JP2016197665A - Electronic apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic apparatus capable of increasing size of a fin while suppressing an increase in the size of an electronic apparatus and effectively utilizing airflow in a passage cover.SOLUTION: A plurality of fins 22 of a heat sink 20 are inclined to both in an extension direction of a first air passage S1 and in a direction in which the fins 22 are aligned. A right wall part 15a of a passage cover 15 is also inclined to both in the extension direction of the first air passage S1 and in the direction in which the fins 22 are aligned in the same manner of the fins 22.SELECTED DRAWING: Figure 6

Description

  The present invention relates to an electronic device that cools an integrated circuit using a heat sink and a cooling fan.

  In an electronic device such as a game device or a personal computer, in order to cool an integrated circuit such as a CPU (Central Processing Unit) or a GPU (Graphics Processing Unit), a heat sink that receives heat from the integrated circuit, a cooling fan that sends air to the heat sink, May be used.

  The electronic devices disclosed in Patent Documents 1 and 2 have an air flow path extending backward from the cooling fan. This air flow path is constituted by a cover disposed in the housing (hereinafter, this cover is referred to as a flow path cover). A heat sink is disposed inside the flow path cover. The air that has passed through the heat sink is discharged to the outside through an exhaust port formed on the back surface of the electronic device.

  In patent document 1, the several fin with which the heat sink is provided is located in a line with the left-right direction. Each fin is arrange | positioned along the front-back direction. That is, each fin is disposed along the extending direction of the air flow path. The electronic device of Patent Document 2 has a plurality of heat sinks. In one heat sink, the plurality of fins are arranged at intervals in a direction inclined in both the front-rear direction and the left-right direction. The remaining heat sink fins are arranged side by side. Also in patent document 2, like patent document 1, all the fins are arrange | positioned along the front-back direction (namely, extending direction of an air flow path).

International Publication No. 2014/185311 US Patent Application Publication No. 2011/226451

  In order to improve the cooling function of the heat sink, it is effective to increase the size of the fins. However, in the electronic devices of Patent Documents 1 and 2, the fins are arranged along the front-rear direction. Therefore, enlarging the size of the fin causes an increase in the size of the electronic device in the front-rear direction.

  Further, if an extra space is formed between the side wall portion of the flow path cover covering the heat sink and the heat sink, an air flow that does not contribute to cooling of the heat sink is generated in the space.

  Furthermore, in the electronic devices of Patent Documents 1 and 2, the power supply unit is arranged behind the flow path cover covering the heat sink, and the case of the power supply unit constitutes an air flow path that follows the air flow path of the flow path cover. Yes. The case of the power supply unit is larger in the left-right direction than the flow path cover. However, since the fins of the heat sink are arranged along the front-rear direction, the air that has passed through the heat sink hardly spreads in the left-right direction within the case of the power supply unit.

  A first object of the present invention is to provide an electronic device that can increase the size of the fins while suppressing an increase in the size of the electronic device and can effectively use the air flow in the flow path cover.

  The second object of the present invention is to increase the size of the fin while suppressing an increase in the size of the electronic device, and to send air to the entire air flow path formed downstream of the flow path cover. It is to provide an electronic device that can be used.

  An electronic device according to the present invention includes a cooling fan, a first air flow path extending from the cooling fan in a first direction, and a plurality of fins arranged in the first air flow path. A plurality of fins arranged in a second direction intersecting the first direction, a heat sink covering the heat sink, constituting the first air flow path, And a flow path cover having a first side wall portion positioned in the second direction. The plurality of fins of the heat sink are inclined with respect to both the first direction and the second direction, and the first side wall portion of the flow path cover is disposed along the plurality of fins, It is inclined with respect to both the first direction and the second direction.

  According to this electronic apparatus, the size (length) of the fins of the heat sink can be increased without increasing the length of the first air flow path. As a result, the heat sink cooling function can be improved without increasing the size of the electronic device. Moreover, compared with the case where the 1st side wall part of a flow path cover is formed along a 1st direction, the space formed between the 1st side wall part of a flow path cover and a fin can be made small. As a result, the air flow formed by the cooling fan can be used effectively.

  Another electronic device according to the present invention includes a cooling fan, a first air passage extending from the cooling fan in a first direction, and a plurality of fins disposed in the first air passage. A heat sink in which the plurality of fins are arranged in a second direction intersecting the first direction, and a flow path that covers the heat sink and constitutes the first air flow path A second air that is positioned in the first direction with respect to the cover and the first air flow path and is larger toward the one side in the second direction than the first air flow path And a flow path. Each of the plurality of fins has a first edge located on the cooling fan side and a second edge located on the opposite side of the first edge, and the plurality of fins Each of which is inclined with respect to both the first direction and the second direction such that the second edge is located on the one side in the second direction with respect to the first edge. doing.

  According to this electronic apparatus, the size (length) of the fins of the heat sink can be increased without increasing the length of the first air flow path. As a result, the heat sink cooling function can be improved without increasing the size of the electronic device. Each of the plurality of fins is inclined with respect to both the first direction and the second direction so that the second edge is located on one side in the second direction with respect to the first edge. ing. Therefore, the air that has passed through the first air flow path is likely to spread to a region on one side of the second air flow path.

It is a perspective view which faces the rear side of the electronic device which concerns on one Embodiment of this invention. It is a disassembled perspective view which faces the rear side of the electronic device shown in FIG. It is a disassembled perspective view of the main body of the electronic device shown in FIG. It is a figure which shows a heat sink. The figure (a) is a perspective view, and the figure (b) is a figure which faces a heat sink from the lower side. It is a figure which faces the lower side of the main body of the electronic device shown in FIG. It is a figure which shows the positional relationship of a flow-path cover, a heat sink, and a cooling fan.

  Hereinafter, an embodiment of the present invention will be described. FIG. 1 is a perspective view of a rear side of an electronic device 1 according to an embodiment of the present invention. FIG. 2 is an exploded perspective view facing the rear side of the electronic device 1. FIG. 3 is an exploded perspective view of the main body 10 of the electronic apparatus 1. FIG. 4 is a view showing the heat sink 20. 4A is a perspective view, and FIG. 4B is a view facing the lower side of the heat sink 20. FIG. 5 is a view of the lower side of the main body 10 of the electronic device 1. FIG. 6 is a diagram showing the air flow paths S0, S1, and S2 formed inside the flow path cover 15 and the case 41 of the power supply unit 40. FIG.

  In the following description, Y1 and Y2 shown in these drawings are the forward direction and the backward direction, respectively, and X1 and X2 are the rightward direction and the leftward direction, respectively. Z1 and Z2 are respectively upward and downward.

  The electronic device 1 is, for example, a game device, a personal computer, an audio / visual device, or the like. The present invention may be applied to other electronic devices.

  As shown in FIG. 2, the electronic device 1 has a main body 10. The main body 10 has a circuit board (not shown) on which an integrated circuit that controls the entire electronic device 1 is mounted. Further, as shown in FIG. 3, the main body 10 includes a heat sink 20 for cooling the integrated circuit, a cooling fan 30 for sending air to the heat sink 20, a power supply unit 40 for generating operating power for the integrated circuit, and the like. doing. Further, the main body 10 has a body frame 11, and the circuit board, the heat sink 20, the cooling fan 30, and the power supply unit 40 are attached to the body frame 11. The body frame 11 is molded from resin, for example. The main body 10 may include a recording medium drive device 17 and a hard disk device. As shown in FIG. 5, the cooling fan 30 and the drive device 17 are disposed in the front portion of the main body 10 and are adjacent to each other in the left-right direction. The power supply unit 40 is disposed behind the cooling fan 30 and the drive device 17. The layout of the device included in the main body 10 is not limited to that shown in FIG. 5 and may be changed as appropriate.

  As illustrated in FIG. 2, the electronic device 1 includes a first exterior cover 12 and a second exterior cover 13. The first exterior cover 12 covers the upper side of the main body 10 and constitutes the upper surface of the electronic device 1. The second exterior cover 13 covers the lower side of the main body 10 and constitutes the lower surface of the electronic device 1. The structure of the exterior member of the electronic device is not limited to this. For example, the electronic device may include two housing halves that can be combined in the vertical direction, and components such as a circuit board and a heat sink may be attached to one housing half.

  As shown in FIG. 3, the cooling fan 30 is arranged so that the center line of rotation thereof is directed in the vertical direction. The cooling fan 30 is attached to the body frame 11. For example, a mounting plate 30 a provided on the top of the cooling fan 30 is attached to the body frame 11. The mounting structure of the cooling fan 30 is not particularly limited. For example, the cooling fan 30 may be attached to the chassis 16 described later.

  A heat sink 20 is disposed behind the cooling fan 30 (see FIG. 5). As shown in FIG. 4, the heat sink 20 includes a heat receiving block 21 and a plurality of fins 22 provided on one surface (the lower surface in the example of this specification) of the heat receiving block 21. The plurality of fins 22 are arranged at intervals. The interval between the fins 22 may be constant in the direction in which the fins 22 are arranged, or may be different. As will be described later, each fin 22 is arranged along a direction inclined with respect to the direction in which the fins 22 are arranged (in the example of the present specification, the left-right direction). The angle of each fin 22 is preferably constant in the direction in which the fins 22 are arranged, but may vary in the direction in which the fins 22 are arranged. The fins 22 may be formed integrally with the heat receiving block 21 or may be attached to the heat receiving block 21 with solder, for example. An integrated circuit to be cooled is thermally connected to the heat receiving block 21. In one example, the integrated circuit is disposed on the other surface (the upper surface in the example of the present specification) of the heat receiving block 21, and the heat receiving block 21 is directly thermally connected to the integrated circuit. In another example, a part of the heat transfer member such as a heat pipe may be connected to the heat receiving block 21 and the other part of the heat transfer member may be attached to the integrated circuit.

  The electronic device 1 has a plate-shaped chassis 16 as shown in FIG. The chassis 16 is formed of a metal plate material. The heat sink 20 is supported by the chassis 16. Specifically, openings having a shape corresponding to the plurality of fins 22 are formed in the chassis 16, and the plurality of fins 22 are fitted into the openings of the chassis 16 from above. And the outer peripheral part 21a (refer FIG. 4) of the heat receiving block 21 is supported by the edge of the opening of the chassis 16. FIG. A circuit board is disposed on the upper side of the chassis 16. The integrated circuit mounted on the circuit board is thermally connected to the heat receiving block 21 directly or via the above-described heat transfer member. The support structure of the heat sink 20 is not limited to the example described here. For example, the heat sink 20 may be attached to a circuit board or a member disposed on the opposite side of the heat sink across the circuit board.

  As shown in FIG. 6, the electronic device 1 has a first air flow path S <b> 1 extending from the cooling fan 30. The heat sink 20 described above is disposed in the first air flow path S1. The first air flow path S <b> 1 is configured by a flow path cover 15 that covers the heat sink 20. That is, the first air flow path S1 is partitioned from the outside by the flow path cover 15. As shown in FIG. 3, in the example shown in the present specification, the flow path cover 15 is disposed below the heat sink 20 and the chassis 16 and covers the fins 22 of the heat sink 20. The fins 22 of the heat sink 20 are disposed inside the flow path cover 15. The upper side of the flow path cover 15 is open, and the upper side of the flow path cover 15 is closed by the chassis 16. Therefore, the first air flow path S1 is configured as a flow path partitioned from the outside by the flow path cover 15 and the chassis 16.

  As shown in FIG. 3, the flow path cover 15 is molded integrally with the body frame 11, for example. The flow path cover 15 may be molded separately from the body frame 11 and attached to the body frame 11 or the chassis 16.

  The plurality of fins 22 included in the heat sink 20 are arranged at intervals in a direction crossing the extending direction of the first air flow path S1. The extending direction of the first air flow path S <b> 1 is a direction in which the downstream end opening (vent) 15 f of the flow path cover 15 is located with respect to the cooling fan 30. Specifically, as shown in FIGS. 3 and 6, the opening 15 f is located behind the cooling fan 30. Therefore, the extending direction of the first air flow path S1 is the front-rear direction. That is, the first air flow path S <b> 1 extends rearward from the cooling fan 30. The fins 22 of the heat sink 20 are arranged at intervals in a direction orthogonal to the extending direction of the first air flow path S1. Specifically, the fins 22 are arranged at intervals in the left-right direction. The extending direction of the first air flow path S1 corresponds to the “first direction” in the claims, and the direction in which the fins 22 are arranged corresponds to the “second direction” in the claims.

  The front edge 22a and the rear edge 22b of each fin 22 are positioned on the straight lines L1 and L2, respectively (see FIG. 4). The direction along the straight lines L1 and L2 is the direction in which the fins 22 are arranged. In the example described in this specification, the straight lines L1 and L2 are along the left-right direction. The front edge 22a is an edge on the cooling fan 30 side, and the rear edge 22b is an edge opposite to the front edge 22a.

  As shown in FIG. 6, each fin 22 has a direction in which the first air flow path S <b> 1 extends (the front-rear direction in the example of the present specification) and the direction in which the fins 22 are aligned (the left-right direction in the example of the present specification). Inclined with respect to both. By doing so, the size (length) of the fins 22 can be increased without increasing the length of the first air flow path S1. As a result, the cooling function of the heat sink 20 can be improved without increasing the size of the electronic device 1. The extending direction of the first air flow path S1 may be the left-right direction of the electronic device. In this case, the fins 22 may be arranged in the front-rear direction of the electronic device.

  The plurality of fins 22 all have the same size. Therefore, the plurality of fins 22 are parallelograms as a whole in plan view. Moreover, as shown in FIG. 4, the heat receiving block 21 is also a parallelogram in plan view. That is, the heat receiving block 21 has a right edge and a left edge parallel to each other, and a front edge and a rear edge parallel to each other. According to this shape of the heat receiving block 21, the manufacturing cost of the heat receiving block 21 can be reduced. That is, the heat receiving block 21 can be obtained by manufacturing a processed product that is elongated in the left-right direction by, for example, extrusion, and then cutting the processed product obliquely at regular intervals. According to this method, the number of machining steps can be reduced, and the amount of material cut out by machining can be reduced. The shape of the heat receiving block 21 is not limited to this. For example, the plurality of fins 22 may be parallelograms as a whole in plan view, while the heat receiving block 21 may be rectangular.

  As shown in FIG. 6, the flow path cover 15 has a right wall portion 15 a that is positioned in the right direction with respect to the fins 22 of the heat sink 20. The right wall portion 15a is disposed along the fin 22 and is inclined with respect to both the front-rear direction and the left-right direction. Here, “the right wall portion 15a is disposed along the fin 22” means that the right wall portion 15a is inclined in the same direction as the fin 22 with respect to the front-rear direction (the extending direction of the first air flow path S1). It means that As will be described later, in the example of the present specification, the right wall portion 15a is inclined so that the rear end thereof is positioned in the right direction with respect to the front end, like the fins 22. A space where no other components are arranged is formed between the fin 22 facing the right wall 15a and the right wall 15a among the plurality of fins 22. By tilting the right wall portion 15a, for example, the space between the right wall portion 15a and the fins 22 can be made smaller than when the right wall portion 15a is formed along the front-rear direction. As a result, the air flow formed by the cooling fan 30 can be used effectively.

  As shown in FIG. 6, the flow path cover 15 has a left wall portion 15 b located on the opposite side of the right wall portion 15 a with the fins 22 of the heat sink 20 interposed therebetween. The flow path cover 15 is located below the heat sink 20 and has a wall portion 15g that connects the right wall portion 15a and the left wall portion 15b (see FIG. 3). The distance between the left wall portion 15b and the right wall portion 15a in the left-right direction gradually increases toward the rear side, that is, toward the second air flow path S2 described later. Thereby, the flow path width (space | interval of the right wall part 15a and the left wall part 15b) in the downstream end (rear end) of 1st air flow path S1 is securable.

  As shown in FIG. 6, the angle between the straight line L3 along the front-rear direction and the left wall 15b is smaller than the angle between the straight line L3 along the front-rear direction and the fins 22. Between the fin 22 and the left wall portion 15b facing the left wall portion 15b, a space where no other parts are arranged is formed. The gap G2 between the fin 22 and the left wall portion 15b is gradually reduced toward the cooling fan 30. Therefore, it is possible to reduce the air flow between the left wall portion 15b and the fins 22, that is, the air flow having little contribution to cooling. In the example of this specification, the left wall part 15b is arrange | positioned along the extending | stretching direction of 1st air flow path S1, ie, the front-back direction. The arrangement of the left wall portion 15b is not necessarily limited to this. For example, the left wall portion 15b may be inclined with respect to both the front-rear direction and the left-right direction, similarly to the right wall portion 15a.

  As described above, the cooling fan 30 is disposed such that the center line of rotation thereof is directed in the vertical direction. The cooling fan 30 is configured such that the fin 31 rotates counterclockwise. In this case, the fin 31 moves in the direction approaching the first air flow path S1 on the right side with respect to the center of the cooling fan 30, whereas the fin 31 moves on the left side with respect to the center of the cooling fan 30. Move away from S1. Therefore, the air flow in the right region in the first air flow path S1 (the air flow indicated by Rf in FIG. 6) is the air flow in the left region in the first air flow path S1 (Lf in FIG. 6). Faster than the airflow shown). As described above, the right wall portion 15 a of the two wall portions 15 a and 15 b of the flow path cover 15 is inclined according to the fins 22 of the heat sink 20. For this reason, the heat sink 20 can be cooled by effectively using the air flow Rf having a fast flow.

  When the air flow in the right region in the first air flow path S1 is fast as described above, the integrated circuit in contact with the heat receiving block 21 of the heat sink 20 has two wall portions 15a and 15b as shown in FIG. Of these, it is preferable to be disposed closer to the right wall portion 15a. By doing so, the integrated circuit can be cooled more efficiently.

  The flow path cover 15 also covers the cooling fan 30. Specifically, as shown in FIG. 6, the flow path cover 15 has a peripheral wall portion 15 c that extends along the circumferential direction of the cooling fan 30 and surrounds the outer periphery of the fin 31 of the cooling fan 30. The left end portion of the peripheral wall portion 15c is connected to the above-described left wall portion 15b. The right end of the peripheral wall portion 15c is connected to the right wall portion 15a described above. The distance from the edge 31a of the fin 31 to the peripheral wall part 15c becomes large as it approaches the right wall part 15a. That is, an air flow path S0 that gradually increases toward the first air flow path S1 is formed between the fin 31 and the peripheral wall portion 15c.

  The flow path cover 15 is not necessarily molded integrally. For example, the portion covering the cooling fan 30 and the portion covering the heat sink 20 may be molded separately. Moreover, the right wall part 15a and the left wall part 15b which comprise 1st air flow path S1 may be shape | molded separately.

  As shown in FIGS. 3 and 5, the flow path cover 15 has a wall portion 15d that covers the air flow path S0. This wall portion 15 d has an opening 15 e at the position of the cooling fan 30. When the cooling fan 30 rotates, external air is sucked into the flow path cover 15 from the opening 15e. And it flows into 1st air flow path S1 through air flow path S0. As shown in FIG. 1, the electronic device 1 has an air inlet 10c on its side (in FIG. 1, an arrow F1 indicates the flow of air sucked from the air inlet 10c). As shown in FIG. 5, the air sucked from the air inlet 10 c enters the opening 15 e of the flow path cover 15 between the main body 10 and the first outer cover 12 and between the main body 10 and the second outer cover 13. It flows toward. Then, the air is sucked into the flow path cover 15 from the opening 15e (the arrow F2 in FIG. 5 indicates the flow of air sucked from the opening 15e).

  As shown in FIG. 6, a second air flow path S2 is provided behind the first air flow path S1. In the example of the present specification, the power supply unit 40 is disposed behind the flow path cover 15. The power supply unit 40 includes a power supply circuit 42 and a case 41 that houses the power supply circuit 42. The second air flow path S2 is configured by the case 41. As described above, the flow path cover 15 opens rearward. The case 41 has a vent 41b in its front wall 41a. An opening (vent hole) 15 f of the flow path cover 15 is connected to the vent hole 41 b of the case 41.

  As shown in FIG. 3, the case 41 has an exhaust port on the rear wall 41c. The exhaust port is formed in substantially the entire region of the rear wall portion 41 c of the case 41. When the case 41 is attached to the body frame 11 of the main body 10, the rear wall portion 11 b of the body frame 11 is located further rearward of the exhaust port of the case 41. An exhaust port is also formed in the rear wall portion 11 b of the body frame 11. Air discharged from the exhaust port of the case 41 is discharged from the exhaust port of the body frame 11 to the outside of the electronic device 1 (in FIG. 1 and FIG. 3, an arrow F3 indicates the flow of air discharged from the body frame 11. ). Louvers 11d and 41d for preventing the inside of the case 41 from being seen from the outside are formed at the exhaust port formed in the rear wall portion 11b of the body frame 11 and the exhaust port of the case 41, respectively.

  As shown in FIG. 6, the second air flow path S2 (case 41) is larger on one side in the left-right direction than the first air flow path S1 (flow path cover 15). That is, the width of the second air flow path S2 in the left-right direction (the width of the case 41) is the width of the first air flow path S1 in the left-right direction (the rear ends of the right wall portion 15a and the left wall portion 15b of the flow path cover 15). Larger than the interval). And 2nd air flow path S2 has area | region R1 located in the one side in the left-right direction rather than the rearmost part of 1st air flow path S1. The fin 22 of the heat sink 20 is inclined so that the rear edge 22b is located on the one side in the left-right direction with respect to the front edge 22a. Thereby, an air flow becomes easy to spread in area | region R1 of 2nd air flow path S2.

  In the example of the present specification, the second air flow path S2 is larger on the right side than the first air flow path S1. That is, the second air flow path S2 has a region R1 that is located to the right of the last part of the first air flow path S1. The fin 22 is inclined so that the rear edge 22b is positioned on the right side of the front edge 22a. The right wall portion 15a of the flow path cover 15 is also inclined so that the rear end thereof is positioned to the right of the front end in accordance with the fins 22. On the other hand, the position of the left end of the second air flow path S2 in the left-right direction coincides with the left end of the rearmost portion of the first air flow path S1 in the left-right direction. That is, the left wall portion 41 e of the case 41 extends rearward from the left wall portion 15 b of the flow path cover 15.

  As shown in FIG. 6, the right wall portion 15 a is larger than the fins 22 and is inclined to the right. In other words, the angle between the straight line L3 and the fin 22 along the front-rear direction is smaller than the angle between the right wall portion 15a and the straight line L3. By doing so, air resistance due to the fins 22 can be reduced. In addition, the right wall portion 15a is inclined more greatly than the fins 22 so that air easily spreads to the right region in the case 41, that is, the region R1 of the second air flow path S2.

  As described above, the cooling fan 30 is configured so that the air flow Rf in the right region in the first air flow path S1 is faster than the air flow Lf in the left region in the first air flow path S1. It is configured. Therefore, since the fast air flow Rf passing through the right side of the first air flow path S1 spreads in the region R1 of the second air flow path S2, it is possible to effectively cool the components arranged in the region R1. .

  As described above, in the electronic device 1, the plurality of fins 22 of the heat sink 20 are inclined with respect to both the extending direction of the first air flow path S <b> 1 and the direction in which the fins 22 are arranged. By doing so, the size (length) of the fins 22 can be increased without increasing the length of the first air flow path S1. As a result, the cooling function of the heat sink 20 can be improved without increasing the size of the electronic device 1.

  Similarly to the fins 22, the right wall portion 15 a of the flow path cover 15 is also inclined with respect to both the extending direction of the first air flow path S <b> 1 and the direction in which the fins 22 are arranged. By doing so, the space between the right wall portion 15a and the fins 22 can be reduced. As a result, the air flow formed by the cooling fan 30 can be used effectively.

  The second air flow path S2 is larger toward the right side than the first air flow path S1. Each fin 22 of the heat sink 20 is inclined so that the rear edge 22b is located on the right side of the front edge 22a. The air flow easily spreads to the right region R1 in the second air flow path S2.

  The present invention is not limited to the embodiment described above, and various modifications may be made.

  For example, the second air flow path S2 may be larger on the left side than the first air flow path S1. In this case, preferably, the fin 22 is inclined so that the rear edge 22b is positioned to the left of the front edge 22a. Further, the left wall portion 15b of the flow path cover 15 is also preferably inclined so that the rear end thereof is positioned in the left direction with respect to the front end, like the fins 22.

  DESCRIPTION OF SYMBOLS 1 Electronic device, 10 Main body, 11 Body frame, 15 Flow path cover, 15a Right wall part, 15b Left wall part, 15c Perimeter wall part, 15d Wall part, 15e Opening, 15f Opening (ventilation hole), 16 Chassis, 17 Drive apparatus , 20 heat sink, 21 heat receiving block, 22 fin, 22a front edge of fin, 22b rear edge of fin, 30 cooling fan, 31 fin, 40 power supply unit, 41 case, 41a front wall, 41b vent, 41c rear wall 42 Power circuit.

Claims (8)

A cooling fan,
A first air flow path extending in a first direction from the cooling fan;
A heat sink having a plurality of fins arranged in the first air flow path, wherein the plurality of fins are arranged in a second direction intersecting the first direction;
A flow path cover that covers the heat sink, configures the first air flow path, and has a first side wall portion positioned in the second direction with respect to the plurality of fins,
The plurality of fins of the heat sink are inclined with respect to both the first direction and the second direction;
The electronic device, wherein the first side wall portion of the flow path cover is disposed along the plurality of fins and is inclined with respect to both the first direction and the second direction. The air flow in one area in the second direction in the first air flow path is more than the air flow in the other area in the second direction in the first air flow path. The cooling fan is configured to be faster,
The electronic device according to claim 1, wherein the first side wall portion of the flow path cover is a side wall portion disposed on the one side in the second direction with respect to the heat sink. Formed downstream of the first air flow path, positioned in the first direction with respect to the first air flow path, on one side in the second direction with respect to the first air flow path A second air flow path that is larger toward the
Each of the plurality of fins has a first edge located on the cooling fan side and a second edge located on the opposite side of the first edge,
The electronic device according to claim 1, wherein the second edge is located on the one side in the second direction with respect to the first edge. The electronic device according to claim 3, wherein the first side wall portion is inclined more than the plurality of fins toward the one side in the second direction. The first side wall portion of the flow path cover further includes a second side wall portion located on the opposite side across the plurality of fins,
The gap between the fins facing the second side wall portion of the plurality of fins and the second side wall portion is gradually reduced toward the cooling fan. 1. The electronic device according to 1. An angle between each of the plurality of fins and the first direction is smaller than an angle between the first side wall portion and the first direction.
The electronic device according to claim 1. A cooling fan,
A first air flow path extending in a first direction from the cooling fan;
A heat sink having a plurality of fins arranged in the first air flow path, wherein the plurality of fins are arranged in a second direction intersecting the first direction;
A flow path cover covering the heat sink and constituting the first air flow path;
A second air flow path that is located in the first direction with respect to the first air flow path and that is larger than the first air flow path toward one side in the second direction; With
Each of the plurality of fins has a first edge located on the cooling fan side and a second edge located on the opposite side of the first edge,
Each of the plurality of fins has both the first direction and the second direction such that the second edge is located on the one side in the second direction with respect to the first edge. An electronic device characterized by being inclined with respect to. The air flow in one area in the second direction in the first air flow path is more than the air flow in the other area in the second direction in the first air flow path. The electronic device according to claim 7, wherein the cooling fan is configured to be faster.

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