.
In order to further improve the heat radiation efficiency, a heat radiation metal such as aluminum is placed (covered) in the central space of the spiral tube provided in the liquid crystal panel and the main chassis.

In FIG. 8, a spiral tube is arranged between a mother board provided with a heating element and a rear cover, and a cylindrical metal for heat dissipation such as aluminum is arranged in a central space surrounded by the spiral tube. It is an example of a structure showing that the heat is released. In FIG. 8, the covers corresponding to the upper part and the lower part of the tubular metal are
An opening for air circulation is provided and an inlet and an outlet are provided.

By forming the tubular metal into a hollow structure, an air path is formed from the inlet to the exhaust through the inside of the hollow, and the heat transferred from the tube to the tubular metal has a chimney effect. Cools efficiently.

FIG. 9 (1) is a diagram showing that a tube is arranged between the liquid crystal panel and the main chassis without contacting / fixing the tubes to radiate heat, and FIG. 9 (2) shows the liquid crystal panel. FIG. 6 is a diagram showing that the distance between the main chassis and the main chassis is approximately equal to the tube diameter, and the liquid crystal panel and the main chassis are in contact with each other in the entire tube to radiate heat.

Next, FIG. 11 shows a cooling system including a pump for sending a refrigerant liquid, a heat receiving head (water jacket W / J), a tube, a heat radiating system having a spiral or zigzag structure or a meandering tube heat radiating section. The relationship with the flow direction of the liquid is shown. Since (1) in FIG. 11 is the liquid flow direction as shown in the figure, the flow path from the pump to the top of the head through the heat radiating section is long, so the pump capacity is correspondingly large, but the heat radiating section is included. The bubbles generated in the refrigerant liquid inside the tube escape upward along the flow and have a great bubble-eliminating effect (the bubble-extracting port is provided at the top of the head). Since (2) of FIG. 11 shows the liquid flow direction as shown, the flow path from the pump to the crown is shorter than that of (1) of FIG. 11, so that the pump can be downsized. Further, in (3) of FIG. 11, since a plurality of heat generating elements are provided outside the CPU as a heat generating source in the desktop computer as described above, a plurality of heat receiving heads are provided corresponding to the plurality of heat generating elements. Shows that the heat receiving heads are connected in series and connected by a tube.

Next, FIG. 12 is a schematic diagram showing the function of the reserve tank for replenishing the refrigerant liquid and the function of removing bubbles in the tube heat radiating portion. According to FIG. 12, a reserve tank for the liquid reservoir is provided at the top of the circulation path of the refrigerant liquid, that is, at the upper part of the tube spiral structure (heat dissipation portion), and in the case of liquid leakage or liquid evaporation from the tube, the reserve tank The liquid acts as a replenisher. By installing the reserve tank at the uppermost part of the liquid circulation path, the bubbles generated in the circulation path will escape to the tank.

Further, regarding the shape of the tube heat radiating portion shown in FIG. 12, instead of horizontally reciprocating the tube, an inclined path of an angle α is formed from the turning point to proceed to the next turning point. Has become. In this way, by forming the liquid circulation path in the heat radiating section in an inclined shape, bubbles in the refrigerant liquid generated in the heat radiating section can easily escape to the reserve tank. That is, it is possible to quickly eliminate the bubbles generated in the refrigerant liquid due to some liquid leakage or the like through the reserve tank.

Next, FIG. 13 shows an example of the configuration relating to liquid cooling of the desktop computer according to the embodiment of the present invention. In this embodiment, the heat dissipation part of the refrigerant liquid tube is formed on the back cover (rear cover) provided on the back side of the main body part. Since the back cover is usually made of metal or plastic, the surface area from the heat dissipation part is large. The heat can be dissipated to the outside air through the back cover. The plastic of the back cover has a heat dissipation characteristic similar to that of metal. Further, FIG. 13 shows a structure in which a liquid receiver for collecting leakage liquid of the refrigerant liquid is provided below the tube heat radiating portion arranged on the back cover.

In the configuration shown in FIG. 13, the back cover is removed to inspect various devices inside the main body at the time of maintenance and inspection of the computer. In the present embodiment, the back cover is removed in consideration of the maintenance and inspection. Instead, it has a hinge structure that allows it to be opened and closed. Also, install the heat dissipation part on the back cover that is fixed to the main body, and for maintenance and inspection, tilt the liquid crystal panel to the front side with the bottom side as the rotation fulcrum and open the liquid crystal panel with the side side as the rotation fulcrum. The internal equipment may be inspected.

Next, FIG. 14 shows an example of the configuration related to liquid cooling of the desktop computer according to the embodiment of the present invention. In this embodiment, when viewed from the front of the computer, the liquid crystal panel, the mother board, the main chassis, the heat dissipation section, and the back cover are arranged in this order. The back cover is detachable from the main body, the main chassis is provided facing the back cover, and the heat dissipation part is attached to the main chassis, and the heat dissipation part has an elastic function. The heat is transferred to the back cover with the body interposed. That is, since the heat radiating portion is in contact with the back cover without a gap via the elastic heat transfer body, the heat radiating effect is good.

According to this embodiment, the heat can be dissipated through the back cover having a large heat dissipating area, and the back cover mounting error can be absorbed by the elastic heat transfer member.

[0046]

According to the present invention, heat generated from a high heat source such as a CPU of a desktop computer having a liquid crystal display device can be efficiently dissipated to the outside.

Further, by adopting the configuration of the present invention, the heat dissipation effect can be improved without changing the size of the outer shape of the computer main body.

Further, it is expected that the heat dissipation efficiency due to the chimney effect of air will be improved by drilling the existing body cover.

Further, it is possible to prevent damages such as liquid leakage and bubble generation which occur due to the present invention adopting heat radiation using a refrigerant liquid.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing an overall configuration related to liquid cooling of a desktop computer according to an embodiment of the present invention.

FIG. 2 is a front view in which a tube and a liquid receiver are fixed to a main chassis in the entire structure shown in FIG.

FIG. 3 shows a board (C
It is a rear view which arranged PU + heat receiving head) and a pump.

FIG. 4 is a cross-sectional view of a configuration example regarding liquid cooling of the desktop computer according to the embodiment of the present invention, in which a tube is fixed to a liquid crystal panel to radiate heat.

FIG. 5 is a cross-sectional view showing a configuration example regarding liquid leakage prevention of liquid cooling of the desktop computer according to the embodiment of the present invention.

FIG. 6 is a diagram showing a configuration example relating to liquid cooling and air cooling of the desktop computer according to the embodiment of the present invention.

FIG. 7 is a cross-sectional view showing a configuration example regarding the arrangement of tubes in liquid cooling of the desktop computer according to the present embodiment.

FIG. 8 is a cross-sectional view showing another configuration example regarding the arrangement of tubes in liquid cooling of the desktop computer according to the present embodiment.

FIG. 9 is a cross-sectional view showing a configuration example related to the arrangement of tubes, a main chassis, and a liquid crystal panel in liquid cooling of the desktop computer according to the present embodiment.

FIG. 10 is a cross-sectional view showing heat exhausted by a fan in the configuration related to liquid cooling of the desktop computer according to the present embodiment.

FIG. 11 is a schematic diagram showing an arrangement of a pump, a heat receiving head, a tube and a liquid flow direction in liquid cooling of the desktop computer according to the present embodiment.

FIG. 12 is a schematic diagram showing a function of a reserve tank for replenishing a refrigerant liquid in liquid cooling of a desktop computer according to the present embodiment and a function of removing bubbles in a tube heat radiating portion.

FIG. 13 is a cross-sectional view showing a configuration example relating to liquid cooling of the desktop computer according to the embodiment of the present invention, in which a tube and a liquid receiver are arranged on a back cover.

FIG. 14 is a cross-sectional view showing an example of the configuration related to liquid cooling of the desktop computer according to the embodiment of the present invention, in which tubes are arranged in the main chassis facing the back cover.

[Explanation of symbols]

1 computer body 2 stand 3 Main chassis 4 motherboard 5 LCD panel 6 tubes 7 pumps 8 Heat receiving head 9 CPU 10 HDD 11 Liquid receiver 12 covers 13 Air inlet 14 exhaust port

Continuation of front page (51) Int.Cl. ⁷ Identification code FI theme code (reference) H05K 7/20 G06F 1/00 360A H01L 23/46 Z (72) Inventor Masao Miyawaki 810 Shimoimaizumi, Ebina, Kanagawa Stock Incorporated Hitachi, Ltd. Internet Platform Division (72) Inventor Takeshi Nakagawa 810 Shimoimaizumi, Ebina City, Kanagawa Prefecture Incorporated Hitachi Internet Platform Division (72) Inventor Shigenori Yamagata, Ebina City, Kanagawa Prefecture 810 Imaizumi, Hitachi Ltd., Internet Platform Division (72) Inventor, Chiho Ito, 810 Shimomaizumi, Ebina City, Kanagawa Prefecture Hitachi Ltd., Internet Platform Division (72) Inventor, Shin Saito Kanagawa 810 Shimo-Imaizumi, Ebina, Ehime Prefecture, Ltd., Internet Platform Division, Hitachi, Ltd. (72) Inventor Akihiko Seki, Ebina, Kanagawa Prefecture Izumi 810, Hitachi Ltd., Internet Platform Division (72) Inventor Kenichi Saito, Ebina City, Kanagawa Prefecture, Ima Izumi 810, Hitachi Ltd., Internet Platform Division, F Term (reference) 5E322 AA01 AA05 BB03 DA01 5F036 AA01 BA05 BB01 BB05 BB35 BC31

Claims (3)

[Claims] 1. In an information processing device including a display, at least one heat-generating part including a CPU, a cooling liquid circulating means including a tubular flow path filled with the cooling liquid, and the cooling liquid circulating in one direction. A cooling liquid pump to which the cooling liquid circulation means is connected; and a heat absorption means that is connected in the middle of the cooling liquid circulation means and cools the heat generating portion with the cooling liquid. Is arranged in the vertical direction of the information processing device, and the heat generated in the heat generating portion is absorbed by the heat absorbing means and is radiated by the other portion using the cooling liquid circulating in the cooling liquid circulating means as a heat transfer medium. Information processing device. 2. A CPU, a display, and a cooling liquid circulating means, which is arranged in the vertical direction of the apparatus and has a part thereof arranged in a tubular flow path filled with the cooling liquid, and circulates the cooling liquid in one direction. A CPU cooling unit of an information processing device, comprising: a cooling liquid pump connected to the cooling liquid circulating means, wherein the CPU cooling unit is connected in the middle of the cooling liquid circulating means to generate heat of the CPU. A CPU cooling unit comprising: a heat receiving head that transfers heat to a cooling liquid; and a heat dissipation fin that dissipates heat accumulated in the heat receiving head into the air. 3. The CPU cooling unit according to claim 2, further comprising a cooling fan that cools the heat radiation fins.