JPH10245526A - Method for working small article - Google Patents

Abstract

PROBLEM TO BE SOLVED: To easily detach a small article, by a method wherein a composition containing a specified compound, a water-soluble or water-swelling polymer material and a polymerization initiator is used to temporarily fix by bonding a small article in a rough shape, and the article is machined and then immersed in water to dissolve or swell the composition so that the temporarily fixed article can be detached. SOLUTION: An adhesive composition for temporary fixing is obtained by compounding one or more compounds selected from quaternary salts of, e.g. N-vinyl-2-pyrrolidone and N,N-dimethylaminoethyl (meth)acrylate and quaternary salts of (meth)acrylamides with a water-soluble or water-swelling polymer material which does not contain a polymerizable ethylenical double bond in the molecule and comprises, e.g. N-vinyl-2-methylpyrrolidone homopolymer, and a polymerization initiator. A small article in a rough shape is temporarily fixed by bonding with this composition, machined into a desired shape, and then immersed in water to dissolve or swell the hardened composition so that the temporarily fixed article is detached.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of temporarily fixing articles such as crystal, lens, metal, electric, electronic parts or accessories and machining them into a desired shape, and is particularly used for temporarily fixing. The swellability due to the water absorption of the cured product of the adhesive is large, and the solubility in water is large.
When removing the small article after the mechanical processing from the temporary fixing, it can be easily removed only by immersing it in water, and the viscosity of the adhesive before curing can be easily adjusted. The present invention relates to a method for processing small articles used.

[0002]

2. Description of the Related Art Various kinds of articles such as seed crystal in the previous stage of a crystal oscillator, a ferrite core used as an electric or electronic component or a core of a printer head, glass, jewelry or a shell used as accessories, a lens, a metal, etc. After temporarily fixing the material of the coarse shape by the desired means with an adhesive,
It is manufactured by performing machining such as cutting, cutting or polishing. For example, when manufacturing a crystal resonator, usually, first, a seed crystal is bonded and temporarily fixed to a glass plate or the like using a hot melt adhesive, but at this time, when cutting into a crystal piece after the temporary fixing, In order to prevent damage, it is manufactured by temporarily fixing the seed crystal in the form of molding the entire seed crystal, cutting the obtained temporary fixed object into the desired shape, heating it, and releasing each crystal piece from the temporary fixing. Is done. Also, when manufacturing the core of the printer head, a polishing step is entered, but in order to prevent burrs generated during polishing, the inside of the head is filled with hot melt adhesive, heated after polishing and hot melt bonded. It is manufactured by removing and washing the agent.

[0003]

However, in the case of this type of hot melt adhesive, the bonding operation must be performed at a heating temperature of about 150 ° C. at the time of bonding, and the small pieces after machining are temporarily fixed. Heating is required to remove from the substrate, and then further cleaning with an alkali agent or an organic solvent is required. Therefore, not only is the operation of removing the temporary fixing troublesome, but also the working environment deteriorates, and small pieces are lost due to heating.

[0004] Further, when cutting quartz, polishing a lens, a decorative article, or the like, it may be temporarily fixed with a cyanoacrylate-based instant adhesive, but these temporarily fixed articles may be warped. Yes, when bonding to a temporarily fixed table,
If the gap between the article and the table is large, the cyanoacrylate-based adhesive flows out, and the gap cannot be filled. Similarly, in the case of a printer head, a cyanoacrylate-based instant adhesive is not suitable because the gap for filling the adhesive is large. Furthermore, when removing the article from the temporary fixing, the cyanoacrylate-based instant adhesive also needs to be subjected to a treatment such as applying heat to apply an impact, thereby causing damage to the processed product.

Accordingly, an object of the present invention is to provide a cured product having a large swelling property and a good peeling property from an adherend because the cured product has a large water absorption. Alternatively, the cured product itself has high solubility in water, and due to these factors, small articles after machining can be easily removed by simply immersing them in water when removing them from temporary fixing. The present invention provides a method for processing a small article in which the viscosity of the agent can be easily adjusted, the viscosity can be arbitrarily adjusted, and the gap can be filled in accordance with the shape of the small article. It is in.

[0006]

In order to achieve the above object, according to the first aspect of the present invention, there are provided (A) N-vinyl-2-pyrrolidone, N, N-dimethylaminoethyl (meth) acrylate, N, N-diethylaminoethyl (meth) acrylate, N-methylaminoethyl (meth) acrylate, N-ethylaminoethyl (meth) acrylate, 2-hydroxyethyl (meth)
Acrylate, 2-hydroxypropyl (meth) acrylate 2-hydroxy-3-phenoxypropyl (meth) acrylate, N, N-dimethyl (meth) acrylamide, N-methoxymethyl (meth) acrylamide,
N-ethoxymethyl (meth) acrylamide, N-methyl (meth) acrylamide, N-methylol (meth) acrylamide, N, N-dimethylaminopropyl (meth) acrylamide, N-vinyloxazolidone, N-
Vinyl succinimide, N-vinyl-N-methylformamide, N-vinyl-N-methylacetamide, ter
One or more selected from t-butyl (meth) acrylamidosulfonic acid, (meth) acryloylmorpholine, amino (meth) acrylate, quaternary salts of amino (meth) acrylates and quaternary salts of (meth) acrylamides (B) a homopolymer of N-vinyl-2-pyrrolidone having no polymerizable ethylenic double bond in the molecule,
A homopolymer of N, N-dimethyl (meth) acrylamide, a copolymer of N-vinyl-2-pyrrolidone and N, N-dimethyl (meth) acrylamide,
One or more kinds of high molecular substances having water solubility or swelling property due to water absorption (C) Polymerization initiator (A) Small articles of coarse shape using the temporary fixing adhesive composition comprising the above (A) to (C) (B) Then, the temporarily fixed small article is machined into a desired shape, and (c) thereafter, the machined small article is immersed in water to form the temporary fixing adhesive. The small-sized article is removed from the temporary fixing by swelling the cured product of the agent composition by dissolving or absorbing water, and according to claim 2, the adhesive composition for temporary fixing further comprises (D) silica-based inorganic filler. The above problem was solved by using an agent.

Next, the components (A) to (C) constituting the temporary fixing resin composition used in the present invention and other components will be described in detail.

The component (A) used in the present invention includes:
N-vinyl-2-pyrrolidone, N, N-dimethylaminoethyl (meth) acrylate, N, N-diethylaminoethyl (meth) acrylate, N-methylaminoethyl (meth) acrylate, N-ethylaminoethyl (meth) acrylate , 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 2-hydroxy-3-phenoxypropyl (meth)
Acrylate, N, N-dimethyl (meth) acrylamide, N-methoxymethyl (meth) acrylamide, N-
Ethoxymethyl (meth) acrylamide, N-methyl (meth) acrylamide, N-methylol (meth) acrylamide, N, N-dimethylaminopropyl (meth)
Acrylamide, N-vinyloxazolidone, N-vinylsuccinimide, N-vinyl-N-methylformamide, N-vinyl-N-methylacetamide, tert-
Butyl (meth) acrylamidosulfonic acid, (meth) acryloylmorpholine, amino (meth) acrylate,
One or more compounds selected from quaternary salts of amino (meth) acrylates and quaternary salts of (meth) acrylamides can be used.

Next, the component (B) used in the present invention has no ethylenic double bond in the molecule, and
Selected from a homopolymer of vinyl-2-pyrrolidone, a homopolymer of N, N-dimethyl (meth) acrylamide, and a copolymer of N-vinyl-2-pyrrolidone and N, N-dimethyl (meth) acrylamide. And one or more kinds of polymer substances having water solubility or swelling property due to water absorption. These components (B) are the same as the components (A)
It is preferable to dissolve in the component (A), but it may be completely or partially insoluble and dispersed in the component (A). The component (B) may be a substance having both properties of swelling due to water absorption and water-solubility, or may have any one property alone.

The component (C) is, for example, a light polymerization initiator or a redox polymerization initiator. Specific examples of the photopolymerization initiator include benzophenone, acetophenone, 2,2-diethoxy, and the like. Acetophenone, Michler's ketone, benzyl, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin propyl ether, benzoin butyl ether,
Tetramethylthiuram sulfide, thioxanthone, chlorothioxanthone, dimethylthioxanthone, diethylthioxanthone, benzyldimethylketal, methylbenzoylformate, hydroxycyclohexylphenylketone, etc. A sensitizer can also be used.

The redox polymerization initiator is a redox catalyst containing an organic peroxide and a reducing agent. Examples of the redox polymerization initiator include ketone peroxides such as methyl ethyl ketone peroxide and methyl cyclohexanone peroxide, and cobalt naphthenate and copper naphthenate. A combination with a metal soap or a diacyl peroxide such as octanoyl peroxide or benzoyl peroxide;
A combination with a tertiary amine such as -dimethylaniline or N, N-dimethyl-p-toluidine, or a hydroperoxide such as cumene hydroperoxide or diisopropylbenzene hydroperoxide and a thiourea, ethylenethiourea or acetylthiourea; Combinations with organic thioureas and the like can be mentioned. As the component (C), a photopolymerization initiator and a redox polymerization initiator can be used in combination.

The mixing ratio of the above-mentioned components (A) and (B) is arbitrary, but if the viscosity is to be increased, a large amount of the component (B) is to be mixed, and if the viscosity is to be lowered, the component (B) is to have a small amount. The desired viscosity is adjusted by changing the blending amount of (B). For example, for use in places with large gaps,
That is, the viscosity is adjusted to be high for application to a warped material as in Example 1 described later. The amount of component (C) is arbitrary, but A: C = 100: 1 with respect to component (A).
A mixing ratio of 10 to 10 (parts by weight) is appropriate.

In the present invention, it is essential that an inorganic filler (D) is further contained in addition to the components (A), (B) and (C). That is, in the present invention, by adding the component (D), the viscosity of the adhesive composition can be more easily adjusted, and the thixotropic property can be imparted to the adhesive composition. Workability can be improved. As such an inorganic filler, a filler dispersed in water such as a silica-based filler is preferable, and a filler in which a hydroxyl group on the surface of a filler particle remains is more preferable. Is not done. The amount of the filler (D) added is 0.1 to 20% by weight based on the total amount of the adhesive.

The present invention further comprises a foaming agent (E) which decomposes at about 50 ° C. to about 200 ° C. with respect to the components (A) to (C) or (A) to (D), so that Of the adherend in water, especially boiling water, is improved,
It can be removed in minutes. As such a foaming agent, for example, azobisisobutylnitrile (AIB)
N), p-toluenesulfonyl hydrazide (TSH),
Benzenesulfonyl hydrazide (BSH), 4,4'-
Oxypisbenzenesulfonyl hydrazide (OBS
H), azodicarbonamide (ADCA), dinitrosopentaethylenetetramine (DPT) and the like, and further, water and / or an organic solvent vaporized at about 50 to 200 ° C. The amount of the foaming agent (D) added is 0.001% to 10%, preferably 0.1% to 5% by weight based on the total amount of the adhesive.

Further, the present invention provides, if necessary, a polymerization inhibitor such as hydroquinone, hydroquinone monomethyl ether, catechol, benzoquinone, and 2,6-di-t.
tert-butyl-p-cresol or the like can be used in combination.

[0016]

The components (A) and (B) of the composition of the present invention described above,
In (C) and (D), the viscosity of the composition can be adjusted by blending the component (B), and when increasing the viscosity, a large amount of the component (B) is blended, whereby application to a material having a large gap becomes possible. In addition, when the viscosity is reduced, the component (B) is reduced, whereby it is possible to apply the composition to a material having a small gap, and the addition of the component (D) inorganic filler makes it easier to adjust the viscosity in the composition. In addition, thixotropic properties are imparted to the adhesive composition.

Further, by containing the foaming agent as the component (E), foaming occurs when immersed in water after adhesion and curing, especially boiling water,
The detachability of the adherend is improved, and the adherend can be removed in a few minutes.

[0018]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail with reference to embodiments. Example 1 50 parts of N-vinyl-2-pyrrolidone, polyvinylpyrrolidone having an average molecular weight of about 40,000 (PVP
50 parts of K-30 GAF) and 2 parts of benzoin ethyl ether were added and dissolved to obtain an adhesive composition of the present invention. The viscosity was about 40,000 cp at 25 ° C. The warped seed crystal and the glass plate were bonded and temporarily fixed using this adhesive, and molded so as to cover the seed crystal. In order to cure the adhesive, ultraviolet rays having a wavelength of 300 to 400 nm (irradiance of 180 mW / cm ² ) were irradiated for 2 minutes. After curing, the gap between the seed crystal and the glass plate was filled with an adhesive. This adhesive is machined to a thickness of 0,0.
The pieces were cut into 4 mm pieces. After processing, when immersed in boiling water, the cured adhesive was dissolved and removed in about 30 minutes, and a crystal flake could be obtained.

Example 2 N-vinyl-2-pyrrolidone 5
0 parts, 50 parts of polyvinyl pyrrolidone having an average molecular weight of about 40,000 (manufactured by PVP K-30 GAF), 2 parts of benzoin ethyl ether, and 2 parts of benzenesulfonyl hydrazide are added and dissolved, and the adhesive of the present invention is dissolved. Agent composition was obtained. Using this adhesive, the warped quartz and the glass plate were adhered, temporarily fixed, and molded so as to cover the seed quartz. In order to cure the adhesive, a wavelength of 300 to
400nm ultraviolet light (ultraviolet light intensity 180mW / c
m ² ) for 2 minutes. After curing, the gap between the seed crystal and the glass plate was filled with an adhesive. The adhesive was machined and cut into small pieces having a thickness of 0.4 mm. After processing, when immersed in boiling water, the cured adhesive was dissolved and removed in about 5 to 10 minutes, and a thin flake of quartz could be obtained.

Example 3 N-vinyl-2-pyrrolidone 5
To a mixed solution of 0 parts and 70 parts of N, N-dimethylacrylamide, 50 parts of polyvinylpyrrolidone having an average molecular weight of about 40,000 (manufactured by PVP K-30 GAF) and 4 parts of benzoin ethyl ether were added and completely dissolved. 12 parts of a silica-based filler (Aerosil 200 manufactured by Nippon Aerosil Co., Ltd.) was added and sufficiently dispersed to obtain an adhesive composition of the present invention having thixotropic properties. The viscosity is about 60,0 at 25 ° C.
00 cp. This adhesive is filled into a printer head core, and a wavelength of 30 is applied to cure the adhesive.
UV light of 0 to 400 nm (UV illuminance 180 mW / c
m ² ) for 2 minutes. Next, after the ultraviolet curable resin was cured, polishing was performed. After the processing, when immersed in boiling water, the cured adhesive was peeled off in about 10 minutes, the head was polished without burrs, and at the same time, washing was performed.

COMPARATIVE EXAMPLE A warped seed crystal and a glass plate were prepared using a rosin-based hot melt adhesive having a melting point of 80 ° C. for 15 minutes.
Bonding was performed in a heating state of 0 ° C., and a molten hot melt adhesive was flowed from above to form a temporary fixed body of the molded seed crystal. This was machined into small pieces having a thickness of 0.4 mm. It took 15 minutes in a heating furnace at 150 ° C. to remove the crystal piece. In addition, in order to wash away the adhesive adhered to the crystal blank, it was immersed in a hot aqueous solution of 5% sodium hydroxide at 80 ° C. for 2 hours, and washing with water required 10 minutes.

[0022]

As described above, the cured product of the temporary fixing adhesive according to the present invention has a large swelling property due to water absorption or a high solubility in water. Preferably, only by immersion in boiling water, the cured product can be easily separated or removed from the adherend. Therefore, the small articles can be taken out without being damaged, so that the occurrence of defective products can be suppressed, and mass productivity can be improved.

Further, since the composition contains the component (B) or the component (D), the viscosity of the adhesive composition can be adjusted and the thixotropic property can be imparted. It is also possible to fill the space and build up with the adhesive itself, thereby improving the workability when handling the adhesive. Furthermore, there is no need for heating during bonding as in the known art. As a result, not only the work is simplified, but also the working environment is favorable, and there is no loss or burrs when removing the parts.

More specifically, when an article such as a printer head core is polished using the adhesive composition containing the components (A) to (D) of the present invention, the adhesive composition Because of its high viscosity and thixotropic properties, the area (space) where burrs occur is filled with the cured product of the adhesive without flowing out, and the burrs generated by polishing are buried in this cured product Captured in this way. Therefore, by immersing the polished head core in water to dissolve and remove the cured product of the adhesive, the burrs described above are also removed, so that no polishing residue remains inside the head core, and Also, generation of burrs is suppressed.

Claims (2)

[Claims] (A) N-vinyl-2-pyrrolidone,
N, N-dimethylaminoethyl (meth) acrylate,
N, N-diethylaminoethyl (meth) acrylate,
N-methylaminoethyl (meth) acrylate, N-ethylaminoethyl (meth) acrylate, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 2-hydroxy-3-phenoxypropyl (meth) acrylate , N, N-dimethyl (meth) acrylamide, N-methoxymethyl (meth)
Acrylamide, N-ethoxymethyl (meth) acrylamide, N-methyl (meth) acrylamide, N-methylol (meth) acrylamide, N, N-dimethylaminopropyl (meth) acrylamide, N-vinyl oxazolidone, N-vinyl succinimide, N -Vinyl-N
-Methylformamide, N-vinyl-N-methylacetamide, tert-butyl (meth) acrylamidosulfonic acid, (meth) acryloylmorpholine, amino (meth) acrylate, amino (meth) acrylates 4
One or more compounds selected from quaternary salts and quaternary salts of (meth) acrylamides (B) N-vinyl-2-pyrrolidone having no polymerizable ethylenic double bond in the molecule and A homopolymer of
A homopolymer of N, N-dimethyl (meth) acrylamide, a copolymer of N-vinyl-2-pyrrolidone and N, N-dimethyl (meth) acrylamide,
One or more kinds of high molecular substances having water solubility or swelling property due to water absorption (C) Polymerization initiator (A) Small articles of coarse shape using temporary fixing adhesive composition comprising (A) to (C) above (B) Then, the temporarily fixed small article is machined into a desired shape, and (c) thereafter, the machined small article is immersed in water to form the temporary fixing adhesive. A method for processing a small article, characterized in that a cured product of the agent composition is dissolved or swelled by water absorption to remove the small article from the temporary fixing. 2. The small article processing method according to claim 1, wherein the temporary fixing adhesive further contains (D) a silica-based inorganic filler.