JP2003282637A - Adhesive composite for circuit connection and circuit connection structure empolying it - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an adhesive composite for circuit connection being connected to a composite basic material containing an inorganic material in a short time under low temperatures and exhibiting a good performance even after reliability test, and a circuit connection structure (semiconductor device) employing it. <P>SOLUTION: The adhesive composite for circuit connection contains (a) a radical polymeric compound, (b) a hardener generating radicals upon irradiation with light or heating, and (c) a silane coupling agent represented by general formula (I). (In the formula, X is an organic group containing a nitrogen atom, R<SB>1</SB>, R<SB>2</SB>and R<SB>3</SB>are alkyl groups, and n, m and l are integers of 1-3). <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to an adhesive composition for circuit connection and a circuit connection structure (semiconductor device) using the same.
Regarding

[0002]

2. Description of the Related Art In semiconductor elements and liquid crystal display elements,
Conventionally, various adhesives have been used for the purpose of bonding various members in the device. The adhesives are required to have various properties such as adhesiveness, heat resistance, and reliability under high temperature and high humidity conditions. The adherends used for adhesion include printed wiring boards, organic base materials such as polyimide, copper, aluminum and other metals, ITO,
Substrates having various surface states such as SiNx and SiO ₂ are used, and it is necessary to design a molecule according to each adherend. Conventionally, a thermosetting resin using an epoxy resin having high adhesiveness and high reliability has been used as an adhesive for the semiconductor element and the liquid crystal display element. As a constituent component of the resin, an epoxy resin, a curing agent such as a phenol resin having reactivity with the epoxy resin, and a thermal latent catalyst that accelerates the reaction between the epoxy resin and the curing agent are generally used. The thermal latent catalyst is an important factor that determines the curing temperature and the curing rate, and various compounds have been used from the viewpoint of storage stability at room temperature and curing rate upon heating. The curing conditions in the actual process are 170 to 250 ° C. and 1
The desired adhesion was obtained by curing for ~ 3 hours.
However, with the recent trend toward higher integration of semiconductor elements and higher definition of liquid crystal elements, the pitch between elements and wiring has become narrower, and heating during curing may adversely affect peripheral members. For further cost reduction, it is necessary to improve throughput, and low temperature (100 to 17
0 ° C), short time (within 1 hour, preferably within 10 seconds),
In other words, low temperature fast curing adhesion is required. In order to achieve this low temperature rapid curing, it is necessary to use a thermal latent catalyst with low activation energy, but it is known that it is very difficult to combine storage stability near room temperature. Recently, radical curable adhesives using a combination of a (meth) acrylate derivative and a peroxide which is a radical initiator have been attracting attention. In radical curing, radicals, which are reactive species, are extremely reactive and can be cured for a short time.Because they remain stable below the decomposition temperature of the radical initiator, low-temperature rapid curing and around room temperature are possible. It is a curing system that achieves both storage stability at room temperature.

[0003]

However, the radical-curing adhesive has a large curing shrinkage at the time of curing, so that it has poor adhesive strength as compared with the case where an epoxy resin is used, and particularly an inorganic material or a metal is used. It has been found that the adhesive strength of the material to the substrate decreases.

Although the present invention is a radical curing system,
Adhesive composition for circuit connection showing high adhesion strength to a substrate composed of an inorganic material by a silane coupling agent having an organic group containing a nitrogen atom in the molecule, and a circuit connection structure using the same (Semiconductor device).

[0005]

Means for Solving the Problems The present invention is represented by [1] (a) a radically polymerizable compound, (b) a curing agent which generates a radical upon irradiation with light or heating, and (c) represented by the general formula (I). An adhesive composition for circuit connection, comprising a silane coupling agent.

[Chemical 2] (In the formula, X is an organic group containing a nitrogen atom, R ₁ , R ₂ ,
R ₃ is an alkyl group, and n, m, and l are each an integer of 1 to 3) Further, the present invention relates to [2] 100 parts by volume of the adhesive composition and 0.1 to 30 volumes of conductive particles. % Is the adhesive composition for circuit connection according to the above [1]. Also,
In the present invention, [3] the circuit connecting adhesive composition according to the above [1] or [2] is interposed between substrates having opposing circuit electrodes, and the substrates having opposing circuit electrodes are pressed. And a circuit connection structure in which electrodes in the pressing direction are electrically connected. Furthermore, in the present invention, [4] the adhesive composition for circuit connection described in [1] or [2] is interposed between the circuit electrodes of the semiconductor element and the circuit electrode of the semiconductor mounting substrate which face each other. And a circuit connection structure (semiconductor device) in which the circuit electrodes facing each other are pressed to electrically connect the electrodes in the pressing direction.

[0006]

BEST MODE FOR CARRYING OUT THE INVENTION As the radically polymerizable compound (a) used in the present invention, known compounds can be used without particular limitation as long as they are compounds having a functional group capable of being polymerized by an active radical. Such functional groups include, for example, an acryloyl group, a methacryloyl group, an allyl group, a maleimide group, a vinyl group, etc. in the molecule, but an acryloyl group and a methacryloyl group (hereinafter, both are collectively referred to as being easy to select. A resin having one or more (called (meth) acryloyl) in the molecule is preferable, and a resin having two or more (meth) acryloyl groups in the molecule is more preferable because a high cured density can be obtained by curing.

Specifically, oligomers such as epoxy (meth) acrylate oligomer, urethane (meth) acrylate oligomer, polyether (meth) acrylate oligomer, polyester (meth) acrylate oligomer, trimethylolpropane tri (meth) acrylate, polyethylene. Glycol di (meth) acrylate,
Polyalkylene glycol di (meth) acrylate, pentaerythritol (meth) acrylate, 2-cyanoethyl (meth) acrylate, cyclohexyl (meth)
Acrylate, dicyclopentenyl (meth) acrylate, dicyclopentenyloxyethyl (meth) acrylate, 2- (2-ethoxyethoxy) ethyl (meth) acrylate, 2-ethoxyethyl (meth) acrylate, 2-
Ethylhexyl (meth) acrylate, n-hexyl (meth) acrylate, 2-hydroxyethyl (meth)
Acrylate, hydroxypropyl (meth) acrylate, isobornyl (meth) acrylate, isodecyl (meth) acrylate, isooctyl (meth) acrylate, n-lauryl (meth) acrylate, 2-methoxyethyl (meth) acrylate, 2-phenoxyethyl (meth ) Acrylate, tetrahydrofurfuryl (meth) acrylate, neopentyl glycol di (meth)
Acrylate, dipentaerythritol hexa (meth)
Acrylate, isocyanuric acid-modified bifunctional (meth) acrylate, isocyanuric acid-modified trifunctional (meth) acrylate, 2- (meth) acryloyloxyethyl phosphate, 2,2'-di (meth) acryloyloxydiethyl phosphate, etc. Included are functional and polyfunctional (meth) acrylate compounds. These compounds may be used alone or as a mixture, if necessary.

As the curing agent (b) used in the present invention to generate radicals by light irradiation or heating, α-
Any known acetaminophenone derivative, peroxide, azo compound or the like can be used without particular limitation.
As these compounds, peroxides are more preferable from the viewpoint of ease of designing the curing temperature. As the usable peroxide, it is convenient to refer to the one-minute half-life temperature which indicates a measure of peroxide decomposition, and the one-minute half-life temperature is 40
C. or higher and 200.degree. C. or lower is preferable, and among them, the one-minute half-life temperature is more preferably 60.degree. Specific examples include diacyl peroxide derivatives, peroxydicarbonate derivatives, peroxyester derivatives, peroxyketal derivatives, dialkyl peroxide derivatives, and hydroperoxide derivatives.

As the diacyl peroxide derivative,
2,4-dichlorobenzoyl peroxide, 3,5,5-trimethylhexanoyl peroxide, octanoyl peroxide, lauroyl peroxide, stearoyl peroxide, succinic peroxide, benzoyl peroxide, benzoyl peroxide, etc. To be

As the peroxydicarbonate derivative, di-n-propylperoxydicarbonate, diisopropylperoxydicarbonate, bis (4-t-
Butylcyclohexyl) peroxydicarbonate, di-2-ethoxymethoxyperoxydicarbonate, di (2-ethylhexylperoxy) dicarbonate, dimethoxybutylperoxydicarbonate, di (3-methyl-3-methoxybutylperoxy) Dicarbonate etc. are mentioned.

As the peroxy ester derivative, 1,1,
3,3-Tetramethylbutylperoxyneodecanoate, 1-Cyclohexyl-1-methylethylperoxynoedecanoate, t-hexylperoxyneodecanoate, t-butylperoxypivalate, 1,1 , 3,3-
Tetramethylbutylperoxy-2-ethylhexanonate, 2,5-dimethyl-2,5-bis (2-ethylhexanoylperoxy) hexane, 2,5-dimethyl-2,5-bis (2-benzoyl) Peroxy) hexane, 1-cyclohexyl-1-methylethylperoxy-2-ethylhexanonate, t-hexylperoxy-2-ethylhexanonate, t-butylperoxyisobutyrate, 1,1-bis (T-Butylperoxy) cyclohexane, t-hexylperoxyisopropyl monocarbonate, t-butylperoxy-3,5,5-trimethylhexanonate, t-
Butyl peroxy laurate, 2,5-dimethyl-2,5-di (m-toluoyl peroxy) hexane, t-butyl peroxyisopropyl monocarbonate, t-butyl peroxy-2-ethylhexyl monocarbonate, t- Hexyl peroxybenzoate, t-butyl peroxyacetate and the like can be mentioned.

As the peroxyketal derivative, 1,1
-Bis (t-hexylperoxy) -3,3,5-trimethylcyclohexane, 1,1-bis (t-hexylperoxy)
-3,3,5-Trimethylcyclohexane, 1,1- (t-butylperoxy) cyclododecane, 2,2-bis (4,4-di-
t-Butylperoxycyclohexyl) propane, 2,2-
Examples thereof include bis (t-butylperoxy) decane.

As the dialkyl peroxide derivative, α, α'bis (t-butylperoxy) diisopropylbenzene, dicumyl peroxide, 2,5-dimethyl-2,5-di (t-butyloxy) hexane, t- Butyl cumyl peroxide and the like can be mentioned.

Examples of hydroperoxides include diisopropylbenzene hydroperoxide and cumene hydroperoxide. These compounds may be used alone or in combination of two or more kinds.

The amount of the curing agent (b) which generates radicals upon irradiation with light or heating is 0.1 to 30 parts by weight per 100 parts by weight of the radically polymerizable compound (a).
Preferably 0.5 to 20 weight, more preferably 1 to 1
5 parts by weight. If the addition amount is less than 0.1 parts by weight, insufficient curing may occur, and if it exceeds 30 parts by weight, the stability upon leaving may be lowered.

The alkyl group of the silane coupling agent represented by the general formula (I) (c) used in the present invention is an alkyl group having 1 to 20 carbon atoms, for example, methyl group, ethyl group, n-propyl group. Group, isopropyl group, n-butyl group, isobutyl group, sec-butyl group, tert-butyl group,
Pentyl group, isopentyl group, neopentyl group, hexyl group, heptyl group, octyl group, nonyl group, decyl group,
Examples thereof include undecyl group, dodecyl group, tridecyl group, tetradecyl group, pentadecyl group, hexadecyl group, heptadecyl group, octadecyl group, nonadecyl group, icosyl group and structural isomers thereof. (C) As the silane coupling agent having an organic group containing a nitrogen atom in the molecule represented by the general formula (I), γ-isocyanatopropyltrimethoxysilane, γ-isocyanatopropyltriethoxysilane, 1,3 , 5-N-tris (3-trimethoxysilylpropyl) isocyanurate, 3-triethoxysilyl-N- (1,3-dimethylbutylidene), γ-phenylaminopropyltrimethoxysilane, N- (β-
Aminoethyl) -γ-aminopropyltrimethoxysilane, γ-aminopropyltrimethoxysilane, γ-aminopropyltriethoxysilane, ureidopropyltriethoxysilane, bis (trimethoxysilylpropyl)
Amine, 3-aminopropyldimethylethoxysilane, 3
-Aminopropyldiethoxymethylsilane, 3- (2-aminoethylaminopropyl) dimethoxymethylsilane,
3- (2-aminoethylaminopropyl) trimethoxysilane, 3- (2-aminoethylaminopropyl) triethoxysilane, 3-morpholinopropyltrimethoxysilane, dimethoxymethyl-3-piperazinepropylsilane, 3-piperazi Nopropyltrimethoxysilane, 3-piperazinopropyltrimethoxysilane, dimethoxymethyl-3-piperidinopropylsilane, 3-piperazinopropyltrimethoxysilane, 3-cyclohexylaminopropyltrimethoxysilane, imidazole group organic A silane coupling agent selected from the base silane coupling agents can be mentioned. These compounds may be used alone or as a mixture of two or more kinds.

Further, in the present invention, (c) a silane coupling agent having an organic group containing a nitrogen atom in the molecule,
A silane coupling agent containing no nitrogen atom in the molecule can be mixed and used. As the silane coupling agent containing no nitrogen atom in the molecule, epoxy silane coupling agent, vinyl silane coupling agent, acrylic silane coupling agent, methacrylic silane coupling agent, mercapto silane coupling agent, Examples thereof include styryl-based silane coupling agents and sulfide-based silane coupling agents.

The amount of the silane coupling agent added is (a)
The amount is 0.1 to 30 parts by weight, preferably 0.5 to 25 parts by weight, and more preferably 1 to 15 parts by weight, based on 100 parts by weight of the adhesive composition containing the radically polymerizable compound. If the addition amount is less than 0.1 parts by weight, it is difficult to obtain high adhesive strength, and if it exceeds 30 parts by weight,
The stability of the adhesive composition decreases.

The conductive particles used in the present invention include Au,
Examples thereof include metal particles such as Ag, Ni, Cu, and solder, carbon, and the like. Alternatively, a non-conductive glass, ceramic, plastic or the like may be used as a core, and the core may be coated with the metal, metal particles or carbon. When the conductive particles are made of plastic as the core and the core is coated with the above metal, metal particles or carbon, or heat-melted metal particles, it is deformable by heating and pressing, so the height variation of the circuit electrodes is eliminated at the time of connection. However, it is preferable because the contact area with the electrode is increased and the reliability is improved. Further, the fine particles further coating the surface of these conductive particles with a polymer resin or the like can suppress a short circuit due to contact between particles when the blending amount of the conductive particles is increased, and the insulation between electrode circuits can be improved. Therefore, they may be used alone or in combination with conductive particles.

The average particle size of the conductive particles is preferably 1 to 18 μm from the viewpoint of dispersibility and conductivity. The amount of the conductive particles used is not particularly limited, but is preferably 0.1 to 30% by volume, and more preferably 0.1 to 10% by volume with respect to 100% by volume of the total amount of the adhesive composition. . If this value is less than 0.1% by volume, the conductivity tends to be poor, and if it exceeds 30% by volume, a circuit short circuit tends to occur. The volume% is determined based on the volume of each component before curing at 23 ° C., but the volume of each component can be converted from the weight to the volume by utilizing the specific gravity. Also, add the appropriate solvent (water, alcohol, etc.) that does not dissolve or swell the component into the graduated cylinder, but wet the component well, and add the increased volume as the volume. You can also ask.

To the adhesive composition of the present invention, additives such as an adhesion improver other than the coupling agent, a thickener, a leveling agent, a colorant, a weather resistance improver and the like may be appropriately added.

Various polymers may be appropriately added to the adhesive composition of the present invention for the purpose of thickening or forming a film. The polymer to be used is not particularly limited, but (a) a radical polymerizable compound, (b) a curing agent that generates radicals by light irradiation or heating, (c) a silane having a nitrogen atom-containing organic group in the molecule. It is essential that the coupling agent and conductive particles are not adversely affected. Such polymers include polyimide, polyamide, phenoxy resins, polymethacrylates, polyacrylates,
Polyimides, polyurethanes, polyesters, polyvinyl butyral, SBS and epoxy modified products thereof,
SEBS and its modified products can be used. These may be used alone or in combination of two or more. Furthermore, these polymers may contain a siloxane bond or a fluorine substituent. These can be suitably used as an adhesive composition as long as the resins to be mixed are completely compatible with each other or microphase separation occurs and the mixture becomes cloudy. The larger the molecular weight of the polymer, the easier it is to obtain a film-forming property, and the melt viscosity that affects the fluidity as an adhesive can be set in a wide range. The molecular weight is not particularly limited, but as a general weight average molecular weight, 5,000 to 150,000 is preferable, and 10,000 to 80,000 is particularly preferable. If this value is less than 5,000, the film formability tends to be poor, and if it exceeds 150,000, the compatibility with other components tends to be poor. The amount used is preferably 20 to 320 parts by weight with respect to 100 parts by weight of the radically polymerizable compound (a). When the amount used is less than 20 parts by weight or more than 320 parts by weight, fluidity and adhesiveness tend to be lowered.

The adhesive composition of the present invention has a room temperature (15-2).
When it is liquid at 5 ° C., it can be used as a paste. When it is solid at room temperature, it may be used by heating, or may be made into a paste by using a solvent. The solvent that can be used is not particularly limited as long as it has no reactivity with the adhesive composition and the additive and exhibits sufficient solubility, but the boiling point at normal pressure is 50 to 150 ° C. Those are preferable. When the boiling point is less than 50 ° C, it may volatilize when left at room temperature, which limits its use in an open system.
When the boiling point exceeds 150 ° C, it is difficult to volatilize the solvent, which may adversely affect the reliability after adhesion.

The adhesive composition of the present invention can also be used in the form of a film. A solution obtained by adding a solvent or the like to the adhesive composition as necessary is applied on a releasable substrate such as a fluororesin film, a polyethylene terephthalate film, a release paper, or a substrate such as a non-woven fabric is impregnated with the solution. It can be used as a film by removing the solvent and the like by placing it on a peelable substrate. When used in the form of a film, it is even more convenient in terms of handleability.

The adhesive composition of the present invention can be adhered by light irradiation, heating, or simultaneous use of heat and pressure simultaneously with light irradiation. By using these in combination, it becomes possible to bond at a lower temperature and in a shorter time. Light irradiation is 150-75
Irradiation light in the wavelength range of 0 nm is preferable, and it can be cured with an irradiation dose of 0.1 to 10 J / cm ² using a low pressure mercury lamp, a medium pressure mercury lamp, a high pressure mercury lamp, an ultrahigh pressure mercury lamp, a xenon lamp, and a metal halide lamp. . The heating temperature is not particularly limited, but a temperature of 50 to 170 ° C. is preferable. The pressure is not particularly limited as long as it does not damage the adherend, but is generally preferably 0.1 to 10 MPa. It is preferable that these heating and pressurization be performed within a range of 0.5 seconds to 3 hours.

The adhesive composition of the present invention can be used as an adhesive for different kinds of adherends having different thermal expansion coefficients. Specifically, use as an anisotropic conductive adhesive, a silver paste, a circuit connecting material typified by silver film, an elastomer for CSP, an underfill material for CSP, a semiconductor element adhesive material typified by LOC tape, etc. You can

An example of the connection between the anisotropic conductive film produced by using the adhesive composition of the present invention and the conductive particles and the electrode will be described below. The anisotropic conductive film is provided between the electrodes on the substrate facing each other, and is heated and pressed to obtain contact between both electrodes and adhesion between the substrates so that the electrodes can be connected. As a substrate for forming electrodes, various combinations of semiconductors, inorganic materials such as glass and ceramics, organic materials such as polyimide and polycarbonate, and composite materials such as glass / epoxy can be applied. Further, the adhesive composition for circuit connection of the present invention can also be used as a film adhesive for adhering an IC chip and a semiconductor mounting substrate or for adhering electric circuits to each other. That is, a first circuit member having a first circuit electrode and a second circuit member having a second circuit electrode are arranged so that the first circuit electrode and the second circuit electrode face each other, and The adhesive composition (film adhesive) for circuit connection of the present invention is interposed between the arranged first circuit electrode and the second circuit electrode, and the first circuit electrode is arranged to face the above by applying heat and pressure. The second circuit electrode can be electrically connected. As such a circuit member, a chip component such as a semiconductor chip, a resistor chip, a capacitor chip, or a substrate such as a printed board is used. These circuit members are usually provided with a large number of connection terminals (may be single in some cases), and at least one set of the circuit members is arranged so as to face at least a part of the circuit electrodes provided on the circuit members. Then, an adhesive agent is interposed between the circuit electrodes arranged facing each other,
The circuit connection structure is formed by electrically connecting the connection terminals arranged facing each other by heating and pressurizing. By heating and pressing at least one set of the circuit electrodes, the circuit electrodes arranged to face each other can be electrically connected by direct contact or through the conductive particles in the circuit connecting adhesive.

[0028]

EXAMPLES The present invention will be specifically described below based on examples, but the present invention is not limited thereto.

Examples 1 to 3 and Comparative Examples 1 and 2 40 g of phenoxy resin (PKHC, trade name of Union Carbide Co., average molecular weight 45,000) was dissolved in 60 g of methyl ethyl ketone to give a solid content of 40% by weight. It was a solution. Isocyanuric acid EO (ethylene oxide) modified (M-315, a product name manufactured by Toagosei Co., Ltd.) as a radically polymerizable compound, and 1,1-bis (t-hexylperoxy) -3,3,5 as a curing agent. -Trimethylcyclohexane (Perhexa TMH, trade name of NOF CORPORATION),
3-Ethoxysilyl-N- (1,3-dimethylbutylidene) (X12-817H, trade name manufactured by Shin-Etsu Chemical Co., Ltd.) as a silane coupling agent containing a nitrogen atom in an organic group, isocyanurate silane (Y11597, Nippon Unicar Co., Ltd. product name) and isocyanate silane (Y5187, Nippon Unicar Co., Ltd. product name), γ as a silane coupling agent containing no nitrogen atom in the organic group
-Methacryloxypropyltrimethoxysilane (SZ6
030, Toray Dow Corning Co., Ltd.) was used. Further, a nickel layer having a thickness of 0.2 μm is provided on the surface of particles having polystyrene as a nucleus, and a gold layer having a thickness of 0.02 μm is provided on the outer side of the nickel layer, and the average particle diameter is 5 μm.
Conductive particles having a specific gravity of 2.5 were produced. Blended as shown in Table 1 in solid weight ratio, further blended and dispersed 1.5% by volume of conductive particles, applied to a fluororesin film having a thickness of 80 μm using a coating device, and dried at 70 ° C. for 10 minutes with hot air. Thus, a film-like adhesive having an adhesive layer thickness of 20 μm was obtained.

[0030]

[Table 1]

[Measurement of Adhesive Strength] A flexible circuit board (FPC) having 500 copper circuits with a line width of 50 μm, a pitch of 100 μm, and a thickness of 18 μm, and a film adhesive obtained by the above-described method, and a 0.2 μm Glass with a thin layer of indium oxide (ITO) (thickness 1.1
mm, surface resistance 20 Ω / □) is connected to a width of 2 mm by applying heat and pressure at 170 ° C. and 3 MPa for 20 seconds using a thermocompression bonding device (heating method: constant heat type, manufactured by Toray Engineering Co., Ltd.). , A circuit connection structure was produced. Immediately after adhesion of this connection body, 85 ° C, 85%
The adhesive strength after leaving for 100 hours in the RH high temperature and high humidity tank is J
According to IS-Z0237, the 90 degree peeling method was used for measurement and evaluation. Here, the adhesive strength measuring device is Tensilon UTM-4 (Peeling speed 50 mm, manufactured by Toyo Baldwin Co., Ltd.
/ Min, 25 ° C) was used.

Similarly, a flexible circuit board (FPC) having 500 copper circuits with a line width of 50 μm, a pitch of 100 μm and a thickness of 18 μm and a film adhesive of 0.5 μm was prepared using the film-like adhesive obtained by the above-mentioned manufacturing method. Glass with a thin layer of silicon nitride (SiNx) (thickness 0.7
mm) and a thermocompression bonding apparatus (heating method: constant heat type, manufactured by Toray Engineering Co., Ltd.)
Width of 2 mm after heating and pressing at 0 ° C and 3 MPa for 20 seconds
Were connected to produce a connected body. Immediately after the bonding of this connector and after leaving it in a high temperature and humidity tank at 85 ° C. and 85% RH for 100 hours, the bonding strength was 90 in accordance with JIS-Z0237.
The degree of peeling was measured and evaluated. The results of the measurement performed as described above are shown in Table 2.

[0033]

[Table 2]

The adhesive compositions obtained in Examples 1 to 3 are
It can be seen that the bonding strength immediately after bonding is excellent. In Example 3, in particular, it can be seen that, immediately after bonding and after being held in a high temperature and high humidity tank at 85 ° C. and 85% RH for 100 hours, good bonding strength is exhibited and high durability is also provided. On the other hand, in Comparative Example 1 in which the silane coupling agent containing no nitrogen atom in the molecule of the present invention was used, the adhesive strength immediately after adhesion to SiNx was low, and thus a satisfactory connected body could not be obtained. Further, in Comparative Example 2 in which the silane coupling agent was not used, the adhesive strength to SiNx was considerably low, and thus a sufficient connected body could not be obtained. The adhesive composition for circuit connection of the present invention is excellent in adhesive force particularly when the adherend is silicon nitride.

(Example 4, Comparative Example 3) Pump area 50 μ
m × 50 μm, pitch 100 μm, height of 20 μm, an IC chip on which gold bumps are arranged, and an ITO substrate (surface resistance <20Ω / □ formed by vapor deposition of indium-tin oxide (ITO) on 1.1 mm thick glass. ) And quartz using the above adhesive composition (using the film adhesive of Example 1 as Example 4 and using the film adhesive of Comparative Example 2 as Comparative Example 3) It was sandwiched between glass and a pressure head, heated at 180 ° C. and 100 MPa (in terms of gold bump area) for 5 seconds, and pressed to obtain a circuit connection structure. At this time, the film adhesive composition was preliminarily placed on the ITO substrate with the adhesive surface of the adhesive composition at 70 ° C. and 0.5 MPa.
Then, it was heated and pressed for 5 seconds to attach it, and then the fluororesin film was peeled off and connected to the IC chip. Immediately after adhering this connector, and in a 85 ° C, 85% RH high temperature and high humidity tank for 100 hours.
The shear adhesive strength after standing was measured using a bond tester (manufactured by Dyge), and the results are shown in Table 3.

[Table 3] In Example 4, the shear adhesive strength is high immediately after the connection and after standing in a high temperature and high humidity chamber at 85 ° C. and 85% RH for 100 hours, and the connection reliability is excellent. Also, when the connection resistance was measured, it was 1Ω.
It was small and good as follows. On the other hand, Comparative Example 3 in which no coupling agent is used has a markedly poor adhesive strength.

[0036]

According to the present invention, a circuit which can be connected to a composite substrate containing an inorganic material such as SiNx at a low temperature for a short time and has a good performance even after a reliability test under high temperature and high humidity conditions. An adhesive composition for connection can be provided.

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁷ Identification code FI theme code (reference) H01B 1/20 H01B 1/20 D H01R 4/04 H01R 4/04 12/06 9/09 C F term ( Reference) 4J040 EC231 ED111 EE001 EE051 EF181 EK072 FA141 FA151 FA211 HA026 HA066 HB41 HC07 HC14 HD36 KA03 KA12 KA13 KA32 LA06 LA09 MA01 NA19 NA20 5E077 BB28 BB31 BB31 BB31 BB37 BB10 BB31 BB37 CC08 DD BB10 BB31 BB37 CC08 DD BB10 BB31 BB08 BB10 BB10 BB10 BB34 BB08 BB10 BB10 CCB DA05 DA10 DA28 DA29 DD03

Claims (4)

[Claims] 1. A method comprising: (a) a radically polymerizable compound, (b) a curing agent that generates radicals upon irradiation with light or heating, and (c) a silane coupling agent represented by the general formula (I). An adhesive composition for circuit connection. [Chemical 1] (In the formula, X is an organic group containing a nitrogen atom, R ₁ , R ₂ ,
R ₃ is an alkyl group, and n, m, and l are each an integer of 1 to 3) 2. The adhesive composition for circuit connection according to claim 1, further comprising 0.1 to 30% by volume of conductive particles with respect to 100 parts by volume of the adhesive composition. 3. Between the substrates having circuit electrodes facing each other,
A circuit connecting structure in which the circuit connecting adhesive composition according to claim 1 or 2 is interposed and a substrate having circuit electrodes facing each other is pressed to electrically connect the electrodes in the pressing direction. 4. The circuit connecting adhesive composition according to claim 1 or 2 is interposed between the circuit electrodes of the semiconductor element and the circuit electrode of the semiconductor mounting substrate, which face each other, and the circuit electrodes facing each other are provided. A circuit connection structure in which pressure is applied to electrically connect electrodes in the pressing direction.