JP2012126915A - Anisotropic conductive film, connection, and semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an anisotropic conductive film which shows high adhesive strength, excels in storage stability at from room temperature to 50°C, and has an enough performance after a reliability test, and to provide a connection, and a semiconductor device.SOLUTION: The anisotropic conductive film includes: (a) a radically polymerizable compound; (b) a curing agent which generates a radical by using heating of 80-200°C or light irradiation of 150-750 nm and the heating together; and (c) a compound which contains a nitrogen atom and a carbon-carbon double bond in the molecular, wherein (c) the compound which contains the nitrogen atom and the carbon-carbon double bond in the molecular is different from (a) the radically polymerizable compound, and 1-20 pts.wt. of (c) the compound which contains the nitrogen atom and the carbon-carbon double bond in the molecular is included based on 100 pts.wt. of (a) the radically polymerizable compound.

Description

  The present invention relates to an anisotropic conductive film, a connection body, and a semiconductor device.

In the semiconductor element and the liquid crystal display element, various adhesives are conventionally used for the purpose of bonding various members in the element. The adhesives are required to have various properties such as adhesiveness, heat resistance, reliability in a high temperature and high humidity state. In addition, adherends used for bonding include organic substrates such as printed wiring boards and polyimides, metals such as copper and aluminum, and substrates having various surface states such as ITO, SiN, and SiO _2. It is necessary to design a molecule for each adherend. Conventionally, as an adhesive for the semiconductor element and the liquid crystal display element, a thermosetting resin using an epoxy resin having high adhesiveness and high reliability has been used. As a constituent component of the resin, a curing agent such as an epoxy resin, a phenol resin having reactivity with the epoxy resin, and a thermal latent catalyst for promoting the reaction between the epoxy resin and the curing agent are generally used. The heat latent catalyst is an important factor for determining the curing temperature and the curing rate, and various compounds have been used from the viewpoint of storage stability at room temperature and curing rate during heating. The curing conditions in the actual process were that desired adhesion was obtained by curing at a temperature of 170 to 250 ° C. for 1 to 3 hours. However, with the recent high integration of semiconductor elements and high definition of liquid crystal elements, the pitch between elements and wirings has narrowed, and there has been a risk of adversely affecting peripheral members due to heating during curing. In order to further reduce the cost, it is necessary to improve the throughput, and adhesion at a low temperature (100 to 170 ° C.), a short time (within 1 hour), in other words, low temperature rapid curing is required. In order to achieve this low-temperature rapid curing, it is necessary to use a thermal latent catalyst with a low activation energy, but it is very difficult to combine storage stability near room temperature. Recently, a radical curable adhesive using a combination of a (meth) acrylate derivative and a peroxide as a radical initiator has attracted attention. In radical curing, radicals, which are reactive species, are extremely reactive, so they can be cured for a short time and stable at temperatures below the decomposition temperature of the radical initiator. It is a curing system that achieves both storage stability.

  However, since radical curing adhesives have a large cure shrinkage during curing, they are inferior in adhesive strength compared to the case of using an epoxy resin, and in particular, the adhesive strength to inorganic or metal substrates is reduced. To do. For this reason, when it is used as an adhesive for semiconductor elements and liquid crystal display elements, sufficient performance (adhesive strength, etc.) cannot be obtained in a reliability test that is allowed to stand under high temperature and high humidity conditions such as 85 ° C. and 85% RH.

  Although the present invention is a radical curing system, it exhibits high adhesion strength to a substrate composed of a metal and an inorganic material, is excellent in storage stability at room temperature to 50 ° C., and has sufficient performance even after a reliability test. An anisotropic conductive film, a connection body, and a semiconductor device having the above are provided.

  The present invention provides [1] (a) a radical polymerizable compound, (b) 150 to 750 nm light irradiation, 80 to 200 ° C. heating, or curing that generates radicals by using the light irradiation and the heating together. (C) An anisotropic conductive film comprising a compound containing a nitrogen atom and a carbon-carbon double bond in the molecule. The compound (c) containing a nitrogen atom and a carbon-carbon double bond in the molecule of the present invention is different from the (a) radical polymerizable compound. Further, the present invention provides [2] (c) wherein the compound containing a nitrogen atom and a carbon-carbon double bond in the molecule is N-vinylimidazole, N-vinylpyridine, N-vinylpyrrolidone, N-vinylformamide, N-vinylcaprolactam, 4,4′-vinylidenebis (N, N-dimethylaniline), N-vinylacetamide, N, N-dimethylaminoethyl methacrylate, N, N-dimethylaminoethyl acrylate, N, N-dimethylamino The difference according to [1] above, which is at least one selected from propyl methacrylate, N, N-dimethylaminopropyl acrylate, N, N-dimethylacrylamide, acryloylmorpholine, N-isopropylacrylamide, and N, N-diethylacrylamideacrylamide. This is a conductive film. In addition, the present invention provides [3] (a) 100 parts by weight of the radical polymerizable compound, (b) 150 to 750 nm light irradiation, 80 to 200 ° C. heating, or the light irradiation and the heating in combination. And 0.5 to 30 parts by weight of a curing agent that generates radicals, and (c) 0.5 to 30 parts by weight of a compound containing a nitrogen atom and a carbon-carbon double bond in the molecule. 1] or the anisotropic conductive film according to [2] above. In addition, the present invention provides any of the above [1] to [3], further comprising 0.1 to 30% by volume of conductive particles with respect to 100% by volume of [4] (a) radical polymerizable compound. An anisotropic conductive film according to any one of the above. The present invention also provides [5] a substrate having circuit electrodes opposed to each other by interposing the anisotropic conductive film according to any one of [1] to [4] above between substrates having circuit electrodes facing each other. Is a connection body in which the electrodes in the pressurizing direction are electrically connected. Furthermore, the present invention provides [6] the anisotropic conductive film according to any one of [1] to [4] above between the circuit electrodes of the semiconductor elements facing each other and the circuit electrodes of the semiconductor mounting substrate, This is a semiconductor device in which circuit electrodes facing each other are pressed to electrically connect electrodes in the pressing direction.

  According to the present invention, an anisotropic conductive film that can be cured at a low temperature for a short time, exhibits good performance even after a reliability test under a high temperature and high humidity condition, and has excellent storage stability (stand stability), a connection body, and A semiconductor device can be provided.

  As the radically polymerizable compound (a) used in the present invention, a known compound can be used without particular limitation as long as it is a compound having a functional group that is polymerized by an active radical. Examples of such a functional group include an acryloyl group, a methacryloyl group, an allyl group, a maleimide group, a vinyl group and the like in the molecule. However, for ease of selection, an acryloyl group and a methacryloyl group (hereinafter collectively referred to as both) A compound having at least one (meth) acryloyl) in the molecule is preferable, and a compound having two or more (meth) acryloyl groups in the molecule is more preferable because a high curing density can be obtained by curing.

  Specifically, epoxy (meth) acrylate oligomer, urethane (meth) acrylate oligomer, polyether (meth) acrylate oligomer, oligomer such as polyester (meth) acrylate oligomer, trimethylolpropane tri (meth) acrylate, polyethylene glycol di ( (Meth) acrylate, polyalkylene glycol di (meth) acrylate, pentaerythritol (meth) acrylate, 2-cyanoethyl (meth) acrylate, cyclohexyl (meth) acrylate, dicyclopentenyl (meth) acrylate, dicyclopentenyloxyethyl (meth) ) Acrylate, 2- (2-ethoxyethoxy) ethyl (meth) acrylate, 2-ethoxyethyl (meth) acrylate, 2-ethylhexyl (meth) a Relate, n-hexyl (meth) acrylate, 2-hydroxyethyl (meth) acrylate, hydroxypropyl (meth) acrylate, isobornyl (meth) acrylate, isodecyl (meth) acrylate, isooctyl (meth) acrylate, n-lauryl (meth) Acrylate, 2-methoxyethyl (meth) acrylate, 2-phenoxyethyl (meth) acrylate, tetrahydrofurfuryl (meth) acrylate, neopentyl glycol di (meth) acrylate, dipentaerythritol hexa (meth) acrylate, isocyanuric acid modified Bifunctional (meth) acrylate, isocyanuric acid modified trifunctional (meth) acrylate, 2- (meth) acryloyloxyethyl phosphate, 2,2′-di (meth) acryloyloxydie Monofunctional and polyfunctional (meth) acrylate compounds such Ruhosufeto like. These compounds may be used alone or in combination as required.

  The maleimide resin has at least one maleimide group in the molecule. For example, phenylmaleimide, 1-methyl-2,4-bismaleimidebenzene, N, N′-m-phenylenebismaleimide, N , N′-p-phenylene bismaleimide, N, N′-4,4-biphenylene bismaleimide, N, N′-4,4- (3,3-dimethylbiphenylene) bismaleimide, N, N′-4, 4- (3,3-dimethyldiphenylmethane) bismaleimide, N, N′-4,4- (3,3-diethyldiphenylmethane) bismaleimide, N, N′-4,4-diphenylmethane bismaleimide, N, N ′ -4,4-diphenylpropane bismaleimide, N, N'-4,4-diphenyl ether bismaleimide, N, N'-4,4-diphenyls Hong bismaleimide, 2,2-bis (4- (4-maleimidophenoxy) phenyl) propane, 2,2-bis (3-s-butyl-3,4- (4-maleimidophenoxy) phenyl) propane, 1, 1-bis (4- (4-maleimidophenoxy) phenyl) decane, 4,4′-cyclohexylidene-bis (1- (4-maleimidophenoxy) phenoxy) -2-cyclohexylbenzene, 2,2-bis (4 -(4-maleimidophenoxy) phenyl) hexafluoropropane and the like may be used alone or in admixture of two or more. Moreover, you may use citraconic imide resin, nadiimide resin, etc.

  Examples of the curing agent used in the present invention (b) 150-750 nm light irradiation, 80-200 ° C. heating, or a combination of the light irradiation and the heating to generate radicals include α-acetaminophenone derivatives and Known substances such as peroxides and azo compounds can be used without particular limitation. As these compounds, peroxides are more preferable particularly from the viewpoint of easy design of the curing temperature. As the usable peroxide, it is easy to refer to the 1 minute half-life temperature indicating the scale of decomposition of the peroxide, and the 1-minute half-life temperature is preferably 40 ° C. or more and 200 ° C. or less. More preferably, the half-life temperature per minute is 60 ° C. or higher and 170 ° C. or lower. Specific examples include diacyl peroxide derivatives, peroxydicarbonate derivatives, peroxyester derivatives, peroxyketal derivatives, dialkyl peroxide derivatives, and hydroperoxide derivatives.

  Diacyl peroxide derivatives include 2,4-dichlorobenzoyl peroxide, 3,5,5-trimethylhexanoyl peroxide, octanoyl peroxide, lauroyl peroxide, stearoyl peroxide, succinic peroxide, benzoyl peroxide And benzoyl peroxide.

  Examples of peroxydicarbonate derivatives include di-n-propyl peroxydicarbonate, diisopropyl peroxydicarbonate, bis (4-t-butylcyclohexyl) peroxydicarbonate, di-2-ethoxymethoxyperoxydicarbonate, di- (2-Ethylhexylperoxy) dicarbonate, dimethoxybutylperoxydicarbonate, di (3-methyl-3-methoxybutylperoxy) dicarbonate and the like.

  Peroxyester derivatives include 1,1,3,3-tetramethylbutylperoxyneodecanoate, 1-cyclohexyl-1-methylethylperoxynoedecanoate, t-hexylperoxyneodecanoate, t-butylperoxypivalate, 1,1,3,3-tetramethylbutylperoxy-2-ethylhexanate, 2,5-dimethyl-2,5-bis (2-ethylhexanoylperoxy) hexane 2,5-dimethyl-2,5-bis (2-benzoylperoxy) hexane, 1-cyclohexyl-1-methylethylperoxy-2-ethylhexanoate, t-hexylperoxy-2-ethylhexanoate Nate, t-butylperoxyisobutyrate, 1,1-bis (t-butylperoxy) cyclohexane, t-he Silperoxyisopropyl monocarbonate, t-butylperoxy-3,5,5-trimethylhexanonate, t-butylperoxylaurate, 2,5-dimethyl-2,5-di (m-toluoylperoxy) Examples include hexane, t-butyl peroxyisopropyl monocarbonate, t-butyl peroxy-2-ethylhexyl monocarbonate, t-hexyl peroxybenzoate, and t-butyl peroxyacetate.

  As peroxyketal derivatives, 1,1-bis (t-hexylperoxy) -3,3,5-trimethylcyclohexane, 1,1-bis (t-hexylperoxy) -3,3,5-trimethylcyclohexane 1,1- (t-butylperoxy) cyclododecane, 2,2-bis (4,4-di-t-butylperoxycyclohexyl) propane, 2,2-bis (t-butylperoxy) decane, etc. Is mentioned.

  Dialkyl peroxide derivatives include α, α ′ bis (t-butylperoxy) diisopropylbenzene, dicumyl peroxide, 2,5-dimethyl-2,5-di (t-butyloxy) hexane, and t-butylcumylper. Examples include oxides.

  Examples of hydroperoxides include diisopropylbenzene hydroperoxide and cumene hydroperoxide. These compounds may be used alone or as a mixture of two or more compounds.

  (B) The addition amount of a hardening | curing agent is 0.5-30 weight part with respect to 100 weight part of (a) radically polymerizable compound, Preferably it is 1-20 weight part. When the addition amount is less than 0.5 parts by weight, there is a concern about insufficient curing, and when it exceeds 30 parts by weight, the adhesive strength may be reduced.

  As the compound containing a nitrogen atom and a carbon-carbon double bond in the molecule (c) used in the present invention, a known compound can be used without particular limitation. As such a compound, a vinyl compound having an amino group in the molecule is particularly preferable. Specifically, N-vinylimidazole, N-vinylpyridine, N-vinylpyrrolidone, N-vinylformamide, N-vinylcaprolactam, 4,4′-vinylidenebis (N, N-dimethylaniline), N-vinylacetamide N, N-dimethylaminoethyl methacrylate, N, N-dimethylaminoethyl acrylate, N, N-dimethylaminopropyl methacrylate, N, N-dimethylaminopropyl acrylate, N, N-dimethylacrylamide, acryloylmorpholine, N-isopropyl Examples include at least one vinyl compound selected from acrylamide and N, N-diethylacrylamide. These compounds may be used alone or in admixture of two or more compounds.

  (C) The addition amount of the compound containing a nitrogen atom and a carbon-carbon double bond in the molecule is 0.5 to 30 parts by weight, preferably 1 with respect to 100 parts of (a) the radical polymerizable compound. ~ 20 parts by weight. If the addition amount is less than 0.5 parts by weight, high adhesive strength is difficult to obtain, and if it exceeds 30 parts by weight, the water absorption rate of the adhesive after curing is increased and the reliability may be lowered. There is.

  Examples of the conductive particles used in the present invention include metal particles such as Au, Ag, Ni, Cu, and solder, and carbon. Further, non-conductive glass, ceramic, plastic, or the like may be used as a core, and the core, metal particles, or carbon may be coated on the core. In the case where the conductive particles are made of plastic as a core and the core is coated with the metal, metal particles or carbon, or hot-melt metal particles, it is deformable by heating and pressurization, eliminating variations in electrode height during connection. Moreover, it is preferable because the contact area with the electrode is increased and the reliability is improved. In addition, the fine particles with the surface of these conductive particles coated with a polymer resin or the like can suppress short circuit due to contact between the particles when the amount of the conductive particles is increased, and can improve the insulation between the electrode circuits. These may be used alone or mixed with conductive particles as appropriate.

  The average particle diameter of the conductive particles is preferably 1 to 18 μm from the viewpoint of dispersibility and conductivity. Although there is no restriction | limiting in particular in the usage-amount of electroconductive particle, It is preferable to set it as 0.1-30 volume% with respect to the total 100 volume of the adhesive composition for circuit connection, and set it as 0.1-10 volume%. It is more preferable. If this value is less than 0.1% by volume, the conductivity tends to be inferior, and if it exceeds 30% by volume, a short circuit tends to occur. In addition, although volume% is determined based on the volume of each component before 23 degreeC hardening, the volume of each component can be converted into a volume from a weight using specific gravity. In addition, do not dissolve or swell the component in a graduated cylinder, etc., but put in a suitable solvent (water, alcohol, etc.) that wets the component well. You can ask for it.

  To the adhesive composition for connecting a contact circuit of the present invention, an additive such as an adhesion improver such as a coupling agent, a leveling agent, and a colorant may be appropriately added.

  The adhesive composition for circuit connection of the present invention may be appropriately added with various resins in order to impart thickening, film-forming properties, adhesiveness, and stress relaxation during curing. The resin to be used is not particularly limited, but (a) a radically polymerizable compound, (b) a curing agent, (c) a compound containing a nitrogen atom and a carbon-carbon double bond in the molecule, and conductive particles are adversely affected. It is essential not to reach. Examples of such resins include polyvinyl butyral resin, polyvinyl formal resin, polyester resin, polyamide resin, polyimide resin, xylene resin, phenoxy resin, polyurethane resin, polymethacrylate resin, polyacrylate resin, SBS and its epoxy modified product, SEBS and A polymer component such as a modified product or urea resin is used. These polymer components preferably have a molecular weight of 10,000 to 10,000,000. The larger the molecular weight, the easier it is to obtain film formability, and the melt viscosity that affects the fluidity as an adhesive can be set in a wide range. Furthermore, these can be suitably used as the adhesive composition as long as the resins to be mixed are completely compatible with each other or microphase separation occurs and the liquid becomes cloudy. Further, these resins may be modified with radically polymerizable functional groups, and in this case, heat resistance is improved. These resins may contain a siloxane bond or a fluorine substituent. Furthermore, it may be modified with a radical polymerizable functional group, an epoxy group, a carboxyl group or the like, and in this case, the heat resistance is improved. The compounding quantity of a high molecular component is 2 to 80 weight%, 5 to 70 weight% is preferable and 10 to 60 weight% is especially preferable. If it is less than 2% by weight, the stress relaxation and the adhesive force are not sufficient, and if it exceeds 80% by weight, the fluidity is lowered.

  The adhesive composition for circuit connection of the present invention can be used in a paste form when it is liquid at room temperature. In the case of a solid at room temperature (about 25 ° C.), in addition to heating, it may be pasted using a solvent. The solvent that can be used is not particularly limited as long as it is not reactive with the adhesive composition and additives, and exhibits sufficient solubility, but has a boiling point of 50 to 150 ° C. at normal pressure. Those are preferred. When the boiling point is 50 ° C. or lower, there is a risk of volatilization if left at room temperature, which restricts use in an open system. Moreover, when the boiling point is 150 ° C. or higher, it is difficult to volatilize the solvent, which may adversely affect the reliability after bonding.

  The adhesive composition for circuit connection of the present invention can be used in the form of a film. A solution prepared by adding a solvent or the like to the adhesive composition as necessary is applied to a peelable substrate such as a fluororesin film, a polyethylene terephthalate film, or a release paper, or a substrate such as a nonwoven fabric is impregnated with the solution. Can be used as a film after removing the solvent and the like. Use in the form of a film is more convenient from the viewpoint of handleability.

The adhesive composition for circuit connection of the present invention can be bonded by light irradiation, heating, or heating and pressurization simultaneously with light irradiation. By using these in combination, adhesion at a lower temperature and in a shorter time becomes possible. The light irradiation is preferably in the wavelength range of 150 to 750 nm, and the irradiation dose is 0.1 to 10 J / cm ² using a low pressure mercury lamp, a medium pressure mercury lamp, a high pressure mercury lamp, an ultrahigh pressure mercury lamp, a xenon lamp, or a metal halide lamp. Can be cured. The heating temperature is 80 to 200 ° C., but may be about 80 to 50 ° C. to 170 ° C. The pressure is not particularly limited as long as it does not damage the adherend, but is generally preferably 0.1 to 10 MPa. These heating and pressurization are performed for 0.5 seconds to 3 hours, preferably 0.5 seconds to 10 minutes, and more preferably 0.5 seconds to 1 minute.

  The adhesive composition for circuit connection of the present invention can be used not only for circuit connection but also as an adhesive for different types of adherends having different thermal expansion coefficients. Specifically, it is used as a semiconductor element adhesive material typified by anisotropic conductive adhesive, silver paste, silver film, etc., circuit connection material, CSP elastomer, CSP underfill material, LOC tape, etc. Can do.

  Below, an example of the connection of the anisotropic conductive film produced using the adhesive composition for circuit connection of this invention and an electrically-conductive particle and an electrode is demonstrated. An anisotropic conductive film is present between opposing circuit electrodes on the substrate, and is heated and pressed to obtain contact between the electrodes and adhesion between the substrates, thereby enabling connection with the electrodes. As the substrate on which the circuit electrodes are formed, various combinations of inorganic materials such as semiconductors, glass and ceramics, organic materials such as polyimide and polycarbonate, and composite materials such as glass / epoxy can be applied.

  Hereinafter, the present invention will be specifically described based on examples, but the present invention is not limited thereto.

(Examples 1-2, Comparative Examples 1-2) 40 g of phenoxy resin (PKHC, trade name of Union Carbide, average molecular weight 45,000) was dissolved in 60 g of methyl ethyl ketone to obtain a solution having a solid content of 40% by weight. . As a radical polymerizable compound, isocyanuric acid EO (ethylene oxide) modified (M-315, trade name manufactured by Toa Gosei Co., Ltd.) and 2-methacryloyloxyethyl acid phosphate (light ester P-2M, trade name manufactured by Kyoeisha Chemical Co., Ltd.) ), 1,1-bis (t-hexylperoxy) -3,3,5-trimethylcyclohexane (Perhexa TMH, product name manufactured by NOF Corporation) as a curing agent, nitrogen atom and carbon-carbon in the molecule N-vinylimidazole (manufactured by Tokyo Chemical Industry Co., Ltd.) and acryloylmorpholine (ACMO, trade name of Kojin Co., Ltd.) were used as the compound containing a double bond. In addition, a nickel layer having a thickness of 0.2 μm is provided on the surface of particles having polystyrene as a core, and a gold layer having a thickness of 0.02 μm is provided outside the nickel layer, and conductive particles having an average particle diameter of 5 μm and a specific gravity of 2.5. Was made. It mix | blends as shown in Table 1 by solid weight ratio, Furthermore, 1.5 volume% of conductive particles are mix-dispersed, and it apply | coats to an 80-micrometer-thick fluororesin film using a coating device, 70 degreeC hot-air drying for 10 minutes As a result, a film adhesive having an adhesive layer thickness of 20 μm was obtained.

  [Measurement of Adhesive Strength and Connection Resistance] A flexible circuit board (FPC) having 500 copper circuits having a line width of 50 μm, a pitch of 100 μm, and a thickness of 18 μm, and a 0.2 μm A glass (thickness 1.1 mm, surface resistance 20 Ω / □) on which a thin layer of indium oxide (ITO) is formed using a thermocompression bonding apparatus (heating method: constant heat type, manufactured by Toray Engineering Co., Ltd.), A connection was made by heating and pressing at 3 MPa for 20 seconds and connecting over a width of 2 mm. The resistance value between adjacent circuits of this connection body was measured with a multimeter immediately after bonding and after being kept in a high-temperature and high-humidity bath at 85 ° C. and 85% RH for 240 hours. The resistance value is shown as an average of 150 resistances between adjacent circuits.

  Moreover, the adhesive strength of this connection body was measured by a 90-degree peeling method according to JIS-Z0237 and evaluated. Here, Tensilon UTM-4 (peeling speed 50 mm / min, 25 ° C.) manufactured by Toyo Baldwin Co., Ltd. was used as a measuring device for adhesive strength. Table 2 shows the results of measurement of the adhesive strength and connection resistance of the connection body performed as described above.

  The adhesive compositions for circuit connection obtained in Examples 1 and 2 show good connection resistance and adhesive strength immediately after bonding and after being kept in a high-temperature and high-humidity tank at 85 ° C. and 85% RH for 240 hours. It can be seen that it has high durability. On the other hand, in Comparative Examples 1 and 2 in which the compound (basic vinyl compound) containing a nitrogen atom and a carbon-carbon double bond in the molecule (c) of the present invention is not used, a good value is obtained immediately after bonding. As shown in the figure, after being kept in a high-temperature and high-humidity tank at 85 ° C. and 85% RH for 240 hours, the connection resistance increased and the adhesive strength significantly decreased, so that a satisfactory connection body could not be obtained.

  (Example 3) The film adhesive obtained in Example 1 was vacuum-packed and allowed to stand at 40 ° C for 5 days, and then subjected to thermocompression bonding between FPC and ITO in the same manner. Connection resistance 2.3 Ω, adhesion strength 1050 N / m, 85 ° C., 85% RH after holding for 240 hours in a high temperature and high humidity bath, connection resistance 2.8 Ω, adhesion strength 900 N / m Even after the test, the same good value as before standing is shown, and the standing stability (storage stability) is excellent.

(Comparative Example 3) The film-like adhesive obtained in Comparative Example 1 was subjected to a standing stability test in the same manner as in Example 3. As a result, the connection resistance immediately after bonding was 4.8Ω, the adhesive strength was 600 N / m, The connection resistance after holding for 240 hours in a high-temperature and high-humidity bath at 85 ° C. and 85% RH is 8.7Ω, and the adhesive strength is 200 N / m. Inferior stability.

Claims (6)

An anisotropic conductive film for interposing between substrates having circuit electrodes facing each other, electrically connecting the electrodes in the pressing direction by heating and pressurizing the substrates having circuit electrodes facing each other,
(A) a radically polymerizable compound, (b) a curing agent that generates radicals by using a combination of heating at 80 to 200 ° C. or light irradiation at 150 to 750 nm and the heating, and (c) a nitrogen atom in the molecule And a compound containing a carbon-carbon double bond,
The compound (c) containing a nitrogen atom and a carbon-carbon double bond in the molecule is different from the (a) radical polymerizable compound, and includes N-vinylimidazole, N-vinylpyridine, N- Vinylpyrrolidone, N-vinylformamide, N-vinylcaprolactam, 4,4′-vinylidenebis (N, N-dimethylaniline), N-vinylacetamide, N, N-dimethylaminoethyl methacrylate, N, N-dimethylaminoethyl At least one selected from acrylate, N, N-dimethylaminopropyl methacrylate, N, N-dimethylaminopropyl acrylate, N, N-dimethylacrylamide, acryloylmorpholine, N-isopropylacrylamide, N, N-diethylacrylamide,
1 to 20 parts by weight of the compound containing a nitrogen atom and a carbon-carbon double bond in the molecule (c) with respect to 100 parts by weight of the (a) radical polymerizable compound,
Anisotropic conductive film.   (A) Curing agent that generates radicals by combining (b) heating at 80 to 200 ° C. or light irradiation at 150 to 750 nm and the heating with respect to 100 parts by weight of the radical polymerizable compound 0.5 to 30 The anisotropic conductive film of Claim 1 formed by containing a weight part.   The anisotropic conductive film according to claim 1 or 2, comprising conductive particles.   The anisotropic conductive film according to claim 1 or 2, further comprising 0.1 to 30% by volume of conductive particles with respect to 100% by volume of the (a) radical polymerizable compound.   The anisotropic conductive film according to any one of claims 1 to 4 is interposed between substrates having circuit electrodes opposed to each other, and the substrate having circuit electrodes opposed to each other is heated and pressed between the electrodes in the pressing direction. A connection body that is electrically connected. The anisotropic conductive film according to any one of claims 1 to 4 is interposed between the circuit electrodes of the semiconductor elements facing each other and the circuit electrodes of the semiconductor mounting substrate, and the circuit electrodes facing each other are heated and pressed. A semiconductor device in which electrodes in the pressure direction are electrically connected.