JP2010171035A - Method of manufacturing printed wiring board and printed wiring board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a printed wiring board, the method uniformly applying a solder resist ink on a surface of a printed wiring board with no application unevenness or dispersion of solder resist thickness; and to provide a printed wiring board obtained by the same. <P>SOLUTION: The method of manufacturing a printed wiring board includes steps of: forming a circuit of a group printed wiring board consisting of a plurality of individual printed wiring boards; forming a solder resist-absorbing means and a plurality of ground patterns between the adjacent individual printed wiring board and the outer circumferential part of the group printed wiring board; and electrostatically applying the solder resist ink to the laminated plate while grounding the ground patterns by a grounding means. The ground patterns are electrically connected to the solder resist ink-absorbing means. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a printed wiring board used in various electronic devices such as a personal computer, a mobile communication telephone, and a video camera.

  In recent years, as electronic devices have higher functions and higher densities, electronic components are increasingly becoming smaller, more integrated, and faster.

  For this reason, the printed wiring board has a tendency to lower the dielectric constant, the thickness, and the weight, and the component mounting density has been increased. For this reason, the influence of the variation in the thickness of the solder resist formed on the substrate surface on component mounting is also increasing.

  A conventional solder resist forming method for a printed wiring board will be described below.

  As a method for forming a solder resist on a printed wiring board, there are a screen printing method, a roll coater method, a curtain coater method, and the like. Here, an electrostatic coating method will be particularly described.

  On the surface of the printed wiring board, a solder resist as an insulating film is formed for the purpose of preventing adhesion of solder, other than lands and through holes for mounting various electronic components.

  A conventional solder resist forming method by electrostatic coating will be described below.

  FIG. 7A is a view showing a conventional solder resist forming process by electrostatic coating, and FIG. 7B is an enlarged view of an end portion of the printed wiring board in FIG. 7A.

  In FIG. 7A, a solder resist ink that is liquid and adjusted to a certain viscosity is prepared (not shown). Next, a negative charge is charged at the tip of the spray gun 1. Accordingly, the solder resist ink 4 fired from the spray gun 1 is charged with a negative charge.

  The printed wiring board 2 and the electrode plate 3 are charged with a charge opposite to that of the spray gun 1, that is, a positive charge. As a result, the solder resist ink 4 has a force when fired from the spray gun 1. A force due to the opposite electric charge of the printed wiring board 2 is applied and applied to the surface 2 a of the printed wiring board 2. Then, if it is a double-sided printed wiring board, the soldering resist ink 4 is similarly apply | coated also to the back surface 2b of the printed wiring board 2. FIG.

  Here, the solder resist ink 4 is charged with a negative charge and the printed wiring board 2 is charged with a positive charge. However, the positive and negative charges of each other may be charged oppositely.

As a prior art document related to the invention of this application, for example, Patent Document 1 is known.
JP-A-2-257698

  However, the conventional printed wiring board manufacturing method has the following problems.

  As shown in FIG. 7B, the solder resist ink 4 is fired from the spray gun 1 toward the printed wiring board 2. Most of the solder resist ink 4 is applied to the surface 2a of the printed wiring board 2 facing the spray gun 1, but a part of the solder resist ink 4 is not applied to the surface 2a. Passes in the vicinity of the outer peripheral portion 6 of the wiring board 2.

  At this time, the electrical attraction force with respect to the solder resist ink 4 is stronger than the force attracted by the electrode plate 3 because the outer peripheral portion 6 of the back surface 2b of the surface 2a of the printed wiring board 2 is closer to the distance. For this reason, the traveling direction of the fired solder resist ink 4 is curved. As a result, the solder resist ink 4 is applied to the outer peripheral portion 6 of the back surface 2b, and a part thereof is applied not only to the outer peripheral portion 6 but also to the product portion 5 that is the inner portion of the back surface 2b. Become.

  As shown in FIG. 8, the printed wiring board 2 is in the form of a collective printed wiring board composed of a plurality of individual printed wiring boards 7 formed with conductor patterns and a peripheral portion 6 excluding them. In general.

  In the following description, the part of the printed wiring board 7 in which a plurality of conductor patterns are formed is referred to as a product part, and the outer peripheral part 6 is referred to as a part outside the product.

  In FIG. 7, the solder resist ink 4 applied to the end portion of the back surface 2b is also applied to the product portion on the back side of the printed wiring board 2 as described above.

  As a result, a thicker solder resist is formed on the part outside the product and the part near the outside of the product. On the other hand, if the thickness to be applied is set to be thin in order to suppress the formation of a portion outside the product, there is a problem that the thickness of the solder resist becomes insufficient in the product portion.

  The present invention solves the above-mentioned conventional problems, and prevents the solder resist ink from being applied on the product part in the vicinity of the outer part of the product from being applied, and the thickness variation of the solder resist formed on the product part An object of the present invention is to stably supply a printed wiring board suitable for high-density component mounting with a small amount of high-density components.

  In order to achieve this object, the configuration of the present invention includes a step of preparing a laminated board having a metal layer as an outermost layer of an insulating base material, and an aggregate printed wiring board comprising a plurality of individual printed wiring boards on the insulating base material Forming a solder resist ink absorbing means and a plurality of ground patterns between the individual printed wiring boards adjacent to each other and the outer peripheral portion of the collective printed wiring board; and grounding the ground pattern by a grounding means, And a step of electrostatically applying solder resist ink to the laminated board, wherein the ground pattern is electrically connected to the solder resist ink absorbing means. Absorbing means and grounding pattern prevent the solder resist ink from turning around on the product part, Effect that makes it possible to reduce the thickness variations in the stringency is obtained.

  As described above, according to the present invention, by providing the solder resist ink absorbing means on the outer peripheral portion of the printed wiring board in advance, it is possible to apply the solder resist ink that has been turned back so as to be absorbed by the outer peripheral portion and the frame portion. The effect of reducing the thickness variation of the solder resist formed on the product part can be obtained.

(Embodiment 1)
Embodiment 1 of the present invention will be described below with reference to the drawings.

  FIG. 1 is a plan view of a printed wiring board according to an embodiment of the present invention.

  As shown in FIG. 1, the printed wiring board 11 of the present invention includes an outer peripheral portion 12 of an insulating base material, a plurality of individual printed wiring boards 13 serving as product parts inside the insulating substrate, and an interval between adjacent individual printed wiring boards 13. This is a collective printed wiring board having a plurality of individual printed wiring boards 13.

  The outer peripheral portion 12 and the frame portion 14 have a conductor pattern 15 made of metal as a solder resist ink absorbing means for absorbing the solder resist ink that wraps around to the back side, and a plurality of conductor patterns 15 electrically connected to the solder resist ink absorbing means. The grounding pattern 16 is provided.

  Among the three ground patterns 16 shown in FIG. 1, for example, one ground pattern is connected to the outer layer conductor pattern 15 or the frame portion 14, and the other is connected to an inner layer conductor pattern to be described later. Can be connected to the conductor patterns on both the inner layer and the outer layer as required.

  Here, the manufacturing method of the printed wiring board of this invention is demonstrated below.

  First, a laminate having a metal layer such as a copper foil as the outermost layer of an insulating base material having a size of 200 mm × 200 mm to 600 mm × 600 mm is prepared. This laminated board may be a multilayer laminated board having an inner layer pattern in the inner layer.

  Next, by selectively etching the metal layer, a circuit of a collective printed wiring board composed of a plurality of individual printed wiring boards 13 is formed on the insulating substrate.

  Simultaneously or sequentially with the formation of the circuit, a frame portion 14 as a solder resist ink absorbing means and an outer peripheral portion 12 are formed on the outer periphery of the collective printed wiring board between adjacent individual printed wiring boards 13. A plurality of ground patterns 16 that are electrically connected to the solder resist ink absorbing means are formed at the end of the insulating substrate.

  Next, solder resist ink is applied to the laminated plate in a state where the ground pattern is grounded by a grounding means (not shown). The grounding means in the present embodiment is a metal transport jig for transporting the laminated plate into the electrostatic coating apparatus, and a portion including at least one of the ground patterns of the laminated plate is sandwiched by the transport jig. To ground. Normally, the potential when grounding is 0 V, but in the present embodiment, the following description will be made assuming that the ground pattern 16 is charged with a positive charge.

  FIG. 2 is an enlarged cross-sectional view of a main part of the printed wiring board in the present embodiment. In FIG. 2, by forming the conductor pattern 15 as the solder resist ink absorbing means on the outer peripheral portion 12 and the frame portion 14, the charge density of the outer peripheral portion 12 and the frame portion 14 is increased, so that the charging property is enhanced.

  For this reason, the negatively charged solder resist ink 17 which is fired from a spray gun (not shown) and passes near the end of the printed wiring board 11 without being applied to the surface of the printed wiring board 11 is It is attracted to the conductor pattern 15 of the portion 12 and the conductor pattern 15 of the frame portion 14 and applied so as to be absorbed by the outer peripheral portion 12 and the frame portion 14 of the printed wiring board 11.

  For this reason, the wraparound to the individual printed wiring board 13 which is the product portion in the vicinity of the outer peripheral portion 12 on the back side of the application surface of the solder resist ink 17 is reduced, and the conductor pattern 15 of the frame portion 14 leads to the outer peripheral portion 12. Concentration of the solder resist ink 17 is suppressed, and as a result, the thickness variation of the solder resist formed on the entire collective printed wiring board composed of a plurality of individual printed wiring boards 13 can be reduced.

  Furthermore, since the conductor pattern 15 of the outer peripheral portion 12 and the conductor pattern 15 of the frame portion 14 are electrically connected to the ground pattern 16 respectively, the charge density of the outer peripheral portion 12 and the frame portion 14 is further increased. Further, the charging property is enhanced.

  When the conductor pattern is not formed on the outer peripheral part and the frame part of the printed wiring board as in the past, the thickness variation of the solder resist formed on the product part is ± 33 μm at maximum, and the thickness actually formed is The range was 10 to 76 μm.

  Further, a solder resist ink 17 is applied to the printed wiring board 11 in which a plurality of linear conductor patterns 15 of conductor width / conductor gap = 100 μm / 100 μm are formed in parallel to each other on the outer peripheral portion 12 and the frame portion 14 by electrostatic coating. Is applied, the plurality of conductor patterns 15 increase the charge density of the outer peripheral portion 12 and the frame portion 14, thereby further enhancing the chargeability.

  For this reason, since the solder resist ink 17 that is turned back is attracted to the conductor pattern 15 of the outer peripheral portion 12 and the frame portion 14, the solder resist ink 17 concentrates on the outer peripheral portion 12 and the frame portion 14 of the printed wiring board 11, and as a result. The thickness variation of the solder resist formed on the individual printed wiring board 13 was ± 20 μm, and the thickness actually formed was in the range of 15 to 55 μm, and the variation could be reduced.

  Next, as shown in FIG. 3A, when the inner layer conductor pattern 18 is formed on the outer peripheral portion 12 and the frame portion 14 of the entire printed wiring board 11, the inner layer conductor pattern 18 of the inner peripheral portion 12 and the frame portion 14. Since this acts as a ground, the charge density of the outer peripheral portion 12 and the frame portion 14 is further increased as compared with the configuration of FIG. 2, and the chargeability is enhanced.

  For this reason, the solder resist ink 17 that is turned around is applied to the outer peripheral portion 12 and the frame portion 14 of the printed wiring board 11 in order to be attracted to the inner conductor pattern 18 of the outer peripheral portion 12 and the frame portion 14. The

  Therefore, the wraparound to the product portion near the outer peripheral portion 12 on the back side of the solder resist ink application surface is reduced, and the conductor pattern 15 of the frame portion 14 suppresses the concentration of the solder resist ink 17 on the outer peripheral portion 12. As a result, it is possible to reduce the thickness variation of the solder resist formed on the entire aggregate printed wiring board composed of the plurality of individual printed wiring boards 13.

  When the solder resist ink was applied to the printed wiring board 11 having the above configuration by the electrostatic coating method, the thickness variation of the solder resist formed on the individual printed wiring board 13 could be reduced to ± 17 μm.

  Further, as shown in FIG. 3 (b), a conductive hole 19 is formed between the outer layer 12 of the printed wiring board 11 and the outer layer conductor pattern 15 of the frame portion 14 and the inner layer conductor pattern 18 of the inner layer to provide interlayer connection. As a result, the charge density of the outer peripheral portion 12 and the frame portion 14 can be further increased. For this reason, the electric resistance can be further enhanced as compared with the configuration of the printed wiring board shown in FIG. 3A, and the force for attracting the solder resist ink 17 that is turned around to the outer peripheral portion 12 and the frame portion 14 is improved. Can do. As a result, the thickness variation of the solder resist formed on the individual printed wiring board 13 was further reduced, and could be reduced to ± 15 μm.

  The plurality of ground patterns 16 formed on the printed wiring board 11 in the present embodiment are portions that are chucked by a metal conveyance jig of the conveyance means of the electrostatic coating apparatus, and the printed wiring board 11 is electrostatically charged. The solder resist ink is applied while being conveyed in the coating apparatus.

  In this case, since the charge density of the outer peripheral portion 12 and the frame portion 14 is further increased due to the conveyance jig being in contact with the ground pattern 16, the charging property is further enhanced. And the force attracted to the frame portion 14 is improved. As a result, the thickness variation of the solder resist formed on the individual printed wiring board 13 is reduced to ± 12 μm.

  It should be noted that at least one of the plurality of ground patterns is electrically connected to the solder resist ink absorbing means of the outer peripheral portion 12 and the frame portion 14 and the inner layer conductor pattern 18, and the other ground pattern is connected to the front or back surface or only the front or back surface. It can also be employed as a configuration electrically connected to the solder resist ink absorbing means. Thereby, by selecting the ground pattern to be chucked by the transport jig, the strength of the charging property of the solder resist ink absorbing means can be changed according to the number of individual printed wiring boards 13, the circuit shape, and the like. .

  The solder resist 21 thus formed is then once cured as shown in FIG. 2 (b) and further subjected to exposure and development processes as shown in FIG. 2 (c). A desired image is formed by removing places such as lands that require mounting of electronic components. Thereafter, the collective printed wiring board 11 is divided into individual printed wiring boards 13 through a normal manufacturing process, and is completed as a printed wiring board.

  In the present embodiment, the configuration in which the conductor pattern 15 and the ground pattern 16 as the solder resist ink absorbing means formed in the outer peripheral portion 12 and the frame portion 14 are formed simultaneously with the circuits in the individual printed wiring board 13 has been described. However, it is good also as a structure formed separately. When each is formed separately, it is particularly effective in the examples of Embodiments 4 and 6 described later.

  Further, in order to suppress variations in the solder resist to be formed, the area and density of the conductor pattern 15 in the outer peripheral portion 12 and the frame portion 14 may be appropriately changed for the inner and outer layers depending on the pattern shape of the individual printed wiring board 13. Good.

  Next, the comparison of the density of the linear conductor pattern 15 formed in the outer peripheral part 12 and the frame part 14 is demonstrated in detail. A plurality of linear conductor patterns 15 as the solder resist ink absorbing means are provided in the same area of the outer peripheral portion 12 and the frame portion 14, and the conductor width: conductor gap is (a) 200 μm: 200 μm, (b) 150 μm: 150 μm, (C) 100 μm: 100 μm, (d) 50 μm: 50 μm.

  Here, the smaller the conductor width / conductor interval, the higher the charge density and the higher the chargeability. Therefore, the electrical attraction of the conductor pattern 15 attracts the solder resist ink 17 that wraps around the back side of the coated surface of the printed wiring board 11. The forces are (d)> (c)> (b)> (a) in order.

  Since the force to absorb the solder resist ink 17 increases as the electric attraction force increases, the solder resist ink 17 that is turned around is easily absorbed by the conductor pattern 15 of the outer peripheral portion 12 and the frame portion 14. As a result, as a result of applying the solder resist ink to each, the thickness variation of the solder resist formed on the product portion, that is, the individual printed wiring board 13, is (a) ± 24 μm, (b) ± 20 μm, (c) ± 18 μm and (d) were ± 16 μm. From these results, a particularly remarkable effect was observed in the variation at 100 μm: 100 μm or less.

  Thus, as the solder resist absorbing means, the conductor pattern 15 is formed on the outer peripheral portion 12 and the frame portion 14 of the printed wiring board 11, and the conductor width: the pitch of the conductor gap is narrowed, whereby the outer peripheral portion 12 and the frame portion 14 are reduced. The solder resist ink 17 that wraps around the back side of the coated surface of the printed wiring board 11 can be applied so as to be absorbed by the outer peripheral portion 12 and the frame portion 14. 13 can reduce the thickness variation of the solder resist formed on the substrate 13.

  As described above, according to the present embodiment, as the solder resist ink absorbing means, the conductor pattern is formed on the outer peripheral portion and the frame portion of the inner layer or outer layer of the printed wiring board and is electrically connected to the conductor pattern. By providing a plurality of grounding patterns and, if necessary, forming conduction holes between the inner and outer layers, or by bringing the conductor pattern of the outer peripheral portion into contact with a metal transport jig, the charging performance of the outer peripheral portion and the frame portion is enhanced. The solder resist ink that wraps around the back side of the application surface of the printed wiring board can be applied so as to be absorbed by the outer peripheral portion and the frame portion. Thereby, the thickness variation of the solder resist formed in the individual printed wiring board which is a product part can be reduced.

(Embodiment 2)
Next, Embodiment 2 of the present invention will be described with reference to the drawings.

  FIG. 4 is a sectional view of a conductor pattern 15a in which the surface of the conductor pattern 15 as the solder resist ink absorbing means shown in FIG.

  4 is formed by performing physical polishing such as buff polishing, brush polishing, sand blasting, etc. on the surface of the conductor pattern 15 in FIG. The surface roughness at this time is 0.01 to 50 μm.

  When unevenness is formed on the surface in this way, the width of the tip portion becomes narrow, so the charge density increases and the chargeability is strengthened, so the electrical suction force that attracts the solder resist ink that wraps around the back side of the coated surface of the printed wiring board Will improve.

  The greater the electrical attraction force, the greater the force to absorb the solder resist ink, so that the solder resist ink that is turned around is easily absorbed by the conductor pattern in the outer peripheral portion and the frame portion. As a result, in this embodiment, when unevenness is formed on the conductor pattern of conductor width: conductor gap = 100 μm: 100 μm and coating is performed, the thickness variation of the solder resist formed on the product portion is reduced to ± 13 μm. It was.

  As described above, according to the present embodiment, the conductive pattern is formed on the outer peripheral portion of the printed wiring board as the solder resist ink absorbing means, and the surface portion is formed with irregularities so that the outer peripheral portion and the frame portion are charged. Solder resist ink that is strengthened and goes around to the back side of the coated surface of the printed wiring board can be applied so that it is absorbed by the outer peripheral part and the frame part outside the product part, and the thickness variation of the solder resist formed in the product part Can be reduced.

(Embodiment 3)
Next, Embodiment 3 of the present invention will be described with reference to the drawings.

  When the outer peripheral conductor pattern 15b formed as shown in FIG. 5 (a) is chemically polished, the tip portion 15c becomes narrower as shown in FIG. 5 (b). As shown in FIG. 5C, a pointed shape 15d is obtained.

  Here, since the charge density is increased and the chargeability is enhanced as the width of the conductor tip portion is narrowed, the electrical attractive force for attracting the solder resist ink that goes around to the back side of the coated surface of the printed wiring board is improved. This tendency becomes more conspicuous when the width of the tip portion is further narrowed and finally formed into a pointed shape.

  Thus, when the width of the tip portion of the conductor is narrowed, the thickness variation of the solder resist of the entire product portion is reduced. In particular, when the tip portion is pointed, the thickness variation of the solder resist is reduced to ± 15 μm.

  As described above, according to the present embodiment, the outer peripheral portion is formed by forming the conductor pattern on the outer peripheral portion and the frame portion of the printed wiring board as the solder resist absorbing means, narrowing the tip portion, and further forming the pointed shape. Solder resist ink that can be applied to the outer peripheral part and the frame part so that the solder resist ink that wraps around on the back side of the coated surface of the printed wiring board can be absorbed, and is formed in the product part. Variation in thickness can be reduced.

(Embodiment 4)
Next, a fourth embodiment of the present invention will be described with reference to the drawings.

  6, when the metal layer 20 is laminated on the conductor pattern 15 of the outer peripheral portion 12 and the frame portion 14 of the printed wiring board 11, the individual printed wiring in which the conductor height of the outer peripheral portion 12 and the frame portion 14 is the product portion. Since the distance for attracting electricity becomes shorter as the height of the conductor becomes higher than that of the board 13, the electrical attractive force is improved, and the solder resist ink that wraps around the back side of the coated surface of the printed wiring board 11 is applied to the outer peripheral portion 12 and the frame. It is absorbed by the portion 14 and becomes prominent particularly when a metal layer is laminated by 20 μm or more.

  In this embodiment, the thickness variation of the solder resist of the individual printed wiring board 13 when 20 μm is laminated is reduced to ± 15 μm. The method for laminating the metal layer may be any of plating, conductive paste application, metal vapor deposition, and metal paste.

  As described above, according to the present embodiment, by forming a conductor pattern on the outer peripheral portion and the frame portion of the aggregate printed wiring board as the solder resist absorbing means, and further laminating the metal layer, the outer peripheral portion and the frame portion are Solder resist ink that wraps around to the back side of the coated surface of the printed wiring board can be applied to be absorbed by the outer peripheral part and the frame part, and the thickness variation of the solder resist formed in the product part can be improved. Can be reduced.

(Embodiment 5)
Next, a fifth embodiment of the present invention will be described with reference to the drawings.

  In the present embodiment, the oxide film is removed by polishing, cleaning or the like on the surface of the conductor pattern 15 formed on the outer peripheral portion 12 and the frame portion 14 of the printed wiring board 11. By removing the oxide film, the chargeability is enhanced and the electric charge is easily concentrated. For this reason, the electrical suction force which attracts the solder resist ink 17 which goes around to the back side of the application surface of the printed wiring board 11 improves.

  As the electrical attraction force increases, the force to absorb the solder resist ink 17 increases, so that the solder resist ink 17 that is turned around is easily absorbed by the conductor pattern 15 of the outer peripheral portion 12 and the frame portion 14. As a result, in this embodiment, when the solder resist ink is applied after removing the oxide film on the surface of the conductor pattern 15 formed in the outer peripheral portion 12 and the frame portion 14, the thickness variation of the solder resist in the product portion is reduced to ± 18 μm. It was done.

  As described above, according to the present embodiment, the conductor pattern is formed on the outer peripheral portion and the frame portion of the printed wiring board as the solder resist absorbing means, and the oxide film on the surface is removed to thereby remove the outer peripheral portion and the frame portion. Solder resist ink that wraps around to the back side of the coated surface of the printed wiring board can be applied to be absorbed by the outer peripheral part and the frame part, and the thickness variation of the solder resist formed in the product part can be improved. Can be reduced.

(Embodiment 6)
Next, a sixth embodiment of the present invention will be described with reference to the drawings.

  On the printed wiring board 11 in which the conductor pattern 15 is formed of copper, silver plating having an electric resistance lower than that of copper is formed on the conductor pattern 15 of the outer peripheral portion 12 and the frame portion 14, for example.

  Since silver has a lower electrical resistance than copper, the charge density is higher than the portion where silver plating is not formed, and the chargeability is enhanced. As a result, the electrical suction force that attracts the solder resist ink 17 that wraps around the coated surface of the printed wiring board 11 is improved.

  For this reason, the solder resist ink 17 that is turned around is easily absorbed by the conductor pattern 15 in the outer peripheral portion and the frame portion. In the present embodiment, as a result of forming a conductor pattern 15 of conductor width: conductor gap = 100 μm: 100 μm on the outer peripheral portion 12 and the frame portion 14 and forming silver plating of 0.01 to 1.0 μm on the surface, The thickness variation of the solder resist of the individual printed wiring board 13 which is a product part was reduced to ± 16 μm.

  In this embodiment, although the silver forming method is formed by plating, any of silver paste application, silver vapor deposition, and silver paste may be used.

  As described above, according to the present embodiment, as the solder resist absorbing means, the conductor pattern is formed on the outer peripheral portion and the frame portion of the printed wiring board, and the circuit of the individual printed wiring board 13 that is the product portion is formed on the surface. By forming a metal having a lower electrical resistance than the metal, the chargeability of the outer peripheral portion and the frame portion is enhanced, and the solder resist ink that wraps around the back side of the application surface of the aggregate printed wiring board is absorbed by the outer peripheral portion and the frame portion. The thickness variation of the solder resist formed in the product portion can be reduced.

  Since the printed wiring board according to the present invention can obtain high interlayer connection reliability, it is necessary to satisfy a high reliability standard such as a fine wiring pattern, such as a personal computer, a mobile communication telephone, and a video camera. The present invention can be applied to a use related to a high-density printed wiring board for handling electronic equipment.

The top view which shows the printed wiring board in Embodiment 1 of this invention The expanded sectional view which shows the soldering resist electrostatic coating process of the printed wiring board in the embodiment The expanded sectional view of the printed wiring board in the embodiment The expanded sectional view of the printed wiring board in Embodiment 2 of the present invention Sectional drawing of the conductor pattern in Embodiment 3 of this invention Sectional drawing of the conductor pattern in Embodiment 4 of this invention Sectional drawing which shows the soldering resist electrostatic coating process of the conventional printed wiring board Plan view of a conventional collective printed wiring board

DESCRIPTION OF SYMBOLS 11 Printed wiring board 12 Outer peripheral part 13 Individual printed wiring board 14 Frame part 15 Conductive pattern 16 Grounding pattern 17 Solder resist ink 18 Inner layer conductive pattern 19 Conductive hole 20 Metal layer 21 Solder resist

Claims (18)

Preparing a laminate having a metal layer on the outermost layer of the insulating substrate;
Forming a circuit of an aggregate printed wiring board composed of a plurality of individual printed wiring boards on the insulating substrate;
Forming solder resist absorbing means and a plurality of grounding patterns between adjacent individual printed wiring boards and on the outer peripheral portion of the aggregate printed wiring board;
A step of grounding the ground pattern by a grounding means and electrostatically applying a solder resist ink to the laminate, wherein the ground pattern is electrically connected to the solder resist ink absorbing means. Manufacturing method of printed wiring board. 2. The method of manufacturing a printed wiring board according to claim 1, wherein the solder resist ink absorbing means has linear conductor patterns formed in parallel to each other. The method for manufacturing a printed wiring board according to claim 2, wherein a plurality of linear conductor patterns are formed. The laminated board is a multilayer laminated board having an inner layer conductor pattern, and the inner layer conductor pattern is electrically connected to at least one of a solder resist ink absorbing means or a plurality of ground patterns. The manufacturing method of the printed wiring board as described in 1 .. 2. The method for producing a printed wiring board according to claim 1, wherein the solder resist ink absorbing means is formed on the front and back of the laminated board, and the solder resist ink absorbing means on the front and back are electrically connected through a conduction hole. . 2. The printed wiring according to claim 1, wherein the solder resist ink absorbing means is formed on the front and back and inner layers of the laminated board, and the solder resist ink absorbing means on the front and back and inner layers are electrically connected through a conduction hole. A manufacturing method of a board. 2. The printed wiring board according to claim 1, wherein the grounding means is a metal transport jig that transports the laminated board, and the grounding means sandwiches at least one of the ground patterns with the transport jig. Production method. The method for producing a printed wiring board according to claim 1, wherein the solder resist ink absorbing means is formed simultaneously with a circuit formed on the aggregate printed wiring board. The method for manufacturing a printed wiring board according to claim 1, wherein the ground pattern is formed simultaneously with a circuit formed on the aggregate printed wiring board. 2. The method for manufacturing a printed wiring board according to claim 1, wherein the surface of the solder resist ink absorbing means is formed in an uneven shape. 2. The method for manufacturing a printed wiring board according to claim 1, wherein the solder resist ink absorbing means is formed in a shape in which the upper side portion of the cross-sectional shape is narrower than the width of the bottom side portion. The method for manufacturing a printed wiring board according to claim 1, wherein the solder resist ink absorbing means has a cross-sectional shape formed in a pointed shape. The method for producing a printed wiring board according to claim 1, wherein the height of the solder resist ink absorbing means is formed higher than the height of the circuit formed on the aggregate printed wiring board. 2. The method for producing a printed wiring board according to claim 1, wherein the height of the solder resist ink absorbing means is 20 μm or more higher than the height of the circuit formed on the aggregate printed wiring board. The manufacturing method of the printed wiring board of Claim 1 which removed the oxide film of the surface of a soldering resist ink absorption means. The method for producing a printed wiring board according to claim 1, wherein a metal having a lower electric resistance than that of a metal forming a circuit of the aggregate printed wiring board is formed on the surface of the solder resist ink absorbing means. An aggregate printed wiring board comprising a plurality of individual printed wiring boards having a circuit on an insulating substrate;
Solder resist ink absorption means on the insulating base material between the adjacent individual printed wiring boards and the outer peripheral portion of the collective printed wiring board;
A grounding pattern formed at an end of the insulating substrate;
The printed wiring board, wherein the ground pattern is electrically connected to the solder resist absorbing means. The printed wiring board is characterized in that the variation in thickness of the solder resist formed on the individual printed wiring board is 20 μm or less.

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