JP2003275881A - Laser beam machining device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a laser beam machining device that facilitates verification as to whether the emission power of an energy beam is at a proper value and that easily finds the optimum driving conditions of the optimum beam source for a workpiece even if the type of workpiece is changed. <P>SOLUTION: The device is provided with a power meter for measuring the emission power of the pulsed laser beam emitted to a workpiece and a means for selectively executing an operation mode for measuring the emission power of the pulsed laser beam while automatically switching a plurality of driving conditions of a YAG laser beam machine and an ordinary machining operation mode. The device may be designed to perform selectively one of two operation modes, namely, an operation mode that forms a machining pattern for setting machining conditions for a workpiece on each of the plurality of driving conditions of the YAG laser beam machine while automatically switching the driving conditions, and the ordinary machining operation mode. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a beam processing apparatus for processing an object to be processed such as resin, ceramics, metal, etc. using a pulsed energy beam such as a pulsed laser beam.

[0002]

2. Description of the Related Art Conventionally, as this type of beam processing apparatus,
There is known a processing device that cuts or punches a workpiece as a processing target by using a pulsed laser beam emitted from a YAG laser device having a Q switch (for example, refer to Patent Document 1). In this beam processing apparatus, a work is set on an XY table, and while moving the work in a direction intersecting the irradiation direction of the pulsed laser beam, a pulsed laser beam having a predetermined repetition frequency is continuously applied to the work. Irradiate. In such a beam processing apparatus, a pulsed laser beam is irradiated so that the irradiation spots on the work are arranged at a constant pitch.

[0003]

[Patent Document 1] Japanese Unexamined Patent Publication No. 11-226773

[0004]

However, in the above-described conventional beam processing apparatus, driving conditions such as the repetition frequency of the laser beam and the lamp current of the YAG laser device are deteriorated due to deterioration of the lamps and optical parts that constitute the YAG laser device. Even if is kept constant, the power of the laser beam emitted from the YAG laser device may change with time. When the power of the laser beam changes in this way, there is a problem that the work may be insufficiently processed, or conversely, the work may be damaged due to excessive processing.

Further, when the type of work to be processed by the conventional beam processing apparatus is changed, the YAG such as the repetition frequency of the laser beam and the lamp current which are optimum for the work is changed.
The driving conditions of the laser device may also change.
Conventionally, in order to find the optimum YAG laser driving condition for each work as described above, there has been a problem that an operator has to perform a complicated work of machining the work while changing the setting of the driving condition of the YAG laser device. .

The above problem occurs in a beam processing apparatus that uses a laser beam as a pulsed energy beam, but it also occurs in a beam processing apparatus that uses another energy beam such as an electron beam or a charged particle beam. You can Further, the above problem is not limited to the case where the work is moved with the irradiation point of the pulsed energy beam fixed, but the work is moved so as to scan the irradiation point of the pulsed energy beam with the work fixedly arranged. In some cases, it may occur when both the irradiation point of the pulsed energy beam and the work are moved.

The present invention has been made under the background described above, and a first object thereof is to provide a beam processing apparatus capable of easily confirming whether or not the irradiation power of an energy beam has an appropriate value. It is to be. A second object is to provide a beam processing apparatus capable of easily finding the optimum driving condition of the beam source optimum for the object to be processed even if the type of the object to be processed changes. is there.

[0008]

In order to achieve the first object, the invention of claim 1 provides a beam source for repeatedly emitting a pulsed energy beam and an energy beam emitted from the beam source. Beam irradiation means for guiding and irradiating the object to be processed, relative moving means for relatively moving the object to be processed and an irradiation point of the energy beam with respect to the object to be processed, and the beam source and the beam source based on processing control data. In a beam processing apparatus provided with a control means for controlling the relative moving means, a power measuring means for measuring an irradiation power of the energy beam with which the object to be processed is irradiated, and a plurality of driving conditions of the beam source are automatically controlled. The operation mode for power measurement in which the irradiation power of the energy beam is measured by the power measuring means while switching the power supply and the normal processing operation mode. It is characterized in the provision of the operation mode selecting and executing means for executing the 択的. The "working object" includes not only a flat surface on which the energy beam is irradiated, but also a curved surface such as a cylindrical surface on which the energy beam is irradiated. Further, the “driving condition of the beam source” includes the repetition frequency of the energy beam and the current supplied to the beam source. In the beam processing apparatus according to claim 1, the operation mode selection executing means selects and executes the power measuring operation mode, thereby automatically switching between a plurality of driving conditions of the beam source while the power measuring means changes the energy beam. Measure the irradiation power. From this measurement result, it is possible to confirm whether or not the irradiation power of the energy beam has an appropriate value for each driving condition of the beam source.

According to a second aspect of the present invention, in the beam processing apparatus according to the first aspect, a driving condition for correcting the driving condition of the beam source based on the measurement result of the power measuring means during execution of the power measuring operation mode. It is characterized in that a correction means is provided. In the beam processing apparatus according to claim 2, the irradiation power of the energy beam is set to an appropriate value by correcting the driving condition of the beam source based on the measurement result of the power measuring means when the power measuring operation mode is executed. can do.

According to a third aspect of the invention, in the beam processing apparatus according to the first aspect, the irradiation power of the energy beam is preset based on the measurement result of the power measuring means when the power measuring operation mode is executed. It is characterized in that an alarm means for issuing an alarm when out of the range is provided. In the beam processing apparatus according to claim 3, an alarm is issued when the power of the energy beam deviates from a preset reference range based on the measurement result of the power measuring means during execution of the power measuring operation mode. It is possible to notify the worker of the deterioration of the components forming the beam source and to prompt the replacement and repair of the components.

In order to achieve the second object, the invention according to claim 4 is a beam source for repeatedly emitting a pulsed energy beam, and an energy beam emitted from the beam source is guided to a workpiece. Beam irradiation means for irradiating the object to be processed, relative moving means for relatively moving the object to be processed and an irradiation point of the energy beam with respect to the object to be processed, and controlling the beam source and the relative moving means based on processing control data. In the beam processing apparatus including a control means for controlling the processing conditions, a processing condition setting operation for automatically switching a plurality of driving conditions of the beam source and forming a processing pattern for setting the processing conditions on the processing target for each driving condition. It is characterized in that an operation mode selection executing means for selectively executing the mode and the normal machining operation mode is provided. In the beam processing apparatus according to claim 4, when the type of the object to be processed changes, the operation mode selection executing means executes the operation mode for setting the processing condition,
By automatically switching a plurality of drive conditions of the beam source and forming a processing pattern for setting the processing condition on the workpiece for each drive condition, the burden on the operator for setting the condition of the beam source drive condition is reduced. Reduce.

According to a fifth aspect of the present invention, in the beam processing apparatus according to the fourth aspect, an image pickup means for picking up an image of a processing pattern formed on the object to be processed formed during execution of the processing condition setting operation mode, and the image pickup means. Driving condition switching means for judging whether the processing is good or bad based on the image of the processing pattern picked up in No. 2 and automatically switching the driving condition of the beam source used in the normal processing operation mode as needed based on the judgment result. And is provided. In the beam processing apparatus according to the fifth aspect, the imaging means images the processing pattern for setting the processing conditions formed when the operation mode for setting the processing conditions is executed. Then, the quality of the processing is judged based on the image of the processing pattern picked up by the image pickup means, and the driving condition of the beam source used in the normal processing operation mode is automatically switched if necessary based on the judgment result. As a result, the burden on the operator of the work quality determination work and the beam source drive condition switching work is reduced.

According to a sixth aspect of the present invention, in the beam processing apparatus according to the fourth or fifth aspect, the processing pattern for forming the processing conditions is formed in the operation mode for setting the processing conditions in association with the type of the object to be processed. Data processing means for pre-storing conditions and data input means for inputting data of the type of the object to be machined are provided, and the operation mode selection executing means is provided for the object to be machined inputted by the data input means. The processing pattern forming condition corresponding to the data of the type is read from the data storage means, and the processing pattern for setting the processing condition is formed under the read forming condition. is there. In the beam processing apparatus according to claim 6, when an operator inputs data of the type of the processing target object from the data input means, the formation condition of the processing pattern corresponding to the data of the type of the processing target object is automatically stored in the data storage means. Read out. The processing pattern for setting the above processing conditions is formed under the read formation conditions. Therefore, it is unnecessary for the operator to set the above-mentioned processing pattern forming conditions based on the type of the processing object. Therefore, it is possible to reduce the burden on the operator when executing the processing condition setting operation mode and shorten the time for setting the processing conditions. Further, as compared with the case where the operator makes a judgment each time the type of the processing object changes and sets the formation condition of the processing pattern,
The risk of erroneous setting of processing pattern formation conditions is reduced.

According to a seventh aspect of the present invention, in the beam processing apparatus according to the fourth or fifth aspect, there is provided a data storage unit for storing data of forming conditions of the processing pattern for setting the processing conditions and an operation mode for the processing conditions setting. Data processing means for accumulating the new shape condition in the data storage means when the used formation condition of the processing pattern for setting the processing condition is new, and formation of the processing pattern selected from the data storage means A condition designating unit for designating a condition, the operation mode selection executing unit reads out the formation condition of the processing pattern designated by the condition designating unit from the data storage unit, and the formation condition thus read out It is characterized in that it is configured to form a processing pattern for setting processing conditions. In the beam processing apparatus according to claim 7,
When the forming condition of the processing pattern for setting the processing condition used in the operation mode for setting the processing condition is new, the new shape condition is accumulated in the data storage means. And
When executing the processing condition setting operation mode, the operator can select an appropriate forming condition from the forming conditions of the plurality of processing patterns used in the past accumulated in the data storage means. Therefore, compared with the case where the operator judges every time the type of the processing target changes and inputs the data of the condition suitable for the processing target, the time for setting the processing conditions for forming the processing pattern can be shortened, and The burden of the setting work can be reduced.

According to an eighth aspect of the present invention, in the beam processing apparatus according to the seventh aspect, there is provided data input means for inputting data of the type of the processing object, and the data processing means is associated with the type of the processing object. And accumulates the processing pattern forming conditions for setting the processing conditions, and reads the processing pattern forming conditions corresponding to the data of the type of the processing object input by the data inputting means from the data storing means. The present invention is characterized in that the processing pattern for setting the processing conditions is formed under the read forming conditions. In the beam processing apparatus according to the eighth aspect, the forming condition of the processing pattern for setting the processing condition is accumulated in association with the type of the object to be processed. Then, when the operator inputs the data of the type of the object to be processed from the data input means, the formation condition of the processing pattern corresponding to the data of the type of the object to be processed is automatically read from the data storage means. The processing pattern for setting the above processing conditions is formed under the read formation conditions. Therefore, it is unnecessary for the operator to set the above-mentioned processing pattern forming conditions based on the type of the processing object. Therefore, it is possible to further reduce the burden on the operator when executing the processing condition setting operation mode, and it is possible to shorten the time for setting the processing conditions. Further, the risk of erroneous setting of the processing pattern forming conditions is reduced as compared with the case where the operator judges and sets the processing pattern forming conditions each time the type of the processing target changes.

The invention of claim 9 relates to claim 1, 2, 3,
In the beam processing device of 4, 5, 6, 7 or 8, when the setting of the driving condition of the beam source is changed in the power measurement operation mode or the processing condition setting operation mode, the beam is emitted from the beam source. The control means is configured to start the processing for measuring the power of the energy beam or finding the processing conditions after a beam stabilization time for stabilizing the power of the energy beam has elapsed. Is. In the beam processing apparatus according to claim 9, when the setting of the driving condition of the beam source is changed, the power of the energy beam emitted from the beam source is measured after the stabilization time has elapsed. Alternatively, the processing for finding the above processing conditions is started. As a result, under each driving condition of the beam source, the power of the energy beam can be measured and the processing conditions can be set in a stable state.

The invention of claim 10 is the invention of claim 1, 2, 3,
In 4, 5, 6, 7, 8 or 9 beam processing equipment,
The object to be processed is a transparent conductive film formed on an insulating substrate, and processing for removing a part of the transparent conductive film in a slit shape is performed. In the beam processing apparatus according to claim 10, in the process of removing a part of the transparent conductive film on the insulating substrate into a slit shape, the relative movement speed between the insulating substrate and the irradiation point of the energy beam is Even if it changes, the irradiation spots of the energy beam are irradiated at regular intervals on the transparent conductive film on the insulating substrate in the direction of the relative movement. Thereby, the slits from which the transparent conductive film is removed by the energy beam have a uniform shape.

[0018]

BEST MODE FOR CARRYING OUT THE INVENTION The present invention will now be described with reference to a transparent conductive film for forming a transparent electrode by removing a part of the transparent conductive film formed on an insulating transparent substrate of a hybrid type touch panel in a slit shape. An embodiment applied to a beam processing apparatus will be described.

FIG. 2 is a schematic block diagram of the beam processing apparatus according to the present invention. This beam processing apparatus guides and irradiates a YAG laser device 1 as a beam source that repeatedly emits a pulsed laser beam as a pulsed energy beam, and a pulsed laser beam emitted from the YAG laser device 1 to an object to be processed. Irradiating means 2 for irradiating, and an XY table 5 as a relative moving means for relatively moving the object to be processed and the irradiation point of the energy beam with respect to the object to be processed.
And a control system 6 as a control means for controlling the YAG laser device 1 and the XY table 5 based on the processing control data.

The YAG laser device 1 has a laser head 101 including a YAG rod 101a, a Q switch 101b, a lamp 101c as an excitation light source, mirrors 101d and 101e, and a Q switch 101b.
It has a switch driving unit 102 and a laser power source 103 for supplying a current (hereinafter referred to as “lamp current”) to a lamp 101c of the laser head 101. The Q switch driving section 102 drives the Q switch 101b in the laser head 101 based on the laser control signal sent from the control system 6. When the Q switch 101b is turned on, near-infrared light (wavelength λ = 10) is emitted from the laser head 101.
A pulsed laser beam of 64 nm) is emitted. The repetition frequency of the pulsed laser control signal input to the Q switch driver 102 can be changed in the range of 20 Hz to 20 kHz (cycle = 50 msec to 0.05 msec), and the pulse width of the laser control signal is It can be changed within the range of 80 to 500 nsec. With this Q switch drive unit 102, the laser head 101
By driving the Q switch 101b in the inside, pulsed laser light can be emitted from the laser head 101 within the repetition frequency range of 1 kHz to 10 kHz.

The YAG rod 101a in the laser head 101 is a YAG (yttrium, aluminum, garnet) crystal doped with a rare earth element Nd (neodymium) and is excited by a lamp 101c as an excitation light source. As the excitation light source, a semiconductor laser or the like can be used in addition to the lamp. YAG rod 101a
Is YA doped with a rare earth element Nd (neodymium)
It is a G (yttrium, aluminum, garnet) crystal, and the lamp 101c is turned on when the lamp current Id is supplied from the laser power source 103. The lamp current I supplied from the laser power source 103 to the lamp 101c
d can be changed based on the control command sent from the control system 6 to the laser power source 103, and thus the output of the pulsed laser light emitted from the YAG laser device 1 can be changed.

FIG. 3 is a diagram showing an example of a change in output of the pulsed laser light emitted from the YAG laser device 1. Here, the average output Pa [W] of the pulsed laser light measured at the laser emission end of the laser head 101 is
The repetition frequency of the laser output waveform of pulsed laser light is F
r [Hz] and the pulse width of the same laser output waveform is τ [n
sec], the peak output Ppe of the same laser output waveform
ak [W] is given by the following equation.

## EQU1 ## Ppeak = {Pa / (Fr × τ)} × 10 ⁶

The beam irradiation means 2 is a step index type optical fiber 20 for guiding a pulsed laser beam.
1 and a laser irradiation head 202 that forms an image of the pulsed laser light guided by the optical fiber 201 and irradiates the object to be processed.

The transparent insulating substrate 3 made of transparent glass or transparent plastic material (for example, PET or polycarbonate) on the surface of which a transparent conductive film 4 made of ITO (indium tin oxide) is formed is an XY table 5. Is fixed on a mounting table 501 driven by a linear motor 502 (for example, a servo motor or a stepping motor) by a suction and mechanical clamp mechanism (not shown). Mounting table 501 to which this transparent insulating substrate 3 is fixed
By controlling the linear motor 502 that drives the X-axis, the transparent insulating substrate 3 on which the transparent conductive film 4 is formed is orthogonal to each other in a virtual plane perpendicular to the irradiation direction of the pulsed laser light. It can be moved two-dimensionally in the direction and the Y direction (direction perpendicular to the paper surface in the figure).

Further, the processing speed, the acceleration of the XY table,
In order to further improve the processing accuracy, for the XY table 5, titanium foam, magnesium, alumina oxide,
It is preferable to use an ultra-light aluminum alloy material.

Further, a through hole may be formed inside the mounting table 501 to reduce the weight. The through hole can also serve as an air flow path for a vacuum chuck when the insulating transparent substrate 3 and the transparent conductive film 4 are in the form of a sheet. Regarding the mounting table 501, a concave portion is formed at least under the portion of the insulating transparent substrate 3 where the pulse laser light is irradiated, and the distance between the lower surface of the insulating transparent substrate 3 and the upper surface of the mounting table 501 is set as much as possible. It is preferable to make it longer. With such a configuration, it is possible to prevent the laser light that has passed through the insulating transparent substrate 3 and reflected on the surface of the mounting table 501 from hitting the transparent conductive film 4 from adversely affecting its processing.

Further, in this embodiment, a linear scale 503 as a moving distance detection pulse signal generating means is attached to the XY table 5. The linear scale 503 is provided in each of the two directions of the X direction and the Y direction, and the moving distance is detected every time the mounting table 501 on which the transparent insulating substrate 3 is mounted is moved by a constant distance in the X direction and the Y direction. Generate a pulse signal. By counting the moving distance detection pulse signal, the moving distance of the mounting table 501 on which the transparent insulating substrate 3 is mounted can be known.
In the present embodiment, the irradiation timing of each pulse laser beam is controlled in synchronization with the moving distance of the mounting table 501 on which the transparent insulating substrate 3 is mounted, based on the moving distance detection pulse signal.

In the present embodiment, the linear scale 50 described above is used.
As for No. 3, by combining the scale and the scanning plate, which have graduation gratings formed on each other, in a non-contact opposed relationship,
A device capable of obtaining a resolution of about 5 μm to 1.0 μm (for example, an open type length measuring system manufactured by HEIDENHAIN CORPORATION: trade name) is used. Here, for example, when the resolution of the linear scale 503 is 1 μm, one pulse is output every 1 μm. Therefore, when the moving speed of the mounting table 501 on which the transparent insulating substrate 3 is mounted is 1 m / sec, 1 MHz. The moving distance detection pulse signal is output at the frequency (cycle = 1 μsec). The linear scale 503 is appropriately selected and used according to conditions such as machining accuracy and machining speed. Further, the moving distance detection pulse signal generating means outputs a moving distance detection pulse signal for each fixed distance movement of the mounting table 501 on which the transparent insulating substrate 3 is mounted in each of the X direction and the Y direction. It may be generated as long as it is generated, and is not limited to the above specific linear scale.

The control system 6 monitors the entire beam processing apparatus and CAM as processing control data.
(Computer Aided Manufacturing) Using a host computer device 601 including a personal computer that issues a control command to each unit based on data, a table drive control device (sequencer) 602, and a control circuit board 603 for synchronous interlocking type operation It is configured.

The CAM data is CAD (Computer A
It is generated in consideration of the device parameters of the beam processing device based on the data of the ided design), and for example, for each processing element of the line segment shape, the pitch of the irradiation point, the coordinates of the processing start point, and the coordinates of the processing end point are one The data structure is as follows.

The host computer device 601 has a processing speed input means for the user to input data of the processing speed Vo, and a driving condition of the mounting table 501 of the XY table 5 based on the processing speed Vo data inputted by the user. It is also used as a processing condition setting means for setting the irradiation condition of the pulsed laser light. The above-mentioned C is added to the host computer 601.
A recording medium such as an FD in which AM data is stored is set and CAM data is read. Along with the reading of the CAM data, the processing speed data desired by the user is input to the host computer 601. Note that the processing speed, which is the maximum moving speed of the mounting table 501 described above, is calculated based on data obtained in advance by experiments or the like as shown in FIG.
When the upper limit value Vmax is set as shown in FIG. 7 and the value of the machining speed Vo input by the user exceeds the upper limit value Vmax, the input value exceeds the upper limit value Vmax on the display of the host computer 601. Warning message and a message prompting you to re-enter the processing speed data are displayed.

In the host computer 601, the mounting table 5 of the XY table 5 is prepared for each machining element based on the CAM data and the machining speed Vo input by the user.
01 movement start point and movement end point coordinates, mounting table 50
The positive acceleration α in the acceleration region 1 and the negative acceleration β in the deceleration region (see FIG. 4), the maximum moving speed (= processing speed) of the mounting table 501, and the laser power supply 103 as the irradiation condition of the pulsed laser light are supplied. The data such as the lamp current Id is calculated and stored in a predetermined storage area. For the calculation of these data, a data table including an optimum range obtained in advance by experiments or the like is used.

Table 1 shows an example of the data table of the optimum range obtained by the experiment in which the beam quality Id [A] and the repetition frequency Fr [Hz] were changed and the processing quality was investigated in the beam processing apparatus of this embodiment. Shows. Table 1 shows PET
It is a result of an experiment in which a slit is formed in the transparent conductive film 4 made of ITO (indium tin oxide) formed on the transparent insulating substrate 3 made of (polyethylene terephthalate).

[Table 1]

The white portion shown by the symbol "A" in Table 1 above shows the condition range in which good slit processing can be performed. On the other hand, in the portion indicated by the symbol “B” in Table 1, the output of the pulsed laser light is insufficient and the transparent conductive film 4 in the slit is formed.
Indicates a range of conditions in which insulation was not removed sufficiently and insulation failure occurred. In addition, the portion indicated by the symbol “C” in Table 1 indicates the condition range in which the transparent insulating substrate 3 and the transparent conductive film 4 in the portion where the output of the pulsed laser light is too strong and the slit is formed are damaged. Shows. Here, the range of the repetition frequency Fr of the pulsed laser light is determined by the driving conditions of the mounting table 501, and the reference numeral "A" is used based on Table 1 above so that good slit processing can be performed in this range of the repetition frequency Fr. The lamp current Id within the optimum range indicated by is set. The power measurement operation mode for checking the power of the pulsed laser beam applied to the object to be processed and the operation mode for determining the condition of the lamp current Id when the type of the object to be processed are changed will be described later. .

The table drive control device 602 controls the drive of the linear motor 502 based on the control command sent from the host computer device 601. The table drive control unit 602 is configured using, for example, a servo controller when the linear motor 502 is a servo motor and a pulse controller when the linear motor 502 is a pulse motor.

FIG. 5 is a block diagram showing a structural example of the control circuit board 603. This control circuit board 603
Is a CPU 603a and an I / O interface 603.
b, a pulse counter 603c, a comparison circuit 603d,
Pulse width shaping circuit 603e and switch circuit 603f
And a memory (RAM, ROM, etc.) (not shown).

The I / O interface 603b is a C
It performs signal processing for data communication between the PU 603a and the external host personal computer device 601.

The pulse counter 603c has a moving distance detection pulse signal Sm generated by the linear scale 503.
Count the number of pulses. This pulse counter 603
The count value Nm of c is compared with the reference value Nref sent from the CPU 603a in the comparison circuit 603d, and when both values match, a pulse signal is output from the comparison circuit 603d. The reference value Nref can be set arbitrarily according to the processing conditions. The moving distance detection pulse signal Sm input to the pulse counter 603c is switched according to the moving direction of the mounting table 501 of the XY table 5. For example, when moving the mounting table 501 in the X direction, the linear scale 50 for the X direction is used.
Output from 3

The pulse width shaping circuit 603d is a circuit that widens the pulse width of the moving distance detection pulse signal Sp output from the comparison circuit 603c to a pulse width at which the Q switch can operate. This pulse width shaping circuit 603d
The pulse width of the pulsed laser light emitted from the YAG laser device 1 can be changed by adjusting.

The switch circuit 603e is the CPU 60.
A circuit for on / off controlling a laser control signal output from the pulse width shaping circuit 603d to the Q switch driving unit 102 so that continuous machining and intermittent machining can be appropriately switched and executed based on a control command from 3a. Is.

6 and 7 show the control circuit board 603.
3 is a time chart showing an example of signals of respective parts of FIG. In these figures, the pitch of the irradiation spot of the pulsed laser light irradiated on the transparent conductive film 4 is set to 330 μm, the resolution of the linear scale 503 is 0.5 μm, and one pulse is generated every 0.5 μm. The case where the signal Sp is output is shown. The reference value Nref is 660 (= 3
30 μm / 0.5 μm), and the above XY table 5
The moving speed of the mounting table 501 is set to 2 m / sec. As shown in FIG. 6, as the mounting table 501 of the XY table 5 moves, the linear scale 503 outputs a moving distance detection pulse signal Sm at a repetition frequency f = 4 MHz (cycle = 0.25 μsec). This moving distance detection pulse signal Sm is counted by the pulse counter 603c. Then, each time the 660 movement distance detection pulse signals Sm are counted, that is, the mounting table 50 described above.
Each time 1 moves by 330 μm, the pulsed laser control signal Sp is output from the comparator 603d. Then, the pulse width shaper 603e widens the width of the laser control signal Sp output from the comparator 603d to a width necessary for driving the Q switch 101b of the YAG laser device 1. Next, as shown in FIG. 7, the laser control signal Sp ′ shaped into a predetermined pulse width is on / off controlled by the switch circuit 603f controlled by the CPU 603a based on the processing control data. This switch circuit 603
The laser control signal Sp ″, which is on / off controlled by f, is input to the Q switch driving unit 102, which causes the YAG laser device 1 to pulse at a predetermined timing synchronized with the moving distance of the transparent insulating substrate 3. Laser light is emitted and irradiated on the transparent conductive film 4 on the transparent insulating substrate 3. In this way, control is performed in synchronization with the moving distance of the transparent insulating substrate 3 fixed to the mounting table 501 of the XY table 5. By irradiating the transparent conductive film 4 on the transparent insulating substrate 3 with the generated pulsed laser light, as shown in FIG. 8A, the irradiation spot Lp of the pulsed laser light with which the transparent conductive film 4 is irradiated.
(X) are arranged at a constant pitch in the X-axis direction. As a result, as shown in FIG. 8B, the transparent conductive film 4 is removed in a slit shape with a uniform processing width. In the example of FIG. 8, the irradiation spot L
Two slits 4a (X) each having a length of 10 p's are formed continuously.

Further, the control system 6 operates in the normal machining operation mode (hereinafter referred to as "normal machining mode") based on the mode selection data input by the operator using a keyboard or the like as the data input means of the host computer 601. And the operation mode for power measurement (hereinafter,
It is called "power check mode". ) And a processing condition setting operation mode (hereinafter, referred to as a “processing condition setting mode”) are selectively operated. Furthermore, this control system 6
It also functions as an alarm means for issuing an alarm when the irradiation power of the pulsed laser light deviates from a preset reference range based on the measurement result of the power meter during execution of the power measurement operation mode. This alarm can be displayed on the display of the host computer device 601, or sound information can be output from the speaker of the host computer device 601, and the mode of this alarm is not particularly limited.

FIG. 1 is a flow chart of main control of the beam processing apparatus having the above configuration. First, an operator operates the upper-level PC device 601, and a normal machining operation mode (hereinafter referred to as “normal machining mode”), a power measurement operation mode (hereinafter referred to as “power check mode”),
And any one of the three operation modes of the operation condition setting operation mode (hereinafter, referred to as “machining condition setting mode”). Here, if the normal processing mode is selected, control is performed so that the transparent conductive film 4 on the transparent insulating substrate 3 is removed in a slit shape to form a transparent electrode based on the processing control data as described above. To be done. On the other hand, when the operator selects the power check mode or the processing condition setting mode, the following control is performed.

FIG. 10 is a flowchart of the power check mode. When the operator selects the power check mode, as shown in FIG.
The power meter 203 as a power measuring means arranged in the vicinity of the laser emission port 202a is moved from the retracted position (the position indicated by the solid line) to the measurement position (the position indicated by the alternate long and short dash line) by a drive mechanism (not shown) (step 1). Next, the laser driving conditions (repetition frequency Fr, lamp current Id)
Initialization is performed to one of a plurality of laser drive conditions for power check, which is selected in advance from the range of laser drive conditions used in the normal processing mode (step 2). Next, after the excitation stabilization time (10 seconds in this embodiment) has elapsed and the laser oscillation has stabilized (step 3), the laser irradiation head 202
The average output Pa [W] of the pulsed laser light emitted from is measured as the irradiation power (step 4). This measurement time is set to about 30 seconds, for example. Next, the measured value of the irradiation power is compared with a predetermined allowable lower limit value (step 5), and when the measured value of the irradiation power is smaller than the allowable lower limit value, a flash lamp or the like constituting the YAG laser device 1 It is controlled so as to issue an alarm for notifying the operator that the constituent parts of (3) are deteriorated (step 6).
With this alarm, it is possible to notify the operator of the deterioration of the components such as the flash lamp that constitute the YAG laser device 1 and to prompt the operator to replace or repair the components. On the other hand, when the measured value of the irradiation power is equal to or higher than the allowable lower limit value, the measured value is stored in the storage device (for example, hard disk) of the host PC device as history data for daily management (step 7). Next, it is judged whether or not the power check has been completed for a plurality of predetermined laser drive conditions for power check (step 8), and if there is a laser drive condition for which the power check has not been completed, Laser driving conditions (repetition frequency Fr, lamp current Id) are set (step 9), and steps 3 to 8 are repeated.
When the power check is completed for all the laser drive conditions for power check, the power meter 203 is moved to the retracted position (the position indicated by the solid line in FIG. 11) to prepare for the next operation mode.

FIG. 12 is a flowchart of the processing condition setting mode. The operator selects the processing condition setting mode, and sets the processing material for processing condition setting made of the same material as the actual processing on the mounting table 501 of the XY table 5 (step 1). Next, the repetition frequency Fr of the pulsed laser light is set to the range of the repetition frequency Fr that can be used in the normal processing mode (for example, 1 kHz).
(10 kHz) to one of a plurality of repetition frequencies Fr selected in advance (for example, 1 kHz) (step 2). Next, by irradiating with pulse laser light while moving the mounting table 501 of the XY table 5 in the X direction at the moving speed used in actual processing, as shown in FIG. Direction slit 4a
(X) is formed. The slit formation in the horizontal direction (X direction) is performed while shifting the lamp current Id (20A to 30A) of the laser while shifting in the vertical direction (Y direction). Similarly, slit formation in the vertical direction (Y direction) is performed by YA
It is performed while changing the setting of the lamp current Id (20A to 30A) of the G laser device while shifting in the lateral direction (X direction). As a result of the above processing, as shown in FIG. 13, a grid-like pattern formed of slits having different lamp currents Id is formed (step 3). Here, when the setting of the lamp current Id is changed, the excitation stabilization time (10 in this embodiment) is set.
(Seconds) has elapsed and laser oscillation has stabilized, then slit processing is started. Next, it is judged whether or not a plurality of predetermined pattern processing for condition setting has been completed (step 4), and when there is a repetition frequency for which the pattern processing for condition setting has not been completed, Repeat frequency Fr
(Step 5) and step 3 is repeated.
When the pattern processing for condition determination is completed for all repetition frequencies, the operator visually checks the processing pattern on the processing material and determines the width of the slit, the presence of white bright spots in the slit, and the presence of damage at the slit intersection. The optimum lamp current Id with which a desired processing pattern can be formed for all repetition frequencies is determined by using the above as a determination parameter. In the example of FIG. 13, 21A is determined as the optimum lamp current Id as shown by the position of the black circle. The data of the determined optimum condition (lamp current Id) is input from the host PC device 601 by the operator, and the storage device (eg hard disk) of the host PC device.
(Step 6) and used when executing the normal machining mode.

As described above, according to the present embodiment, the driving condition of the YAG laser device 1 (repetition frequency Fr, lamp current Id) is achieved by executing the power check mode.
Measure the irradiation power of the pulsed laser light that irradiates the object to be processed under the conditions set for actual processing, and easily check whether the irradiation power of the pulsed laser light is an appropriate value. be able to.

Further, according to the present embodiment, by executing the above-mentioned processing condition setting mode, the load of the processing work for the condition setting by the operator is reduced, and the YAG laser device 1 that is optimum for the processing target is driven. Conditions (lamp current I
d) can be easily found.

Further, according to the present embodiment, since the irradiation timing of the pulsed laser light is controlled so as to be synchronized with the movement distance of the mounting table 501 of the XY table 5, the mounting table 5
Even in the acceleration region and the deceleration region of 01, the uniform slit processing can be performed.

In the power check mode of the above embodiment, the lamp current Id of the YAG laser device 1 may be automatically corrected based on the measurement result of the irradiation power of the pulsed laser light by the power meter 203. The control system 6 can be used as the drive condition correction means for automatically correcting the lamp current Id. Then, for example, as shown in the flowchart of FIG. 14, each laser drive condition (repetition frequency Fr, lamp current I
After the power measurement in d) is completed (steps 1-9),
It is determined whether or not each measured value is within a preset target range (step 10), and if it is outside the target range, the lamp current Id is set so that the irradiation power falls within the target range for all repetition frequencies Fr. Is corrected (step 11).

Further, in the processing condition setting mode of the above embodiment, the quality of the processing is judged based on the image of the lattice-shaped processing pattern for setting the processing conditions, and based on the judgment result, the YAG laser device 1 is judged. The lamp current Id may be switched as needed to control so as to set the optimum value for the workpiece. The control system 6 can be used as the drive condition switching means based on the determination result regarding the quality of processing of the processing pattern. Then, for example, as shown in FIG. 15, after the pattern processing for condition setting is completed (steps 1 to 5), the lattice-shaped processing pattern formed on the processing material is imaged by an imaging means such as a CCD camera. (Step 6), the quality of the processing is determined based on the captured image of the processing pattern, and the optimum value for the lamp current Id of the YAG laser device 1 is automatically determined based on the determination result. Then, it is switched and set as necessary (step 7).

Further, in the above embodiment, the data storage means for storing the formation conditions of the processing pattern for setting the processing conditions and the data input means for the operator to input the data of the type of the processing object are provided. May be provided. The data storage means stores the formation conditions of the processing pattern for setting the processing conditions formed in the processing condition setting mode in association with the type of the object to be processed by the beam processing device in advance as a library. is there. As the data storage means, a storage device such as the hard disk of the host computer 601 can be used. Further, as the data input means, a keyboard of the host computer 601 or the like can be used. Then, the control system 6 as the operation mode selection executing means reads from the data storing means the forming condition of the processing pattern corresponding to the data of the type of the processing object inputted by the data inputting means. The processing pattern for setting the above processing conditions is formed under the read formation conditions. Here, the type of the processing target is classified by, for example, the type of the base material of the processing target and the thickness of the film formed on the processing surface. in this case,
When the operator inputs the data of the type of the object to be processed from the data input means, the formation condition of the processing pattern corresponding to the data of the type of the object to be processed is automatically read from the data storage means. The processing pattern for setting the above processing conditions is formed under the read formation conditions. Therefore, it is unnecessary for the operator to set the above-mentioned processing pattern forming conditions based on the type of the processing object. Therefore, it is possible to reduce the burden on the operator when executing the processing condition setting operation mode and shorten the time for setting the processing conditions. Further, the risk of erroneous setting of the processing pattern forming conditions is reduced as compared with the case where the operator judges and sets the processing pattern forming conditions each time the type of the processing target changes.

Further, in the above embodiment, the data storing means for storing the data of the forming condition of the processing pattern for setting the processing condition, the data processing means for accumulating the forming condition of the processing pattern, and the operator performing the processing. A condition designating unit that designates a pattern forming condition may be provided. The data processing means accumulates the new shape condition in the data storage means when the forming condition of the processing pattern for the processing condition setting used in the processing condition setting operation mode is new. Further, the condition designating means is for the operator to designate the forming condition of the processing pattern selected from the data storing means. As the data storage means, a storage device such as the hard disk of the host computer device 601 can be used. A host computer 601 can be used as the data processing means, and a keyboard or the like of the host computer 601 can be used as the condition specifying means. Then, the control system 6 as the operation mode selection executing means reads out the forming condition of the processing pattern designated by the operator by the condition designating means from the data storing means. The processing pattern for setting the above processing conditions is formed under the read formation conditions. In this case, when executing the processing condition setting operation mode, the operator can select an appropriate forming condition from the forming conditions of the plurality of previously used processing patterns accumulated in the data storage means. Therefore, compared with the case where the operator judges every time the type of the processing target changes and inputs the data of the condition suitable for the processing target, the time for setting the processing conditions for forming the processing pattern can be shortened, and The burden of the setting work can be reduced.

Here, the conditions for forming the new processing conditions for setting the processing conditions may be stored in a library in association with the type of the object to be processed using the forming conditions. In this case, when the operator inputs the data of the type of the object to be processed by the data input means such as the keyboard of the host computer device 601, the formation condition of the processing pattern corresponding to the data of the type of the object to be processed. Is read from the data storage means. The processing pattern for setting the above processing conditions is formed under the read formation conditions. Therefore, it is unnecessary for the operator to set the above-mentioned processing pattern forming conditions based on the type of the processing object. Therefore, it is possible to further reduce the burden on the operator when executing the processing condition setting operation mode, and it is possible to shorten the time for setting the processing conditions. Further, the risk of erroneous setting of the processing pattern forming conditions is reduced as compared with the case where the operator judges and sets the processing pattern forming conditions each time the type of the processing target changes.

In the above embodiment, when forming the lattice-like slits in the transparent conductive film 4 on the transparent insulating substrate 3, first, avoiding the intersection Pc as shown in FIG. 8A. By irradiating a pulsed laser beam while moving the transparent insulating substrate 3 in the X-axis direction, a predetermined length of X
A plurality of axial slits 4a (X) are formed. After that, the transparent insulating substrate 3 is set to Y so as to pass through the intersection Pc.
The pulsed laser light is emitted while moving in the axial direction. As a result, as shown in FIG. 16A, the irradiation spots Lp (Y) of the pulsed laser light with which the transparent conductive film 4 is irradiated are arranged at a constant pitch in the Y-axis direction. As a result, as shown in FIG. 16B, the transparent conductive film 4 is removed in a slit shape with a uniform processing width also in the Y-axis direction, and the slit 4a in the X-axis direction is formed.
It is possible to form a lattice-shaped slit in which (X) intersects with the slit 4a (Y) in the Y-axis direction. In particular, in the processing example of the lattice-shaped slits shown in FIG. 16, the pulse laser light is 1 at the intersection Pc as in the other irradiation points.
Since the irradiation is performed only once, it is possible to prevent a defect such as damage due to excessive laser irradiation at the intersection Pc. In the processing example of FIG. 16, the slit 4a (X) in the X-axis direction is formed while avoiding the intersection Pc, and the slit 4a (Y) in the Y-axis direction is continuously formed. , The slit 4a (X) in the X-axis direction may be formed continuously.

FIG. 17 is a sectional view of a touch panel constructed by using a touch panel substrate on which an electrode pattern is formed by processing the transparent conductive film 4 in the beam processing apparatus. 18A and 18B are an exploded perspective view and a plan view of the touch panel, respectively. As shown in FIG. 17, in the touch panel, a pair of upper and lower touch panel substrates 7 and 8 are provided with a spacer 9 having a predetermined height (for example, 9 to 12 μm) so that the transparent electrodes made of the transparent conductive films 4 do not contact each other in a normal state. The structure is such that they face each other. Then, when this touch panel is pressed from above in FIG. 17, the upper touch panel substrate 7 is deformed as shown by the chain double-dashed line, and the transparent electrodes of the upper and lower touch panel substrates 7 and 8 come into contact with each other. From the change in the resistance between the upper and lower transparent electrodes due to this contact, it is possible to know whether or not it has been pressed and the pressed position. Further, in this touch panel, as shown in FIGS. 18A and 18B, slits 7 a and 8 a orthogonal to each other are formed in each of the upper and lower touch panel substrates 7 and 8 in each transparent conductive film 4.

The beam processing apparatus of this embodiment is shown in FIG.
The slits 7a and 8a shown in (a) and (b) are formed in the transparent conductive film 4. The insulating transparent substrate 3 having the transparent conductive film 4 (thickness = about 500 angstroms) formed on the surface by vacuum deposition, ion plating, sputtering, or the like is placed on the mounting table 501 toward the upper side of the transparent conductive film 4 side. Set. The transparent conductive film 4 on the set insulating transparent substrate 3 is moved in one direction by the XY table 5 while being irradiated with the pulsed laser light having a predetermined spot diameter. In the process of this movement, width 50
Portions irradiated with pulsed laser light of about 0 to 1000 [μm] are evaporated and removed from the transparent conductive film 4, and slits 7a and 8a for insulating each electrode region are formed.

In the beam processing apparatus of this embodiment, the transparent conductive film 4 can be processed to form a plurality of transparent electrodes on the insulating transparent substrate 3 without using the photolithography method involving etching treatment. Therefore, the upper and lower touch panel substrates 7 and 8 can be manufactured without polluting the environment with the developer of the photoresist and the waste liquid of the etching liquid. Further, even when the pattern shape of the transparent electrode is changed, it is possible to form the plurality of transparent electrodes according to the pattern by processing the transparent conductive film 4 with CAM data without using a light shielding mask for photolithography. For this reason, it is necessary to prepare a light-shielding mask having a dedicated light-shielding pattern for each of the touch panel substrates 7 and 8 having different electrode patterns, which makes it difficult to perform small-scale production of other types of products and stains the work with residual resist solution. It is possible to shorten the lead time and sufficiently meet on-demand requests without causing any problems due to the law.

On the other hand, in the electrode processing using the photolithography method, there is a problem that waste liquid such as photoresist developing solution and etching solution is generated to pollute the environment. Further, when the pattern of the transparent electrode is changed, a light-shielding mask for photolithography must be newly created, so that the processing efficiency is poor, and it is difficult to cope with small-volume production of other products and to reduce the cost. In particular, even in the case of forming several slits in the transparent conductive film 4 like an analog type touch panel, the same photolithography process as in the case of a digital type touch panel forming hundreds of slits is required. Therefore, it is difficult to reduce the waste liquid and reduce the cost even though the processed portion is small.

In the above embodiment, the XY table 5 is used.
The case where processing is performed while moving the mounting table 501 of X in the X-axis direction or the Y-axis direction has been described.
The mounting table 501 in an oblique direction intersecting the axial direction and the Y-axis direction
It can also be applied when machining while moving. In the case of this diagonal movement, the reference value Nref (X) shown in the following equation 2 or the reference value Nref (Y) shown in the following equation 3 is used as the reference value sent from the CPU 603a to the comparator 603d. The operator "INT" in the expression is an operator that finds an integer closest to the numerical value in parentheses. Further, "Nref" on the right side of the equation is a reference value when moving in the X-axis direction or the Y-axis direction. Further, “θ” in the equation is an angle formed by the moving direction and the X-axis direction as shown in FIG. 19, and is obtained from the processing control data.

[Formula 2] Nref (X) = INT (Nref × cos θ)

[Formula 3] Nref (Y) = INT (Nref × sin θ)

Here, for example, when using the moving distance detection pulse signal Sm (X) output from the linear scale 503 in the X-axis direction, the reference value Nre shown in Formula 1 is used as the reference value.
Use f (X). On the other hand, a linear scale 503 in the Y-axis direction
When using the moving distance detection pulse signal Sm (Y) output from the above, the reference value Nref (y) shown in Formula 2 is used as the above reference value. From the viewpoint of accurately detecting the moving distance of the mounting table 501, the moving direction of the mounting table 501 is X.
If it is close to the axis, the linear scale 503 in the X-axis direction
From the moving distance detection pulse signal Sm (X) and the reference value Nre
When f (X) is used in combination and the moving direction of the mounting table 501 is close to the Y axis, the linear scale 50 in the Y axis direction is used.
3 moving distance detection pulse signal Sm (Y) and the reference value N
It is preferably used in combination with ref (Y). By switching and using such a combination, the number of movement distance detection pulse signals corresponding to the pitch of the irradiation spot of the pulsed laser light does not become extremely small,
It is possible to detect the moving distance of the mounting table 501 in the diagonal direction with high accuracy as in the case of moving the mounting table 501 in the X-axis direction or the Y-axis direction.

Further, in the above embodiment, the case where the processing of removing a part of the transparent conductive film 4 on the transparent insulating substrate 3 is performed has been described, but the present invention is limited to such processing. It can be applied without. For example, as shown in FIG. 20, a slit 14 for inter-wiring insulation is formed around a wiring pattern 13 made of a conductive paste (eg, silver paste) formed on the surface of the transparent conductive film 4 on the transparent insulating substrate 3. The same effect can be obtained by using the same.

The present invention can also be applied to the case where the resin plate is half-etched or punched. In this case, the depth of the processed portion can be made uniform. Furthermore, the present invention performs not only the slit forming process, the half etching process, and the drilling process, but also a surface treatment process on an object to be processed such as a resin, a ceramic, a metal, a photosensitive layer for photolithography, and an exposure to a photoresist. It is also applicable to cases.

In the above embodiment, the pulse distance of the pulse laser light is synchronized with the moving distance of the transparent insulating substrate 3 mounted on the mounting table 501 by using the moving distance detecting pulse signal output from the linear scale 503. Although the irradiation timing is controlled, the mounting table 501 on which the transparent insulating substrate 3 is mounted using the output of a linear scale, a linear encoder, or the like.
It is also possible to determine the moving speed of the pulse laser and control the irradiation timing of the pulsed laser light so as to be synchronized with this moving speed.

Further, in the above embodiment, the case where the pulsed near infrared laser beam (wavelength λ = 1064 nm) emitted from the Nd: YAG laser having the Q switch is used, but the present invention is not limited to this. The present invention can be applied without being limited to the laser beam. For example, an Nd: YLF laser with a Q switch (wavelength λ = 104
7 nm), Nd: YVO ₄ laser (wavelength λ = 1064n
m), a pulsed laser such as a CO ₂ laser and a copper vapor laser can be used. The present invention can also be applied to the case where a laser beam obtained by wavelength-converting the output of each of the above-mentioned lasers is used by using a nonlinear optical crystal. For example, Nd: YAG laser and LiB ₃ O
₅ (LBO), KTiOPO ₄ , β-BaB ₂ O ₄ (B
(BO), CsLiB ₆ O ₁₀ (CLBO) and other nonlinear optical crystals are combined to obtain wavelengths of 355 nm and 266.
A laser beam in the ultraviolet region of nm can be obtained. A pulsed ultraviolet laser beam emitted from a KrF excimer laser or the like can also be used as the laser beam in the ultraviolet region that mainly removes the transparent conductive film by ablation. Furthermore, the present invention can be applied to the case of using a pulsed light beam other than laser light, a pulsed energy beam such as a charged particle beam, or the like.

In the above embodiment, the case where the irradiation path of the pulsed laser light is fixed by the laser irradiation head 202 and the object to be processed is moved in the X direction and the Y direction orthogonal to each other has been described. The present invention can also be applied to a case where a processing object is fixed and set and an energy beam such as a laser is moved in the X direction and the Y direction, or when both the energy beam and the processing object are moved.

[0066]

According to the inventions of claims 1, 2, 3, 6 and 7, by executing the operation mode for power measurement,
It is said that it is possible to easily check whether the irradiation power of the energy beam is an appropriate value by measuring the irradiation power of the energy beam with the power measuring means while automatically switching a plurality of driving conditions of the beam source. effective. In particular, according to the second aspect of the invention, there is an effect that the driving condition of the beam source can be automatically corrected and the irradiation power of the energy beam can be set to an appropriate value. In particular, according to the third aspect of the invention, there is an effect that it is possible to notify the worker of deterioration or the like of the components forming the beam source and to prompt replacement of the components or repair. According to the invention of claims 4 to 10, by executing the processing condition setting operation mode when the type of the object to be processed is changed, the burden on the operator for setting the conditions for driving the beam source is reduced. However, there is an effect that the optimum driving condition of the beam source for the object to be processed can be easily found. In particular, according to the invention of claim 5, there is an effect that it is possible to reduce the burden on the operator of the work of judging the quality of the processing and the work of switching the driving condition of the beam source. Particularly, according to the invention of claim 6,
It is possible to reduce the burden on the operator when executing the processing condition setting operation mode and to shorten the time for setting the processing conditions. Moreover, there is an effect that the risk of erroneous setting of the formation condition of the processing pattern is reduced as compared with the case where the operator judges and sets the formation condition of the processing pattern each time the type of the processing target changes. .
In particular, according to the inventions of claims 7 and 8, the formation of the machining pattern is made as compared with the case where the operator judges every time the type of the machining object changes and inputs the data of the condition suitable for the machining object. This has the effect of shortening the time for setting the conditions and reducing the burden of the setting work. In particular,
According to the invention of claim 8, it is possible to further reduce the burden on the operator when executing the processing condition setting operation mode and to shorten the time for setting the processing conditions. Moreover, there is an effect that the risk of erroneous setting of the formation condition of the processing pattern is reduced as compared with the case where the operator judges and sets the formation condition of the processing pattern each time the type of the processing target changes. . In particular, according to the invention of claim 9, under each driving condition of the beam source, the power of the energy beam can be measured and the processing conditions can be set in a stable state. There is an effect that the accuracy of the condition setting can be improved. In particular, according to the invention of claim 10, even when the relative movement speed between the transparent substrate on which the conductive thin film is formed and the energy beam changes, the shape of the slit from which the conductive thin film is removed by the energy beam. Has the effect of being uniform.

[Brief description of drawings]

FIG. 1 is a flowchart of main control of a beam processing apparatus according to an embodiment of the present invention.

FIG. 2 is a schematic configuration diagram of the beam processing apparatus.

FIG. 3 is an explanatory diagram showing a change over time in the output of each pulsed laser beam.

FIG. 4 is a graph showing a relationship between a moving distance and a moving speed of a mounting table on which a transparent insulating substrate is mounted.

FIG. 5 is a block diagram of a control circuit board used in the beam processing apparatus.

FIG. 6 is a time chart showing the output of a linear scale, the output of a comparator, and the output of a pulse shaping circuit.

FIG. 7: Output of pulse shaping circuit, ON / OFF of switch circuit
The time chart which shows OFF control and output.

FIG. 8A is an explanatory diagram of irradiation spots of pulsed laser light with which a transparent conductive film on a transparent insulating substrate is irradiated.
(B) is explanatory drawing of the slit of the transparent conductive film formed by irradiation of a pulsed laser beam.

FIG. 9 is a graph showing a relationship between a moving distance and a moving speed of a mounting table on which a transparent insulating substrate is mounted.

FIG. 10 is a flowchart of a power check mode.

FIG. 11 is an explanatory diagram showing how the power meter moves.

FIG. 12 is a flowchart of a processing condition setting mode.

FIG. 13 is an explanatory diagram of a grid-shaped processing pattern used for setting processing conditions.

FIG. 14 is a flowchart of a power check mode according to a modification.

FIG. 15 is a flowchart of a processing condition setting mode according to a modification.

FIG. 16A is an explanatory diagram of irradiation spots of pulsed laser light in the Y-axis direction, which are irradiated on the transparent conductive film on the transparent insulating substrate. (B) is explanatory drawing of the lattice-shaped slit of the transparent conductive film formed by irradiation of a pulsed laser beam.

FIG. 17 is an enlarged sectional view of the touch panel.

FIG. 18A is an exploded perspective view of a touch panel. (B)
Is a plan view of the touch panel.

FIG. 19 is an explanatory view of a tilt angle θ in a moving direction of a mounting table on which a transparent insulating substrate is mounted.

FIG. 20 is an explanatory diagram of a wiring pattern at a peripheral end portion of the touch panel and slits around the wiring pattern.

[Explanation of symbols]

1 YAG laser device 2 beam irradiation means 3 Transparent insulating substrate 4 Transparent conductive film 5 XY table 6 control system 101 laser head 101a YAG rod 101b Q switch 102 Q switch driver 102 103 Laser power supply 201 optical fiber 202 laser irradiation head 203 power meter 501 mounting table 502 linear motor 503 linear scale 601 Host computer device 602 Table drive control device 603 control circuit board

Continued front page    (72) Inventor Yasuhiro Kawakami             Ricoh Mike, 10-3 Kitamura, Tottori City, Tottori Prefecture             RO Electronics Co., Ltd. F-term (reference) 4E068 CA02 CA03 CA18 CB02 CC02                       CE01 DA11                 5F072 AB02 HH02 HH03 JJ08 PP01                       QQ02 RR01 YY06

Claims (10)

[Claims] 1. A beam source for repeatedly emitting a pulsed energy beam, a beam irradiation means for guiding and irradiating an energy beam emitted from the beam source to an object to be processed, the object to be processed and the object to be processed. A beam processing apparatus comprising: a relative moving unit that relatively moves an irradiation point of the energy beam with respect to an object; and a control unit that controls the beam source and the relative moving unit based on processing control data. Power measuring means for measuring the irradiation power of the energy beam applied to the laser beam, and a power measuring operation for automatically measuring the irradiation power of the energy beam by the power measuring means while automatically switching a plurality of driving conditions of the beam source. A mode and an operation mode selection executing means for selectively executing a normal machining operation mode are provided. Over-time processing equipment. 2. The beam processing apparatus according to claim 1, further comprising drive condition correcting means for correcting drive conditions of the beam source based on a measurement result of the power measuring means when the power measuring operation mode is executed. A beam processing device characterized in that 3. The beam processing apparatus according to claim 1, wherein the irradiation power of the energy beam deviates from a preset reference range based on the measurement result of the power measuring means during execution of the power measuring operation mode. A beam processing apparatus, characterized in that an alarm means for issuing an alarm is provided in the. 4. A beam source that repeatedly emits a pulsed energy beam, a beam irradiation means that guides and irradiates an energy beam emitted from the beam source to an object to be processed, the object to be processed and the object to be processed. A beam processing apparatus comprising: a relative moving unit that relatively moves an irradiation point of the energy beam with respect to an object; and a control unit that controls the beam source and the relative moving unit based on processing control data. To selectively execute a machining condition setting operation mode in which a machining pattern for machining condition setting is formed on the object to be machined for each driving condition while automatically switching a plurality of drive conditions, and a normal machining operation mode A beam processing apparatus, characterized in that the operation mode selection executing means is provided. 5. The beam processing apparatus according to claim 4, wherein an image pickup means for picking up an image of a processing pattern formed on the object to be processed formed during execution of the processing condition setting operation mode; A driving condition switching means is provided for judging whether the processing is good or bad based on the image of the processing pattern, and automatically switching the driving condition of the beam source used in the normal processing operation mode as needed based on the judgment result. Beam processing equipment. 6. The beam processing apparatus according to claim 4 or 5, wherein the forming conditions of the processing pattern for setting the processing conditions to be formed in the operation mode for setting the processing conditions are stored in advance in association with the type of the object to be processed. Data storage means and data input means for inputting data of the type of the object to be processed, and the operation mode selection executing means corresponds to the data of the type of the object to be processed inputted by the data input means. Reading the processing pattern forming conditions from the data storage means,
A beam processing apparatus configured to form a processing pattern for setting the processing conditions under the read forming conditions. 7. The beam processing apparatus according to claim 4 or 5, wherein the data storage means stores data of forming conditions of the processing pattern for setting the processing conditions, and the processing conditions used in the operation mode for setting the processing conditions. Data processing means for accumulating the new shape condition in the data storing means when the forming condition of the setting processing pattern is new, and condition for specifying the forming condition of the processing pattern selected from the data storing means The operation mode selection executing means reads out the forming conditions of the processing pattern specified by the condition specifying means from the data storing means, and the processing conditions are set by the read forming conditions. A beam processing apparatus, which is configured to form a processing pattern. 8. The beam processing apparatus according to claim 7, further comprising data input means for inputting data of the type of the processing object, wherein the data processing means is associated with the type of the processing object to set the processing conditions. The processing pattern forming conditions for the processing are accumulated, and the processing pattern forming conditions corresponding to the data of the type of the processing object input by the data input means are read out from the data storage means, and are read out. A beam processing apparatus, which is configured to form a processing pattern for setting the above-described processing conditions under different forming conditions. 9. A method according to claim 1, 2, 3, 4, 5, 6, 7 or 8.
In the beam processing apparatus, the beam stability in which the power of the energy beam emitted from the beam source is stable when the setting of the driving condition of the beam source is changed in the power measuring operation mode or the processing condition setting operation mode. After the aging time has passed,
A beam processing apparatus, which starts measurement of irradiation power of the energy beam or formation of a processing pattern for setting the processing conditions. 10. Claims 1, 2, 3, 4, 5, 6, 7, 8
Alternatively, in the beam processing apparatus of Item 9, the beam is characterized in that the object to be processed is a transparent conductive film formed on an insulating substrate, and processing for removing a part of the transparent conductive film in a slit shape is performed. Processing equipment.