JP2003313510A - Method for processing using adhesive for temporary fixing and method for peeling adhesive for temporary fixing - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for processing comprising temporarily fixing an object of processing to a supporting substrate with an adhesive, carrying out a mechanical processing, then dipping the resultant object in a peeling liquid and peeling the object of processing from the supporting substrate. <P>SOLUTION: The method for processing is carried out as follows. The object of processing is temporarily fixed to the supporting substrate with an adhesive for temporary fixing comprising at least one kind of compound (1) selected from N,N-dimethylacrylamide, N-vinylcaprolactam, acryloylmorpholine, 2- hydroxyethyl(meth)acrylate, 2-hydroxypropyl(meth)acrylate, glycerol(meth) acrylate and a polyalkylene oxide mono(meth)acrylate represented by structural formula (I) (wherein, R1, R2 and R3 are each an H or a CH<SB>3</SB>; and n is an integer of 4-20) and a radical polymerization initiator (2). The prescribed mechanical processing is carried out and the object of processing is then dipped in the aqueous peeling liquid and irradiated with ultraviolet rays at ≤280 nm wavelength. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention temporarily fixes an object to be processed on a supporting substrate with an adhesive for temporary fixing, and after subjecting it to predetermined machining such as cutting, polishing, grinding and drilling, water, The present invention relates to a processing method, which comprises immersing an object to be processed from a supporting substrate by immersing it in a peeling solution composed of a water-soluble organic solvent and an aqueous solution of the water-soluble organic solvent. More specifically, the present invention significantly reduces the adhesive force of the temporary fixing adhesive by irradiating a short wavelength ultraviolet ray having a wavelength of 280 nm or less after machining, and dipping it in a peeling solution to peel the object to be processed. A method for reducing the time required. The present invention also relates to a method for peeling two or more articles temporarily fixed by an adhesive for temporary fixing, which is characterized by irradiating ultraviolet rays having a short wavelength of 280 nm or less.

[0002]

2. Description of the Related Art A machining method using a temporary fixing step is widely used for a quartz oscillator, an optical prism, an electronic component, a precision mechanical component and the like. Conventionally, hot melt adhesives such as pine resin and wax are used to temporarily fix the processing object such as crystal, optical glass, ceramics, stainless steel, ferrite, aluminum, and silicon to the supporting substrate, and cutting, polishing, grinding and holes. After mechanical processing such as emptying, it was immersed in a halogen-based organic solvent such as methylene chloride or trichloroethylene at room temperature or heated to melt and remove the adhesive, and the processed component was peeled from the supporting substrate.
However, hot-melt adhesives require 100 to 1
It is necessary to perform fixing work at a high temperature of about 50 ° C for a short time, and the melt viscosity easily changes, so skill is required for the work, and the harmfulness of the halogen-based organic solvent used as a stripper and environmental pollution, etc. Is a problem, and there is a strong demand for improvement in terms of operability, safety and environmental protection.

As a method of solving the above-mentioned drawbacks, a method of temporarily fixing with an acrylic adhesive and immersing it in water, alcohol, etc. to peel it off has been devised, and many prior arts are disclosed as exemplified below. ing.

That is, JP-A-61-287976 and JP-A-2-12-1
42874, JP 2-147678, JP 6-116534
In JP-A-6-116535 and JP-A-10-245526, temporary fixing using an adhesive for temporary fixing containing a hydrophilic monomer or prepolymer as a component, water heated after machining is used. There is disclosed a method of immersing the object to be processed in a few hours by immersing it in boiling water, and in particular, the use of water in the separating step is excellent in the effect of improving safety and environmental protection.

[0005]

However, these methods need to be immersed in a stripping solution heated to a high temperature during stripping, and for example, boiling water must be used. There was a defect that it did not exist or required a lot of energy for heating. In addition, in the conventional method, when peeling the object to be processed, the principle is that the peeling liquid penetrates from the outer peripheral portion of the temporarily fixed adhesive in the temporarily fixed state into the temporary fixing adhesive to reduce the adhesive force. Therefore, if the size of the object to be processed becomes large, it takes a long time for the peeling liquid to penetrate the entire temporarily fixed area, and the peeling time becomes very long, or peeling occurs within a practical production time. This is difficult and practically applicable only to the work piece of a small part with a size of several mm. For example, Japanese Patent Laid-Open No. 6-11
No. 6534 discloses an adhesive for temporary fixing using acryloylmorpholine or N, N-dimethylacrylamide, and when peeling a quartz plate having a diameter of 8 mm at most, 240 minutes in water at 20 ° C. is also required. To do. Further, Japanese Patent Laid-Open No. 2001-226641 describes a temporary fixing adhesive composed of a hydrophilic vinyl monomer, a polyalkylene oxide mono (meth) acrylate and a radical polymerization agent, and this temporary fixing adhesive is used. By doing so, the film can be easily peeled by immersing it in a peeling solution at a relatively low temperature of room temperature to 80 ° C, but even in that case, peeling requires at least several hours.

[0006]

Means for Solving the Problems As a result of research aimed at solving the above problems, the present inventors have found that when a specific compound is used as a component of a temporary fixing adhesive, it supports a work piece. Completed the present invention by discovering that the adhesive state is significantly changed by irradiating ultraviolet rays having a wavelength of 280 nm or less while it is temporarily fixed on the substrate, and the peeling time when immersed in a peeling solution is significantly shortened. did. That is, the present invention is
N, N-dimethylacrylamide, N-vinylcaprolactam, acryloylmorpholine, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, glycerol (meth) acrylate, and the following structural formula (I) At least one compound (1) selected from polyalkylene oxide mono (meth) acrylates:

[0007]

[Chemical 1]

(Wherein R ₁ , R ₂ , and R ₃ are H or CH
₃ , n is an integer of 4 to 20); and a temporary fixing adhesive containing the radical polymerization initiator (2) is used to temporarily fix the object to be processed on the supporting substrate, and after performing predetermined machining. ,
In a processing method, which comprises immersing a temporarily fixed object to be processed and a supporting substrate in a stripping solution composed of water, a water-soluble organic solvent, or an aqueous solution of the water-soluble organic solvent to separate them from each other. At least one of the substrates is made of a material that transmits ultraviolet rays having a wavelength of 280 nm or less, and at the time of peeling, an ultraviolet ray having a wavelength of 280 nm or less is formed on the processing target and / or the supporting substrate. Illuminating,
According to the processing method. There is no particular limitation on the object to be processed in the processing method of the present invention, but examples thereof include a crystal oscillator, an optical prism, an electronic component, and a precision machine component as described in JP 2001-226641 A. Can be done. Therefore, the invention also relates to these products produced by this processing method. Further, the working steps of temporary fixing and machining in the method of the present invention are known to those skilled in the art, and some examples thereof are specifically described in, for example, Japanese Patent Laid-Open No. 2001-226641.

Further, the present invention provides two or more articles (for example, an object to be processed and a supporting substrate) temporarily fixed by an adhesive for temporary fixing with water, a water-soluble organic solvent, or an aqueous solution of the water-soluble organic solvent. The method of immersing in a stripping solution consisting of
According to the above-mentioned peeling method, an article made of a material that transmits ultraviolet rays having a wavelength of 280 nm or less and irradiating an article made of a material that transmits ultraviolet rays having a wavelength of 280 nm or less with ultraviolet rays having a wavelength of 280 nm or less . As an example of the temporary fixing adhesive in the peeling method, the temporary fixing adhesive used in the processing method of the present invention can be mentioned.

Since the change in the adhesion state by the peeling method of the present invention is due to the photochemical alteration of the temporary fixing adhesive due to the irradiation of ultraviolet rays having a wavelength of 280 nm or less, it is evenly distributed over the entire temporarily fixed area. In principle, it does not depend on the size of the object to be processed or the article. Therefore, when the present invention is applied, practically sufficient working durability is exhibited in the machining process, and at the same time, even a large-sized work object or article can be peeled off in a short time. For example, according to the present invention, even a large object having a diameter of 100 mm or more can be immersed in water at room temperature and peeled off in a few minutes.

[0011]

BEST MODE FOR CARRYING OUT THE INVENTION Next, the structure of the present invention will be described in more detail. Examples of the material used in the present invention that transmits ultraviolet rays having a short wavelength of 280 nm or less include any material known to those skilled in the art, for example, quartz, quartz, ultraviolet transmitting glass and the like. Therefore, it can be easily achieved by using a quartz plate or ultraviolet transmitting glass for the supporting substrate. Further, for example, when the object to be processed is a quartz product such as a crystal unit, a quartz cell, or a quartz optical filter, this requirement is immediately achieved. Any material such as plate glass, metal, and ceramics can be applied. Of course, both the object to be processed and the supporting substrate may be made of a material such as quartz which transmits ultraviolet rays having a short wavelength of 280 nm or less. Alternatively, at least one of the articles may be made of a material that transmits ultraviolet rays having a short wavelength of 280 nm or less. In the method of the present invention, the object to be processed and / or the support substrate (hereinafter, also referred to as “article”) made of a material that transmits ultraviolet rays having a wavelength of 280 nm or less when peeled off.
In the present invention, which is characterized by irradiating ultraviolet rays having a wavelength of 280 nm or less to a light source for irradiating ultraviolet rays having a short wavelength of 280 nm or less, a high pressure mercury lamp, a metal halide lamp, a low pressure mercury lamp, a mercury-xenon lamp, and a wavelength of 250 n.
An ultraviolet fluorescent lamp (such as a germicidal lamp) having an output near m can be used. Irradiation of short-wavelength ultraviolet rays having a wavelength of 280 nm or less is performed in a state where it is still temporarily fixed after being subjected to predetermined machining. At this time, it is necessary to irradiate from the side of a material that can transmit ultraviolet rays having a short wavelength of 280 nm or less. In addition, both the workpiece and the supporting substrate have a wavelength of 28
When ultraviolet rays having a short wavelength of 0 nm or less can be transmitted, irradiation may be performed from both sides of the object to be processed and the supporting substrate. Wavelength 280nm
The irradiance of the following short wavelength ultraviolet rays is preferably 0.1 mW / cm ² or more, more preferably 1 mW / cm ² or more. The irradiation time should be several seconds or longer, but usually 1 minute to 1 minute.
Conduct within a time range. However, irradiation may be performed for several hours or more as needed.

As the stripping solution used in the method of the present invention, water, a water-soluble organic solvent or an aqueous solution of the water-soluble organic solvent is used. As the water-soluble organic solvent, alcohols such as methanol, ethanol and propanol, methyl 2-hydroxyisobutyrate, N-methylpyrrolidone and dimethyl sulfoxide can be applied. These organic solvents are excellent in safety and environmental protection as compared with halogen-based organic solvents such as methylene chloride and hydrocarbon solvents which have been widely used conventionally.
If desired, a cleaning agent or a rust preventive agent may be added to these stripping solutions. Particularly, when water is used as the stripping solution, the highest degree of safety and environmental protection effect can be obtained. The temperature of the stripper is in the range of room temperature to 60 ° C. However, if there is no particular problem, hot water or boiling water at 80 ° C may be used.
Usually, it is possible to peel in a shorter time by increasing the temperature of the stripping solution, but by optimizing the conditions of short wavelength UV irradiation, even a large workpiece with a diameter of 10 cm can be removed in a few seconds in a stripping solution at room temperature. It can be peeled off. In particular, if peeling is performed at room temperature, a heating device is not required and the highest energy saving effect can be obtained.

Further, the peeling time can be further shortened by heating at least one of the object to be processed and the supporting substrate when irradiating the ultraviolet ray having a wavelength of 280 nm or less. The heating means is not particularly limited and can be performed by any method known to those skilled in the art, for example,
There is a method in which the entire object to be processed and the supporting substrate are put in a constant temperature bath, and ultraviolet rays are radiated by a light source which radiates short wavelength ultraviolet rays having a wavelength of 280 nm or less introduced into the constant temperature bath. Further, the workpiece and the support substrate that are temporarily fixed may be placed on the heated hot plate. Further, the workpiece and / or the temporarily fixed portion of the support substrate may be locally heated by a heat ray such as an infrared heater or a halogen heater. In the method using an infrared heater or a halogen heater, the heating time and temperature conditions can be easily controlled, and the heat energy utilization efficiency is high in that the temporary fixing portion required for promoting peeling can be locally heated. The heating temperature is preferably 50 ° C. or higher, and a significant shortening effect on the peeling time can be obtained. More preferably, by heating to 60 ° C. or higher, a remarkable effect of shortening the peeling time can be obtained. The heating time is not particularly limited, but may be about the same as or shorter than the irradiation time of ultraviolet rays having a short wavelength of 280 nm or less. For example, when using an infrared heater, the heating is performed for several minutes to 30 minutes. The effect of shortening the peeling time by heating is achieved by irradiating ultraviolet rays having a short wavelength of 280 nm or less. Heating without irradiation of ultraviolet rays may have a completely opposite effect such as a longer peeling time than that without heating.

As the component of the temporary fixing adhesive used in the present invention, the compound (1) specified in the present invention may be used alone, or two or more kinds of the compound (1) may be blended and used. . The composition of the temporary fixing adhesive is appropriately adjusted in consideration of the size of the object to be processed, the required processing durability, the viscosity suitable for the temporary fixing operation, and the like. The compound (1) is preferably used in an amount of 20% by weight or more in order to sufficiently exert the effects of the present invention. Further, the temporary fixing adhesive composition of the present invention does not impair the effects of the present invention. As far as it is possible, it is possible to add a hydrophobic monomer, a polymer, an inorganic filler or the like as an optional component to adjust the viscosity or the mechanical characteristics, or to add a pigment or the like for coloring. The hydrophobic monomer can be adjusted so as to impart appropriate hydrophobicity to the adhesive composition, improve water resistance during machining, and endure long-term processing. Specific examples of the hydrophobic monomer include isobornyl (meth) acrylate, dicyclopentanyl (meth) acrylate, dicyclopentenyl (meth) acrylate, dicyclopentanyloxyethyl (meth) acrylate, benzyl (meth) acrylate, cyclohexyl. Monofunctional (meth) acrylates such as (meth) acrylate and 1,6-hexanediol di (meth) acrylate, triethylene glycol dimethacrylate, polyethylene glycol # 400
Examples thereof include polyfunctional (meth) acrylates such as dimethacrylate and polyethylene glycol # 600 dimethacrylate. The polymer can increase the viscosity of the adhesive composition, and can easily fill the gap generated when the work having poor flatness is fixed to the substrate. However, since the temporary fixing adhesive composition of the present invention can be increased in viscosity by the addition of a small amount of polymer, it does not become an adhesive substance when it is immersed in water or the like for peeling, and productivity such as delay of peeling time is increased. Does not occur. Specific examples of the polymer preferably used in the present invention include polyvinylpyrrolidone and polymethylmethacrylate. Such optional components other than the compound (1) may be contained in an amount of 80% by weight in order to sufficiently exert the effects of the present invention.
It is preferably used in the range of less than%.

Examples of the radical polymerization initiator used in the temporary fixing composition for temporary fixing of the present invention include photopolymerization initiators such as ultraviolet polymerization initiators and visible light polymerization initiators, as well as organic peracids and azobis. A known thermal polymerization initiator such as isobutyronitrile or the like can be used. Examples of the visible light polymerization initiator include benzyl, quinones, acylphosphine oxide, α-aminoketone, bisacylphosphine oxide, metallocene and thioxanthone, but camphorquinone, acylphosphine oxide, α-aminoketone, bisacylphosphine oxide, And preferably selected from the group consisting of metallocenes. Specific examples of compounds belonging to this group include camphorquinone, 2,4,6-trimethylbenzoyldiphenylphosphine oxide, 2-methyl-1 [4- (methylthio) phenyl] -2-morpholinopropan-1-one, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butanone-1, bis (2,6-dimethoxybenzoyl) -2,4,4-trimethyl-pentylphosphine oxide, bis (2,4 , 6-Trimethylbenzoyl) -phenylphosphine oxide, bis (η ⁵ -2,4-cyclopentadien-1-yl) -bis (2,6-difluoro-3- (1H-pyrrol-1-yl) -phenyl) Examples include titanium.

Examples of the UV polymerization initiator include benzoin, benzoin such as benzoin methyl ether, benzoylbenzoic acid, benzophenone such as 4-phenylbenzophenone, 1-hydroxycyclohexyl phenyl ketone, 1-
[4- (2-hydroxyethoxy) -phenyl] -2-hydroxy-2
Examples include acetophenone-based compounds such as -methyl-1-propan-1-one. At that time, usually, in the temperature range of 40 ° C to 150 ° C for 5 minutes to 5 hours, preferably in the temperature range of 50 ° C to 120 ° C.
Thermal polymerization can be carried out by heating for from 120 minutes to 120 minutes.
A person skilled in the art can adjust the polymerization temperature and the polymerization time as appropriate for the production process by adjusting the addition amount and type of the thermal polymerization initiator.

The thermal polymerization initiator is benzoyl peroxide,
1,1-bis (t-butylperoxy) cyclohexane, 1,1-bis (t-butylperoxy) cyclododecane, t-butylperloylbenzoate, n-butyl-4,4-bis (t-butyl) Perloyl) balalate, organic peroxide such as 2,5-dimethyl-2,5-di (t-butylperloyl) hexane, and 2,2'-azobisisobutyronitrile, 2- (carbamoylazo) Examples include azo compounds such as -isobutyronitrile and 2,2'-azobis (2,4,4-trimethylpentane).

In the present invention, two or more kinds of the above radical polymerization initiators may be mixed and used, and the total amount thereof is usually adjusted appropriately in the range of 0.05 to 10% by weight.

When a photopolymerization initiator is used as a radical polymerization initiator and a temporary fixing adhesive is irradiated with light having a wavelength of 300 nm or more for temporary fixing, a high pressure mercury lamp, an ultrahigh pressure mercury lamp or a metal halide is used as a light source. Besides a lamp and a mercury-xenon lamp, an ultraviolet fluorescent lamp that outputs long-wavelength ultraviolet light in the range of 300 nm to 400 nm can be used. Again 40
When irradiating short-wavelength visible light of 0 nm to 500 nm, a halogen lamp, a xenon lamp, etc. can be applied in addition to a visible light fluorescent lamp having an output in the same wavelength range. However, since high-pressure mercury lamps, ultra-high-pressure mercury lamps, metal halide lamps, mercury-xenon lamps, etc. also output short-wavelength ultraviolet light with a wavelength of 280 nm or less, when temporarily fixing an object to be processed, a temporary fixing adhesive is practically used. It is necessary to prevent irradiation with ultraviolet rays having a short wavelength of 280 nm or less. For example, when the object to be processed is quartz and the supporting substrate is plate glass, light irradiation may be performed from the plate glass side that does not transmit ultraviolet rays having a short wavelength of 300 nm or less. If the workpiece is made of quartz and the support substrate is an opaque metal plate or ceramics, cut short wavelengths of 280 nm or less between the ultraviolet light source and the workpiece made of quartz, such as plate glass. It is sufficient to interpose the filter of. Irradiation conditions when curing the temporary fixing adhesive can be appropriately determined by those skilled in the art according to the type of temporary fixing adhesive to be used and the type of the processing object, but 0.1 mW / cm at an irradiance of ultraviolet rays having a wavelength of 365 nm. It is preferably ² or more, and more preferably 1 mW / cm ² or more. The irradiation time is usually in the range of several seconds to 1 hour, but irradiation may be carried out for a longer time if necessary.

[0020]

EXAMPLES The present invention will be described in more detail with reference to Examples and Comparative Examples. However, the technical scope of the present invention is not limited to these examples.

Example 1 The processing object is a quartz disk with a diameter of 30 mm, and it is used as a support substrate.
Then, it was made into a normal plate glass. For temporary fixing adhesive,
55 parts by weight of royl morpholine, R₁, R_Two, R _ThreeBut water
Of the structural formula (I) in which n is in the range of 4 to 8 and has an average of 6
45 weight of compound polyethylene oxide monoacrylate
Part and 2,4,6-trimethylbenzo as a photopolymerization initiator
0.5 parts by weight of ildiphenylphosphine oxide was added.
I used the one. Apply a small amount of temporary fixing adhesive to the plate glass
The quartz disks are stacked and the maximum wavelength is 352 nm.
Powerful long-wavelength UV fluorescent lamp from the quartz disc side
It was temporarily fixed by irradiating it with ultraviolet rays for 10 minutes. Polish this
After working, if it is temporarily fixed,
Irradiance at a wavelength of 254 nm is 6 mW using a high-pressure mercury lamp.
/cm²Was irradiated with short wavelength ultraviolet light of 20 minutes. At room temperature
When it was immersed in water, the quartz disk became support substrate in 15 minutes.
It spontaneously peeled off the plate.

Comparative Example 1 Under the same conditions as in Example 1 except that the quartz disk was not irradiated with a high pressure mercury lamp after polishing, the workpiece and the supporting substrate temporarily fixed in water at 60 ° C. were immersed. However, it took 20 hours to peel off naturally.

Comparative Example 2 Under the same conditions as in Example 1, except that the plate glass was irradiated with a high-pressure mercury lamp after polishing, the object to be temporarily fixed and the supporting substrate were immersed in water at 60 ° C. It took 21 hours to peel naturally.

Example 2 A silicon wafer having a diameter of 10 cm was used as an object to be processed, and a quartz plate was used as a supporting substrate. As an adhesive for temporary fixing, N,
60 parts by weight of N-dimethylacrylamide, 40 parts by weight of the same polyethylene oxide monoacrylate as in Example 1, 0.1 part by weight of camphorquinone as a photopolymerization initiator, and 2,4,6-trimethylbenzoyldiphenylphosphine oxide 0.7.
A mixture of parts by weight was used. A small amount of temporary fixing adhesive is applied to the quartz plate, the silicon wafers are overlaid, and the quartz plate side is irradiated with ultraviolet rays for 10 minutes using a long-wavelength ultraviolet fluorescent lamp with a maximum output of 352 nm wavelength. The thing was temporarily fixed to the supporting substrate. After polishing the silicon wafer, ultraviolet irradiation was performed from the quartz plate side at an irradiance of ² mW / cm ² for 5 hours using a short wavelength ultraviolet fluorescent lamp having a maximum output at a wavelength of 254 nm. When the object to be processed and the supporting substrate were immersed in water at room temperature, the silicon wafer spontaneously peeled from the quartz plate in 2 minutes and 30 seconds.

Comparative Example 3 Example except that irradiation with a short wavelength ultraviolet fluorescent lamp was not performed
Under the same conditions as in 2, when the temporarily fixed workpiece and the supporting substrate were immersed in water at room temperature, the silicon wafer did not spontaneously peel from the quartz plate even after being immersed for 24 hours.

Example 3 A quartz piece having a width of 15 mm and a length of 45 mm was used as an object to be processed, and an iron disk was used as a supporting substrate. A small amount of the same temporary fixing adhesive as in the example was applied to the center of the iron disk, the quartz pieces were overlapped, and the visible light for 20 minutes was used from the quartz piece side using a visible light fluorescent lamp having a maximum output at a wavelength of 420 nm. It was irradiated and temporarily fixed. After polishing the quartz pieces, the same high-pressure mercury lamp used in Example 1 was used to irradiate the quartz side with short-wavelength ultraviolet rays having a wavelength of 280 nm or less for 5 minutes. Next, when this was immersed in water at 50 ° C., it spontaneously peeled off in 35 minutes.

Example 4 In Example 3, when a short-wave ultraviolet ray having a wavelength of 280 nm or less was irradiated by a high-pressure mercury lamp for 5 minutes, an infrared heater of 500 W was set on the supporting substrate side and simultaneously turned on for 5 minutes. When the object to be processed and the supporting substrate were immersed in water at 50 ° C., they spontaneously peeled off in only 5 seconds.

Comparative Example 4 In Example 3, immersion in water at 50 ° C. without irradiation with short-wavelength ultraviolet rays having a wavelength of 280 nm or less by a high-pressure mercury lamp required 15 hours for spontaneous peeling.

Comparative Example 5 Instead of using the visible light fluorescent lamp having the maximum output at a wavelength of 420 nm in Example 3, the high pressure mercury lamp used in Example 1 was used to irradiate with ultraviolet rays for 20 minutes. Although the quartz pieces were temporarily fixed, many adhesion defects occurred on the temporarily fixed surfaces of the quartz pieces and the iron disk. When trying to polish this, the quartz pieces fell off from the iron disk within a few tens of seconds, and the polishing process could not be performed.

Example 5 An object to be processed was an unpolished quartz disk having a diameter of 30 mm, and a plate glass was used as a supporting substrate. 28 parts by weight of acryloylmorpholine as an adhesive for temporary fixing, a compound represented by the structural formula (I) in which R ₁ and R ₂ are methyl groups, R ₃ is hydrogen, and n is 4 to 8 on average. 13 parts by weight of polypropylene oxide monomethacrylate, 35 parts by weight of 2-hydroxyethyl methacrylate, 25 parts by weight of isobornyl methacrylate as an optional component, as a photopolymerization initiator
A mixture of 1 part by weight of 2,4,6-trimethylbenzoyldiphenylphosphine oxide and 0.1 part by weight of benzyl was used. A small amount of adhesive for temporary fixing is applied to the plate glass, a quartz disk with a diameter of 30 mm is overlaid, and the quartz disk side is temporarily fixed by irradiating ultraviolet rays for 10 minutes with a long-wavelength ultraviolet fluorescent lamp having a maximum output at a wavelength of 352 nm. did. After polishing the quartz disc, 4 from the quartz disc side as in Example 1.
00W high-pressure mercury vapor lamp emits short wavelength ultraviolet rays with wavelength of 280nm or less.
After irradiating for a period of time, it was immersed in a 50% ethanol aqueous solution at 60 ° C., and spontaneously peeled off in 90 minutes.

Comparative Example 6 The same as Example 5 except that the high pressure mercury lamp was not used to irradiate short wavelength ultraviolet rays having a wavelength of 280 nm or less in Comparative Example 6
When immersed in water at 0 ° C, the quartz disc did not peel off even after 24 hours.

Example 6 An object to be processed was a quartz piece having a width of 15 mm and a length of 90 mm, and a supporting substrate was a plate glass. 100 parts by weight of N, N-dimethylacrylamide as an adhesive for temporary fixing, 2,4,6 as a photopolymerization initiator
A mixture of 1 part by weight of trimethylbenzoyldiphenylphosphine oxide and 0.1 part by weight of camphorquinone was used. Adhesive for temporary fixing was applied to the plate glass and the quartz pieces were overlapped, and when the plate glass side was irradiated with long-wavelength ultraviolet light for 10 minutes using the high-pressure mercury lamp used in Example 1, no adhesion defect was found on the adhesive surface. None, a good temporary fixing state was obtained. After cutting the quartz piece together with the plate glass into a width of 15 mm, this time, the quartz piece was irradiated with short-wavelength ultraviolet light for 45 minutes from the quartz piece side with the high-pressure mercury lamp. When this was immersed in water at 90 ° C, it spontaneously peeled off in 90 minutes.

Comparative Example 7 In Example 6, when the sample was immersed in water at 90 ° C. without irradiating it with short-wavelength ultraviolet light from the quartz side after cutting, it took 12 hours for spontaneous peeling. .

Example 7 70 parts by weight of 2-hydroxyethyl methacrylate and 30 parts by weight of isobornyl acrylate were used as a temporary fixing adhesive and 0.5 parts by weight of 1-hydroxycyclohexyl phenyl ketone was used as a photopolymerization initiator. Example 6 except that
Under the same conditions as above, when the cut test piece was immersed in water at 90 ° C, it spontaneously peeled off in 4 hours and 30 minutes.

Comparative Example 8 In Example 7, after slicing, the quartz side was immersed in 90 ° C. water without irradiating it with 45-minute short-wavelength ultraviolet light from a high-pressure mercury lamp. Could not be peeled off.

Comparative Example 9 As a temporary fixing adhesive, 13 parts by weight of 2-hydroxyethyl methacrylate, 67 parts by weight of isobornyl acrylate,
20 parts by weight of triethylene glycol dimethacrylate,
The same conditions as in Example 6 were used except that 1-bidroxycyclohexyl phenyl ketone was used as a photopolymerization initiator in an amount of 0.5 part by weight. After cutting, the quartz side was irradiated with short-wavelength ultraviolet rays with a wavelength of 280 nm or less for 45 minutes from the quartz side and immersed in water at 90 ° C, but it could not be peeled off spontaneously even after immersion for 24 hours. .

Example 8 20 parts by weight of N-vinylcaprolactam, 30 parts by weight of N, N-dimethylacrylamide, R ₁ and R ₂ are hydrogen, R ₃ is a methyl group, n
25 parts by weight of a compound of structural formula (I) polyethylene oxide monoacrylate having an average of 6 including 4 to 8,
25 parts by weight of a compound of the structural formula (I) wherein R ₁ , R ₂ and R ₃ are hydrogen and n is 12 to 20 and has an average of 16; 1-hydroxycyclohexyl phenyl ketone as a photopolymerization initiator An adhesive composition for temporary fixing containing 0.5 part by weight and 0.1 part by weight of camphorquinone was used. The processing target is a quartz disk with a diameter of 7.5 cm,
A quartz plate was used as the supporting substrate. A small amount of temporary fixing adhesive was applied to the quartz plate, the quartz disks were overlapped, and irradiated with a long-wavelength ultraviolet fluorescent lamp having a maximum output at a wavelength of 352 nm for 10 minutes for temporary fixing. After polishing the quartz disk, the irradiance at a wavelength of 254 nm was 6 mW / c using a high pressure mercury lamp from the quartz plate side.
After irradiating with ultraviolet rays of short wavelength of m ² for 10 minutes, when it was immersed in a 20% aqueous solution of isopropanol at room temperature, it could be peeled off naturally in 3 minutes.

[0038]

As described above, according to the present invention, in the machining method using the temporary fixing step, the time required for peeling an object to be machined after machining is remarkably shortened, and the machining step using the temporary fixing is performed. Greatly increase the productivity of. Further, the present invention solves the drawback that the peeling time is delayed and the peeling becomes difficult due to the increase in the size of the object to be processed in the prior art, and the size limitation of the object to be processed is greatly relaxed. Furthermore, the present invention, which conventionally required a high-temperature stripping solution such as boiling water for stripping in a short time, can be realized at room temperature or at a low temperature of 60 ° C. or lower to save thermal energy required for stripping. At the same time, it should be possible to apply it to heat-sensitive workpieces. These effects are first achieved by the present invention. Furthermore, the present invention has an effect that the peeling time can be further shortened by heating the object to be processed and the supporting substrate when irradiating the ultraviolet ray having a short wavelength of 280 nm or less.

Claims (6)

[Claims] 1. N, N-dimethylacrylamide, N-vinylcaprolactam, acryloylmorpholine, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, glycerol (meth).
At least one compound (1) selected from an acrylate and a polyalkylene oxide mono (meth) acrylate represented by the following structural formula (I): (In the formula, R ₁ , R ₂ , and R ₃ are H or CH ₃ , and n is 4 to
An integer of 20); and a temporary fixing adhesive containing a radical polymerization initiator (2) to temporarily fix an object to be processed on a supporting substrate, perform predetermined machining, and then temporarily fix the processed object. In a processing method comprising immersing an object and a supporting substrate in water, a water-soluble organic solvent, or a stripping solution composed of an aqueous solution of the water-soluble organic solvent to separate them from each other, Irradiating the object to be processed and / or the supporting substrate, which is made of a material which transmits ultraviolet rays having a wavelength of 280 nm or less and which transmits ultraviolet rays having a wavelength of 280 nm or less, at the time of peeling with ultraviolet rays having a wavelength of 280 nm or less. Characteristic,
The processing method. 2. Method according to claim 1, characterized in that the temporary fixing adhesive comprises at least 20% by weight of compound (1). 3. A photopolymerization initiator is used as a radical polymerization initiator, and a temporary fixing adhesive is irradiated with light having a wavelength of 300 nm or more to perform temporary fixing.
The described processing method. 4. The processing method according to claim 1, wherein at least one of the object to be processed and the supporting substrate is heated when the ultraviolet ray having a wavelength of 280 nm or less is irradiated. 5. A method in which two or more articles temporarily fixed by a temporary fixing adhesive are immersed in a peeling solution composed of water, a water-soluble organic solvent, or an aqueous solution of the water-soluble organic solvent to separate them from each other. And at least one of the temporarily fixed articles has a wavelength of 280
The peeling method, wherein an article made of a material that transmits ultraviolet rays having a wavelength of 280 nm or less and being peeled is irradiated with ultraviolet rays having a wavelength of 280 nm or less. 6. The processing method according to claim 5, wherein at least one of the articles is heated when the ultraviolet ray having a wavelength of 280 nm or less is irradiated.