JP2003258472A - Heat sink device and information processing unit - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To improve a heat sink efficiency without increasing a outside dimension due to an increase or the like in the size of a fan. <P>SOLUTION: A heat sink device comprises the fan 2 for sucking air from an axial direction and exhausting the air in a tangential direction, and supplying cooling wind; and the heat sink 3 having a plurality of fins 10 having a plurality of channels 11 for the cooling wind. The sink 3 has a supply port 9 for the wind from the fan 2, and the channels 11 having the fins 10 arranged obliquely at predetermined angles in a space between the exterior of the housing of an information processing unit such as a note-sized personal computer and an exhausting unit for exhausting the wind. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat dissipation device having improved heat dissipation efficiency, and an information processing apparatus equipped with the heat dissipation device, and more particularly to a heat dissipation technique for heat generation of heat generating components housed in a limited space.

[0002]

2. Description of the Related Art In recent years, portable information processing apparatuses such as notebook personal computers have been widely used, and there is a demand for downsizing and thinning of the apparatuses in order to improve their portability.

In the above-mentioned notebook personal computer, for example, an electronic element that generates heat during operation, such as a central processing unit (C), is used.
PU) is mounted, and since it is required to be small and thin and to have an improved processing capability, a high-performance and high-performance CPU has come to be used. Such a high-performance and high-performance CPU consumes a large amount of power and accordingly generates a large amount of heat. This increase in the amount of generated heat causes adverse effects such as malfunction and damage due to overheating, and therefore more effective heat dissipation / cooling has been demanded.

[0004]

In order to dissipate heat from the heat-generating electronic elements and other heat sources constituting the above-mentioned information processing apparatus to the outside of the apparatus, a fan is used to radiate air for cooling. The most common method is to circulate and cool the heat source, but the information processing device itself is extremely small,
Since it is thin, the installation space for the heat dissipation device is limited. The heat dissipation device installed in such a limited space has a problem that the heat dissipation from the heat source cannot be effectively released to the outside when the attached fan is small and the heat dissipation efficiency is poor.

The above-mentioned decrease in heat radiation efficiency can be prevented by enlarging the fan to increase the flow rate of the cooling air. However, an increase in the size of the fan leads to an increase in the installation space of the heat dissipation device, which hinders the size reduction and thickness reduction of the information processing device, and therefore cannot be adopted.

Therefore, an object of the present invention is to provide a heat dissipation device having improved heat dissipation efficiency without an increase in external dimensions due to an increase in size of a fan, and an information processing device equipped with this heat dissipation device. And

[0007]

Means for Solving the Problems As a result of intensive studies by the present inventors to solve the above-mentioned problems, as a result of the heat radiation device, the state of the flow path of the cooling air formed by the plate-shaped fins against which the cooling air hits is radiated. Found to contribute to improved efficiency,
The present invention has been completed.

That is, the heat dissipation device according to the present invention which achieves the above-mentioned object is provided with a fan for sucking air in the axial direction, exhausting it in the tangential direction and sending cooling air, and a cooling air arranged at a predetermined interval. A heat sink having a plurality of fins that form a plurality of flow paths, and the heat sink cools a supply port of cooling air from a fan and the outside of a housing such as an information processing device in which the heat dissipation device is disposed. It is characterized in that the flow path formed by the fins is arranged so as to be inclined at a predetermined angle in a space between the discharge section for discharging the wind. The inclination of the flow path is based on, for example, the side plane of the fan casing.

Further, in the information processing apparatus according to the present invention, the above-mentioned heat dissipation device is attached to a heat generating component inside the housing, for example, a CPU, and the heat sink of the heat dissipation device has a supply port for cooling air from a fan and information processing. It is characterized in that a flow path is arranged so as to be inclined at a predetermined angle in a space between the apparatus and a discharge section that discharges cooling air to the outside of the apparatus.

According to the heat dissipation device of the present invention described above,
The heat dissipation efficiency is improved without increasing the external dimensions of the device itself by increasing the size of the fan. Further, according to the information processing device of the present invention, by disposing the heat dissipation device as described above, the heat of the heat generating component is dissipated with high heat dissipation efficiency, and a high-performance, high-performance CPU or the like that emits high heat Even in such a case, adverse effects such as malfunction and failure due to overheating can be prevented.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Specific embodiments of a heat dissipation device and an information processing device according to the present invention will be described in detail below with reference to the drawings. The heat dissipation device according to the present invention is disposed in an electronic device such as an information processing device, for example, a notebook personal computer (hereinafter, simply referred to as a notebook computer) described later, and a heat generating component such as a CPU in the notebook computer. The heat generated in (2) is forcibly radiated by sending cooling air to the CPU and discharging the cooling air to the outside of the notebook computer.

As shown in FIGS. 1 and 3, the heat dissipation device 1 includes a fan 2 for sending cooling air, a heat sink 3 hit by the cooling air from the fan 2, and a heat connecting the heat generating component and the heat sink 3. It consists of a pipe 4.

As shown in FIG. 1, the fan 2 is arranged in a casing 5 and an eccentric position in the casing 5, and is rotationally driven in the direction of arrow A in the figure by a motor (not shown) or the like. And an impeller 6. The fan 2 is a centrifugal fan (also referred to as a sirocco fan) that sucks air from one or both of the axial directions of the impeller 6 and exhausts it in a tangential direction (centrifugal direction) when the impeller 6 rotates. A supply port 9 to be described later is provided on the outer peripheral portion of the impeller 6.
In the space inside the casing 3 constituted by the side wall and the upper and lower surface covers provided except for the one side where there is a vent, there is an air passage 7 whose radial width gradually increases from the upstream side to the downstream side. . The fan 2 is configured such that the air compressed on the downstream side having a narrow width is widened on the upstream side (hereinafter, referred to as an impeller 6 and a casing 5 on the downstream side so as to match the increase in the flow rate of the wind). Part of 7 is narrowed part 7a
A part of the ventilation passage 7 constituted by the impeller 6 and the casing 5 on the upstream side is referred to as a wide portion 7a for description. ), Air is exhausted as cooling air to increase the static pressure.

As shown in FIGS. 1 and 2, the fan 2 has an intake port 8 on the upper surface and the lower surface of the casing 5, specifically, on two surfaces orthogonal to the axis of the impeller 6, and the casing 5 A supply port 9 for supplying cooling air to the heat sink 3 is formed on one side surface of the heat sink 3.

As shown in FIGS. 3 and 4, the heat sink 3 is composed of a plurality of fins 10 arranged in parallel with each other with a predetermined interval. This fin 10
The surface is a metal material having a flat plate shape, such as an aluminum plate, and is arranged at an angle perpendicular to the longitudinal side surface of the heat sink 3 formed by arranging a plurality of fins 10. . The heat sink 3 is provided with a large number of passages 11 for allowing the cooling air from the fan 2 to pass between the adjacent fins 10 and guiding the cooling air to the outside of the above-mentioned notebook computer or the like.

The fin 10 may be a flat plate having a large number of small protrusions formed on the flat surface thereof in order to increase the contact area of the cooling air from the fan 2.

Further, the heat sink 3 is provided with a mounting portion 3a for mounting on the fin 2. The heat sink 3 is fixed to the fin 2 by a method such as screwing or soldering at the mounting portion 3a.

The heat pipe 4 constitutes a heat receiving portion for receiving the heat generated by the heat generating component and a heat transfer path for transferring the heat received by the heat receiving portion to the heat radiating portion. In this example, a heat receiving block 1 that contacts a heat generating component as a heat receiving portion as described later.
2 is provided, and the above-mentioned heat sink 3 is provided as a heat dissipation portion.

The heat receiving block 12 serving as a heat receiving portion is made of a metal having a high heat conductivity such as aluminum or its alloy, and is provided with a heat radiating sheet or heat transfer grease which enhances the heat conductivity directly or from a heat generating component. The heat-generating component is brought into close contact with it. One surface of the heat receiving block 12, specifically, a flat surface on which a groove to be described later is not formed is a contact surface for the heat generating component. The heat receiving block 12 is attached to a heat generating component by, for example, screwing, and a spring 13 is provided at the time of attachment so that the heat receiving block 12 can be biased in the direction of arrow B in FIG. It is possible to control the strength, that is, the contact pressure on the heat generating component. The heat receiving block 12 conducts the heat generated during the operation of the heat generating component from the portion in contact with the heat generating component as described above, and absorbs the heat generated in the heat generating component by this heat conduction.

As shown in FIGS. 1 and 4, one end of the heat pipe 4 is formed to have a larger diameter than the other part, and this one end contacts the other surface of the heat receiving block 12, that is, the heat generating component. It is fitted in a groove 13 formed on the surface opposite to the surface and is connected by an adhesive or the like. Heat pipe 4
By forming one end portion with a large diameter as described above and connecting it to the heat receiving block 12, it is possible to increase the contact area with the heat receiving block 12 that has absorbed the heat from the heat generating component. It is possible to efficiently receive heat from the. The heat pipe 4 is the heat receiving block 1.
It is also possible to form a hole in 2 and insert it into this hole to connect.

The other end of the heat pipe 4 is connected to the heat sink 3, which is a heat radiating section, by penetrating the fin 10 at the other end. In the heat dissipation device 1,
With such a structure, the cooling air from the fan 2 directly hits the heat pipe 4 in addition to the fins 10, so that the heat dissipation is further enhanced. In the heat dissipation device 1, the heat pipe 4 is connected to the fin 1 in this example.
Although it is connected to the heat sink 3 by penetrating it through 0, the heat pipe 4 is attached to one of the side surfaces of the heat sink 3 so as to be in contact with all the fins 10 arranged, and a plurality of fins 10 are provided on the heat pipe 3. They may be connected in a state in which they are arranged.

In the heat dissipation device 1 described above, the fan 2
1, and an exhaust unit for exhausting cooling air provided in a main body device (for example, a notebook computer) such as an information processing device in which the heat dissipation device 1 is disposed, for example, a virtual dashed line in FIG. In the space between the discharge part X shown by
In this space, the heat sink 3 is provided with a flow path 11 that is inclined with respect to the direction orthogonal to both the supply port 9 and the discharge portion X in this example. The inclination of the flow passage 11 is such that the flow passage 11 formed by the flat fins 10 is formed.
Of the cooling air, that is, the opening of the cooling air, that is, the opening 11b on the outlet X side, compared to the opening of the cooling air on the fan 2 side.
Is inclined so as to be positioned closer to the wide portion 7b of the fan 2. In the heat dissipation device 1, since the fins 10 are arranged at an angle orthogonal to the side surface in the longitudinal direction of the heat sink 3, the narrow portion is narrower than the end surface of the heat sink 3 located on the wide portion 7b side of the fan 2. By arranging the heat sink 3 itself so that the end face located on the 7a side is separated from the fan 2, the inclined flow passage 11 is formed as described above. In the heat dissipation device 1, the fan 2 is provided with a cover member 15 that covers the upper surface of the space in which the heat sink 3 is arranged.
Is attached to.

In the heat dissipation device 1, as described above, the heat sink 3 is disposed so as to be inclined, and the flow path 11 constituted by the fins 10 has an inclination of a predetermined angle in the present embodiment. The flow path 11 constituted by the fins 10 is inclined by 5 ° to 6 ° with respect to the side flat surface 3b located on the side of the wide portion 7b of the casing 3 that determines the exhaust direction, so that the heat dissipation efficiency is improved. The side flat surface 3b of the casing 3 in this example is a part of the side wall of the casing 3 on the wide portion 7b side, and is a flat plate portion provided at an angle orthogonal to both the supply port 9 and the discharge portion X (see FIG. 1), but the side plane 3b does not necessarily have to be orthogonal to both the supply port 9 and the discharge part X.
This is because, in the heat dissipation device 1, the flow path 11 having an inclination is provided in the space between the supply port 9 through which the cooling air from the fan 2 passes and the discharge portion X, so that the space between the fan 2 and the heat sink 3 is provided. It is considered that a turbulent flow is generated in the air flow, and the turbulent flow reduces the resistance to the cooling air passing through the space including the flow path 11 and improves the passage of the cooling air, thereby improving the heat dissipation efficiency. In order to generate such a turbulent flow of the cooling air, it is also effective to wire the fins 10 forming the heat sink 3 with a wire.

Further, it is considered that the cooling air supplied from the fan 2 is supplied from the supply port 9 to the heat sink 3 in a direction along the rotation direction of the impeller 6. Therefore, the flow path 1 inclined so as to have a predetermined angle
By providing 1 in the space between the supply port 9 and the discharge part X,
The fact that the cooling air in the wind direction as described above easily hits the fins 10 forming the flow path 11 is also considered to be a factor that improves the heat dissipation efficiency in the heat dissipation device 1.

Further, the impeller 6 is arranged at an eccentric position such that the narrow portion 7a and the wide portion 7b are formed between the impeller 6 and the casing 5, and the air is taken in from the axial direction and exhausted in the tangential direction. In the fan 2, the cooling air having a non-uniform air volume and air pressure is discharged on the narrow portion 7a side and the wide portion 7b side of the supply port 9. Specifically, as shown in FIG. 5, in the fan 2 of the heat dissipation device 1, cooling is performed with a large air volume and a high air pressure from the wide portion side of the supply port 9 compared to the narrow portion side. The wind is supplied to the heat sink 3 from the supply port 9. The size of the arrow in FIG. 5 indicates the magnitude of the air volume and the air pressure. By providing the flow path 11 inclined so as to have a predetermined angle in the space between the supply port 9 and the discharge portion X, as described above, the cooling air supplied with the non-uniform air volume and the air pressure is uniformly heat sink. 3 is supplied to the entire heat dissipation device 3, which is also considered as one of the factors that improve the heat dissipation efficiency in the heat dissipation device 1.

The heat dissipation device 1 having improved heat dissipation efficiency due to such reasons can improve the heat dissipation efficiency without enlarging the outer dimensions of the device itself by enlarging the fan. Therefore, it is suitable for being installed in a portable information processing device such as a laptop computer whose size and thickness have been reduced, and can dissipate the heat of heat-generating components with good heat dissipation efficiency. Even a high-performance, high-performance CPU or the like that emits high heat can prevent malfunction or failure due to overheating.

In the heat dissipation device 1 described above, the heat sink 3 is tilted so that the space between the supply port 9 and the discharge portion X is provided with the inclined flow path 11 having a predetermined angle. The present invention is not limited to such a configuration. In the present invention, as shown in FIG.
The fins 10 are arranged in advance so as to be inclined at a predetermined angle with respect to the longitudinal side surface of the heat sink 3, and the heat sink 3 is straightened, specifically, the supply port 9 when the fan 2 has the shape shown in FIG. It may be arranged in parallel with and the flow path 11 inclined to the space between the supply port 9 and the discharge part X may be formed.

In each of the above examples, the flow channel 11
Although the opening 11b is inclined such that the opening 11b is located closer to the wide portion 7b of the fan 2 than the opening 11a, the opening 1b in the heat dissipation device 1 is opposite.
The inclination may be such that the opening 11b is located closer to the narrow portion 7a of the fan 2 than the opening 1a. Specifically, in the heat dissipation device 1, the heat sink 3 in which the fins 10 are arranged at an angle orthogonal to the side portion in the longitudinal direction of the heat sink 3 shown in FIG. 7 is located on the narrow portion 7 a side of the fan 2. As compared with the end face, the end face located on the wide portion 7b side may be arranged so as to be separated from the fan 2 so as to form the flow passage 11 having the above-described inclination. The fins 10 shown in advance are arranged so as to be inclined with respect to the longitudinal side surface of the heat sink 3 so as to have a predetermined angle, and the heat sink 3 is arranged straight, that is, in parallel with the supply port 9, and thus the flow having the above-described inclination is obtained. It may be the path 11.

In the heat dissipating device 1 also in each of the above-mentioned configurations, since the inclined flow path 11 is provided in the space between the supply port 9 of the fan 2 and the discharge part X, the device itself is enlarged by increasing the size of the fan or the like. The heat radiation efficiency can be improved without increasing the outer dimensions of the.

In the heat dissipation device 1 described above, the heat pipe 4 is used to transfer the heat generated in the heat generating component from the heat receiving block 12 to the heat sink 3.
The present invention is not limited to such a configuration, and the heat generating component and the heat receiving block 12 that absorbs heat from the heat generating component are arranged immediately below the heat sink 3 and the heat receiving block 12 is provided.
It is also possible to have a structure in which heat is directly conducted to the heat sink 3.

Further, in the above-mentioned example, in order to express the inclination of the flow passage 11, the opening 11b is called closer to the wide portion 7b of the fan 2 than the opening 11a. Although the reference is set to the side flat surface 3b of the casing 3 in the description, other points may be used as the reference depending on the configuration of the heat dissipation device 1. For example, the flow path 11 may be provided so as to be inclined at a predetermined angle with respect to a plane orthogonal to the horizontal plane including the discharge part X, and in addition to this, the supply port 9 of the fan 2 may be included. The inclination reference is set according to the configuration of the heat dissipation device 1, such as a horizontal plane or a horizontal plane including a side wall of the casing 5 on the side of the wide portion 7b.

The above-described heat dissipation device 1 is arranged in an information processing device such as a notebook computer for cooling a heat generating component mounted in the information processing device, for example, a CPU. Hereinafter, an example in which the heat dissipation device 1 is provided in the notebook computer 21 will be described.

As shown in FIGS. 9 and 10, the notebook computer 21 has a display unit 23 and a keyboard unit 2 which are attached to the main body 22 of the apparatus via a hinge so as to be openable and closable.
4, a pointing device 25 such as a slice pad is provided, and in addition to these, it has the same configuration as an ordinary notebook personal computer, although not shown.
The notebook computer 21 includes a housing 2 that constitutes the device body 22.
A motherboard 28 on which the CPU 28 is mounted is arranged in the CPU 6. And, to this CPU 28, the CPU 28
A heat dissipation device 1 for dissipating heat generated during the operation of is attached.

As shown in FIG. 10, the notebook computer 21 is provided with an exhaust port 29 for exhausting the cooling air from the heat dissipation device 1 to the outside of the housing 26. In the notebook computer 21, the heat dissipation device 1 is provided adjacent to the exhaust port 29. The heat dissipation device 1 is arranged on the motherboard 28 so that the heat sink 3, which is a heat dissipation unit, is located in the space between the exhaust port 29 of the notebook computer 21 and the fan 2 forming the heat dissipation device 1. It And
In the heat dissipation device 1 arranged in such a position, a heat sink is arranged so that the flow path 11 tilted at a predetermined angle is formed by the fins 10.

By disposing the heat dissipation device 1 as described above, the notebook computer 21 has a high heat dissipation efficiency even if the high performance and high performance CPU 27 is mounted.
Since the heat generated in 7 can be dissipated, the CPU 2 due to overheating
It is possible to prevent malfunctions and failures of 7.

In the notebook computer 21 described above, the case where the heat-generating component which is the object of forced air cooling by the heat dissipation device 1 is the CPU 28 has been described, but the invention is not limited to this and other CPU 28 can be used. Needless to say, a wide range of general electronic components that generate heat by being energized and operated may be subjected to forced air cooling with the heat dissipation device 1 attached.

Further, it is needless to say that the present invention is not limited to the above-mentioned embodiment and can be appropriately modified within a range not departing from the gist thereof.

[0038]

As described above in detail, according to the heat dissipation device of the present invention, the heat dissipation efficiency can be improved without increasing the external size of the device itself by increasing the size of the fan. . Further, the information processing apparatus according to the present invention is a high-performance, high-performance CPU or the like that dissipates the heat of the heat-generating component with high heat dissipation efficiency by disposing the heat dissipation device as described above, and emits high heat. Also, it is possible to prevent adverse effects such as malfunction and failure due to overheating.

[Brief description of drawings]

FIG. 1 is a plan view of a heat dissipation device according to the present invention.

FIG. 2 is a bottom view of the heat dissipation device.

FIG. 3 is a side view of the heat dissipation device.

FIG. 4 is a plan view of a heat receiving block and a heat sink connected by a heat pipe.

FIG. 5 is a diagram schematically showing a distribution state of the air volume and the air pressure of the cooling air supplied from the fan to the heat sink.

FIG. 6 is a diagram for explaining a positional relationship between a fan and a heat sink of a heat dissipation device according to another configuration.

FIG. 7 is a diagram for explaining a positional relationship between a fan and a heat sink of a heat dissipation device according to still another configuration.

FIG. 8 is a diagram for explaining a positional relationship between a fan and a heat sink of a heat dissipation device according to still another configuration.

FIG. 9 is a perspective view showing a laptop personal computer, which is an example of an information processing apparatus according to the present invention, with a part thereof cut away.

FIG. 10 is a diagram for explaining an arrangement position of a heat dissipation device in the notebook personal computer.

[Explanation of symbols]

1 heat dissipation device, 2 fan, 3 heat sink, 4 heat pipe, 5 casing, 6 impeller, 7 ventilation passage, 8 intake port, 9 supply port, 10 fins, 11 flow path, 12 heat receiving block, 21 notebook computer, 26
Case, 27 CPU, 29 Exhaust port

Continuation of front page (51) Int.Cl. ⁷ Identification code FI theme code (reference) G06F 1/00 360C

Claims (6)

[Claims] 1. A heat radiating device for radiating heat generated from a heat-generating component that generates heat during operation by forced air cooling and discharging cooling air during forced air cooling to the outside of the housing in which the heat-generating component is disposed, in the axial direction. And a heat sink having a plurality of fins arranged at a predetermined interval and forming a plurality of flow paths for the cooling air, The heat sink is arranged in the space between the supply port for the cooling air from the fan and the discharge portion for discharging the cooling air to the outside of the housing so that the flow path is inclined at a predetermined angle. Characteristic heat dissipation device. 2. The fins are arranged at an angle orthogonal to a side surface of the heat sink, and the fins are arranged between a supply port for the cooling air from the fan and an exhaust portion for exhausting the cooling air to the outside of the housing. The heat dissipation device according to claim 1, wherein the heat dissipation device is disposed so as to be inclined in a space, and the flow path is inclined at a predetermined angle. 3. The fins are arranged at a predetermined angle with respect to the side surface of the heat sink, and a supply port for cooling air from the fan and an exhaust portion for exhausting the cooling air to the outside of the housing are provided. The heat dissipating device according to claim 1, wherein the heat dissipating device is disposed in a space therebetween in parallel with the supply port or the discharge part, and the flow path is inclined at a predetermined angle. 4. A heat radiating device for radiating heat generated by a heat-generating component that generates heat during operation by forced air cooling and discharging cooling air during forced air cooling to the outside of a housing in which the heat-generating component is disposed, in a casing. An impeller is disposed in the fan, and a fan that sucks air in the axial direction of the impeller, exhausts it in a tangential direction, and sends cooling air, and a plurality of flow paths for the cooling air that are arranged at a predetermined interval. A heat sink having a plurality of fins to be formed, wherein the heat sink is arranged such that the flow path is inclined at a predetermined angle with respect to a side plane of the casing. 5. The heat dissipation device according to claim 4, wherein the predetermined angle is 5 ° to 6 °. 6. An information processing apparatus in which a heat dissipation device is attached to a heat generating component that generates heat during operation inside a housing, wherein the heat dissipation device draws air in an axial direction, exhausts in a tangential direction, and blows cooling air. And a heat sink having a plurality of fins arranged at predetermined intervals to form a plurality of flow paths for the cooling air, wherein the heat sink includes a cooling air supply port from the fan and the cooling air. An information processing device, characterized in that the flow path is arranged so as to be inclined at a predetermined angle in a space between a discharge part for discharging wind to the outside of the housing.