JP2003283280A - Method of manufacturing oscillator - Google Patents

Method of manufacturing oscillator

Info

Publication number
JP2003283280A
JP2003283280A JP2002077861A JP2002077861A JP2003283280A JP 2003283280 A JP2003283280 A JP 2003283280A JP 2002077861 A JP2002077861 A JP 2002077861A JP 2002077861 A JP2002077861 A JP 2002077861A JP 2003283280 A JP2003283280 A JP 2003283280A
Authority
JP
Japan
Prior art keywords
solder
manufacturing
vibrator
solder paste
flux
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002077861A
Other languages
Japanese (ja)
Inventor
Eiji Shigeta
栄治 重田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Miyota KK
Original Assignee
Miyota KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Miyota KK filed Critical Miyota KK
Priority to JP2002077861A priority Critical patent/JP2003283280A/en
Publication of JP2003283280A publication Critical patent/JP2003283280A/en
Pending legal-status Critical Current

Links

Landscapes

  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing an oscillator which uses a solder paste, without depositing its solder particulates to an oscillating piece. <P>SOLUTION: The oscillator manufacturing method comprises solidifying once molten solder particulates in a solder paste, remelting the solidified solder, and settling it with an oscillating piece. <P>COPYRIGHT: (C)2004,JPO

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】この発明は半田ペーストを用
いた振動子の製造方法に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a vibrator manufacturing method using a solder paste.

【0002】[0002]

【従来の技術】図1は本発明にかかわる円筒型水晶振動
子1の斜視図である。円筒型水晶振動子1の容器は封止
管2、金属環3、絶縁部材4、二本のリード線5等で構
成されていて、内部に水晶を矩形状に加工した矩形状水
晶片が収納されている。
2. Description of the Related Art FIG. 1 is a perspective view of a cylindrical crystal resonator 1 according to the present invention. The container of the cylindrical crystal resonator 1 is composed of a sealing tube 2, a metal ring 3, an insulating member 4, two lead wires 5 and the like, and a rectangular crystal piece obtained by processing the crystal into a rectangular shape is housed inside. Has been done.

【0003】図2は気密端子6の斜視図である。気密端
子6は二本のリード線5を絶縁部材4を介して金属環3
に固定している。
FIG. 2 is a perspective view of the airtight terminal 6. The airtight terminal 6 includes two lead wires 5 via the insulating member 4 and the metal ring 3
It is fixed to.

【0004】図3は本発明にかかわる円筒型水晶振動子
1の内部構造の斜視図である。矩形状水晶片7は図中記
載のX軸方向を矩形状水晶片短手方向、Y軸方向を矩形
状水晶片長手方向といい、X軸とY軸を含む矩形状水晶
片平面を主面と呼ぶ。主面の両面にはそれぞれ電極8が
構成されており、二本のインナーリード線5Aは半田9
により矩形状水晶片7の主面の長手方向の一端に片支持
で導通がとられている。
FIG. 3 is a perspective view of the internal structure of a cylindrical crystal unit 1 according to the present invention. In the rectangular crystal piece 7, the X-axis direction shown in the drawing is called the rectangular crystal piece lateral direction and the Y-axis direction is called the rectangular crystal piece longitudinal direction, and the rectangular crystal piece plane including the X axis and the Y axis is the main surface. Call. Electrodes 8 are formed on both sides of the main surface, and the two inner lead wires 5A are solder 9
Thus, the rectangular crystal piece 7 is electrically connected to one end of the main surface of the rectangular crystal piece 7 in the longitudinal direction by one-sided support.

【0005】図4は半田ペースト10を塗布した気密端
子6の断面図である。半田ペースト10には半田微粒子
10Aと有機溶剤10Bが含まれている。
FIG. 4 is a sectional view of the airtight terminal 6 to which the solder paste 10 is applied. The solder paste 10 contains solder fine particles 10A and an organic solvent 10B.

【0006】図5は加熱後の半田9と気密端子6と矩形
状水晶片7の断面図である。インナーリード線5Aに半
田ペースト10を塗布した後、矩形状水晶片7をインナ
ーリード線5A間に挿入し、加熱する。加熱された半田
ペースト10中の半田微粒子10Aは液相線温度以上で
溶体(溶けている状態)となる。その後、固相線温度以
下で再度固体となり、インナーリード線5Aと矩形状水
晶片7上の電極8とが導通固定される。
FIG. 5 is a sectional view of the solder 9, the airtight terminal 6, and the rectangular crystal piece 7 after heating. After applying the solder paste 10 to the inner lead wires 5A, the rectangular crystal piece 7 is inserted between the inner lead wires 5A and heated. The solder fine particles 10A in the heated solder paste 10 become a solution (melted state) at a liquidus temperature or higher. Then, it becomes solid again below the solidus temperature, and the inner lead wire 5A and the electrode 8 on the rectangular quartz piece 7 are electrically connected and fixed.

【0007】前述のように半田を用いた水晶振動子の製
造方法は、インナーリードに半田ペーストを塗布する工
程と半田ペーストを塗布したインナーリード間に矩形状
水晶片を挿入する工程とその後加熱し半田微粒子を溶融
固化させインナーリードと矩形状水晶片上の電極を導通
固定させる工程となっている。
As described above, the method of manufacturing a crystal unit using solder includes a step of applying a solder paste to the inner leads, a step of inserting a rectangular crystal piece between the inner leads coated with the solder paste, and then heating. This is a step of melting and solidifying the solder fine particles to electrically connect and fix the inner lead and the electrode on the rectangular crystal piece.

【0008】[0008]

【発明が解決しようとする課題】半田微粒子と有機溶剤
が含まれている半田ペーストを加熱すると温度上昇によ
り半田ペースト内の有機溶剤が沸騰し突沸が発生する。
突沸により半田微粒子が飛び散り矩形状水晶片に付着す
る。付着した半田微粒子は振動子の諸特性に悪影響を及
ぼす可能性がある。本発明はこの課題を解決することを
目的としている。
When the solder paste containing the fine solder particles and the organic solvent is heated, the organic solvent in the solder paste is boiled due to the temperature rise and bumping occurs.
The bumps cause the fine solder particles to scatter and adhere to the rectangular crystal piece. The attached solder fine particles may adversely affect various characteristics of the vibrator. The present invention aims to solve this problem.

【0009】[0009]

【課題を解決するための手段】二本のリード線を絶縁部
材を介して金属環に固定した気密端子の二本のインナー
リードと矩形状水晶片とを半田ペーストによって固定す
る振動子の製造方法に於いて、少なくともインナーリー
ドに半田ペーストを塗布する工程と塗布した半田ペース
トを加熱し溶融後固化させる工程と固化した半田を再溶
融して矩形状水晶片を固定する工程とを具備する振動子
の製造方法とする。
A method for manufacturing a vibrator in which two inner leads of an airtight terminal in which two lead wires are fixed to a metal ring via an insulating member and a rectangular crystal piece are fixed by a solder paste. In at least an inner lead, a step of applying a solder paste to the inner lead, a step of heating the applied solder paste to melt and then solidifying, and a step of remelting the solidified solder to fix a rectangular crystal piece Manufacturing method.

【0010】前記振動子の製造方法に於いて、溶融固化
工程後、又は固化した半田を再溶融して矩形状水晶片と
固定する工程後、半田のフラックス等を除去する工程を
具備する振動子の製造方法とする。
In the above-mentioned vibrator manufacturing method, a vibrator having a step of removing solder flux or the like after the step of melting and solidifying or after the step of remelting the solidified solder and fixing it to the rectangular crystal piece. Manufacturing method.

【0011】二本のリード線を絶縁部材を介して金属環
に固定した気密端子の二本のインナーリードと矩形状水
晶片とを半田ペーストによって固定する振動子の製造方
法に於いて、少なくともインナーリードに半田ペースト
を塗布する工程と塗布した半田ペーストを加熱し溶融後
固化させる工程と溶融固化工程後、半田にフラックスを
塗布する工程と固化した半田を再溶融して矩形状水晶片
を固定する工程とを具備する振動子の製造方法とする。
In a method of manufacturing a vibrator, two inner leads of an airtight terminal in which two lead wires are fixed to a metal ring via an insulating member and a rectangular crystal piece are fixed by a solder paste, at least the inner After applying the solder paste to the leads, heating the applied solder paste to solidify it after melting and solidifying, and then applying flux to the solder and remelting the solidified solder to fix the rectangular crystal piece. A method of manufacturing a vibrator, comprising:

【0012】二本のリード線を絶縁部材を介して金属環
に固定した気密端子の二本のインナーリードと矩形状水
晶片とを半田ペーストによって固定する振動子の製造方
法に於いて、少なくともインナーリードに半田ペースト
を塗布する工程と塗布した半田ペーストを加熱し溶融後
固化させる工程と溶融固化工程後、半田のフラックス等
を除去する工程と再度半田にフラックスを塗布する工程
と固化した半田を再溶融して矩形状水晶片を固定する工
程とを具備する振動子の製造方法とする。
In a method of manufacturing a vibrator, in which two inner leads of an airtight terminal in which two lead wires are fixed to a metal ring via an insulating member and a rectangular crystal piece are fixed by a solder paste, at least the inner After applying the solder paste to the leads, heating the applied solder paste to solidify after melting, and solidifying after melting, the process of removing flux etc. of the solder, the process of applying flux to the solder again, and the solidified solder And a step of melting and fixing the rectangular crystal piece.

【0013】二本のリード線を絶縁部材を介して金属環
に固定した気密端子の二本のインナーリードと矩形状水
晶片とを半田ペーストによって固定する振動子の製造方
法に於いて、少なくともインナーリードに半田ペースト
を塗布する工程と塗布した半田ペーストを加熱し溶融後
固化させる工程と溶融固化工程後、半田にフラックスを
塗布する工程と固化した半田を再溶融して矩形状水晶片
と固定する工程と半田のフラックス等を除去する工程と
を具備する振動子の製造方法とする。
In a method of manufacturing a vibrator, two inner leads of an airtight terminal in which two lead wires are fixed to a metal ring via an insulating member and a rectangular crystal piece are fixed by a solder paste, at least the inner After applying the solder paste to the leads, heating the applied solder paste to solidify after melting, and melting and solidifying the solder, apply flux to the solder and remelt the solidified solder to fix it to the rectangular crystal piece. A method of manufacturing a vibrator, comprising: a step and a step of removing solder flux and the like.

【0014】[0014]

【発明の実施の形態】工程1では、気密端子6のインナ
ーリード線5Aに半田ペースト10を塗布する。塗布す
る半田ペースト10はSn:Pb比が63%:37%、
共晶線温度(液相線温度と固相線温度が同一)が約18
3度のものを使用した。
BEST MODE FOR CARRYING OUT THE INVENTION In step 1, a solder paste 10 is applied to an inner lead wire 5A of an airtight terminal 6. The solder paste 10 to be applied has a Sn: Pb ratio of 63%: 37%,
Eutectic temperature (liquidus temperature and solidus temperature are the same) is about 18
The thing of 3 times was used.

【0015】工程2では、半田ペースト10を塗布した
気密端子6を加熱し、半田微粒子10Aを溶融してから
固化する。半田ペースト10中の半田微粒子10Aは液
相線温度(約183度)以上で溶融し、溶融後自然冷却
し固相線温度(約183度)以下で固化する。
In step 2, the airtight terminal 6 coated with the solder paste 10 is heated to melt and solidify the solder fine particles 10A. The solder fine particles 10A in the solder paste 10 are melted at a liquidus temperature (about 183 ° C.) or higher, are naturally cooled after melting, and are solidified at a solidus temperature (about 183 ° C.) or lower.

【0016】工程2により、半田ペースト10中のフラ
ックス等の有機溶剤10Bは加熱によりある程度揮発し
てしまうので再度有機溶剤10Bを塗布する。これは溶
融後固化した半田9表面は酸化膜で覆われており、その
影響で矩形状水晶片7上の電極8と導通固定しにくいの
で活性力を高めるために再度有機溶剤10Bを塗布する
工程を追加したほうがよいが、省略することもできる。
In step 2, the organic solvent 10B such as flux in the solder paste 10 is volatilized to some extent by heating, so the organic solvent 10B is applied again. This is because the surface of the solder 9 solidified after melting is covered with an oxide film, and due to the effect, it is difficult to electrically connect and fix with the electrode 8 on the rectangular crystal piece 7, so the step of applying the organic solvent 10B again in order to increase the activity. Should be added, but can be omitted.

【0017】工程3では、気密端子6のインナーリード
線5A間に矩形状水晶片7を挿入し、半田9を再溶融・
固化して矩形状水晶片7を固定する。半田9は液相線温
度(約183度)以上で溶融し、溶融後自然冷却し固相
線温度(約183度)以下で矩形状水晶片7上の電極8
と導通固化される。
In step 3, the rectangular crystal piece 7 is inserted between the inner lead wires 5A of the hermetic terminal 6, and the solder 9 is remelted.
The rectangular crystal piece 7 is solidified and fixed. The solder 9 is melted at a liquidus temperature (about 183 ° C.) or higher, is naturally cooled after melting, and is an electrode 8 on the rectangular crystal piece 7 at a solidus temperature (about 183 ° C.) or lower.
And is solidified with conduction.

【0018】固化した半田9表面にはフラックス等の有
機溶剤10Bが残る。この有機溶剤10Bが残っている
と振動子の諸特性に悪影響を及ぼす可能性があるので塩
素系溶剤などを用いて除去する工程を追加したほうがよ
い。
The organic solvent 10B such as flux remains on the surface of the solidified solder 9. If the organic solvent 10B remains, it may adversely affect various characteristics of the vibrator. Therefore, it is better to add a step of removing the organic solvent 10B using a chlorine-based solvent or the like.

【0019】以上、本発明を矩形状水晶振動子で説明し
たが、セラミックやその他(単結晶圧電素子など)を使
用した振動片にも適応できる。
Although the present invention has been described with reference to the rectangular crystal oscillator, the present invention can be applied to a resonator element using ceramics or the like (single crystal piezoelectric element or the like).

【0020】[0020]

【発明の効果】本発明により、リード線と振動片上の電
極を導通させる前に半田ペースト中の半田微粒子を溶融
し固化させてしまうので、振動片を半田付けする際に振
動片上に半田微粒子が付着することはない。
According to the present invention, since the fine solder particles in the solder paste are melted and solidified before the lead wire and the electrode on the vibrating piece are electrically connected, the solder fine particles are not deposited on the vibrating piece when soldering the vibrating piece. It does not adhere.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明にかかわる円筒型水晶振動子の斜視図FIG. 1 is a perspective view of a cylindrical crystal unit according to the present invention.

【図2】気密端子の斜視図FIG. 2 is a perspective view of an airtight terminal.

【図3】本発明にかかわる円筒型水晶振動子内部の斜視
FIG. 3 is a perspective view of the inside of a cylindrical crystal unit according to the present invention.

【図4】加熱前の半田ペーストと気密端子の断面図FIG. 4 is a sectional view of the solder paste and the airtight terminal before heating.

【図5】加熱後の半田と気密端子と矩形状水晶片の断面
FIG. 5 is a sectional view of the solder, the airtight terminal, and the rectangular crystal piece after heating.

【符号の説明】[Explanation of symbols]

1 円筒型水晶振動子 2 封止管 3 金属管 4 絶縁部材 5 リード線 5A インナーリード線 6 気密端子 7 矩形状水晶片 8 電極 9 半田 10 半田ペースト 10A 半田微粒子 10B 有機溶剤 1 Cylindrical crystal unit 2 Sealed tube 3 metal tubes 4 Insulation member 5 lead wires 5A inner lead wire 6 Airtight terminal 7 rectangular crystal pieces 8 electrodes 9 solder 10 Solder paste 10A solder fine particles 10B organic solvent

Claims (5)

【特許請求の範囲】[Claims] 【請求項1】 二本のリード線を絶縁部材を介して金属
環に固定した気密端子の二本のインナーリードと振動片
とを半田ペーストによって固定する振動子の製造方法に
於いて、少なくともインナーリードに半田ペーストを塗
布する工程と塗布した半田ペーストを加熱し溶融後固化
させる工程と固化した半田を再溶融して振動片を固定す
る工程とを具備する事を特徴とする振動子の製造方法。
1. A vibrator manufacturing method in which two inner leads of an airtight terminal in which two lead wires are fixed to a metal ring via an insulating member and a vibrating piece are fixed by a solder paste, and at least an inner member is provided. A method of manufacturing a vibrator, comprising: a step of applying a solder paste to a lead; a step of heating the applied solder paste to melt it and then solidifying it; and a step of remelting the solidified solder to fix a vibrating piece. .
【請求項2】 請求項1記載の製造方法に於いて、溶融
固化工程後、又は固化した半田を再溶融して振動片と固
定する工程後、半田のフラックス等を除去する工程を追
加する事を特徴とする振動子の製造方法。
2. The manufacturing method according to claim 1, wherein a step of removing solder flux or the like is added after the step of melting and solidifying or after the step of remelting the solidified solder and fixing it to the resonator element. And a method of manufacturing a vibrator.
【請求項3】 請求項1記載の製造方法に於いて、溶融
固化工程後、半田にフラックス等を塗布する工程を追加
する事を特徴とする振動子の製造方法。
3. The method of manufacturing a vibrator according to claim 1, further comprising a step of applying flux or the like to the solder after the melting and solidifying step.
【請求項4】 請求項1記載の製造方法に於いて、溶融
固化工程後、半田のフラックス等を除去する工程とフラ
ックス等を除去した後、再度半田にフラックス等を塗布
する工程を追加する事を特徴とする振動子の製造方法。
4. The manufacturing method according to claim 1, wherein after the melting and solidifying step, a step of removing the flux or the like of the solder and a step of again applying the flux or the like to the solder after removing the flux or the like are added. And a method of manufacturing a vibrator.
【請求項5】 請求項1記載の製造方法に於いて、溶融
固化工程後、半田にフラックスを塗布する工程と固化し
た半田を再溶融して振動片と固定する工程後、半田のフ
ラックス等を除去する工程を追加する事を特徴とする振
動子の製造方法。
5. The manufacturing method according to claim 1, wherein after the step of melting and solidifying, the step of applying flux to the solder and the step of remelting the solidified solder and fixing it to the vibrating piece A method of manufacturing a vibrator, which is characterized by adding a step of removing the vibrator.
JP2002077861A 2002-03-20 2002-03-20 Method of manufacturing oscillator Pending JP2003283280A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002077861A JP2003283280A (en) 2002-03-20 2002-03-20 Method of manufacturing oscillator

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002077861A JP2003283280A (en) 2002-03-20 2002-03-20 Method of manufacturing oscillator

Publications (1)

Publication Number Publication Date
JP2003283280A true JP2003283280A (en) 2003-10-03

Family

ID=29228145

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002077861A Pending JP2003283280A (en) 2002-03-20 2002-03-20 Method of manufacturing oscillator

Country Status (1)

Country Link
JP (1) JP2003283280A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005223885A (en) * 2004-01-07 2005-08-18 Miyota Kk Quartz oscillator manufacturing method and fluxless soldering device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005223885A (en) * 2004-01-07 2005-08-18 Miyota Kk Quartz oscillator manufacturing method and fluxless soldering device

Similar Documents

Publication Publication Date Title
JP5216290B2 (en) Piezoelectric device and method for manufacturing piezoelectric device
JP2003283280A (en) Method of manufacturing oscillator
JP2002261570A (en) Package base for crystal oscillator, and method for producing crystal oscillator package structure using the same
JPH0936690A (en) Thin crystal vibrator
JP2001267190A (en) Electronic component and method for manufacturing the same
JP2003224223A (en) Seal cap for ceramic package
JP5131438B2 (en) Method for manufacturing piezoelectric device
JP3401781B2 (en) Electronic component package and method of manufacturing electronic component package
JP2001313534A (en) Manufacturing method for capacitor incorporated piezoelectric resonator and lead terminal
JPS6150413A (en) Manufacture of piezoelectric vibrator
JPH0865093A (en) Electronic component and manufacture thereof
JP3173546B2 (en) Method of forming bump
JP4216653B2 (en) Vibrator cleaning device and cleaning method
JP2010165904A (en) Electronic component package, and manufacturing method therefor
JP2007142186A (en) Method of manufacturing lid body for electronic component package, lid body for electronic component package manufactured using the same, method of manufacturing electronic component package, and electronic component package manufactured using the same
JP2004048717A (en) Forming method of twin crystal, quartz crystal oscillating piece, manufacturing method thereof and quartz crystal device
JPH01230213A (en) Electronic part
JPH10242633A (en) Manufacture of electronic device
JPH088684A (en) Piezo-oscillator
JP2004031474A (en) Electronic component and manufacturing method therefor
JP2006080599A (en) Piezoelectric vibrator and manufacturing method thereof
JP2000188056A (en) Protection element and its manufacture
JP2002299484A (en) Electronic component
JPS63187906A (en) Press-in type airtight holder for piezoelectric vibrator
JP2005175654A (en) Quartz resonator

Legal Events

Date Code Title Description
A621 Written request for application examination

Effective date: 20041213

Free format text: JAPANESE INTERMEDIATE CODE: A621

A977 Report on retrieval

Effective date: 20061120

Free format text: JAPANESE INTERMEDIATE CODE: A971007

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20061128

A02 Decision of refusal

Effective date: 20070327

Free format text: JAPANESE INTERMEDIATE CODE: A02