WO2008078469A1 - Composition, and method for temporarily fixing member using the composition - Google Patents

Composition, and method for temporarily fixing member using the composition Download PDF

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Publication number
WO2008078469A1
WO2008078469A1 PCT/JP2007/072131 JP2007072131W WO2008078469A1 WO 2008078469 A1 WO2008078469 A1 WO 2008078469A1 JP 2007072131 W JP2007072131 W JP 2007072131W WO 2008078469 A1 WO2008078469 A1 WO 2008078469A1
Authority
WO
WIPO (PCT)
Prior art keywords
composition
meth
light
temporarily fixing
coloring matter
Prior art date
Application number
PCT/JP2007/072131
Other languages
French (fr)
Japanese (ja)
Inventor
Gosuke Nakajima
Hiroyuki Kurimura
Kazuhiro Oshima
Original Assignee
Denki Kagaku Kogyo Kabushiki Kaisha
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denki Kagaku Kogyo Kabushiki Kaisha filed Critical Denki Kagaku Kogyo Kabushiki Kaisha
Priority to JP2008550991A priority Critical patent/JPWO2008078469A1/en
Publication of WO2008078469A1 publication Critical patent/WO2008078469A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors

Abstract

This invention provides an adhesive agent composition for temporal fixation, which can realize easy identification of a coated part in temporal fixation of an optical member and can easily distinguish the state of curing in a curing process by light irradiation, and a method for temporarily fixing a member. The composition is characterized by comprising (A) a polyfunctional (meth)acrylate, (B) a (meth)acryloyl group-containing monofunctional monomer, (C) a coloring matter which undergoes a change in color upon exposure to light, and (D) a photopolymerization initiator. Preferably, in the composition, the coloring matter (C), which undergoes a change in color upon exposure to light, is at least one coloring matter selected from the group consisting of photocolor forming coloring matters and light fading coloring matters. Preferably, in the composition, both the polyfunctional (meth)acrylate (A) and the (meth)acryloyl group-containing monofunctional monomer (B) are hydrophobic. The method for temporarily fixing a member is characterized by comprising bonding a member with the aid of the above composition to temporarily fix the member, fabricating the temporarily fixed member, and immersing the fabricated member in warm water of 90°C or below to remove a cured product of the composition.
PCT/JP2007/072131 2006-12-25 2007-11-14 Composition, and method for temporarily fixing member using the composition WO2008078469A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008550991A JPWO2008078469A1 (en) 2006-12-25 2007-11-14 Composition and method for temporarily fixing member using the same

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006348129 2006-12-25
JP2006-348129 2006-12-25

Publications (1)

Publication Number Publication Date
WO2008078469A1 true WO2008078469A1 (en) 2008-07-03

Family

ID=39562262

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/072131 WO2008078469A1 (en) 2006-12-25 2007-11-14 Composition, and method for temporarily fixing member using the composition

Country Status (2)

Country Link
JP (1) JPWO2008078469A1 (en)
WO (1) WO2008078469A1 (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010010900A1 (en) * 2008-07-22 2010-01-28 電気化学工業株式会社 Method for provisional fixing/release of member and adhesive for provisional fixing suitable therefor
JP2010100831A (en) * 2008-09-26 2010-05-06 Denki Kagaku Kogyo Kk Composition and method for temporarily fixing members using the same
WO2010095735A1 (en) * 2009-02-23 2010-08-26 サンスター技研株式会社 Color-fading primer composition
JP2011079888A (en) * 2009-10-02 2011-04-21 Denki Kagaku Kogyo Kk (meth)acrylic resin composition, adhesive composition, and temporary fixation and peeling method
WO2011136015A1 (en) * 2010-04-27 2011-11-03 オリンパスメディカルシステムズ株式会社 Optical adhesive and endoscope formed using same
JP2011219686A (en) * 2010-04-14 2011-11-04 Denki Kagaku Kogyo Kk Adhesive composition, and temporary fixation method of member using the same
JP2013151702A (en) * 2013-04-17 2013-08-08 Denki Kagaku Kogyo Kk Method for transporting member
US11377538B2 (en) * 2019-10-01 2022-07-05 3D Systems, Inc. Optically active build materials for 3D printing

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0786212A (en) * 1993-07-27 1995-03-31 Lintec Corp Adhesive sheet for sticking of wafer
JPH10130309A (en) * 1996-10-25 1998-05-19 Toagosei Co Ltd Photocurable composition for temporary fixation and production of article
JPH1171553A (en) * 1997-08-28 1999-03-16 Toagosei Co Ltd Production of photocurable composition for temporary fixation and article
JP2003313510A (en) * 2002-04-23 2003-11-06 Aader:Kk Method for processing using adhesive for temporary fixing and method for peeling adhesive for temporary fixing
JP2006328094A (en) * 2005-05-23 2006-12-07 Denki Kagaku Kogyo Kk Composition, and method for temporarily fixing member by using the same
JP2007009131A (en) * 2005-07-04 2007-01-18 Denki Kagaku Kogyo Kk Composition and method for temporary fixing of part by using the same
JP2007056066A (en) * 2005-08-22 2007-03-08 Denki Kagaku Kogyo Kk Composition and method for temporarily fixing member by using the same
JP2007169560A (en) * 2005-12-26 2007-07-05 Denki Kagaku Kogyo Kk Composition and method for temporarily fixing member using the same

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01204975A (en) * 1988-02-12 1989-08-17 Dainippon Ink & Chem Inc Formation of cured film of photopolymerizable paint
JPH07242715A (en) * 1994-03-02 1995-09-19 Japan Synthetic Rubber Co Ltd Thermosetting resin composition
WO2006100788A1 (en) * 2005-03-18 2006-09-28 Denki Kagaku Kogyo Kabushiki Kaisha Adherent composition and method of temporarily fixing member therewith

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0786212A (en) * 1993-07-27 1995-03-31 Lintec Corp Adhesive sheet for sticking of wafer
JPH10130309A (en) * 1996-10-25 1998-05-19 Toagosei Co Ltd Photocurable composition for temporary fixation and production of article
JPH1171553A (en) * 1997-08-28 1999-03-16 Toagosei Co Ltd Production of photocurable composition for temporary fixation and article
JP2003313510A (en) * 2002-04-23 2003-11-06 Aader:Kk Method for processing using adhesive for temporary fixing and method for peeling adhesive for temporary fixing
JP2006328094A (en) * 2005-05-23 2006-12-07 Denki Kagaku Kogyo Kk Composition, and method for temporarily fixing member by using the same
JP2007009131A (en) * 2005-07-04 2007-01-18 Denki Kagaku Kogyo Kk Composition and method for temporary fixing of part by using the same
JP2007056066A (en) * 2005-08-22 2007-03-08 Denki Kagaku Kogyo Kk Composition and method for temporarily fixing member by using the same
JP2007169560A (en) * 2005-12-26 2007-07-05 Denki Kagaku Kogyo Kk Composition and method for temporarily fixing member using the same

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010010900A1 (en) * 2008-07-22 2010-01-28 電気化学工業株式会社 Method for provisional fixing/release of member and adhesive for provisional fixing suitable therefor
JP5675355B2 (en) * 2008-07-22 2015-02-25 電気化学工業株式会社 Temporary fixing / peeling method of member and temporary fixing adhesive suitable for the method
JP2010100831A (en) * 2008-09-26 2010-05-06 Denki Kagaku Kogyo Kk Composition and method for temporarily fixing members using the same
WO2010095735A1 (en) * 2009-02-23 2010-08-26 サンスター技研株式会社 Color-fading primer composition
JP2010195850A (en) * 2009-02-23 2010-09-09 Sunstar Engineering Inc Color-fading primer composition
JP2011079888A (en) * 2009-10-02 2011-04-21 Denki Kagaku Kogyo Kk (meth)acrylic resin composition, adhesive composition, and temporary fixation and peeling method
JP2011219686A (en) * 2010-04-14 2011-11-04 Denki Kagaku Kogyo Kk Adhesive composition, and temporary fixation method of member using the same
WO2011136015A1 (en) * 2010-04-27 2011-11-03 オリンパスメディカルシステムズ株式会社 Optical adhesive and endoscope formed using same
JP2013151702A (en) * 2013-04-17 2013-08-08 Denki Kagaku Kogyo Kk Method for transporting member
US11377538B2 (en) * 2019-10-01 2022-07-05 3D Systems, Inc. Optically active build materials for 3D printing
US20220363867A1 (en) * 2019-10-01 2022-11-17 3D Systems, Inc. Optically active build materials for 3d printing
JP2022550410A (en) * 2019-10-01 2022-12-01 スリーディー システムズ インコーポレーテッド Optically active building materials for 3D printing
JP7340099B2 (en) 2019-10-01 2023-09-06 スリーディー システムズ インコーポレーテッド Optically active building materials for 3D printing
US11780989B2 (en) 2019-10-01 2023-10-10 3D Systems, Inc. Optically active build materials for 3D printing

Also Published As

Publication number Publication date
JPWO2008078469A1 (en) 2010-04-15

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