JP2003283133A - Multi-layer wiring substrate and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method for a multi-layer wiring substrate which can obtain good layer connection for all the conductor posts. <P>SOLUTION: The multi-layer wiring substrate has plural insulating layers, a conductor circuit that is formed on at least one face of each insulating layer and the conductor post that passes through the insulating layer and that connects to the conductor circuit. The multi-layer wiring substrate is inter-layer connected by the conductor post. In the multi-layer wiring substrate and its manufacturing method, an inner conductor post is formed only on a position equivalent to a position perpendicularly above the conductor post positioned at an outermost layer on both faces of the multi-layer wiring substrate. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to a multilayer wiring board and a method for manufacturing the same.

[0002]

2. Description of the Related Art With the recent demand for high functionality, lightness, thinness, shortness, and miniaturization of electronic devices, high-density integration and further high-density mounting of electronic parts have been advanced, and they are used in these electronic devices. Semiconductor packages are becoming smaller and more pins than ever before.

A conventional circuit board is called a printed wiring board, and is composed of a laminate of glass fiber woven cloth impregnated with epoxy resin. After patterning a copper foil attached to a glass epoxy board, a plurality of layers are stacked. The mainstream method is to use a wiring board in which layers are laminated and bonded, a through hole is drilled, copper is plated on the wall surface of the hole to form a via, and electrical connection is made between layers. However, the miniaturization and high densification of mounted components have advanced, and the wiring density is insufficient in the above-described wiring board, which causes a problem in mounting the components.

Under these circumstances, build-up multilayer wiring boards have been adopted in recent years. The build-up multilayer wiring board is formed by stacking an insulating layer composed only of resin and a conductor. As a method for forming vias, instead of conventional drilling, there are various methods such as laser method, plasma method, and photo method, and via holes of small diameter are freely arranged to achieve high density. There are blind vias (Blind Vias) and buried vias (Buried Vias: a structure in which a via is filled with a conductor) as an interlayer connection portion, and a stacked via in which a via is formed on the via is possible. Has been done. Barry via holes are classified into a method of filling the via holes with plating and a method of filling the via holes with a conductive paste or the like. On the other hand, as a method of forming a conductor circuit, there are a method of etching a copper foil (subtractive method), a method of electrolytic copper plating (additive method), etc., and an additive method capable of coping with high wiring density is particularly noted. Is being started.

A via hole is formed in a two-layer base material consisting of an insulating layer and a metal layer, and a conductor post is formed by filling the via hole by electrolytic plating using the metal layer as a lead for electrolytic plating. Then, the metal layer is patterned (etched). )
There is a method of manufacturing a single-sided wiring board in which a conductor circuit is formed.
Since the multilayer wiring board obtained by laminating the single-sided wiring boards is interlayer-connected by the conductor posts, a stacked via structure is possible and the interlayer connection density can be increased.

In such a method for manufacturing a multilayer wiring board, the pressure distribution at the time of stacking occurs due to the position in the in-plane direction and the position in the thickness direction of the conductor posts as well as the pattern and density of the conductor circuit. There is a problem that good interlayer connection may not be obtained in all the conductor posts, resulting in a decrease in manufacturing yield.

[0007]

DISCLOSURE OF THE INVENTION The present invention has been made as a result of extensive studies in view of such problems of interlayer connection, and manufacture of a multilayer wiring board in which good interlayer connection can be obtained in all conductor posts. The purpose is to provide a method.

[0008]

The present invention includes: A plurality of insulating layers, a conductor circuit formed on at least one surface of each insulating layer, and a conductor post penetrating the insulating layer to connect with the conductor circuit, and are interlayer-connected by the conductor post. A multilayer wiring board, wherein the inner layer conductor posts are formed only at positions corresponding to vertically above the conductor posts located on the outermost layers on both sides of the multilayer wiring board, and 2. ． A multilayer formed by laminating a plurality of wiring boards each having an insulating layer in contact with at least one surface of the conductor circuit and a conductor post penetrating the insulating layer and connecting to the conductor circuit, and connecting the layers by the conductor posts. A method of manufacturing a wiring board, comprising:
When forming the conductor posts of the wiring board as the inner layer, the conductor posts are formed only at positions corresponding to vertically above the conductor posts located at the outermost layers on both surfaces of the multilayer wiring board. A method for manufacturing a wiring board is provided.

[0009]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be specifically described with reference to the drawings, but the present invention is not limited thereto.

FIG. 2 is a view for explaining an example of a method for manufacturing a multilayer wiring board according to an embodiment of the present invention, and FIG. 2 (c).
FIG. 3 is a cross-sectional view showing an example of the structure of a multilayer wiring board having conductor circuits for four layers and conductor posts for three layers connecting them between layers.

First, the wiring boards 110a to 110c and the layer 220 to be connected are aligned with each other (FIG. 2A). For the alignment, use is made of a method of aligning a positioning mark previously formed on the wiring boards 110a to 110c and the layer 220 to be connected by reading with an image recognition device, a method of aligning with a pin for alignment, or the like. You can The wiring boards 110a to 110c each include an insulating layer that is in contact with at least one surface of the conductor circuit, a conductor post that penetrates the insulating layer and is connected to the conductor circuit, and further includes an adhesive layer for bonding the layers. It has a structure formed on the surface of the insulating layer. The conductor posts of the wiring board 110b, which is the inner wiring board, are the outermost wiring boards 110a, 110.
It is formed at a position vertically above the conductor post formed in c.

Next, the wiring boards 110a to 110c and the layer 220 to be connected are collectively heated and pressed to collectively melt all the joining metal material layers to perform interlayer connection, and the multilayer wiring board 240. Is obtained (FIG. 2 (b)). As a method of heating / pressurizing, for example, a vacuum press is used to remove the adhesive layer 109 from the bonding metal material layer 108, and the bonded portion 2
30 and the conductor post 107, the metal material layer 108 for joining
A method of adhering the wiring substrates 110a to 110c and the layer 220 to be connected to the wiring substrate 110a to 110c is performed by heating and pressurizing until the metal bonding is performed, and further curing the adhesive layer 109. It is essential that the maximum heating temperature is equal to or higher than the melting point of the bonding metal material layer 108.

Finally, the metal layer 201 is removed by etching to obtain a multilayer wiring board 240 (FIG. 2).
(C)). Through the above steps, it is possible to manufacture a multilayer wiring board in which the conductor circuits of the respective layers and the conductor posts are metal-bonded by the metal material layer for bonding, and the respective layers are bonded by the adhesive layer.

The features of the present invention will now be described, including differences from the conventional method for manufacturing a multilayer wiring board shown in FIG. First, the present invention will be described. In FIG. 2A, the wiring boards 110a and 110c include conductor posts positioned at the outermost layers when the wiring board finally becomes a multilayer wiring board, whereas the wiring board 110b finally has a multilayer wiring board. It includes conductor posts located in the inner layer when it becomes a wiring board. Here, the conductor posts located in the inner layer of the multilayer wiring board are formed only at positions corresponding to vertically above the conductor posts located in the outermost layers on both surfaces of the multilayer wiring board, as shown by the dotted line in the figure. .

Next, a conventional method for manufacturing a multilayer wiring board will be described with reference to FIG. As shown in FIG. 3A, the conductor posts located in the inner layer of the multilayer wiring board correspond to the vertical positions of the conductor posts located in the outermost layers on both sides of the multilayer wiring board, as indicated by the dotted line in the figure. It is not formed only at the position, but as shown at 350 in FIG. 3, it is also formed at a position other than the position corresponding to the vertical position of the conductor post located at the outermost layer on both surfaces of the multilayer wiring board. In the heating / pressurizing step of FIG. 3B, the conductor post formed at the position corresponding to the vertical position receives an appropriate pressure necessary for interlayer connection, but it is formed at a position other than the vertical position. Since the appropriate pressure required for interlayer connection is unlikely to be applied to the conductor posts that are present, interlayer connection failure occurs at this portion, and the yield decreases. By increasing the pressure in the heating / pressurizing process, it is possible to avoid interlayer connection failure in the conductor posts formed at positions other than vertically corresponding positions, but it is formed at positions corresponding vertically. Since the pressure applied to the conductor post becomes too high, the conductor post cuts into the conductor circuit, causing undulations in the conductor circuit.

On the other hand, in the present invention, the conductor posts located in the inner layer of the multilayer wiring board are formed only at the positions corresponding to vertically above the conductor posts located in the outermost layers on both sides of the multilayer wiring board. Appropriate pressure required for interlayer connection is applied, and good interlayer connection can be obtained in all conductor posts. This is the greatest feature of the present invention.

Next, an example of a method for manufacturing the wiring board 110 used in the method for manufacturing a multilayer wiring board according to the present invention will be described with reference to FIG.

First, a patterned plating resist 102 is formed on the metal layer 101 (FIG. 1A).
As the plating resist 102, for example, an ultraviolet-sensitive dry film resist is laminated on the metal layer 101,
It can be formed by selectively exposing with a negative film or the like and then developing. Alternatively, the liquid resist may be applied by curtain coating or a roll coater, and similarly exposed and developed to form the liquid resist.

The material of the metal layer 101 may be any material as long as it is suitable for this manufacturing method.
It must be resistant to the chemical used and can be finally removed by etching. For example, copper, a copper alloy, 42 alloy, nickel, etc. are mentioned. In particular, copper foil, copper plate, and copper alloy plate are preferable for use as the metal layer 101 because not only electrolytic plated products and rolled products can be selected, but also those with various thicknesses can be easily obtained.

Next, the resist metal layer 103 is formed by electrolytic plating using the metal layer 101 as an electrolytic plating lead (feeding electrode), and subsequently, the conductor circuit 104 is formed by electrolytic plating (FIG. 1 (b)). ). By this electrolytic plating, the resist metal layer 103 and the conductor circuit 104 are formed on the portion of the metal layer 101 where the plating resist 102 is not formed.

The resist metal layer 103 may be made of any material as long as it is suitable for this manufacturing method.
In particular, it is necessary to have resistance to a chemical liquid used when finally removing the metal layer 101 by etching. For example, nickel, gold, tin, silver, solder, palladium, etc. may be mentioned. The purpose of forming the resist metal layer 103 is to prevent the conductor circuit 104 from being etched by a chemical solution used when etching the metal layer 101. For example, when the material of the metal layer 101 is copper (copper foil, copper plate or copper alloy plate) and the material of the conductor circuit 104 is copper, it is most preferable to select gold as the material of the resist metal layer 103. By making the material of the resist metal layer 103 gold, it has resistance to almost all etching solutions (generally, ferric chloride solution, cupric chloride solution) used when etching the metal layer 101. Therefore, it becomes easier to secure solder wettability during interlayer bonding. There is also a method of selecting nickel, tin, or solder as the material of the resist metal layer 103, but since it is soluble in a normal acid-based etching solution, it is necessary to use an alkali-based etching solution (ammonium chloride solution). Despite the drawbacks, it also has the advantage of being less expensive than gold.

On the other hand, if the conductor circuit 104 has resistance to the chemical liquid used for etching the metal layer 101, the resist metal 103 is unnecessary.
The resist metal layer 103 does not have to have the same pattern as the conductor circuit 104, and the resist metal layer 103 may be formed on the entire surface of the metal layer 101 before forming the plating resist 102 on the metal layer 101. . In that case, after removing the metal layer 101 by etching, the conductor circuit 1
It is necessary to etch the resist metal layer 103 using a chemical solution that does not etch 04.

The conductor circuit 104 may be made of any material as long as it is suitable for this manufacturing method.
Examples thereof include copper, nickel, gold, tin, silver and palladium. In particular, when the material of the conductor circuit 104 is copper, the conductor circuit 104 with low resistance and stable can be obtained.

Next, the plating resist 102 is removed, and then the insulating layer 105 is formed on the formed conductor circuit 104 (FIG. 1C). The insulating layer 105 may be formed by a method suitable for the resin used, such as printing resin varnish, curtain coating, or bar coating directly, or vacuum laminating a dry film type resin,
A method of laminating by a method such as vacuum pressing may be used. In particular, the dry film type resin is not only easy to handle but also excellent in productivity. On the other hand, a commercially available resin-coated copper foil (for example, for build-up multilayer wiring board) is easily available, and is formed by embedding the unevenness of the conductor circuit 104 by vacuum lamination / vacuum pressing, and finally the copper foil is formed. If etched, the surface of the insulating layer 105 becomes a conductor circuit 1.
It can be formed very flat without being affected by the unevenness of 04. Further, since the finely roughened shape of the copper foil surface is transferred to the surface of the insulating layer 105, it is possible to secure the adhesiveness with the adhesive layer 109 shown in FIG.

The insulating layer 105 used in the present invention may be any one suitable for this manufacturing method, and a thermosetting resin or a thermoplastic resin can be used. Examples of the thermosetting resin include resins such as epoxy, phenol, bismaleimide, bismaleimide triazine, triazole, cyanate, isocyanate and benzocyclobutene. As the thermoplastic resin, polyamide, polyimide,
Polyamideimide, polyetherimide, polyesterimide, polyetheretherketone, polyphenylene sulfide, polyethersulfone, polyquinoline,
Examples thereof include resins such as polynorbornene, polybenzoxazole, polybenzimidazole, polytetrafluoroethylene, and liquid crystal polymer. These may be used alone or in combination of two or more, and inorganic filler such as silica filler, leveling agent, coupling agent, defoaming agent, curing catalyst and the like may be added. Alternatively, a material obtained by impregnating a resin into a reinforcing fiber such as a glass cloth or an aramid non-woven fabric typified by a glass epoxy base material and curing or semi-curing the resin may be used as the insulating layer 105.

Next, a via hole 106 is formed in the formed insulating layer 105 (FIG. 1 (d)). In the manufacture of the wiring board which is the inner layer, the via hole is formed at a position corresponding to any of the via hole positions of the wiring board which is the outer layer. The method for forming the via hole 106 may be any method as long as it is suitable for this manufacturing method, and examples thereof include dry etching with laser and plasma, and chemical etching. When the insulating layer 105 is a photosensitive resin, the via hole 106 can be formed by selectively exposing the insulating layer 105 to light and developing it. Opening with a laser is advantageous because the fine via holes 106 can be easily formed regardless of whether the insulating layer 105 is photosensitive or non-photosensitive. As the laser, an excimer laser, a UV laser, a carbon dioxide laser, or the like can be used.

Next, the conductor post 107 is formed by electrolytic plating using the metal layer 101 as an electrolytic plating lead (feeding electrode) (FIG. 1E). By this electrolytic plating, the conductor post 107 is formed in the portion of the insulating layer 105 where the via hole 106 is formed. When the conductor post 107 is formed by electrolytic plating, by selecting the plating current density and the additive to the plating bath,
The tip shape of the conductor post 107 can be freely controlled from a flat shape to a convex shape. The material of the conductor post 107 may be any material as long as it is suitable for this manufacturing method. For example, copper, nickel, gold, tin, silver,
Examples thereof include palladium. Especially by using copper,
A stable conductor post 107 having a low resistance can be obtained.

Next, a metal material layer for bonding 108 is formed on the tip surface of the conductor post 107 (FIG. 1 (f)). As the method of forming the bonding metal material layer 108, a method of forming it by electroless plating, a method of forming the metal layer 101 as an electrolytic plating lead (feeding electrode) by electrolytic plating, and a paste containing a bonding metal material are used. There is a method of printing. In the method by printing, it is necessary to accurately align the printing mask with the conductor post 107. However, in the method by electroless plating or electrolytic plating, the bonding metal material 108 is formed on the surface other than the surface of the conductor post 107. Since it does not occur, it is easy to deal with miniaturization and high density of the conductor post 107. In particular, the electrolytic plating method is very suitable because it has a wider variety of metals that can be plated and the chemical solution is easier to manage than the electroless plating method.

As the material of the bonding metal material layer 108,
Any metal may be used as long as it can be metal-bonded to the joined portion 230 of the connected layer 220 shown in FIG. 2A, and examples thereof include solder. Among solder, Sn, In,
Alternatively, Sn, Ag, Cu, Zn, Bi, Pd, Sb,
It is preferable to use a solder composed of at least two kinds of Pb, In and Au. More preferably, environmentally friendly P
b Free solder.

The tip shape of the bonding metal material layer 108 is preferably convex. Bonding metal material layer 10
By making the tip of 8 a convex shape, the metal material layer 1 for bonding is used when thermocompression-bonding with the layer 220 to be connected shown in FIG.
Since the adhesive layer 109 that exists between the bonding target 08 and the bonding target 230 is easily removed, metal bonding can be performed without an adhesive remaining between the bonding metal material layer 108 and the bonding target 230.

Next, an adhesive layer 109 is formed so as to cover the tip surface of the joining metal material layer 108 and the insulating layer 105 (FIG. 1 (g)). The adhesive layer 109 may be formed by a method suitable for the resin used, and a resin varnish may be directly applied by a method such as printing, curtain coating, bar coating, or the like.
Examples thereof include a method of laminating a dry film type resin by a method such as vacuum lamination or vacuum pressing.

As the resin used for the adhesive layer 109, a resin having good heat resistance and insulating properties such as epoxy, phenol, polyimide, and polyamide-imide can be used. Furthermore, it is preferable that the adhesive layer 109 is a metal bonding adhesive, that is, an adhesive having a surface cleaning function and having high insulation reliability. The surface cleaning function is, for example, a function of removing an oxide film existing on the surface of the bonding metal material layer or the surface of the metal to be connected, and a function of reducing the oxide film. By this surface cleaning function, the wettability with the surface for connecting with the joining metal material layer is sufficiently enhanced, and the metal joining adhesive in the metal joining portion is eliminated by the force of the wetting and spreading of the joining metal material layer, In metal joining using a metal joining adhesive, resin residue is less likely to occur, and its electrical connection reliability is high.

Finally, the metal layer 101 is removed by etching to obtain the wiring board 110 (FIG. 1 (h)). A resist metal layer 10 is provided between the metal layer 101 and the conductor circuit 104.
3 is formed, and the resist metal layer 103 has resistance to a chemical solution used when removing the metal layer 101 by etching. Therefore, even if the metal layer 101 is etched, the resist metal layer 103 is formed. Are not etched, and consequently the conductor circuit 104 is not etched. When the material of the metal layer 101 is copper and the material of the resist metal is nickel, tin, or solder, a commercially available ammonia-based etching solution can be used. Metal layer 1
When the material of 01 is copper and the material of the resist metal layer 103 is gold, most etching solutions including ferric chloride solution and cupric chloride solution can be used.

The resist metal layer 103 may or may not be removed. For example, when the resist metal layer 103 is gold, it is not only difficult to remove it by etching, but also the gold surface is difficult to oxidize so that the bonding with the bonding metal material layer 108 is relatively easy. Therefore, it is preferable to leave it without removing it. On the other hand, when the resist metal layer 103 is nickel, tin, or solder, if formation on the entire exposed surface of the conductor circuit 104 poses a performance problem,
It is preferable to remove. Note that nickel, tin, or solder can be easily removed by using a commercially available solder / nickel release agent (for example, Pewtax manufactured by Mitsubishi Gas Chemical Co., Inc.).

As the metal-bonding adhesive, an adhesive containing at least one resin having a phenolic hydroxyl group (A) and a resin (B) acting as a curing agent as essential components, and an epoxy resin (C). An adhesive agent containing, as an essential component, a compound (D) having an imidazole ring and acting as a curing agent for the epoxy resin (C) is preferable. In the first preferred metal bonding adhesive, the phenolic hydroxyl group of the resin (A) having a phenolic hydroxyl group removes stains such as oxides on the bonding metal material layer and the metal surface due to its surface cleaning function or , Reduces oxides and acts as a flux for metal bonding. Further, since a good cured product can be obtained by the resin (B) acting as the curing agent, there is no need for washing and removing after metal bonding,
Maintains electrical insulation even in high temperature and high humidity atmosphere, and has good bonding strength,
Enables highly reliable metal bonding.

The resin (A) having at least one phenolic hydroxyl group used in the first preferred metal bonding adhesive in the present invention includes phenol novolac resin, alkylphenol novolac resin, resole resin, cresol novolac resin, and It is preferably selected from polyvinylphenol resins, and one or more of them can be used.

The resin (A) having a phenolic hydroxyl group, which is used in the first preferred metal adhesive in the present invention,
An epoxy resin, an isocyanate resin, or the like is used as the resin (B) that acts as a curing agent. Specifically, in both cases, phenol-based resins such as bisphenol-based, phenol novolac-based, alkylphenol novolac-based, biphenol-based, naphthol-based or resorcinol-based resins and skeletons such as aliphatic, cycloaliphatic and unsaturated aliphatic resins are used. Examples thereof include modified epoxy compounds and isocyanate compounds.

A resin (A) having a phenolic hydroxyl group, which is used in the first preferred metal bonding adhesive in the present invention.
Is preferably contained in the adhesive in an amount of 20 wt% or more and 80 wt% or less from the viewpoint of bonding strength and reliability. A more preferable upper limit value is 60 wt%. On the other hand, the resin (B) acting as a curing agent is contained in the adhesive in an amount of 20 wt% or more 8
It is preferably contained in an amount of 0 wt% or less. Further, a colorant, a curing catalyst, an inorganic filler, various coupling agents, a solvent, etc. may be added to the resin used for the metal bonding adhesive.

In a second preferred metal bonding adhesive,
The imidazole ring of the compound (D) removes stains such as oxides on the bonding metal material layer and the metal surface or reduces the oxide film by the surface cleaning function due to the unpaired electron of the tertiary amine, and reduces the metal. Acts as a bonding flux.
Further, since the imidazole ring also acts as a curing agent when anionically polymerizing the epoxy resin (C), a good cured product can be obtained, and cleaning and removal after soldering are not required, and even in a high temperature and high humidity atmosphere. Maintains electrical insulation and enables metal bonding with high bonding strength and reliability.

In the present invention, the addition amount of the compound (D) used in the second preferable metal bonding adhesive is preferably 1 wt% or more and 10 wt% or less from the viewpoint of strength and reliability of metal bonding. A more preferable upper limit value is 5 wt%.

The epoxy resin (C) used in the second preferred metal bonding adhesive in combination with the compound (D) in the present invention includes bisphenol type, phenol novolac type, alkylphenol novolac type, biphenol type, naphthol type and resorcinol type. Examples thereof include a phenol-based epoxy resin such as a system, and an epoxy compound modified based on a skeleton such as aliphatic, cycloaliphatic, or unsaturated aliphatic.

The compound (D) having an imidazole ring and used as a curing agent for the epoxy resin (C) used in the second preferred metal bonding adhesive in the present invention includes:
Imidazole, 2-methylimidazole, 2-ethyl-
4-methylimidazole, 2-phenylimidazole,
1-benzyl-2-methylimidazole, 2-undecylimidazole, 2-phenyl-4-methylimidazole, bis (2-ethyl-4-methyl-imidazole),
2-phenyl-4-methyl-5-hydroxymethylimidazole, 2-phenyl-4,5-dihydroxymethylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2-methylimidazole, 1- Examples thereof include cyanoethyl-2-phenylimidazole, triazine addition type imidazole and the like. Also, those made into epoxy adducts,
Microencapsulated products can also be used. These may be used alone or in combination of two or more.

In the present invention, the compounding amount of the epoxy resin (C) used in the second preferred metal bonding adhesive is preferably 30 wt% or more and 99 wt% or less of the whole metal bonding adhesive. If it is less than 30 wt%, a sufficient cured product may not be obtained. As a component other than the epoxy resin (C) and the compound (D) that acts as a curing agent thereof, a thermosetting resin such as a cyanate resin, an acrylic acid resin, a methacrylic acid resin, or a maleimide resin can be used as a resin for a metal bonding adhesive. Alternatively, a thermoplastic resin may be blended. Further, a colorant, a curing catalyst, an inorganic filler, various coupling agents, a solvent, etc. may be added to the resin used for the metal bonding adhesive.

The metal bonding adhesive can be prepared, for example, by dissolving a resin (A) having a solid phenolic hydroxyl group and a resin (B) acting as a solid curing agent in a solvent to prepare a solid phenol. Resin Having a Hydrophilic Hydroxyl Group (A)
Of the resin (B) acting as a liquid curing agent, and a method of dissolving the resin (B) acting as a solid curing agent in the resin (A) having a liquid phenolic hydroxyl group A method of dispersing or dissolving a compound (D) having an imidazole ring and acting as a curing agent for the epoxy resin (C) in a solution of a solid epoxy resin (C) dissolved in a solvent, a liquid epoxy resin (C ), And a method of dispersing or dissolving the compound (D) having an imidazole ring and acting as a curing agent for the epoxy resin (C). As the solvent used, acetone, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone, toluene, mesitylene, xylene, hexane, isobutanol, n-butanol, 1-methoxy, 2-propanol acetate, butyl cellosolve, ethyl cellosolve, methylcello Sorb, cellosolve acetate, ethyl lactate, ethyl acetate, dimethyl phthalate, diethyl phthalate, dibutyl phthalate, diethylene glycol, -n-butyl benzoate, N-methylpyrrolidone, N, N-
Examples thereof include dimethylformamide, tetrahydrofuran, γ-butyl lactone, anisole and the like. Preferably,
It is a solvent having a boiling point of 200 ° C. or lower.

The wiring board 110 obtained here has a conductor circuit 104 formed by electrolytic plating, and has a structure in which the conductor circuit 104 is embedded in an insulating layer 105 so that one surface is exposed. However, the tip of the conductor post 107 projects from the insulating layer 105, but the conductor post may have another structure, for example, a structure in which the bonding metal material layer is not formed on the surface of the conductor post, or the conductor post. There is a structure in which the tip of the conductor post does not project from the insulating layer but the tip of the metal material layer for joining projects.

In addition to the above-mentioned manufacturing method, a base material made of an insulating layer on which a conductive layer is formed is prepared, and the conductive layer is used as a lead for electrolytic plating to form a conductor circuit on the surface of the conductive layer and insulation is performed. A wiring board in which a via hole is formed in a layer and a conductor post is formed in the via hole in the same manner as the manufacturing method described above may be obtained and used in the present invention. Alternatively, by using a base material composed of a plurality of metal layers that can be selectively etched, the metal layer on one surface is etched to form a conductor circuit, and an insulating layer is formed on the conductor circuit, whereby the conductor circuit layer is formed. A wiring board embedded in an insulating layer so as to expose one surface may be obtained and used in the present invention. Further, by using a base material composed of an insulating layer and a metal layer, the metal layer is etched to form a conductor circuit, thereby obtaining a wiring board formed on the surface of the insulating layer so that the conductor circuit contacts one surface. And may be used in the present invention.

An example of the method for manufacturing the multilayer wiring board and the method for manufacturing the wiring board used therefor have been described above in detail with reference to FIGS. 2 and 1. However, since there are a wide variety of wiring boards used for manufacturing the multilayer wiring board of the present invention,
Naturally, the structure of the multilayer wiring board obtained by the present invention is various.

[0048]

According to the present invention, the wiring is such that the conductor posts located in the inner layer of the multilayer wiring board are formed only at positions corresponding to vertically above the conductor posts located in the outermost layers on both surfaces of the multilayer wiring board. By using the substrate, the pressure required for interlayer connection can be optimized, and good interlayer connection can be obtained in all conductor posts.

[Brief description of drawings]

FIG. 1 is a cross-sectional view for explaining an example of a method of manufacturing a wiring board used for manufacturing a multilayer wiring board according to the present invention.

FIG. 2 is a cross-sectional view for explaining an example of the method for manufacturing a multilayer wiring board (collective stacking method) according to the present invention.

FIG. 3 Conventional manufacturing method of multilayer wiring board (collective stacking method)
It is sectional drawing for demonstrating an example.

[Explanation of symbols]

101, 201, 301: Metal layer 102: Plating resist 103: Resist metal layer 104: Conductor circuit 105: Insulating layer 106: Via hole 107: Conductor post 108: Metal material layer for bonding 109: Adhesive layer (Metal bonding adhesive layer ) 110, 110a, 110b, 110c, 110a ',
110b ', 110c': Wiring boards 220, 320: Connected layers 230, 330: Joined parts 240, 340: Multilayer wiring board 350: Corresponding to vertically above the conductor posts located on the outermost layers of both surfaces of the multilayer wiring board. Conductor posts formed outside the position

Claims (2)

[Claims] 1. A conductor post having a plurality of insulating layers, a conductor circuit formed on at least one surface of each insulating layer, and a conductor post penetrating the insulating layer and connecting to the conductor circuit. A multilayer wiring board formed by connecting layers, wherein the inner-layer conductor posts are formed only at positions corresponding to vertically above the outermost conductor posts on both sides of the multilayer wiring board. Wiring board. 2. A plurality of wiring boards, each having an insulating layer in contact with at least one surface of the conductor circuit and a conductor post penetrating the insulating layer and connected to the conductor circuit, are stacked and interconnected by the conductor post. A method of manufacturing a multilayer wiring board formed by: forming a conductor post of a wiring board as an inner layer, the conductor post being vertically above the conductor posts located on the outermost layers of both surfaces of the multilayer wiring board. A method for manufacturing a multilayer wiring board, which is characterized in that it is formed only at corresponding positions.