JP2003280180A - Photosensitive resin composition and photosensitive resin laminate using the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition which is thoroughly developed, has high sensitivity, high resolution, good adhesion to a substrate and excellent etching resistance, can be developed with a dilute aqueous alkali solution and makes stripped pieces small in stripping with an aqueous alkali solution and to provide a photosensitive resin laminate and a method for producing the same. <P>SOLUTION: The photosensitive resin composition comprises at least a binder resin (A), a polymerizable monomer (B), a photopolymerization initiator (C) and an organic carboxylic acid anhydride. The photosensitive resin laminate (dry film resist) is produced using the photosensitive resin composition. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a photosensitive resin composition that can be developed with a dilute alkaline solution, a photosensitive resin laminate using the same, and a method for producing the same, and more specifically, a photoresist for etching and the like. The present invention relates to a photosensitive resin composition applicable to, and can be widely used in the printing industry, the electronics industry and the like.

[0002]

2. Description of the Related Art As a resist used for processing a metal base material using a photo-etching method typified by lead frame manufacturing, a stamping method or a water-soluble polymer (PVA, casein, etc.) has been used as a resist. A liquid resist added with dichromate has been used as the resist. However,
Due to the recent fine patterning and small-quantity and large-variety production, the stamping method has problems such as the limit of resolution and soaring mold cost.When liquid resist is used, the capital investment for coating and drying is large and uniform. Problems such as difficult coating, low sensitivity, and treatment of chromium waste liquid generated during the process have occurred. In order to solve these problems, dry film resists are often used in the field of photoresists for processing metal substrates in recent years.

When it is used as an etching photoresist, it has a high sensitivity and a high resolution, and has an adhesion force to a substrate.
It is necessary to have excellent chemical resistance (etching resistance).
Further, it is desirable that the storage stability is good in consideration of handleability, and that development is possible with water or a dilute alkaline aqueous solution rather than an organic solvent in consideration of working environment and natural environment protection.

As a method for use as a resist for processing a metal substrate, a photosensitive resin composition is applied onto a substrate or a photosensitive film (dry film) in which a photosensitive layer made of the photosensitive resin composition is formed on a film-shaped support. Resist) is laminated, and after pattern exposure, the unexposed portion is removed with a developer,
According to the intended use, a pattern is formed by performing etching or plating treatment, and then the photosensitive cured film is peeled off from the substrate. Especially, in the peeling process of the cured resist, if the peelability from the substrate is insufficient, the peeled cured resin piece (peeling piece) becomes large and the resin piece is entangled with the transport roller, and the peeling piece is reattached to the substrate. However, there arises a problem that the immersion time in the resist stripping solution becomes long, and the stripping solution becomes difficult to regenerate by filtration. When an organic amine-based stripping agent is used as the resist stripping solution, the stripping piece shape becomes fine and the dipping time can be shortened, but problems such as odor and waste liquid treatment occur. Therefore, there is a demand for a new photosensitive resin composition capable of realizing stripping of stripped pieces and reduction of immersion time in a conventional aqueous stripping solution such as heated sodium hydroxide or potassium hydroxide.

Conventionally, a method of using a binder resin having a low molecular weight (weight average molecular weight of 20,000 or less), a hydrophilic monomer or a monofunctional monomer has been used as a method for making the peeled pieces of an alkali developing type photosensitive film into fine pieces. And a method using a binder polymer having polyethylene glycol (Japanese Patent Publication No. 49-43434)
However, these methods have a problem that chemical resistance such as resistance to an etching solution or a plating solution further decreases due to the characteristics of the binder resin used. Further, a method of mixing a high molecular weight binder resin and a low molecular weight binder resin (Japanese Patent Laid-Open No. 11-2122).
No. 62), there remains a problem in resolution.

[0006]

SUMMARY OF THE INVENTION The object of the present invention is to overcome the above-mentioned problems, to provide high sensitivity and high resolution with no development residue, good adhesion to a substrate, and excellent etching resistance. Another object of the present invention is to provide a photosensitive resin composition and a photosensitive resin laminate, which can be developed using a dilute alkaline aqueous solution, and have a strip-like strip shape when stripped using a strong alkaline aqueous solution, and a method for producing the same.

[0007]

[Means for Solving the Problems] As a result of studies to solve the above problems, the sensitivity, resolution, adhesion, and etching resistance were improved by adding an organic carboxylic acid anhydride to the photosensitive resin composition. It was found that the shape of the peeling piece becomes a strip in peeling with an alkaline aqueous solution without lowering, and the above-mentioned problems were achieved. That is, the present application provides the following inventions. A first invention according to claim 1 is a photosensitive resin composition containing at least a binder resin (A), a polymerizable monomer (B), a photopolymerization initiator (C) and an organic carboxylic acid anhydride (D), The film formed after photocuring of the photosensitive resin composition has a thickness of 10 to 40 μm, and is immersed in a strong alkaline aqueous solution for less than 2 minutes to give 10 m.
A photosensitive resin composition, which is a resin strip having m-square or less. A second invention according to claim 2 is a photosensitive resin composition containing at least a binder resin (A), a polymerizable monomer (B), a photopolymerization initiator (C) and an organic carboxylic acid anhydride (D), Etching characterized in that a film formed after photocuring of the photosensitive resin composition is a resin strip of 10 mm square or less when immersed in a heated alkaline aqueous solution at a thickness of 10 to 40 μm within 2 minutes. It is a photosensitive resin composition for use. A third invention according to claim 3 is a photosensitive resin laminate having at least a support and a photosensitive layer, wherein the photosensitive layer is the photosensitive resin laminate.
It is a photosensitive resin laminated body characterized by comprising the photosensitive resin composition described. According to a fourth aspect of the present invention, in a photosensitive resin laminate having at least a support and a photosensitive layer, the photosensitive layer has at least a binder resin (A), a polymerizable monomer (B), and a photopolymerization initiator ( A photosensitive resin laminate comprising a photosensitive resin composition containing C) and an organic carboxylic acid anhydride (D). 5th invention which concerns on Claim 5 WHEREIN: As for the ratio which occupies in the non-volatile component in the said photosensitive resin composition, respectively, the binder resin (A) is 30-80 weight%, and the polymerizable monomer (B) is 20-60. % By weight, and the photopolymerization initiator (C) was 0.
1 to 10% by weight, the organic carboxylic acid anhydride (D) is 1 to 1
It is 5 weight%, It is a photosensitive resin laminated body of Claim 2 characterized by the above-mentioned.

[0008]

BEST MODE FOR CARRYING OUT THE INVENTION The photosensitive resin composition of the present invention will be described in detail below.

In the present invention, as the binder resin (A), a copolymer containing at least one monomer having an acidic group is preferably used. Specific examples of such a copolymer binder resin include acidic acids such as (meth) acrylic acid, maleic acid, maleic anhydride, crotonic acid, itaconic acid, fumaric acid, and (o, m or p) -polyvinylphenol. A monomer having a group and a monomer copolymerizable with the monomer having an acidic group, specifically, (meth) acryl such as methyl (meth) acrylate, ethyl (meth) acrylate, and hydroxyethyl (meth) acrylate. Examples thereof include, but are not limited to, acid esters and binder resins obtained by copolymerizing styrene, α-methylstyrene, vinyl acetate, acrylonitrile, (meth) acrylamide, allyl glycidyl ether, and the like. In addition, in this specification, "(meth) acrylic" means "acrylic or methacrylic". The same applies to "(meth) acrylate".

The molecular weight of this binder resin (A) is G
The polystyrene-equivalent weight average molecular weight measured by PC (gel permeation chromatography) is about 5,0.
It is preferably from 00 to about 200,000. When it is smaller than this, the strength of the cured film is remarkably lowered, and when it is larger than this, the solubility is lowered, and the peeled pieces are not preferable because they become fine pieces at the time of peeling. Considering sensitivity, resolution and peeling property, the weight average molecular weight is more preferably in the range of 8,000 or more and 80,000 or less. Further, the proportion of the binder resin (A) is 30 to 8 in the nonvolatile component excluding the diluent of the photosensitive resin composition.
It is preferably in the range of 0% by weight. Furthermore, the acid value of the binder resin (A) (in accordance with JIS K-1557)
Is preferably in the range of 50 to 500 mgKOH / g. When the acid value is 50 mgKOH / g or less, it becomes difficult to remove the uncured photosensitive resin composition during development with a dilute alkaline aqueous solution. On the other hand, the acid value is 500mgKOH / g
If the above is the case, an image may flow during development with a dilute aqueous alkali solution, or the moisture resistance of the cured film may deteriorate. The binder resin may be used alone or in combination of two or more.

The binder resin (A) may be one in which a polymerizable group such as a polymerizable double bond is added to the side chain, if necessary, and the commercially available compound is Daicel Chemical Industries Ltd. ) "Cyclomer P" manufactured by
There is no particular limitation as long as a polymerizable group is newly introduced using the binder resin. By adding a polymerizable double bond group to the side chain of the binder resin, the reactivity of the binder resin is increased, and the sensitivity and chemical resistance can be improved, and thus a more preferable photosensitive resin composition is obtained. You can

The polymerizable monomer (B) used in the present invention may be a compound having a radical polymerizable property and is compatible with the binder resin (A). Such compounds include (meth) acrylic acid, itaconic acid, maleic acid,
(Meth) acrylamide, diacetone acrylamide,
High-boiling-point vinyl monomers such as ethylenebisacrylamide, mono (meth) acrylic esters such as methanol, ethanol, 1-propanol, 1-butanol, 2-ethylhexanol, and ethylene glycol, and ethylene glycol, diethylene glycol, polyethylene glycol. In addition to 2- to 6-functional (meth) acrylic acid esters such as neopentyl glycol, trimethylolpropane, pentaerythritol, and dipentaerythritol, urethane acrylates and polyfunctional (meth) acrylates having urethane group polyesters may be mentioned. Yes, but not limited to this. Further, the polymerizable monomer (B) used may be two or more kinds, or may contain two or more kinds of ethylenically unsaturated units. Among these polymerizable monomers, trifunctional or higher functional acrylic monomers are particularly preferable in terms of sensitivity and etching resistance of the cured film.
The monomer can be contained in the range of 20 to 60% by weight, preferably 20 to 50% by weight, based on the nonvolatile components of the photosensitive resin composition. If it is 20 parts by weight or less, the sensitivity is lowered, and if it is 50 parts by weight or more, the developability is deteriorated.

Further, the photopolymerization initiator (C) in the present invention
The compound is not particularly limited as long as it is a compound that generates a radical species by light, and includes, for example, benzoin and its alkyl ethers such as benzoylmethyl ether and benzoylethyl ether, and 2,2-dimethoxy-2-phenylacetophenone. 2,2-diethoxyacetophenone, 2-methyl- [4- (methylthio) phenyl]-
Acetophenones such as 2-morpholino-1-propanone, anthraquinones such as 2-methylanthraquinone, thioxanthones such as 2,4-diethylthioxanthone, ketals or xanthones, and benzophenones such as methylbenzophenone. These may be used in combination with known and commonly used photopolymerization accelerators such as benzoic acid type or tertiary amine type. These photopolymerization initiators can be used alone or in combination with each other as appropriate, and the total amount thereof is preferably 0.1 to 10 relative to the nonvolatile components of the photosensitive resin composition.
%, Particularly preferably 1 to 7% by weight. If it is less than the above range, it is not sufficiently photocured, while if it is more than the above range, it becomes thermally unstable, and it is not preferable in terms of light transmittance and cost.

In the present invention, the organic carboxylic acid anhydride (D) is blended. As the acid to be blended, an organic carboxylic acid anhydride is particularly preferable in terms of the strength and availability of the acid, and specifically, acetic anhydride, trichloroacetic anhydride, trifluoroacetic anhydride, tetrahydrophthalic anhydride, succinic anhydride. , Maleic anhydride, itaconic anhydride, glutaric anhydride, 1,2-cyclohexanedicarboxylic anhydride, n-octadecylsuccinic anhydride, 5-anhydrous
Aliphatic carboxylic acid anhydrides such as norbornene-2,3-dicarboxylic acid, phthalic anhydride, trimellitic acid anhydride,
Examples thereof include aromatic carboxylic acid anhydrides such as pyromellitic acid anhydride and naphthalic acid anhydride. Of these, succinic anhydride is preferable. The organic carboxylic acid anhydride content can be in the range of 1 to 15% by weight, preferably 2 to 8% by weight, based on the nonvolatile components of the photosensitive resin composition.
When the content of the component (D) is 15% by weight or more, the resolution becomes poor.
Further, other than those listed here, there is no particular limitation as long as it is an acid capable of hydrolysis.

When preparing the photosensitive resin composition of the present invention, the non-volatile components consisting of the components (A) to (D) may be diluted if necessary. Specific examples include the following. Dichloromethane, chloroform, acetone, 2-butanone, cyclohexanone, ethyl acetate, 2-methoxyethanol, 2-ethoxyethanol, 2-butoxyethanol, 2-ethylethoxyacetate, 2-butoxyethylacetate, 2-methoxyethylether, 2- Ethoxyethyl ether, 2-
(2-ethoxyethoxy) ethanol, 2- (2-butoxyethoxy) ethanol, 2- (2-ethoxyethoxy) ethyl acetate, 2- (2-butoxyethoxy)
Examples of the organic solvent include ethyl acetate, propylene glycol monomethyl ether, tetrahydrofuran, and 1,4-dioxane. These solvents may be used alone or in a mixture of two or more.

The photosensitive resin composition of the present invention may contain coloring substances such as dyes and pigments in order to improve the visibility of development and etching patterns. The coloring substance is preferably added in a proportion of 0.1 to 2.4% by weight with respect to the nonvolatile content of the photosensitive resin composition. If the amount is less than 0.1% by weight, the visibility is impaired, and if the amount is more than 2.4% by weight, the sensitivity and resolution of the photosensitive resin composition are adversely affected. Examples of coloring substances that can be added include fuchsin, phthalocyanine green, auramine base, chalcoxide green S, paramagenta, crystal violet, methyl orange, Nile blue 2B, Victoria blue, malachite green, basic blue 20, diamond green and the like. Of these, dyes are particularly preferable.

A color-forming dye that develops color upon irradiation with light may be incorporated in the photopolymerizable composition of the present invention. As such a coloring dye, there is a combination of a leuco dye or a fluorane dye and a halogen compound. Examples of leuco dyes include tris (4-dimethylamino-
2-methylphenyl) methane [leuco crystal violet], tris (4-dimethylamino-2-methylphenyl) methane [leucomalachite green] and the like can be mentioned. On the other hand, as the halogen compound, amyl bromide, isoamyl bromide, isobutylene bromide, ethylene bromide, diphenylmethyl bromide, benzal bromide, methylene bromide, tribromomethylphenyl sulfone, carbon bromide, tris (2, 3-dibromopropyl) phosphate, trichloroacetamide, amyl iodide, isobutyl iodide,
1,1,1-trichloro-2,2-bis (p-chlorophenyl) ethane, hexachloroethane, triazine compounds and the like can be mentioned.

The photosensitive resin composition of the present invention has the above (A)
In addition to the component (D), if necessary, compatible additives such as a polymerization inhibitor, a plasticizer, a stabilizer, a surfactant,
A leveling agent, a coupling agent, an antihalation agent and the like can be added within a range that does not impair the object of the present invention.

The photosensitive resin composition thus obtained is applied with a bar coater, an applicator, a doctor blade,
It is coated on a metal substrate such as stainless steel or copper, a glass substrate, a substrate such as a plastic film typified by polyester by using a known coating means such as a roll coater, a spin coater, a die coater, and a comma coater, and a photosensitive layer. To form. If diluted, then for example 60-1
Dry at a temperature of 00 ° C. Although the thickness of the photosensitive layer after drying varies depending on the use, it is 5 to 100 μm, preferably 10 to 80 μm for producing a printed wiring board and a metal-worked substrate.
And a frequently used range is 10 to 40 μm. The thinner the photosensitive layer, the higher the resolution.

The photosensitive layer formed by the above method is exposed through a photomask having a predetermined pattern with, for example, an ultrahigh pressure mercury lamp, a high pressure mercury lamp, a medium pressure mercury lamp, a low pressure mercury lamp, a xenon lamp, a halogen lamp, etc. After curing the light-irradiated portion, the resist pattern faithful to the mask pattern can be obtained by developing with a developer which is a dilute alkaline aqueous solution. As the developing solution, an aqueous solution of sodium carbonate having a concentration of 0.5 to 5% by weight is usually used as a dilute alkali, but is not limited thereto. If you need more,
It is possible to improve heat resistance, etching resistance and adhesion by heat treatment, i.e. post-baking, to further advance the film hardening. The heat treatment may be performed in a hot air oven, a far infrared ray oven, or the like at a temperature and time at which the thermosetting components sufficiently react.

The photosensitive resin composition of the present invention is used as a photoresist, such as an etching resist, a solder resist,
It is used for dry film resists and printing plates. When it is used as an etching resist, the resist pattern formed on the substrate as described above is treated with an etching solution to transfer the desired pattern onto the substrate. Let The etching solution is not particularly limited, but usually an aqueous solution of ferric chloride, cupric chloride or the like is used.

After the etching process is completed, the photosensitive layer cured by using a heated strong alkaline aqueous solution is removed. The temperature of the strong alkaline aqueous solution is preferably 50 ° C. or higher. Further, it is preferable that the base used as the aqueous solution is an inorganic base because the environmental load is light, and a hydroxide of an alkali metal or an alkaline earth metal is preferable. Specifically, sodium hydroxide or potassium hydroxide is the most preferable. The concentration is pH 12 or more, which can be called a strong alkali, preferably pH 13
If the adjustment is made as described above, the stripping proceeds well,
It is also good for shortening the immersion time. Although it depends on the thickness of the film formed after photo-curing, in a general range of use as an etching resist of 10 to 40 μm, the immersion time in a stripping solution which is a strong alkaline aqueous solution is usually 10 seconds to 2 minutes. Ranges are preferred. If the immersion time is short, the cured resin coating will not completely peel off, or the peeled pieces will be as large as 10 mm square or more even after peeling. The cured film of the photosensitive resin composition of the present invention has a thickness of 10 μm and a size of 10 × on the test substrate.
In the case of being prepared with 10 cm ² , the strip can be peeled off even by immersing in a strong alkaline aqueous solution for 30 seconds, and the stripping proceeds more reliably in 1 minute and 30 seconds after 1 minute of immersion.

When used as a dry film resist, the photosensitive resin composition of the present invention is applied to a flexible film-like support such as polyethylene or polyester by the above method and then dried. To form a photosensitive layer, and a protective film is laminated on the photosensitive layer to form a dry film. As a method of using this dry film, in accordance with a conventional method, first, a protective film is stripped from the dry film resist, the exposed photosensitive layer is superposed on the heated substrate surface, and then the photosensitive layer is exposed through a predetermined negative mask, and then, By carrying out development and heat treatment, a desired image can be formed.

The embodiments of the present invention will be described below with reference to specific examples. Further, since the photosensitive resin composition of the present invention is extremely sensitive to light, in order to prevent exposure to unnecessary light such as natural light, all work is performed in yellow,
Or it should be done under red light.

[0025]

The present invention will be described in more detail below with reference to examples and comparative examples, but the present invention is not limited to the following examples unless it exceeds the gist.

<Examples 1 to 8 and Comparative Examples 1 to 2> Percentage of nonvolatile components (components (A) to (D)) in the photosensitive resin composition according to the compounding ratios shown in Table 1. Of 45% was sufficiently mixed and dissolved in propylene glycol monomethyl ether as a diluting solvent to prepare a photosensitive resin composition. The unit in Table 1 is parts by weight.

[0027]

[Table 1]

<Binder resin> A: Cyclomer P ACA200M (manufactured by Daicel Chemical Industries, Ltd., acid value = 115 mg KOH / g weight average molecular weight = 11,000, solvent propylene glycol monomethyl ether, solid content 50 g) <Polymerizable monomer> B1: urethane Acrylate (Kyoeisha Chemical Co., Ltd. "U
A306H ") B2: Dipentaerythritol (penta and hexa) acrylate (" Aronix M40 manufactured by Toagosei Co., Ltd. "
0 ") <Photoinitiator> C1: 2-methyl- [4- (methylthio) phenyl]-
2-morpholino-1-propanone (“Irg907” manufactured by Ciba Specialty Chemicals Co., Ltd.) C2: 4,4′-bisdiethylaminobenzophenone C3: 2,4-diethylthioxanthone (manufactured by Nippon Kayaku Co., Ltd. “DETX-”) S ") <organic carboxylic acid anhydride> D1: succinic anhydride D2: maleic anhydride <coloring substance> E1: leuco crystal violet <coloring dye> E2: malachite green E3: tribromomethysphenyl sulfone

Each of the photosensitive resin compositions of Examples 1 to 8 and Comparative Examples 1 and 2 was used as a support and had a thickness of 25 μm.
m polyethylene terephthalate film was coated with a bar coater so that the film thickness after drying was 10 μm, and dried in a hot air oven at 90 ° C. for 15 minutes to obtain a photosensitive resin laminate (dry film resist). The photosensitive resin laminate is then degreased, washed with water and dried to a thickness of 150.
It was laminated on a copper test substrate having a size of 10 × 10 cm ² . The laminating conditions are: substrate temperature 65 ° C, laminating temperature 120 ° C, laminating pressure 4.0 kgf / cm.
^2. Laminating speed was 1.5 m / min.

Next, a gray scale (Kodak PhotographicStep Tablet No.
2. After exposure using Kodak Co., Ltd.) and an ultra-high pressure mercury lamp (HMW-532, manufactured by Oak Manufacturing Co., Ltd.) via a negative mask pattern, 30 ° C., 1 wt.
% Sodium carbonate aqueous solution as a developing solution, 0.15 MPa
To develop a resist pattern.

The obtained sample was evaluated for sensitivity, resolution, adhesion, etching resistance and alkali film peeling property, and the results shown in Table 2 were obtained. The evaluation methods for the photosensitive resin compositions and cured products obtained in Examples 1 to 8 and Comparative Examples 1 and 2 were as follows.

1) The exposure amount when the number of steps in the gray scale is 5 by visual inspection after sensitivity development. 2) Resolution A negative type resolution chart was printed and the minimum pattern size resolved after development was determined. 3) Adhesion Cross-cut test (JIS D-020) evaluated. The cured film of the resist was cut at 1 mm intervals into 10 vertical and horizontal cuts, 100 cross-cuts were made, and the cellotape (registered trademark) was strongly pressed to peel it off. I counted. ◯: No peeling at all. (Triangle | delta): 1 to 10 peeling or chipping was found out of 100 eyes. X: 11 or more peeling or chipping was found in 100 eyes. 4) Etching resistance The sample after development was post-baked in an oven at 200 ° C. for 90 seconds, and then ferric chloride aqueous solution at 70 ° C. was used as an etching solution, and etching was performed at a spray pressure of 0.5 MPa for 1.5 minutes. After washing with water, the state of the etched pattern was visually evaluated with a microscope. ◯: The resist was not cracked or dissolved, and no permeation of the aqueous ferric chloride solution was observed at the substrate / coating interface. Δ: The resist did not crack or dissolve, but a slight infiltration of the aqueous ferric chloride solution was observed at the substrate / coating interface. X: Cracking or dissolution occurred in the resist, and penetration of the aqueous ferric chloride solution was observed at the substrate / coating interface. 5) The sample after the alkaline film-peeling etching was immersed for 1.5 minutes at 50 ° C. in a 2% NaOH aqueous solution as a stripping solution to observe the shape of the strip after stripping the resist. S: The peeled pieces were small pieces of 5 mm square or less. M: The peeled pieces were 10 mm square or smaller pieces. L: Although the resist had cracks, the peeled pieces were 10 mm square or more. LL: The resist was peeled without cracks or was not peeled.

[0033]

[Table 2]

As shown in Table 2, the photosensitive resin composition to which the organic carboxylic acid anhydride was not added did not give fine results because the peeling pieces did not become fine pieces (Comparative Examples 1 to 1).
2). On the other hand, in each of the photosensitive resin compositions to which an organic carboxylic acid anhydride was added, the shape of the peeling piece was a resin strip having a size of 10 mm square or less, and good results were obtained (Examples 1 to 1).
8). At this time, the sensitivity, resolution, adhesiveness and etching resistance were not reduced.

[0035]

As described above, according to the present invention, sensitivity, resolution,
It is possible to provide a photosensitive resin composition and a photosensitive resin laminate which are excellent in workability because the shape of the peeled resist film becomes a resin strip having a size of 10 mm square or less without lowering adhesion and etching resistance.

   ─────────────────────────────────────────────────── ─── Continued front page    F term (reference) 2H025 AA04 AB15 AB17 AC01 AD01                       BC13 BC42 CA00 CB43 CC20                       FA17 FA40

Claims (5)

[Claims] 1. A photosensitive resin composition containing at least a binder resin (A), a polymerizable monomer (B), a photopolymerization initiator (C) and an organic carboxylic acid anhydride (D), which is a photosensitive resin composition. The photosensitive resin composition, wherein the coating film formed after photocuring is formed into resin strips of 10 mm square or less by dipping within 2 minutes in a strong alkaline aqueous solution when the thickness is 10 to 40 μm. 2. A photosensitive resin composition containing at least a binder resin (A), a polymerizable monomer (B), a photopolymerization initiator (C) and an organic carboxylic acid anhydride (D), which is a photosensitive resin composition. The photosensitive photosensitive resin composition for etching, wherein the film formed after photocuring is formed into resin strips of 10 mm square or less by dipping within 2 minutes in a heated alkaline aqueous solution when the thickness is 10 to 40 μm. . 3. A photosensitive resin laminate having at least a support and a photosensitive layer, wherein the photosensitive layer is the photosensitive layer.
A photosensitive resin laminate comprising the photosensitive resin composition as described above. 4. A photosensitive resin laminate having at least a support and a photosensitive layer, wherein the photosensitive layer comprises at least a binder resin (A), a polymerizable monomer (B), a photopolymerization initiator (C) and an organic carboxylic acid. A photosensitive resin laminate comprising a photosensitive resin composition containing an anhydride (D). 5. The proportion of the non-volatile component in the photosensitive resin composition in the non-volatile component is 30 to 80% by weight for the binder resin (A) and 20 to 60 for the polymerizable monomer (B).
%, The photopolymerization initiator (C) is 0.1 to 10% by weight, and the organic carboxylic acid anhydride (D) is 1 to 15% by weight. body.