JP4759172B2 - Substrate manufacturing method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a substrate manufacturing method for forming a circuit pattern by removing a conductive material on a substrate using an energy beam such as a laser beam, and more particularly, a touch panel in which a transparent conductive film is formed on an insulating transparent substrate. The present invention relates to a substrate manufacturing method suitable for forming a circuit pattern on a substrate.
[0002]
[Prior art]
Conventionally, as a method for manufacturing a substrate, a manufacturing method using a photolithography method with an etching process is widely known. In this photolithography method, a photomask is created and aligned with a substrate coated with a photo-curable photosensitive material, and light containing ultraviolet rays (hereinafter referred to as UV light) is irradiated using an ultraviolet lamp or the like. The circuit pattern formed on the mask is exposed and printed on the substrate. Then, the exposed substrate is etched to remove the unexposed conductive metal material. Thereafter, the photosensitive material photocured by chemical treatment is removed.
[0003]
In the photolithography method described above, it is necessary to always create a photomask even in the production of one or a small number of substrates, and after that, a process of attaching and exposing the photomask to the substrate takes time and cost. Furthermore, the processing of the photoresist developer and the waste solution of the etching solution is expensive.
[0004]
For this reason, for example, Japanese Patent Application Laid-Open No. 10-235486 discloses a printed circuit board direct drawing apparatus that uses a photocurable film as a photosensitive material and directly forms a circuit pattern on a substrate without using a photomask. Yes. In this printed circuit board direct drawing apparatus, light including ultraviolet light is irradiated by moving a drawing head on a substrate having an ultraviolet curable film attached on a conductive metal material based on wiring pattern data created by the printed circuit board CAD. Then, a circuit pattern according to the wiring pattern data is formed on the substrate. In this printed circuit board direct drawing apparatus, a circuit pattern can be formed on a substrate without using a photomask. However, since an etching process and a photocured film removal process by chemical treatment are necessary, the manufacturing time The shortening of the process and the reduction of the process were not sufficient.
[0005]
Therefore, for example, in Japanese Patent Application No. 2000-77153, the present applicant removes the conductive material by irradiating an insulating transparent substrate on which a transparent conductive film is formed as a conductive material with an energy beam such as laser light. A method of manufacturing a touch panel substrate for forming a pattern is proposed. When a circuit pattern is formed on an insulating transparent substrate by this touch panel substrate manufacturing method, for example, it is performed as follows.
[0006]
(1) A transparent conductive film is formed on an insulating transparent substrate by vapor deposition or the like. {Circle around (2)} In order to prevent damage to the surface due to conveyance or the like, a laminate film is attached to the surface on which the transparent conductive film is formed and the surface opposite to this surface. (3) The laminate film is peeled off and set on the XY table of the laser processing apparatus with the surface on which the transparent conductive film is formed facing upward. (4) The substrate is irradiated with laser light in synchronization with the laser light irradiation and the XY table, and the transparent conductive film is removed to form a circuit pattern. {Circle around (5)} The substrate is washed to wash away surface deposits (for example, debris) by laser processing.
[0007]
In this touch panel substrate manufacturing method, a circuit pattern can be formed on a substrate without using a photomask, and an etching process and a chemical treatment process are not required, so that the manufacturing time is significantly reduced and the number of processes is reduced. Can be planned.
[0008]
[Problems to be solved by the invention]
In the manufacturing method of the touch panel substrate, generally, a plurality of substrates from which the laminate film has been peeled are stacked and accommodated in a stocker, and the substrate is set on an XY table of a laser processing apparatus by a vacuum suction transfer device or the like. For this reason, the surface opposite to the surface on which the transparent conductive film or transparent conductive film is formed (the surface becomes the surface when it becomes a touch panel) is damaged by the stacking or vacuum suction conveyance in the stocker. There was a case. If the touch panel substrate is damaged, it cannot be used as a substrate for a touch panel, resulting in a poor yield.
[0009]
Therefore, the present inventors diligently studied, and by irradiating an energy beam onto the touch panel substrate with the laminate film adhered, the energy beam can penetrate the laminate film to process the transparent conductive film, and can be accommodated and transported. It came to the conclusion that the damage by the could be prevented.
[0010]
The deterioration of the yield due to the damage of the touch panel substrate becomes a problem not only in the touch panel substrate but also in a normal printed circuit board.
[0011]
The present invention has been made under the above background. The purpose of the present invention is to remove damage such as scratches due to accommodation or transportation of the substrate when the conductive material on the substrate is removed using an energy beam. It is providing the board | substrate manufacturing method which can prevent.
[0012]
[Means for Solving the Problems]
  In order to achieve the above object, the invention of claim 1 provides a substrate.Formed on the top surface ofConductive materialConductive film comprisingIn the substrate manufacturing method of forming a circuit pattern on the substrate by irradiating the substrate with an energy beam emitted from the beam processing apparatus,Formed on the top surfaceConductivefilmofOn top, The conductivefilmIt is harder to be processed with the above energy beam, and the energy beam can be transmitted., PET (polyethylene terephthalate), PC (polycarbonate), PEN (polyethylene naphthalate), PAR (polyarylate), PES (polyethersulfone) or PI (polyimide)A laminate film made of is attached, the substrate to which the laminate film is attached is set in the beam processing apparatus,,Above boardFormed on the top surface ofConductivefilmThe above-mentioned laminated film is irradiated with the above energy beam.On the upper surface of the conductive filmLeave the conductivefilmA circuit pattern is formed on the substrate by removing the substrate.
[0013]
  In this substrate manufacturing method, even when an operator's fingertip or a member constituting the beam processing device comes into contact with the substrate when the substrate is set in the beam processing device, the substrateFormed on the top surface ofConductive materialConductive film comprisingPasted on the surface ofMade of PET (polyethylene terephthalate), PC (polycarbonate), PEN (polyethylene naphthalate), PAR (polyarylate), PES (polyether sulfone) or PI (polyimide)Laminate film, substrateFormed on the top surface ofConductivefilmPrevent damage. When the substrate is irradiated with the energy beam, the energy beam passes through the laminate film and passes through the conductive film.filmThe conductiveMembraneRemove by evaporation. At this time, the laminate film and the conductive filmfilmThe above energy at the interface between-The energy of the beam is concentrated and the conductionfilmIs efficiently removed. Moreover, the laminate film is made of the conductive material.filmSince the laminate film is not processed and the laminate film remains, the conductive film is not processed.filmCan only be processed. When the substrate is removed from the beam processing apparatus, the conductivefilmEven if an operator's fingertip or the like comes into contact with the processed surface on which the circuit pattern is formed by removing the film, the laminated film protects the processed surface and prevents damage.
  The invention of claim 2 is a substrate.Formed on the top surface ofConductive materialConductive film comprisingIn the substrate manufacturing method of forming a circuit pattern on the substrate by irradiating the substrate with an energy beam emitted from the beam processing apparatus, the substrateAboveConductiveTop surface with filmOn the opposite sideunderOn the surface, the conductivefilmIt is harder to be processed with the above energy beam, and the energy beam can be transmitted., PET (polyethylene terephthalate), PC (polycarbonate), PEN (polyethylene naphthalate), PAR (polyarylate), PES (polyethersulfone) or PI (polyimide)A laminate film comprising: a substrate on which the laminate film is attached is set on the beam processing apparatus, and the substrate on which the laminate film is attached.Formed on the top surfaceConductivefilmThe above-mentioned laminated film is irradiated with the above energy beam.On the bottom surface of the substrateLeave the conductivefilmA circuit pattern is formed on the substrate by removing the substrate.
  In this substrate manufacturing method, when the substrate is set on the beam processing apparatus, even if an operator's fingertip or a member constituting the beam processing apparatus contacts the substrate, the substrateFormed on the top surfaceConductive materialConductive film comprisingAffixed to the opposite side of the substrateMade of PET (polyethylene terephthalate), PC (polycarbonate), PEN (polyethylene naphthalate), PAR (polyarylate), PES (polyether sulfone) or PI (polyimide)Laminate film prevents damage to the substrate surface.
[0014]
  Claim3The invention of claim 1Or 2In the substrate manufacturing method, the substrate is accommodated in a substrate supply unit of the beam processing apparatus, and the conductive material of the substrate is stored.filmButBeen formedThe substrate is transported from the substrate supply unit while being vacuum-sucked by a vacuum suction member, set at a processing position of the beam processing apparatus, and the substrate is irradiated with the energy beam to form a circuit pattern. The conductivity of the substratefilmButFormed onThe substrate is transported from the processing position while being vacuum-sucked by the vacuum suction member, and is accommodated in the substrate discharge portion.
[0015]
  In this substrate manufacturing method, the substrate is electrically conductive using a vacuum suction member (for example, a rubber sucker).filmWhen the substrate on which the substrate is formed is vacuum-sucked to convey the substrate, the vacuum-suction member contacts the laminate film andfilmDo not touch the board surface directly. As a result, when the substrate is transported by vacuum suction, the conduction due to the contact of the vacuum suction member.filmIn addition, damage to the substrate surface and occurrence of contamination can be prevented.
[0016]
  Claim4The invention of claim 1 and 2Or 3In the substrate manufacturing method, the substrate is an insulating transparent substrate, and the conductivefilmIs a transparent conductive film, and a part of the transparent conductive film on the insulating transparent substrate is removed in a slit shape by the energy beam, thereby forming a transparent electrode on the insulating transparent substrate. To do.
[0017]
  In this substrate manufacturing method, transparent conductivefilmIn addition, it is possible to manufacture a substrate that is free from scratches or contamination on the substrate surface and that has a uniform slit shape between the transparent electrodes formed on the insulating transparent substrate.
[0018]
  Claim5The invention of claim 1, 2, 3Or 4In this substrate manufacturing method, the energy beam is YAG laser light emitted from a YAG laser light source having a Q switch.
[0019]
In this substrate manufacturing method, a stable energy beam can be obtained even when the repetition frequency for controlling the emission timing of the energy beam is changed in a relatively wide range via the Q switch. The irradiation timing can be easily controlled.
[0022]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, an example of an embodiment of the present invention will be described in detail.
FIG. 1 is a schematic configuration diagram of a beam processing apparatus used in the substrate manufacturing method of the present invention. This beam processing apparatus guides and irradiates a workpiece with a YAG laser apparatus 1 as a beam source that repeatedly emits a pulsed laser beam as a pulsed energy beam and a pulsed laser light emitted from the YAG laser apparatus 1. Beam irradiation means 2, an XY table 5 as a relative movement means for relatively moving an object to be processed and an irradiation point of the energy beam with respect to the object to be processed, and a YAG laser device 1 and an XY table 5 based on the processing control data And a control system 6 as a control means for controlling.
[0023]
The YAG laser apparatus 1 includes a laser head 101 including a YAG rod 101a and a Q switch 101b, a Q switch driving unit 102 for driving the Q switch 101b, and a drive current for laser oscillation in the YAG rod 101a in the laser head 101. And a laser power source 103 for supplying the power. The Q switch driving unit 102 drives the Q switch 101 b in the laser head 101 based on the laser control signal sent from the control system 6. When the Q switch 101b is turned on, a pulse laser beam composed of near infrared light (wavelength λ = 1064 nm) is emitted from the laser head 101. The repetition frequency of the pulsed laser control signal input to the Q switch driving unit 102 can be changed in the range of 20 Hz to 20 kHz (cycle = 50 msec to 0.05 msec), and the pulse width of the laser control signal is It can be changed in the range of 80 to 500 nsec. By driving the Q switch 101b in the laser head 101 by the Q switch driving unit 102, the pulse laser beam can be emitted from the laser head 101 within the range of the repetition frequency of 500 Hz to 5 kHz.
[0024]
The YAG rod 101a in the laser head 101 is a YAG (yttrium, aluminum, garnet) crystal doped with rare earth element Nd (neodymium) and is excited by an excitation source (not shown) such as a flash lamp or a semiconductor laser. These excitation sources are driven by supplying a drive current Id from the laser power source 103. The drive current Id supplied from the laser power supply 103 to the excitation source of the YAG rod 101a can be changed based on a control command sent from the control system 6 to the laser power supply 103, whereby the YAG laser device 1 It is possible to change the output of the pulsed laser beam emitted from.
[0025]
An insulating transparent substrate 3 having a transparent conductive film 4 as a processing object formed on the surface thereof is not shown on a mounting table 501 driven by a linear motor 502 (for example, a servo motor or a stepping motor) of the XY table 5. It is fixed by suction and a mechanical clamping mechanism. The control system 6 controls the linear motor 502 that drives the mounting table 501 on which the insulating transparent substrate 3 is fixed, so that the insulating transparent substrate 3 on which the transparent conductive film 4 is formed can It can be moved two-dimensionally in an X direction and a Y direction (direction perpendicular to the paper surface in the drawing) orthogonal to each other in a virtual plane perpendicular to the irradiation direction.
[0026]
In order to further improve the processing speed, the acceleration of the XY table, and the processing accuracy, the XY table 5 is preferably formed of an ultralight material of foamed titanium, magnesium, alumina oxide, or aluminum alloy.
[0027]
Further, a weight reduction may be achieved by forming a through hole inside the mounting table 501. This through-hole can also serve as an air flow path for a vacuum chuck when the integral body of the insulating transparent substrate 3 and the transparent conductive film 4 is a sheet.
With respect to the mounting table 501, a recess is formed at least below the portion of the insulating transparent substrate 3 that is irradiated with the pulsed laser beam, and the distance between the lower surface of the insulating transparent substrate 3 and the upper surface of the mounting table 501 is as much as possible. It is preferable to make it long. With such a configuration, it is possible to suppress the adverse effect on the processing due to the reflected laser beam that has passed through the insulating transparent substrate 3 and reflected on the surface of the mounting table 501 hitting the transparent conductive film 4.
[0028]
In the present embodiment, a linear scale 503 is attached to the XY table 5 as a moving distance detection pulse signal generation unit. The linear scale 503 is provided for each of the two directions of the X direction and the Y direction, and the movement distance is detected for each movement of the mounting table 501 on which the insulating transparent substrate 3 is mounted by a certain distance in the X direction and the Y direction. Generate a pulse signal. By counting the movement distance detection pulse signal, the movement distance of the mounting table 501 on which the insulating transparent substrate 3 is mounted can be known. In the present embodiment, the irradiation timing of each pulsed laser beam is controlled in synchronization with the moving distance of the mounting table 501 on which the insulating transparent substrate 3 is mounted based on the moving distance detection pulse signal.
[0029]
The control system 6 includes a host computer device 601 including a personal computer that monitors the entire beam processing device and issues a control command to each unit based on CAM (Computer Aided Manufacturing) data as processing control data, and a table drive control device. (Sequencer) 602 and a control circuit board 603 for synchronous interlock operation are configured.
[0030]
The CAM data is generated based on CAD (Computer Aided Design) data in consideration of the apparatus parameters of the beam processing apparatus. For example, (1) irradiation point pitch and (2) processing for each line-shaped processing element. It has a data structure in which the coordinates of the start point and (3) the coordinates of the processing end point are a set.
[0031]
The host computer 601 includes a processing speed input means for the user to input processing speed Vo data, and the driving conditions of the mounting table 501 of the XY table 5 and the pulse laser beam based on the processing speed Vo data input by the user. It is also used as processing condition setting means for setting the irradiation conditions.
A recording medium such as an FD in which the CAM data is stored is set in the host computer device 601 and the CAM data is read. Along with the reading of the CAM data, data on the processing speed desired by the user is input to the host computer device 601.
[0032]
In the host computer 601, based on the CAM data and the machining speed Vo input by the user, for each machining element, (1) the coordinates of the movement start point and movement end point of the mounting table 501 in the XY table 5, 2) Positive acceleration in the acceleration region of the mounting table 501 and negative acceleration in the deceleration region, (3) Maximum moving speed (= processing speed) of the mounting table 501, and (4) Laser power source as the irradiation condition of the pulse laser beam Data such as the drive current Id supplied from 103 is calculated and stored in a predetermined storage area. For the calculation of these data, a data table including an optimum range obtained in advance through experiments or the like is used.
[0033]
The table drive control device 602 controls the drive of the linear motor 502 based on a control command sent from the host computer device 601. The table drive control unit 602 is configured using a servo controller when the linear motor 502 is a servo motor, for example, and is configured using a pulse controller when the linear motor 502 is a pulse motor.
[0034]
FIG. 2 is a block diagram showing a configuration example of the control circuit board 603. The control circuit board 603 uses a CPU 603a, an I / O interface 603b, a pulse counter 603c, a comparison circuit 603d, a pulse width shaping circuit 603e, a switch circuit 603f, and a memory (RAM, ROM, etc.) not shown. It is configured.
[0035]
The I / O interface 603b performs signal processing for data communication between the CPU 603a and the external host personal computer device 601.
[0036]
The pulse counter 603c counts the number of pulses of the movement distance detection pulse signal Sm generated by the linear scale 503. The count value Nm by the pulse counter 603c is compared with the reference value Nref sent from the CPU 603a in the comparison circuit 603d, and when both values match, a pulse signal is output from the comparison circuit 603d. The reference value Nref can be arbitrarily set according to the processing conditions. The movement distance detection pulse signal Sm input to the pulse counter 603c is switched according to the movement direction of the mounting table 501 of the XY table 5. For example, when the mounting table 501 is moved in the X direction, it is output from the linear scale 503 for the X direction.
[0037]
The pulse width shaping circuit 603d is a circuit that widens the pulse width of the movement distance detection pulse signal Sp output from the comparison circuit 603c to a pulse width at which the Q switch can operate. By adjusting the pulse width shaping circuit 603d, the pulse width of the pulse laser beam emitted from the YAG laser apparatus 1 can be changed.
[0038]
The switch circuit 603e outputs a laser control signal output from the pulse width shaping circuit 603d to the Q switch driving unit 102 so that continuous processing and intermittent processing can be appropriately switched based on a control command from the CPU 603a. This is a circuit for on / off control.
[0039]
Next, a manufacturing method of a touch panel substrate in which a transparent electrode is formed by removing a part of a transparent conductive film formed on an insulating transparent substrate of a hybrid touch panel into a slit shape using the beam processing apparatus. explain.
[0040]
FIG. 3 is a perspective view of the touch panel substrate before processing.
As shown in the figure, a transparent conductive film 4 is formed on an insulating transparent substrate 3 in advance, and the touch panel substrate is laminated on the upper surface of the transparent conductive film 4 and the lower surface of the insulating transparent substrate 3 for surface protection. The film 10 is affixed uniformly.
[0041]
The insulating transparent substrate 3 is made of transparent glass or a transparent plastic material (for example, PET or polycarbonate).
The transparent conductive film 4 is made of ITO (indium tin oxide) or the like with a thickness of about 500 angstroms on the surface of the insulating transparent substrate 3 by vacuum deposition, ion plating, sputtering or the like.
The laminated film is preferably made of a material that transmits laser light well and is harder to be processed by laser light than the transparent conductive film 4. For example, PET (polyethylene terephthalate), PC (polycarbonate), PEN (polyethylene naphthalate), PAR (polyarylate), PES (polyether sulfone), PI (polyimide) and the like can be mentioned.
[0042]
When the transparent conductive film 4 on the insulating transparent substrate 3 is subjected to beam processing, first, as shown in FIG. 4, the operator creates a plurality of insulating transparent substrates 3 with the laminate film 10 attached thereto. And accommodated in the supply stocker 11. Conventionally, the laminate film is peeled off from the substrate and accommodated in the supply stocker 11. However, the surface of the substrate may be damaged due to accommodation or conveyance. Therefore, in the present embodiment, the insulating transparent substrate 3 with the laminate film 10 attached is accommodated in the supply stocker 11.
The insulating transparent substrates 3 housed in the supply stocker 11 are automatically placed on the mounting table 501 of the XY table 5 by the vacuum suction transfer device 12 that moves in synchronization with the processing operation of the beam processing device one by one. It is installed and fixed by a suction and mechanical clamping mechanism (not shown).
[0043]
In FIG. 1, the linear motor 502 is driven to move the mounting table 501 on which the insulating transparent substrate 3 is mounted to the initial position, and pulse laser light is emitted from the laser head 101. The pulsed laser light passes through the optical fiber 201, reaches the laser irradiation head 202, and is irradiated onto the insulating transparent substrate 3 from directly above. The control system 6 moves the linear motor 502 in the X and Y directions according to the CAM data created based on the CAD data as described above, and the pulse laser beam is transmitted through the laminate film 10 according to the CAD data circuit pattern. The transparent conductive film 4 on the insulating transparent substrate 3 is irradiated. The irradiated pulse laser beam passes through the laminate film 10 and reaches the transparent conductive film 4. In the course of this movement, the irradiated portion of the pulse laser beam having a width of about 500 to 1000 [μm] is evaporated and removed from the transparent conductive film 4 to form a slit that insulates each electrode region.
[0044]
At this time, the energy of the pulse laser beam is concentrated on the boundary surface between the laminate film 10 and the transparent conductive film 4, and the transparent conductive film 4 is efficiently removed. The power of the laser beam can be reduced. Further, since the laminate film 10 is harder to be laser-processed than the transparent conductive film 4, it remains adhered to the transparent conductive film 4 in the same state as before processing, and can be transported and accommodated after processing. The occurrence of damage can be prevented.
[0045]
As shown in FIG. 4, the beam-processed insulating transparent substrate 3 is transported from the mounting table 501 by the vacuum suction transport device 12 and accommodated in the discharge stocker 13. Thereafter, the laminate film 10 is peeled off from the insulating transparent substrate 3, and the processing is completed through a substrate cleaning step and a printing step.
[0046]
A touch panel used for a PDA or the like can be created by assembling two insulating transparent substrates 3 manufactured through the above manufacturing process so as to face each other.
FIG. 5 is a cross-sectional view of a touch panel configured using a touch panel substrate on which an electrode pattern is formed by processing the transparent conductive film 4 in the beam processing apparatus. FIGS. 6A and 6B are an exploded perspective view and a plan view of the touch panel, respectively.
As shown in FIG. 5, the touch panel has a pair of upper and lower touch panel substrates 7 and 8 having a predetermined height (for example, 9 to 12 μm) spacers 9 so that the transparent electrodes made of the respective transparent conductive films 4 are not in contact with each other in a normal state. It is the structure which was made to oppose through. When the touch panel is pressed from above in FIG. 5, the upper touch panel substrate 7 is deformed as indicated by a two-dot chain line, and the transparent electrodes of the upper and lower touch panel substrates 7 and 8 are brought into contact with each other. From the change in resistance between the upper and lower transparent electrodes due to this contact, it is possible to know whether or not the pressure has been pressed and the pressed position. In addition, as shown in FIGS. 6A and 6B, this touch panel has slits 7a and 8a perpendicular to each other formed in the upper and lower touch panel substrates 7 and 8, respectively.
[0047]
As described above, according to the present embodiment, since the insulating transparent substrate 3 is subjected to beam processing while the laminate film 10 is adhered, accommodation in the supply stocker 11 or conveyance from the supply stocker 11 to the beam processing apparatus, In addition, the laminate film 10 protects the insulating transparent substrate 3 and the transparent conductive film 4 during transport from the beam processing apparatus to the discharge stocker 13, and damage such as scratches can be prevented. Thereby, the deterioration of the yield due to damage or the like can be prevented without increasing the cost in the manufacturing process.
Further, the debris and the like generated when the transparent conductive film 4 evaporates due to the irradiation of the pulsed laser light is confined in the slit and prevented from scattering to the outside. Thereby, it is not necessary to separately provide a blower for collecting scattered debris and the like, and the cost of the manufacturing apparatus can be reduced. In addition, the beam processing of the insulating transparent substrate 3 can be easily performed even in a clean room.
[0048]
Furthermore, in the substrate manufacturing method of the present embodiment, the transparent conductive film 4 can be processed to form a plurality of transparent electrodes on the insulating transparent substrate 3 without using a photolithography method involving an etching process. For this reason, the upper and lower touch panel substrates 7 and 8 can be manufactured without polluting the environment with a photoresist developer or an etchant waste solution. Even when the pattern shape of the transparent electrode is changed, a plurality of transparent electrodes corresponding to the pattern can be formed by processing the transparent conductive film 4 with the CAM data without using a light-shielding mask for photolithography. For this reason, it is necessary to prepare a light-shielding mask with a dedicated light-shielding pattern for each of the touch panel substrates 7 and 8 having different electrode patterns, making it difficult to produce a small quantity of other varieties, and soiling a workpiece with a residual resist solution. There is no problem due to the law, and the lead time can be shortened to sufficiently respond to on-demand requests.
[0049]
In the above embodiment, the method of applying the beam by laminating the laminate film 10 on both the upper surface of the transparent conductive film 4 and the lower surface of the insulating transparent substrate 3 has been described. However, the laminate film is formed on at least one of the surfaces. If 10 is affixed, the damage in accommodation or conveyance can be prevented.
[0050]
Moreover, although the said embodiment demonstrated the case where a touchscreen board | substrate was manufactured, it can apply to not only a touchscreen board | substrate but a printed circuit board, and can also prevent damage to a printed circuit board.
[0051]
Furthermore, in the above embodiment, the case where a pulsed near-infrared laser beam (wavelength λ = 1064 nm) emitted from an Nd: YAG laser having a Q switch has been described, but the present invention is applied to this laser beam. It is applicable without limitation. For example, Nd: YLF laser (wavelength λ = 1047 nm), Qd switch, Nd: YVO₄Laser (wavelength λ = 1064 nm), CO₂The present invention can also be applied when a pulse laser such as a laser or a copper vapor laser is used.
The present invention can also be applied to the case of using a laser beam obtained by wavelength-converting the output of various lasers using a nonlinear optical crystal. For example, Nd: YAG laser and LiB₃O₅(LBO), KTiOPO₄, Β-BaB₂O₄(BBO), CsLiB₆O₁₀When combined with a nonlinear optical crystal such as (CLBO), a laser beam in the ultraviolet region with wavelengths of 355 nm and 266 nm can be obtained. As the laser beam in the ultraviolet region for removing the transparent conductive film mainly by ablation, a pulsed ultraviolet laser beam emitted from a KrF excimer laser or the like can also be used.
Furthermore, the present invention can also be applied to the case of using other pulsed energy beams such as a pulsed light beam other than laser light and a charged particle beam.
[0052]
Furthermore, in the above embodiment, the case where the irradiation path of the pulse laser beam is fixed by the laser irradiation head 202 and the workpiece is moved in the X direction and the Y direction orthogonal to each other has been described. The present invention can also be applied to a case where an object is fixed and set, and an energy beam such as a laser is moved in the X direction and the Y direction, or both the energy beam and the workpiece are moved.
[0053]
【The invention's effect】
  Claims 1, 3 to5According to the invention, even when a member constituting the operator's fingertip or the beam processing apparatus comes into contact with the substrate when the substrate is accommodated or transported, the substrateFormed on the top surfaceConductive materialConductive film comprisingPasted onMade of PET (polyethylene terephthalate), PC (polycarbonate), PEN (polyethylene naphthalate), PAR (polyarylate), PES (polyether sulfone) or PI (polyimide)Laminate film makes this conductivefilmThere is an effect that it is possible to prevent damage. The laminate film and the conductive filmfilmThe above energy at the interface between-The energy of the beam is concentrated and the conductionMembraneSince it is removed efficiently, the energy is higher than when the laminate film is not attached.-There is also an effect that the power of the beam can be reduced.
  Claims2 to 5According to the invention, when the substrate is set on the beam processing apparatus, even if an operator's fingertip or a member constituting the beam processing apparatus contacts the substrate, the substrateFormed on the top surfaceConductive materialConductive film comprisingOn the opposite side of the surfaceunderPasted on the surfaceMade of PET (polyethylene terephthalate), PC (polycarbonate), PEN (polyethylene naphthalate), PAR (polyarylate), PES (polyether sulfone) or PI (polyimide)Laminate film makes the substrateUnderThis has the effect of preventing surface damage.
[0054]
  In particular, the claims3According to the present invention, when the substrate is transported by vacuum suction, the conductivity by contact of the vacuum suction member isfilmIn addition, there is an effect that it is possible to prevent damage to the substrate surface and generation of dirt.
[0055]
  In particular, the claims4According to the invention of transparent conductivefilmIn addition, there is an effect that it is possible to manufacture a substrate in which the substrate surface is not damaged or dirty, and the slits between the transparent electrodes formed on the insulating transparent substrate have a uniform shape. This substrate can be used as a substrate for a touch panel.
[0056]
  In particular, the claims5According to the invention, since the YAG laser having a Q switch with a stable beam output is used even when the repetition frequency for controlling the irradiation timing of the energy beam is changed in a relatively wide range, the energy beam is used. There is an effect that the irradiation timing can be easily controlled.
[Brief description of the drawings]
FIG. 1 is a schematic configuration diagram of a beam processing apparatus according to an embodiment of the present invention.
FIG. 2 is a block diagram of a control circuit board used in the beam processing apparatus.
FIG. 3 is a perspective view of a touch panel substrate.
FIG. 4 is an explanatory view of accommodation and conveyance of a touch panel substrate.
FIG. 5 is an enlarged cross-sectional view of a touch panel.
FIG. 6A is an exploded perspective view of a touch panel.
(B) is a plan view of the touch panel.
[Explanation of symbols]
1 YAG laser equipment
2 Beam irradiation means
3 Insulating transparent substrate
4 Transparent conductive film
5 XY table
6 Control system
10 Laminate film
11 Supply stocker
12 Vacuum suction transfer device
13 Discharge stocker
101 Laser head
101a YAG rod
101b Q switch
102 Q switch drive unit 102
103 Laser power supply
201 optical fiber
202 Laser irradiation head
501 mounting table
502 linear motor
503 linear scale
601 Host computer device
602 Table drive control device
603 Control circuit board

Claims (5)

In a substrate manufacturing method for forming a circuit pattern on a substrate by irradiating a conductive film made of a conductive material formed on an upper surface of the substrate with an energy beam emitted from a beam processing apparatus,
The upper surface of the conductive film formed on the upper surface of the substrate, the conductive film and the energy beam hardly processed by the energy beam is permeable than, PET (polyethylene terephthalate), PC (polycarbonate), PEN (polyethylene Na A laminated film made of phthalate), PAR (polyarylate), PES (polyethersulfone) or PI (polyimide) ,
Set the substrate with the laminated film attached to the beam processing device,
Through the laminate film, the conductive film formed on the upper surface of the substrate by irradiating the energy beam, the substrate on by removing the remains conductive film leaving the laminate film on the upper surface of the conductive film A circuit board is formed on the substrate. In a substrate manufacturing method for forming a circuit pattern on a substrate by irradiating a conductive film made of a conductive material formed on an upper surface of the substrate with an energy beam emitted from a beam processing apparatus,
Under surface opposite to the upper surface of the conductive film of the substrate is formed, than the conductive film and hard to be processed by the energy beam the energy beam is capable of transmitting, PET (polyethylene terephthalate), PC (polycarbonate ), PEN (polyethylene naphthalate), PAR (polyarylate), PES (polyethersulfone) or PI (polyimide) laminate film is applied,
Set the substrate with the laminated film attached to the beam processing device,
The conductive film formed on the upper surface of the substrate to which the laminate film is attached is irradiated with the energy beam, and the conductive film is removed while leaving the laminate film on the lower surface of the substrate. A substrate manufacturing method comprising forming a pattern . In 請 Motomeko 1 or 2 of the substrate manufacturing process,
The substrate is accommodated in the substrate supply unit of the beam processing apparatus,
The upper surface of the conductive film of the substrate was formed by transporting the substrate from the substrate supply unit with vacuum suction by the vacuum suction member was set in the processing position of the beam processing apparatus,
After then irradiating the energy beam to form a circuit pattern on the substrate, the upper surface of the conductive film of the substrate is formed from the machining position while vacuum suction by the vacuum suction member to convey the substrate board A substrate manufacturing method, wherein the substrate is accommodated in a discharge portion. In the board | substrate manufacturing method of Claim 1, 2, or 3 ,
The substrate is an insulating transparent substrate, and the conductive film is a transparent conductive film,
A substrate manufacturing method comprising forming a transparent electrode on the insulating transparent substrate by removing a part of the transparent conductive film on the insulating transparent substrate in a slit shape with the energy beam. In the board | substrate manufacturing method of Claim 1, 2, 3 or 4 ,
A substrate manufacturing method, wherein the energy beam is YAG laser light emitted from a YAG laser light source having a Q switch.

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