JP2003246361A - Carrying tape for electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a carrying tape for electronic components with which characteristics after packing can be checked. <P>SOLUTION: The carrying tape for the electronic components having successive holding holes for receiving the electronic components is equipped, on a bottom of the holding hole, with an inspecting through hole for causing a terminal provided on a rear face of the component to be exposed. The electronic component comprises a crystal product. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a carrier tape for electronic parts in the technical field of industry, and more particularly to a carrier tape for confirming characteristics after packaging electronic parts as a crystal product for surface mounting.

[0002]

BACKGROUND OF THE INVENTION Crystal products for surface mounting, for example, crystal oscillators (referred to as surface mounting oscillators) are built into many electronic devices as a reference source of frequency and time and are mass-produced. In such a device, a surface mount oscillator is generally housed in a carrier tape and wound on a reel for shipment in order to automatically mount the electronic device on a set substrate.

(Example of Prior Art) FIG. 3 is a diagram of a carrier tape for explaining a conventional example, FIG. 3A is a sectional view thereof, and FIG. 3B is a plan view of the carrier tape. The carrier tape 1 is commonly referred to as an embossed carrier tape, and the holding holes 2 are continuously formed.
It is made of a resin tape having. Then, after the surface mount oscillator 3 is housed in the holding hole 2 by an automatic machine, the cover tape 4 is covered and wound on a transport reel (not shown). In general, a through hole 5 is provided at the center of the bottom of the holding hole 2 in order to detect the presence or absence of a product by light or the like. The reference numeral 7 in the drawing is a transport hole.

The surface-mounted oscillator 3 has, for example, a crystal resonator (crystal piece), an IC, and the like (not shown) hermetically sealed in a mounting container, and has mounting terminals 6 at four corners on the back surface as shown in FIG. The mounting terminal 6 includes at least a power supply, an output and a ground terminal.

[0005]

Problems to be Solved by the Invention (Problems of Prior Art)
However, in recent years, the standard of the surface mount oscillator 3 has become stricter, and even if the standard was satisfied before packing the surface mount oscillator 3 with respect to the carrier tape 1 having the above-described configuration, it sometimes became defective after packing. For example, external force is applied by contact with an automatic machine or the like until the surface mount oscillator 3 is housed in the holding hole 2 of the carrier tape 1, and for example, the mounting container is cracked or chipped to cause characteristic deterioration due to airtight leakage or the like. . Further, with the carrier tape having the above-described configuration, the characteristics cannot be confirmed after the surface-mounted oscillator 3 is packaged, and there is a problem that this defect is not revealed until after the product is shipped.

(Object of the Invention) It is an object of the present invention to provide a carrier tape for electronic parts, whose characteristics after packaging can be confirmed.

[0007]

SUMMARY OF THE INVENTION The basic solution of the present invention is to provide an inspection through hole for exposing a terminal of an electronic component at the bottom of a holding hole in a carrier tape. Less than,
An embodiment of the present invention will be described.

[0008]

In the present invention, the characteristic of the electronic component is measured by inserting the measuring terminal into the through hole for inspection provided in the holding hole of the carrier tape and abutting the terminal of the electronic component. An embodiment of the present invention will be described below.

[0009]

1 and 2 are views for explaining an embodiment of the present invention. FIG. 1 is a plan view of a carrier tape and FIG. 2 is a sectional view of the same. It should be noted that the same parts as those of the prior art example are given the same reference numerals, and the description thereof will be simplified or omitted. Transport tape 1
As described above, the transport hole 7 is provided on one side and the holding hole 2 that is continuously provided is provided in the central region. In this example, the inspection through holes 8 are provided at the four corners of the holding hole 2. The inspection through hole 8 exposes the mounting terminal 6 provided on the back surface of the surface mount oscillator 3.

In such a structure, the surface mount oscillator 3 is housed in the holding hole 2 and the cover tape 4 is covered as described above. Then, the measuring terminals 9 from the measuring instrument are inserted into the through holes 8 for inspection provided at the four corners of the holding hole 2 so as to come into contact with at least the power supply, the output and the ground terminal. Reference numeral 10 in the drawing is a cable. Next, the surface mount oscillator 3 is operated to measure the electrical characteristics, for example, the oscillation frequency, and the quality is determined. Then, the defective product is excluded and wound on the reel.

With such a structure, the surface mount oscillator 3 can be measured after the surface mount oscillator 3 is packaged, so that defective products can be eliminated before shipment. Further, since the user can check the characteristics through the measuring through holes 8 at the four corners, defective products due to transportation or the like can be eliminated. Since the presence or absence of the product can be confirmed by the measuring through hole 8, the conventional through hole provided in the center is not necessary.

[0012]

[Other Matters] In the above embodiment, the inspection through hole 8 provided in the holding hole 2 has four corners, but it may be formed at a position corresponding to the terminal of the surface mount oscillator 3. Although the inspection through holes 8 are provided in each of the four corners, only the terminals required for measurement are exposed, and the power supply, output, and ground terminals are the minimum required terminals.

Although the surface mount oscillator 3 has been described as an example, the present invention can be applied to, for example, a crystal product such as a crystal oscillator or a filter which is greatly affected by airtight leakage, and can also be applied to general electronic parts.

[0014]

According to the present invention, since the inspection through hole exposing the terminals of the electronic component is provided at the bottom of the holding hole in the transport tape, the transport tape for the electronic component capable of confirming the characteristics after packaging is provided. it can.

[Brief description of drawings]

FIG. 1 is a plan view of a carrier tape illustrating an embodiment of the present invention.

FIG. 2 is a cross-sectional view of a carrier tape illustrating an embodiment of the present invention.

3A and 3B are views of a transport tape for explaining a conventional example, in which FIG. 3A is the same sectional view and FIG. 3B is the same plan view.

FIG. 4 is a back view of a surface mount oscillator for explaining a conventional example.

[Explanation of symbols]

1 carrier tape, 2 holding holes, 3 surface mount oscillator, 4
Cover tape, 5 push-up through holes, 6 mounting electrodes, 7 transport holes, 8 measuring through holes, 9 measuring terminals, 1
0 cable.

Claims (2)

[Claims] 1. A carrier tape for an electronic component, which continuously has a holding hole for accommodating the electronic component, wherein an inspection through hole exposing a terminal provided on the back surface of the electronic component is provided at the bottom of the holding hole. Conveying tape characterized by being provided. 2. The carrier tape for an electronic component according to claim 1, wherein the electronic component is a crystal product.