JP2003304054A - Printed wiring board and its manufacturing method - Google Patents
Printed wiring board and its manufacturing methodInfo
- Publication number
- JP2003304054A JP2003304054A JP2002108708A JP2002108708A JP2003304054A JP 2003304054 A JP2003304054 A JP 2003304054A JP 2002108708 A JP2002108708 A JP 2002108708A JP 2002108708 A JP2002108708 A JP 2002108708A JP 2003304054 A JP2003304054 A JP 2003304054A
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- density
- lines
- electric
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、パソコン、移動体
通信用電話機、ビデオカメラ等の各種電子機器に用いら
れるプリント配線板とその製造方法に関するものであ
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed wiring board used in various electronic devices such as a personal computer, a mobile communication telephone, a video camera and the like, and a manufacturing method thereof.
【０００２】[0002]
【従来の技術】近年、電子機器の高機能化、高密度化に
伴い、電子部品は、益々小型化、高集積化、高速化の傾
向にある。2. Description of the Related Art In recent years, electronic parts have become more and more compact, highly integrated, and faster, with the increasing functionality and density of electronic equipment.
【０００３】このために、プリント配線板の形態も益々
低誘電率、薄型、軽量化、高密度化の傾向が進み製品及
び生産過程における各種精度の向上が求められている。For this reason, the form of the printed wiring board is further reduced in dielectric constant, thinner, lighter and higher in density, and various precisions in products and production processes are required to be improved.
【０００４】特に、プリント配線板の写真法プロセスの
形成方法のひとつである静電塗布において、塗布される
膜厚の精度の向上が要求されてきている。In particular, in electrostatic coating, which is one of the methods of forming a photographic method of a printed wiring board, it is required to improve the accuracy of the film thickness to be coated.
【０００５】以下に従来のプリント配線板の製造方法の
静電塗布について説明する。The electrostatic coating in the conventional method for manufacturing a printed wiring board will be described below.
【０００６】図７は、従来のプリント配線板の静電塗布
方法の構成を示す図である。この構成において以下の順
で塗膜を形成する（工程の流れは図示せず）。FIG. 7 is a diagram showing a structure of a conventional electrostatic coating method for a printed wiring board. In this structure, a coating film is formed in the following order (process flow is not shown).
【０００７】（１）回路パターンが形成されたプリント
配線板１１を準備する。(1) A printed wiring board 11 on which a circuit pattern is formed is prepared.
【０００８】（２）接地（０Ｖ）状態に保った搬送部１
２にプリント配線板を固定させ、プリント配線板全面を
アース状態とする。(2) Transport unit 1 kept in the ground (0V) state
Fix the printed wiring board to 2 and ground the entire surface of the printed wiring board.
【０００９】（３）プリント配線板と反対の電荷を帯電
させたソルダレジストインキ１３をスプレーガン１４を
介して、吐出する。(3) The solder resist ink 13 charged with an electric charge opposite to that of the printed wiring board is discharged through the spray gun 14.
【００１０】（４）ソルダレジストインキ１３は、スプ
レーの吐出力に加え、それぞれ反対の電荷との間に発生
する電気力線より生じる静電引力によってプリント配線
板１１の全面に塗布される。(4) The solder resist ink 13 is applied to the entire surface of the printed wiring board 11 by an electrostatic attractive force generated by the lines of electric force generated between the spray resisting force and the opposite electric charges.
【００１１】（５）塗布されたソルダレジストインキ
を、８０℃、２０分程度の熱風により指触乾燥する。(5) The applied solder resist ink is dried by touch with hot air at 80 ° C. for about 20 minutes.
【００１２】（６）その後、露光用フィルムなどを介し
て紫外線照射により露光し、未露光部を現像液で溶解除
去し、１３０℃、５０分程度の熱処理により本硬化しソ
ルダレジストを完成する。(6) After that, it is exposed to ultraviolet rays through an exposure film or the like, the unexposed portion is dissolved and removed by a developing solution, and the main resist is heat-treated at 130 ° C. for about 50 minutes to complete curing to complete a solder resist.
【００１３】[0013]
【発明が解決しようとする課題】プリント配線板表面に
形成された回路パターンの形成密度は基板上の位置で異
なる。そのため金属層からなる回路パターンが形成され
た部分と回路パターンが形成されず基材が露出した部分
とは電気特性の違いにより帯電状態が異なり、プリント
配線板に電荷を帯電させる際にその電荷密度は不均一と
なる。The formation density of the circuit pattern formed on the surface of the printed wiring board differs depending on the position on the substrate. Therefore, the charge state differs between the part where the circuit pattern made of the metal layer is formed and the part where the circuit pattern is not formed and the base material is exposed due to the difference in electrical characteristics. Will be non-uniform.
【００１４】その結果、上記従来の製造方法において
は、ソルダレジストインキとプリント配線板との間に生
じる電気力線の電束密度が不均一となる。As a result, in the above conventional manufacturing method, the electric flux density of the lines of electric force generated between the solder resist ink and the printed wiring board becomes non-uniform.
【００１５】特に、図８に示すようにプリント配線板１
１の角部１５においては、電気力線の電束密度が高くな
りやすくソルダレジストインキ１３の塗布量が多くな
り、これが原因で塗布ムラ、ソルダレジスト厚のバラツ
キが発生するという問題点を有していた。In particular, as shown in FIG. 8, the printed wiring board 1
In the corner 15 of No. 1, the electric flux density of the lines of electric force is likely to be high, and the amount of the solder resist ink 13 applied is large, which causes a problem that uneven coating and unevenness of the solder resist thickness occur. Was there.
【００１６】更に、以上のことは益々回路パターンの細
線化、高密度化が進む中でこの傾向が顕著になり、また
プリント配線板の高機能化の要求に応えるために基材材
料の低誘電率化が進む中でこの傾向が顕著になるという
問題点を有していた。Further, the above tendency becomes more remarkable as the circuit pattern becomes finer and the density becomes higher, and in order to meet the demand for higher functionality of the printed wiring board, the low dielectric constant of the base material is used. There was a problem that this tendency became remarkable as the ratio increased.
【００１７】本発明は上記従来の問題点を解決するもの
であり、プリント配線板表面にソルダレジストインキを
均一に塗布し、塗布ムラ、ソルダレジスト厚のバラツキ
のないプリント配線板の製造方法を提供することを目的
とする。The present invention solves the above-mentioned conventional problems, and provides a method for manufacturing a printed wiring board in which the solder resist ink is evenly applied to the surface of the printed wiring board and there is no coating unevenness or variation in the solder resist thickness. The purpose is to do.
【００１８】[0018]
【課題を解決するための手段】この目的を達成するため
に本発明のプリント配線板は、帯電したインキが静電塗
布された板状のプリント配線板であって、前記板状の角
部に、電気力線の密度が高くならない手段を備えたプリ
ント配線板に電荷を帯電させ、それと逆の電荷を帯電さ
せたインキをプリント配線板上に静電塗布することであ
り、これによりプリント配線板表面にソルダレジストイ
ンキを均一に塗布し、塗布ムラ、厚みのバラツキのない
プリント配線板を提供するものである。To achieve this object, the printed wiring board of the present invention is a plate-shaped printed wiring board on which electrostatically charged ink is electrostatically applied, wherein , The electric charge is applied to the printed wiring board provided with means for preventing the density of the lines of electric force from increasing, and the ink charged with the opposite electric charge is electrostatically applied onto the printed wiring board. It is intended to provide a printed wiring board on which the solder resist ink is evenly applied to the surface to prevent application unevenness and thickness variation.
【００１９】[0019]
【発明の実施の形態】まず本発明の特徴は、板状のプリ
ント配線板の角部に、電気力線の密度が高くならない手
段を設ける工程において、その手段を備えたプリント配
線板を準備し、そのプリント配線板に電荷を帯電させ、
前記電荷と逆の電荷をインキに帯電させる工程と、前記
インキをプリント配線板上に静電塗布する工程を用いて
プリント配線板の製造方法とすることである。これによ
り、板状のプリント配線板の角部とそれ以外の部分との
電気力線の密度の差、及び静電塗布によるインキの塗布
量の差及びバラツキを低減させるという作用を有する。BEST MODE FOR CARRYING OUT THE INVENTION First of all, the feature of the present invention is that in the step of providing a means for preventing the density of electric lines of force from increasing at the corners of a plate-shaped printed wiring board, a printed wiring board provided with the means is prepared. , Charge the printed wiring board,
A method of manufacturing a printed wiring board includes a step of charging the ink with an electric charge opposite to the electric charge and a step of electrostatically applying the ink on the printed wiring board. This has the effect of reducing the difference in the density of the lines of electric force between the corners of the plate-shaped printed wiring board and the other portions, and the difference and variation in the amount of ink applied by electrostatic coating.
【００２０】また本発明は、電気力線の密度が高くなら
ない手段を設ける工程として、プリント配線板の角部を
曲率半径２ｍｍ以上の曲線形状に仕上げることであり、
このプリント配線板上に静電塗布することにより曲線形
状により電気力線の電束密度の角部先端への集中をなく
し、インキの塗布量の集中を防ぐことができる。Further, according to the present invention, as a step of providing a means for preventing the density of the lines of electric force from increasing, the corner portion of the printed wiring board is finished into a curved shape having a radius of curvature of 2 mm or more,
By electrostatically coating the printed wiring board, it is possible to eliminate the concentration of the electric flux density of the electric flux lines at the tip of the corner due to the curved shape and prevent the concentration of the ink coating amount.
【００２１】さらに本発明は、電気力線の密度が高くな
らない手段を設ける工程として、角部近傍に導電層を形
成するものであって、その導電層を曲率半径２ｍｍ以上
の曲線を有するものとすることである。このプリント配
線板上に静電塗布することにより曲線形状の導電層によ
り電気力線の電束密度の角部先端から分散し、インキの
塗布量を均一にすることができる。Further, according to the present invention, a conductive layer is formed in the vicinity of a corner as a step of providing a means for preventing the density of lines of electric force from increasing, and the conductive layer has a curve with a radius of curvature of 2 mm or more. It is to be. By electrostatically coating the printed wiring board, the curved conductive layer disperses the electric flux density from the tip of the corner portion of the electric flux density, and the ink coating amount can be made uniform.
【００２２】さらに本発明は、電気力線の密度が高くな
らない手段を設ける工程として、角部を構成する２辺か
ら１０ｍｍの領域内に貫通孔を設け、このプリント配線
板上に静電塗布することにより、貫通孔内へのインキの
流入により、角部近傍の表面の厚みを低減させ、プリン
ト配線板全体として、均一な塗布を実現するものであ
る。Further, in the present invention, as a step of providing a means for preventing the density of the lines of electric force from increasing, a through hole is provided within a region of 10 mm from the two sides forming the corner, and electrostatic coating is performed on this printed wiring board. As a result, the thickness of the surface in the vicinity of the corners is reduced by the inflow of the ink into the through holes, and uniform coating is realized as the entire printed wiring board.
【００２３】特に貫通孔の中心の位置は、角部を構成す
る２辺から１０ｍｍが望ましく、近すぎると貫通孔の直
径が小となり、インキ流入量が少ない。逆に遠すぎると
電気力線の分散の効果が小さいとともに、プリント配線
板材料に無駄が生じる。Particularly, the center position of the through hole is preferably 10 mm from the two sides forming the corner. If it is too close, the diameter of the through hole becomes small and the ink inflow amount is small. On the other hand, if it is too far, the effect of dispersing the lines of electric force is small, and the printed wiring board material is wasted.
【００２４】また貫通孔の直径は、２ｍｍ以上１０ｍｍ
以下であることが有効である。上記の貫通孔の形成位置
において、プリント配線板材料に無駄を生じることな
く、貫通孔内に流入するインキ量を確保するのに必要な
直径となる。The diameter of the through hole is 2 mm or more and 10 mm.
The following is effective. At the position where the through hole is formed, the diameter is required to secure the amount of ink flowing into the through hole without wasting the printed wiring board material.
【００２５】さらに本発明は、前記プリント配線板は複
数の個別プリント配線板で構成されたものにおいても有
効である。Further, the present invention is effective when the printed wiring board is composed of a plurality of individual printed wiring boards.
【００２６】特に個別プリント配線板の角部に電気力線
の密度が高くならない手段として、個別プリント配線板
の角部近傍に導電層を備え、その導電層を曲率半径２ｍ
ｍ以上の曲線を有するものとすることである。このプリ
ント配線板上に静電塗布することにより曲線形状の導電
層により電気力線の電束密度の角部先端から分散し、各
個別プリント配線板のインキの塗布量を均一にすること
ができる。In particular, as means for preventing the density of lines of electric force from increasing at the corners of the individual printed wiring board, a conductive layer is provided near the corners of the individual printed wiring board, and the conductive layer has a radius of curvature of 2 m.
It is to have a curve of m or more. By electrostatically coating on this printed wiring board, the curvilinear conductive layer disperses the electric flux density of the electric flux lines from the corners of the corners, so that the amount of ink applied to each individual printed wiring board can be made uniform. .
【００２７】さらに本発明は、プリント配線板あるいは
個別プリント配線板の前記導電層を表裏面に形成し、そ
れを導通孔によって電気的接続することで、表裏を同電
位とし、表裏面においてもインキの塗布量を均一にする
ことができる。Further, according to the present invention, the conductive layers of the printed wiring board or the individual printed wiring board are formed on the front and back surfaces and electrically connected by the conductive holes so that the front and back surfaces have the same potential, and the ink is formed on the front and back surfaces. Can be applied uniformly.
【００２８】（実施の形態）以下本発明の実施の形態に
ついて説明する。(Embodiment) An embodiment of the present invention will be described below.
【００２９】まず第１の実施の形態について説明する。First, the first embodiment will be described.
【００３０】図１は、本発明の実施の形態におけるプリ
ント配線板を示すものである。FIG. 1 shows a printed wiring board according to an embodiment of the present invention.
【００３１】絶縁基板上に回路パターンを形成したプリ
ント配線板１の四隅の角部２を曲率半径２ｍｍ以上の曲
線の形状に形成する。形成する工程は、回路パターンの
形成前であっても形成後であってもよいが、後のソルダ
レジストの塗布形成前に行う必要がある。The corners 2 at the four corners of the printed wiring board 1 having a circuit pattern formed on an insulating substrate are formed in a curved shape having a radius of curvature of 2 mm or more. The step of forming may be performed before or after forming the circuit pattern, but it is necessary to be performed before the subsequent coating and forming of the solder resist.
【００３２】次に、本発明のプリント配線板の製造方法
を説明する。Next, a method of manufacturing the printed wiring board of the present invention will be described.
【００３３】図２は、本発明の実施の形態におけるプリ
ント配線板の静電塗布方法の構成を示す図である。この
構成において、次の順序でソルダレジストを形成する。FIG. 2 is a diagram showing the construction of the electrostatic coating method for a printed wiring board according to the embodiment of the present invention. In this structure, the solder resist is formed in the following order.
【００３４】（１）回路パターンが形成され、かつ電気
力線の密度が高くならない手段としての角部２を備えた
プリント配線板１を準備する。(1) A printed wiring board 1 having a corner portion 2 on which a circuit pattern is formed and which does not increase the density of lines of electric force is prepared.
【００３５】（２）接地（０Ｖ）状態に保った搬送部６
にプリント配線板１を固定させ、プリント配線板１全面
をアース状態とする。(2) Transport section 6 kept in the ground (0 V) state
The printed wiring board 1 is fixed to and the entire surface of the printed wiring board 1 is grounded.
【００３６】（３）プリント配線板１と反対の電荷を帯
電させたソルダレジストインキ３をスプレーガン７を介
して、吐出する。(3) The solder resist ink 3 charged with a charge opposite to that of the printed wiring board 1 is discharged through the spray gun 7.
【００３７】（４）ソルダレジストインキ３は、スプレ
ーの吐出力に加え、それぞれ反対の電荷との間に発生す
る電気力線より生じる静電引力によってプリント配線板
１の全面に塗布される。(4) The solder resist ink 3 is applied to the entire surface of the printed wiring board 1 by the electrostatic force of attraction generated by the lines of electric force generated between the spray resisting force and the opposite electric charges.
【００３８】（５）塗布されたソルダレジストインキ３
を、８０℃、２０分程度の熱風により指触乾燥する。(5) The applied solder resist ink 3
Is dried by touch with hot air at 80 ° C. for about 20 minutes.
【００３９】（６）その後、露光用フィルムなどを介し
て紫外線照射により露光し、未露光部を現像液で溶解除
去し、１３０℃、５０分程度の熱処理により本硬化しソ
ルダレジストを完成する。(6) After that, the film is exposed to ultraviolet rays through an exposure film or the like, the unexposed portion is dissolved and removed by a developing solution, and heat curing is carried out at 130 ° C. for about 50 minutes to complete curing to complete the solder resist.
【００４０】次に第２の実施の形態について説明する。Next, a second embodiment will be described.
【００４１】図３は、本発明の実施の形態におけるプリ
ント配線板を示すものである。FIG. 3 shows a printed wiring board according to the embodiment of the present invention.
【００４２】絶縁基板上に回路パターンを形成したプリ
ント配線板１の四隅の角部２の近傍に曲線半径２ｍｍ以
上の曲線を有する導電層４を形成する。形成する工程
は、回路パターンの形成と同時に行う。A conductive layer 4 having a curve with a curve radius of 2 mm or more is formed in the vicinity of corners 2 at four corners of a printed wiring board 1 having a circuit pattern formed on an insulating substrate. The step of forming is performed simultaneously with the formation of the circuit pattern.
【００４３】また図４に示すように、プリント配線板１
が、複数の個別プリント配線板１ｂで構成される場合に
おいても、各個別プリント配線板１ｂの角部２ｂの近傍
に導電層４ｂを回路パターンの形成と同時に行うことも
できる。Further, as shown in FIG. 4, the printed wiring board 1
However, even when it is composed of a plurality of individual printed wiring boards 1b, the conductive layer 4b can be formed in the vicinity of the corner 2b of each individual printed wiring board 1b at the same time when the circuit pattern is formed.
【００４４】さらに、図５に示すように、導電層４をプ
リント配線板１の表裏面の略同一箇所に形成し、導通孔
５を介して電気的接続を図ることもできる。導通孔５の
形成は、電解めっきによる方法、あるいは導電性ペース
トの充填による方法があるが、回路パターンの形成前、
あるいは回路パターン形成後であってもよいが、ソルダ
レジストの形成前でなければならない。Further, as shown in FIG. 5, the conductive layer 4 can be formed on the front and back surfaces of the printed wiring board 1 at substantially the same location, and electrical connection can be achieved through the conduction hole 5. The conductive holes 5 may be formed by electrolytic plating or filling with a conductive paste.
Alternatively, it may be after the circuit pattern is formed, but it must be before the solder resist is formed.
【００４５】このように電気力線の密度が高くならない
手段としての導電層４または４ｂを備えたプリント配線
板１を準備する工程を経た後、第１の実施の形態に示し
た図２の構成及び方法と同様にしてソルダレジストを形
成することができる。After the step of preparing the printed wiring board 1 having the conductive layer 4 or 4b as means for preventing the density of the lines of electric force from increasing in this way, the structure of FIG. 2 shown in the first embodiment. The solder resist can be formed by the same method as described above.
【００４６】次に第３の実施の形態について説明する。Next, a third embodiment will be described.
【００４７】図６は、本発明の実施の形態におけるプリ
ント配線板を示すものである。FIG. 6 shows a printed wiring board according to the embodiment of the present invention.
【００４８】絶縁基板上に回路パターンを形成したプリ
ント配線板１の四隅の角部２を構成する２辺２ｃ，２ｄ
から１０ｍｍの領域内に貫通孔５を形成する。形成する
工程は、回路パターンの形成前あるいは回路パターン形
成後であってもよいが、ソルダレジストの形成前でなけ
ればならない。Two sides 2c and 2d forming the corners 2 at the four corners of the printed wiring board 1 having a circuit pattern formed on an insulating substrate.
A through hole 5 is formed in a region of 10 mm from. The step of forming may be before forming the circuit pattern or after forming the circuit pattern, but it has to be performed before forming the solder resist.
【００４９】特に貫通孔５の直径は２ｍｍ以上１０ｍｍ
以下に形成することによって、プリント配線板材料に無
駄を生じることなく、貫通孔５内に流入するインキ量を
確保するのに有効である。Particularly, the diameter of the through hole 5 is 2 mm or more and 10 mm.
The following formation is effective in securing the amount of ink flowing into the through hole 5 without wasting the printed wiring board material.
【００５０】このように電気力線の密度が高くならない
手段としての貫通孔５を備えたプリント配線板１を準備
する工程を経た後、第１の実施の形態に示した図２の構
成及び方法と同様にしてソルダレジストを形成すること
ができる。After the step of preparing the printed wiring board 1 having the through holes 5 as means for preventing the density of the lines of electric force from increasing in this way, the structure and method of FIG. 2 shown in the first embodiment. A solder resist can be formed in the same manner as in.
【００５１】以上の本発明の作用効果について説明す
る。The operation and effect of the present invention described above will be described.
【００５２】本発明は、プリント配線板の角部を曲線形
状とすることにより電気力線の電束密度の角部先端への
集中をなくし、インキの塗布量の集中を防ぐことができ
る。According to the present invention, by making the corners of the printed wiring board curved, it is possible to eliminate the concentration of the electric flux density of the lines of electric force at the tip of the corners and prevent the concentration of the ink application amount.
【００５３】また、角部近傍に曲率半径２ｍｍ以上の曲
線を有する導電層を形成することで電気力線の電束密度
の角部先端から分散し、インキの塗布量を均一にするこ
とができる。また表裏両面に導電層を形成し導通接続す
ることによって、表裏のバラツキを低減させることがで
きる。By forming a conductive layer having a curve with a radius of curvature of 2 mm or more in the vicinity of the corner, the electric flux density of the lines of electric force is dispersed from the tip of the corner and the amount of ink applied can be made uniform. . Further, by forming conductive layers on both the front and back surfaces and making conductive connection, it is possible to reduce variations in the front and back surfaces.
【００５４】さらに角部を構成する２辺から１０ｍｍの
領域内に貫通孔を設け、この貫通孔内へのインキの流入
により、角部近傍の表面の厚みを低減させ、プリント配
線板全体として、均一な塗布を実現するものである。Further, a through hole is provided in a region 10 mm from the two sides forming the corner, and the thickness of the surface in the vicinity of the corner is reduced by the ink flowing into the through hole, so that the entire printed wiring board is It achieves uniform application.
【００５５】本発明の実施の形態によって、プリント配
線板の角部と他の部位とのソルダレジストの厚みのバラ
ツキは１０μｍ程度となり、従来の２０〜３０μｍのバ
ラツキに比較して著しく均一に塗布することができる。According to the embodiment of the present invention, the variation in the thickness of the solder resist between the corners of the printed wiring board and other portions is about 10 μm, which is remarkably uniform as compared with the conventional variation of 20 to 30 μm. be able to.
【００５６】なお、上記の実施の形態においては、本発
明の第１〜第３の実施の形態をそれぞれ単独で行った
が、各実施の形態を組み合わせることによって、さらに
効果を高めることも可能である。In the above embodiment, the first to third embodiments of the present invention are carried out independently, but the effects can be further enhanced by combining the embodiments. is there.
【００５７】[0057]
【発明の効果】以上のように本発明は、プリント配線板
表面を均一な電荷に帯電させ、これによりソルダレジス
トインキを均一に塗布し、塗布ムラや厚みのバラツキの
低いソルダレジストを備えたプリント配線板を提供する
ことができる。As described above, according to the present invention, the surface of a printed wiring board is charged to a uniform electric charge, so that the solder resist ink is uniformly applied, and a print provided with a solder resist having a low coating unevenness and a thickness variation. A wiring board can be provided.
【図１】本発明の実施の形態におけるプリント配線板を
示す図FIG. 1 is a diagram showing a printed wiring board according to an embodiment of the present invention.
【図２】本発明の実施の形態におけるプリント配線板の
静電塗布方法の構成を示す図FIG. 2 is a diagram showing a configuration of an electrostatic coating method for a printed wiring board according to an embodiment of the present invention.
【図３】本発明の実施の形態におけるプリント配線板を
示す図FIG. 3 is a diagram showing a printed wiring board according to an embodiment of the present invention.
【図４】本発明の実施の形態におけるプリント配線板を
示す図FIG. 4 is a diagram showing a printed wiring board according to an embodiment of the present invention.
【図５】本発明の実施の形態におけるプリント配線板を
示す図FIG. 5 is a diagram showing a printed wiring board according to an embodiment of the present invention.
【図６】本発明の実施の形態におけるプリント配線板を
示す図FIG. 6 is a diagram showing a printed wiring board according to an embodiment of the present invention.
【図７】従来のプリント配線板の静電塗布方法の構成を
示す図FIG. 7 is a diagram showing a configuration of a conventional electrostatic coating method for a printed wiring board.
【図８】従来のプリント配線板を示す図FIG. 8 is a diagram showing a conventional printed wiring board.
１ プリント配線板 １ｂ 個別プリント配線板 ２，２ｂ 角部 ２ｃ，２ｄ 角部を構成する辺 ３ ソルダレジストインキ ４，４ｂ 導電層 ５ 導通孔 ６ 搬送部 ７ スプレーガン 1 printed wiring board 1b Individual printed wiring board 2,2b corner 2c, 2d Sides forming corners 3 Solder resist ink 4,4b conductive layer 5 through holes 6 Transport section 7 spray gun
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 ＦＩ テーマコート゛(参考） Ｈ０５Ｋ 1/02 Ｈ０５Ｋ 1/02 Ｃ Ｇ Ｆターム(参考） 4D075 AA09 AA82 CA48 DA06 DC19 EA33 5E314 AA24 BB02 BB11 BB12 CC03 FF01 GG15 GG26 5E338 AA00 BB02 BB13 BB25 BB31 BB63 BB65 BB71 BB75 CC09 EE21 EE32 EE33 ─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. 7 Identification code FI theme code (reference) H05K 1/02 H05K 1/02 CG F term (reference) 4D075 AA09 AA82 CA48 DA06 DC19 EA33 5E314 AA24 BB02 BB11 BB12 CC03 FF01 GG15 GG26 5E338 AA00 BB02 BB13 BB25 BB31 BB63 BB65 BB71 BB75 CC09 EE21 EE32 EE33
Claims (12)
プリント配線板であって、前記板状の角部に、電気力線
の密度が高くならない手段を備えたプリント配線板。1. A plate-shaped printed wiring board on which electrostatically charged ink is electrostatically applied, wherein the plate-shaped corner portion is provided with means for preventing the density of lines of electric force from increasing.
角部が曲率半径２ｍｍ以上の曲線の形状であることを特
徴とする請求項１記載のプリント配線板。2. A means for preventing the density of electric lines of force from increasing is
The printed wiring board according to claim 1, wherein the corner portion has a curved shape with a radius of curvature of 2 mm or more.
層を備え、電気力線の密度が高くならない手段は、前記
導電層が曲率半径２ｍｍ以上の曲線を有するものである
ことを特徴とする請求項１記載のプリント配線板。3. A plate-shaped printed wiring board is provided with a conductive layer near a corner, and the means for preventing the density of lines of electric force from increasing is that the conductive layer has a curve with a radius of curvature of 2 mm or more. The printed wiring board according to claim 1.
板状の角部を構成する２辺から１０ｍｍの領域内に貫通
孔が設けられているものであることを特徴とする請求項
１記載のプリント配線板。4. A means for preventing the density of electric lines of force from increasing is
The printed wiring board according to claim 1, wherein the through hole is provided within a region of 10 mm from two sides forming the plate-shaped corner portion.
であることを特徴とする請求項４記載のプリント配線
板。5. The printed wiring board according to claim 4, wherein the diameter of the through hole is 2 mm or more and 10 mm or less.
プリント配線板であって、前記プリント配線板は複数の
個別プリント配線板で構成され、前記個別プリント配線
板の角部に電気力線の密度が高くならない手段を備えた
ことを特徴とするプリント配線板。6. A plate-shaped printed wiring board electrostatically coated with charged ink, wherein the printed wiring board is composed of a plurality of individual printed wiring boards, and an electric force is applied to a corner portion of the individual printed wiring board. A printed wiring board having means for preventing the wire density from increasing.
を備え、電気力線の密度が高くならない手段は、前記導
電層が曲率半径２ｍｍ以上の曲線を有することを特徴と
する請求項６記載のプリント配線板。7. The individual printed wiring board is provided with a conductive layer in the vicinity of a corner, and the means for preventing the density of electric flux lines from increasing is that the conductive layer has a curve with a radius of curvature of 2 mm or more. Printed wiring board described.
られ、表裏面の導電層は導通孔によって電気的に接続さ
れていることを特徴とする請求項３または７記載のプリ
ント配線板。8. The printed wiring board according to claim 3, wherein the conductive layers are provided on the front and back surfaces of the printed wiring board, and the conductive layers on the front and back surfaces are electrically connected by a conductive hole.
線の密度が高くならない手段を設ける工程と、前記プリ
ント配線板に電荷を帯電させ、前記電荷と逆の電荷をイ
ンキに帯電させる工程と、前記インキをプリント配線板
上に静電塗布する工程を有するプリント配線板の製造方
法。9. A step of providing a means for preventing the density of electric lines of force from increasing in the corners of a plate-shaped printed wiring board, and charging the printed wiring board with an electric charge and charging the ink with an electric charge opposite to the electric charge. A method of manufacturing a printed wiring board, comprising the steps of: and the step of electrostatically applying the ink onto the printed wiring board.
設ける工程は、角部を曲率半径２ｍｍ以上の曲線形状に
仕上げることを特徴とする請求項９記載のプリント配線
板の製造方法。10. The method for manufacturing a printed wiring board according to claim 9, wherein in the step of providing a means for preventing the density of the lines of electric force from increasing, the corner portion is finished into a curved shape having a radius of curvature of 2 mm or more.
設ける工程は、角部近傍に導電層を形成する工程であっ
て、前記導電層は曲率半径２ｍｍ以上の曲線を有するこ
とを特徴とする請求項９記載のプリント配線板の製造方
法。11. The step of providing a means for preventing the density of the lines of electric force from increasing is a step of forming a conductive layer in the vicinity of a corner, and the conductive layer has a curve with a radius of curvature of 2 mm or more. The method for manufacturing a printed wiring board according to claim 9.
設ける工程は、角部を構成する２辺から１０ｍｍの領域
内に貫通孔を設けることを特徴とする請求項９記載のプ
リント配線板の製造方法。12. The printed wiring board according to claim 9, wherein the step of providing a means for preventing the density of the lines of electric force from increasing is provided with a through hole within a region of 10 mm from two sides forming the corner. Production method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002108708A JP4357792B2 (en) | 2002-04-11 | 2002-04-11 | Method for manufacturing printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002108708A JP4357792B2 (en) | 2002-04-11 | 2002-04-11 | Method for manufacturing printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2003304054A true JP2003304054A (en) | 2003-10-24 |
| JP4357792B2 JP4357792B2 (en) | 2009-11-04 |
Family
ID=29392372
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002108708A Expired - Fee Related JP4357792B2 (en) | 2002-04-11 | 2002-04-11 | Method for manufacturing printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4357792B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100643928B1 (en) | 2005-08-29 | 2006-11-10 | 삼성전기주식회사 | Printed circuit board with dual type inner structure |
| JP2007066964A (en) * | 2005-08-29 | 2007-03-15 | Cmk Corp | Collective printed wiring board and method for manufacturing same |
| CN104438000A (en) * | 2013-09-23 | 2015-03-25 | 深圳崇达多层线路板有限公司 | Spray method and spray device of electrostatic spraying circuit board |
-
2002
- 2002-04-11 JP JP2002108708A patent/JP4357792B2/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100643928B1 (en) | 2005-08-29 | 2006-11-10 | 삼성전기주식회사 | Printed circuit board with dual type inner structure |
| JP2007066964A (en) * | 2005-08-29 | 2007-03-15 | Cmk Corp | Collective printed wiring board and method for manufacturing same |
| CN104438000A (en) * | 2013-09-23 | 2015-03-25 | 深圳崇达多层线路板有限公司 | Spray method and spray device of electrostatic spraying circuit board |
| CN104438000B (en) * | 2013-09-23 | 2017-11-07 | 深圳崇达多层线路板有限公司 | The spraying method and its device of electrostatic spraying wiring board |
Also Published As
| Publication number | Publication date |
|---|---|
| JP4357792B2 (en) | 2009-11-04 |
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